CN215869432U

CN215869432U - Battery piece hot-pressing bonding device

Info

Publication number: CN215869432U
Application number: CN202121965619.8U
Authority: CN
Inventors: 夏永飞; 戴秋喜; 潘加永; 刘光照
Original assignee: Suzhou Yingzhen Intelligent Technology Co ltd
Current assignee: Suzhou Yingzhen Intelligent Technology Co ltd
Priority date: 2021-08-20
Filing date: 2021-08-20
Publication date: 2022-02-18
Anticipated expiration: 2031-08-20

Abstract

The utility model discloses a cell hot-pressing bonding device which comprises a fixed seat, a lifting mechanism, a silicon wafer positioning mechanism, an infrared heating mechanism and a temperature feedback mechanism, wherein a silicon wafer placing position is arranged on the fixed seat, the lifting mechanism and the temperature feedback mechanism are fixed on the fixed seat, the silicon wafer positioning mechanism and the infrared heating mechanism are respectively connected with the lifting mechanism, the silicon wafer positioning mechanism and the infrared heating mechanism are both positioned right above the silicon wafer placing position, the temperature feedback mechanism at least comprises a temperature sensor, and the temperature of a silicon wafer at the silicon wafer placing position is measured by the temperature feedback mechanism through the temperature sensor. By adopting the hot-pressing bonding device for the battery piece, the damage to the battery piece due to overhigh temperature can be avoided in the heating process, and the influence on the service life of the battery piece is avoided.

Description

Battery piece hot-pressing bonding device

Technical Field

The utility model relates to the technical field of crystalline silicon solar cell production, in particular to a cell hot-pressing bonding device.

Background

In the processing and production of crystalline silicon solar cell strings, a plurality of cell pieces are generally required to be welded through interconnection bars to form a cell string (plate). Because the interconnection strip is metal construction, the welding of interconnection strip and battery piece just can be realized to high temperature during the welding, and behind the high temperature welding cooling, thereby the battery piece can appear contracting and the condition such as splitting, damage, fish tail and pollution appears, is unfavorable for subsequent processing and use, influences the life of battery piece simultaneously.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a cell hot-pressing bonding device which can avoid damage to a cell caused by overhigh temperature in the heating process and avoid influence on the service life of the cell.

The technical scheme is as follows:

battery piece hot pressing bonding device, including fixing base, elevating system, silicon chip positioning mechanism, infrared heating mechanism and temperature feedback mechanism, it places the position to be equipped with the silicon chip on the fixing base, elevating system temperature feedback mechanism all is fixed in on the fixing base, silicon chip positioning mechanism infrared heating mechanism respectively with elevating system links to each other, silicon chip positioning mechanism infrared heating mechanism all is located directly over the position is placed to the silicon chip, temperature feedback mechanism includes temperature sensor at least, temperature feedback mechanism measures the temperature of the silicon chip that the position was placed to the silicon chip through temperature sensor.

Further, elevating system includes lift driving piece and lift fixed plate, the lift driving piece with the lift fixed plate links to each other, silicon chip positioning mechanism infrared heating mechanism all is fixed in on the lift fixed plate, the lift mounting drives silicon chip positioning mechanism infrared heating mechanism is to being close to or keeping away from the direction that the position was placed to the silicon chip removes.

Furthermore, the infrared heating mechanism comprises a fixed hanging plate, an infrared heating assembly and a height adjusting assembly, the fixed hanging plate is connected with the lifting mechanism, the height adjusting assembly is movably connected with the fixed hanging plate, the height adjusting assembly is connected with the infrared heating assembly, and an infrared lamp tube is arranged on the infrared heating assembly.

Furthermore, the height adjusting assembly comprises an adjusting bolt and at least two adjusting nuts, an adjusting groove is formed in the fixed hanging plate, one end of the adjusting bolt penetrates through the adjusting groove and then is connected with the infrared heating assembly, the two adjusting nuts are respectively sleeved on the adjusting bolt, and the two adjusting nuts are respectively fixed on the upper surface and the lower surface of the fixed hanging plate.

Further, the silicon wafer positioning mechanism comprises a flexible pressure head, a pressure adjusting assembly and a guide assembly, the guide assembly is connected with the pressure adjusting assembly, and the pressure adjusting assembly is connected with the flexible pressure head.

