CN207489679U - A kind of radiator for capacitor case - Google Patents

Abstract

The utility model discloses a heat dissipation device for a capacitor casing, which comprises a casing, a cover body and a heat dissipation device, the cover body is connected to the top of the casing, and the heat dissipation device is arranged inside the shell wall of the casing. The heat dissipation device includes a heat absorption layer and a heat dissipation layer, the heat absorption layer is arranged inside the heat dissipation layer, the heat absorption layer is composed of a heat absorption sheet and heat insulation cotton, and the heat absorption sheet is arranged on the inner side of the heat dissipation layer. The upper part of the heat insulation cotton, the heat insulation cotton is provided with a number of stuffing openings, the semiconductor refrigeration chips are arranged in the filling openings, the heat dissipation layer is composed of heat dissipation parts and axial flow fans, and the heat dissipation parts are arranged on the shaft Right side of the blower. Beneficial effects: the utility model can directly absorb the heat on the casing effectively through the heat dissipation device, and occupies a small space, is safe to use, and has obvious heat dissipation effect, so that the working stability, operation safety and service life.

Description

A cooling device for a capacitor case

technical field

The utility model relates to the field of capacitors, in particular to a heat dissipation device for capacitor shells

Background technique

In the rapid development of society, all kinds of electrical products are developing in the direction of miniaturization, light weight, compactness and high efficiency. Therefore, electronic products with high power have been developed rapidly, and the resulting large amount of heat has no space to dissipate. It will directly affect the working stability, operational safety and service life of electronic products. Conventional cooling methods can no longer meet the heat dissipation requirements of high-power electronic products, so it is necessary to increase the heat dissipation rate of electronic products.

Aiming at the problems in the related technologies, no effective solution has been proposed yet.

Utility model content

Aiming at the problems in the related art, the utility model proposes a heat dissipation device for the capacitor casing to overcome the above-mentioned technical problems in the existing related art.

The technical scheme of the utility model is achieved in that:

A heat dissipation device for a capacitor casing, comprising a casing, a cover and a heat dissipation device, the cover is connected to the top of the casing, the heat dissipation device is arranged inside the shell wall of the casing, and the heat dissipation device includes a suction A heat layer and a heat dissipation layer, the heat absorption layer is arranged inside the heat dissipation layer.

The heat-absorbing layer is composed of a heat-absorbing sheet and heat-insulating cotton. The heat-absorbing sheet is arranged on the upper part of the heat-insulating cotton. There are a number of stuffing openings in the heat-insulating cotton. Semiconductors are arranged in the stuffing openings. Refrigeration chip, the heat dissipation layer is composed of heat dissipation parts and axial flow fans, the heat dissipation parts are arranged on the inside of the axial flow fans, and the outside of the axial flow fans is provided with ventilation pipes, and the two ends of the ventilation pipes are respectively Connect the vents opened at both ends of the housing.

Further, the heat-absorbing sheet is wrapped with a heat-absorbing plate.

Further, a ventilation hole is opened between two adjacent filling ports.

Further, an anti-reflection heat dissipation plate is added between the heat absorption layer and the heat dissipation layer.

Further, a dustproof plate is fixedly connected to the vent.

The beneficial effects of the utility model: through the heat-absorbing layer and using the semiconductor refrigeration chip to carry out heat transfer, it is beneficial to concentrate heat absorption, and accelerating heat transfer greatly improves the cooling speed of the outer shell, and then adopts the heat-absorbing layer The plate increases the heat exchange area of the heat dissipation device to transfer heat more effectively, and then further absorbs heat through the heat dissipation parts in the heat dissipation layer, and then drives the heat through the axial flow fan, and through the ventilation The tube discharges the heat into the casing to fully achieve the purpose of heat dissipation. The anti-reflection cooling plate is added so that the heat will not flow into the casing in reverse, and the heat can be dissipated more effectively. The dust-proof plate makes it difficult for external dust to enter the interior of the casing, which can effectively increase the service life of the utility model. The heat on the casing of the utility model can directly absorb heat effectively through the heat dissipation device, and It occupies a small space, is safe to use, and has an obvious heat dissipation effect, which ensures the stability, safety and service life of electronic products.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only the present invention. For some embodiments of the present invention, those of ordinary skill in the art can also obtain other drawings based on these drawings on the premise of not paying creative efforts.

1 is a schematic diagram of an internal cross-sectional structure of a heat sink for a capacitor housing according to an embodiment of the present invention;

Fig. 2 is a schematic diagram of the external structure of a heat dissipation device for a capacitor casing according to an embodiment of the present invention.

In the picture:

1. Shell; 2. Cover; 3. Thermal device; 4. Heat absorbing layer; 5. Heat dissipation layer; 6. Heat absorbing sheet; 7. Heat insulation cotton; 11. Axial flow fan; 12. Ventilation pipe; 13. Air vent; 14. Heat absorbing plate; 15. Ventilation hole; 16. Anti-reflection cooling plate;

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

According to an embodiment of the present invention, a heat dissipation device for a capacitor casing is provided.