Furthermore, the pressure regulating assembly comprises a feeding knob, a regulating block and an elastic regulating piece, the regulating block is positioned between the feeding knob and the elastic regulating piece, one end of the elastic regulating piece is connected with the regulating block, and the other end of the elastic regulating piece is connected with the guide assembly.

Further, the guide assembly at least comprises a guide cylinder, an accommodating cavity is formed in the middle of the guide cylinder, and the bottom of the feeding knob, the adjusting block and the elastic adjusting piece are located in the accommodating cavity.

Furthermore, the guide assembly further comprises a guide block and a guide bolt, the other end of the elastic adjusting piece is connected with the top of the guide block, two opposite guide grooves are formed in the bottom of the guide column body, the guide bolt penetrates through the guide block, two ends of the guide bolt are arranged in the two guide grooves respectively, and the flexible pressure head is connected with the guide block.

Furthermore, the silicon wafer positioning mechanisms are multiple and are respectively positioned at different positions above the silicon wafer placing position.

Further, the temperature feedback mechanism further comprises a detection fixing plate, the detection fixing plate is fixed on the side of the fixing seat, and the temperature sensor is fixed on the detection fixing plate.

The following illustrates the advantages or principles of the utility model:

1. the utility model relates to a cell hot-pressing bonding device which comprises a lifting mechanism, a silicon wafer positioning mechanism, an infrared heating mechanism and a temperature feedback mechanism. When the device is used for heating and bonding the battery pieces, the battery pieces are firstly placed at the silicon chip placing position, and then the lifting mechanism drives the silicon chip positioning mechanism and the infrared heating mechanism to move downwards. After the silicon wafer positioning mechanism and the infrared heating mechanism move to the preset positions, the infrared heating mechanism heats the battery piece, and the temperature of the battery piece is measured in real time through the temperature feedback mechanism in the heating process, so that the heating temperature of the battery piece is accurately controlled, the damage to the battery piece caused by overhigh temperature is avoided, and the service life of the battery piece is prevented from being influenced.

2. When the battery piece is heated, the silicon wafer positioning device positions the battery piece, so that the bending deformation of the battery piece is avoided, or the bending degree of the battery piece is reduced to a minimum range.

Drawings

Fig. 1 is a schematic structural diagram of a cell thermocompression bonding apparatus of the present embodiment;

fig. 2 is another schematic structural diagram of the cell thermocompression bonding apparatus of the present embodiment;

FIG. 3 is a schematic structural view of an infrared heating unit according to the present embodiment;

FIG. 4 is a schematic structural view of a silicon wafer positioning mechanism of the present embodiment;

FIG. 5 is another schematic structural diagram of the structure of the silicon wafer positioning mechanism of this embodiment;

description of reference numerals:

1. a fixed seat; 2. a lifting mechanism; 3. a silicon wafer positioning mechanism; 4. an infrared heating mechanism; 5. a temperature feedback mechanism; 11. fixing the bottom plate; 12. a vertical fixing plate; 21. a lifting drive member; 22. a lifting fixing plate; 41. fixing the hanging plate; 42. an infrared heating assembly; 43. a height adjustment assembly; 431. adjusting the bolt; 432. adjusting the nut; 433. an adjustment groove; 31. a flexible indenter; 32. a pressure regulating assembly; 33. a guide assembly; 321. a feed knob; 322. an adjusting block; 323. an elastic adjustment member; 331. a guide cylinder; 332. a guide block; 333. a guide pin; 334. a guide groove; 51. a temperature sensor; 52. detecting the fixed plate; 13. and placing a bit on the silicon chip.

Detailed Description

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "middle", "inner", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the utility model easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the utility model.

As shown in fig. 1 to 5, the present embodiment discloses a thermal bonding apparatus for battery plates, which includes a fixing base 1, a lifting mechanism 2, a silicon wafer positioning mechanism 3, an infrared heating mechanism 4 and a temperature feedback mechanism 5. Wherein, fixing base 1 is including PMKD 11 and vertical fixed plate 12, and the bottom of vertical fixed plate 12 links to each other with PMKD 11's upper surface, is equipped with silicon chip on the PMKD 11 and places position 13. The lifting mechanism 2 is fixed on the vertical fixing plate 12, the temperature feedback mechanism 5 is fixed on the fixing bottom plate 11, the silicon wafer positioning mechanism 3 and the infrared heating mechanism 4 are respectively connected with the lifting mechanism 2, and the silicon wafer positioning mechanism 3 and the infrared heating mechanism 4 are both located right above the silicon wafer placing position 13.