As shown in Figure 1-2, according to the embodiment of the utility model, it includes a housing 1, a cover body 2 and a heat dissipation device 3, the cover body 2 is connected to the top of the housing 1, and the heat dissipation device 3 is arranged on the Inside the shell wall of the housing 1 , the heat dissipation device 3 includes a heat absorption layer 4 and a heat dissipation layer 5 , and the heat absorption layer 4 is arranged inside the heat dissipation layer 5 .

The heat-absorbing layer 4 is composed of a heat-absorbing sheet 6 and a heat-insulating cotton 7, the heat-absorbing sheet 6 is arranged on the upper part of the heat-insulating cotton 7, and a plurality of stuffing openings 8 are opened in the heat-insulating cotton 7, The filling port 8 is provided with a semiconductor refrigeration chip 9, and the heat dissipation layer 5 is composed of a heat dissipation element 10 and an axial flow fan 11. The heat dissipation element 10 is arranged inside the axial flow fan 11, and the axial flow fan The outer side of 11 is provided with a ventilation pipe 12 , and the two ends of the ventilation pipe 12 are respectively connected to the ventilation openings 13 provided at the two ends of the casing 1 .

In one embodiment, for the above-mentioned heat-absorbing sheet 6 , the heat-absorbing sheet 6 is wrapped with a heat-absorbing plate 14 .

In one embodiment, for the aforementioned stuffing ports 8 , a vent hole 15 is opened between two adjacent stuffing ports 8 .

In one embodiment, for the heat absorption layer 4 and the heat dissipation layer 5 , an anti-reflection heat dissipation plate 16 is added between the heat absorption layer 4 and the heat dissipation layer 5 .

In one embodiment, for the above-mentioned air vent 13 , a dustproof plate 17 is fixedly connected to the air vent 13 .

To sum up, with the help of the above-mentioned technical solution of the utility model, heat transfer is carried out through the heat-absorbing layer 4 and the semiconductor refrigeration chip 9, which is conducive to concentrated heat absorption, and the acceleration of heat transfer greatly improves the performance of the outer shell 1. The cooling rate of the heat sink is increased, and the heat exchange area of the heat sink is increased by the heat absorbing plate 14 to transfer heat more effectively, and then the heat is further absorbed by the heat sink 10 in the heat sink layer 5, Then the heat is dissipated through the axial flow fan 11, and the heat is discharged from the housing 1 through the ventilation pipe 12 to fully achieve the purpose of heat dissipation. The anti-reflection cooling plate 16 is added so that the heat will not flow into the housing in reverse. In the casing 1, heat dissipation is more effective, and the dust-proof plate 17 is added at the vent 13 to make it difficult for external dust to enter the interior of the casing, which can effectively increase the service life of the utility model. The utility model The heat on the housing 1 can be effectively absorbed by the heat sink 3 directly, and it occupies a small space, is safe to use, and has an obvious heat dissipation effect, so that the working stability, operation safety and service life of the electronic product are improved.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model shall be included in the Within the protection scope of the present utility model.

Claims (5)

1. a kind of radiator for capacitor case, which is characterized in that including shell (1), cover (2) and radiator (3), the cover (2) is connected at the top of the shell (1), and the radiator (3) is set in the shell wall of the shell (1) Portion, the radiator (3) include heat-sink shell (4) and heat dissipating layer (5), and the heat-sink shell (4) is set to the heat dissipating layer (5) Inside；

The heat-sink shell (4) is made of heat absorbing sheet (6) and heat insulation foam (7), and the heat absorbing sheet (6) is set to the heat insulation foam (7) Top, several filling mouths (8) are offered in the heat insulation foam (7), semiconductor refrigeration chip is provided in the filling mouth (8) (9), the heat dissipating layer (5) is made of radiating piece (10) and axial flow blower (11), and the radiating piece (10) is set to the axis stream The inside of wind turbine (11) offers ventilation duct (12), the both ends point of the ventilation duct (12) on the outside of the axial flow blower (11) The ventilation opening (13) at the shell (1) both ends Lian Jie be opened in.

2. the radiator according to claim 1 for capacitor case, which is characterized in that the heat absorbing sheet (6) is outside Portion is enclosed with absorber plate (14).

3. the radiator according to claim 1 for capacitor case, which is characterized in that two adjacent described to fill out Venthole (15) is offered between mouth (8).

4. the radiator according to claim 1 for capacitor case, which is characterized in that the heat-sink shell (4) and Counnter attack heat sink (16) is equipped between the heat dissipating layer (5).

5. the radiator according to claim 1 for capacitor case, which is characterized in that on the ventilation opening (13) It is fixedly connected with dust excluding plate (17).