The lifting mechanism 2 can drive the silicon wafer positioning mechanism 3 and the infrared heating mechanism 4 to move towards the direction close to or far away from the silicon wafer placing position 13. The lifting mechanism 2 comprises a lifting driving part 21 and a lifting fixing plate 22, the lifting driving part 21 is connected with the lifting fixing plate 22, the silicon wafer positioning mechanism 3 and the infrared heating mechanism 4 are fixed on the lifting fixing plate 22, and the lifting driving part 21 drives the lifting fixing plate 22 to move upwards or downwards. Preferably, the lifting driving member 21 is a cylinder.

After the battery piece is placed on the silicon chip placing position 13, the infrared heating mechanism 4 heats the battery piece. Preferably, the number of the infrared heating mechanisms 4 is two, and the two infrared heating mechanisms 4 are oppositely arranged on the lifting fixing plate 22. The infrared heating mechanism 4 of this embodiment includes fixed hanger plate 41, infrared heating element 42 and height adjusting assembly 43, and fixed hanger plate 41 is fixed in on the lift fixed plate 22, height adjusting assembly 43 with fixed hanger plate 41 swing joint, height adjusting assembly 43 with infrared heating element 42 links to each other, be equipped with infrared lamp on the infrared heating element 42. The battery pieces are heated by the infrared lamp tubes of the infrared heating assembly 42, so that the battery pieces are bonded.

The height adjusting assembly 43 is used for adjusting the height of the infrared heating assembly 42 in the vertical direction, and the height adjusting assembly 43 comprises an adjusting bolt 431 and two adjusting nuts 432. The fixed hanger plate 41 is provided with an adjusting groove 433, one end of the adjusting bolt 431 passes through the adjusting groove 433 and then is connected with the infrared heating assembly 42, the adjusting bolt 431 is sleeved with two adjusting nuts 432 respectively, and the two adjusting nuts 432 are fixed on the upper surface and the lower surface of the fixed hanger plate 41 respectively. The adjusting bolt 431 is movably connected with the fixed hanger plate 41 through two adjusting nuts 432.

When it is required to adjust the height of the infrared heating unit 42, the adjusting nut 432 positioned at the lower side may be moved to the lower side of the adjusting bolt 431, the adjusting nut 432 positioned at the upper side may be moved to the upper side of the adjusting bolt 431, and then the adjusting bolt 431 may be moved upward or downward. After the height of the adjusting bolt 431 is adjusted, the adjusting bolt 431 is fixed by two adjusting nuts 432. The adjusting bolt 431 can also be moved left and right within the adjusting groove 433 to adjust the position of the infrared heating unit 42 in the lateral direction. Preferably, one infrared heating mechanism 4 of the present embodiment includes two height adjustment assemblies 43. The present embodiment adjusts the height of the infrared heating assembly 42 to make the infrared light irradiated to the cell sheet reach a proper position.

In order to prevent the battery piece from bending and deforming, the battery piece is positioned by the silicon wafer positioning mechanism 3. The number of the silicon wafer positioning mechanisms 3 in this embodiment is seven, two of the silicon wafer positioning mechanisms 3 are located above one end of the silicon wafer placing position 13, the other two silicon wafer positioning mechanisms 3 are located above the other end of the silicon wafer placing position 13, and the remaining three silicon wafer positioning mechanisms 3 are located in the middle of the silicon wafer placing position 13.

The silicon wafer positioning mechanism 3 comprises a flexible pressure head 31, a pressure adjusting assembly 32 and a guide assembly 33, wherein the guide assembly 33 is connected with the pressure adjusting assembly 32, and the pressure adjusting assembly 32 is connected with the flexible pressure head 31. Preferably, the flexible indenter 31 is a suction cup made of silicone or soft plastic.

Further, the pressure adjusting assembly 32 includes a feeding knob 321, an adjusting block 322 and an elastic adjusting member 323, the adjusting block 322 is located between the feeding knob 321 and the elastic adjusting member 323, one end of the elastic adjusting member 323 is connected to the adjusting block 322, and the other end of the elastic adjusting member 323 is connected to the guiding assembly 33. Preferably, the feed knob 321 is a micrometer knob, which adjusts the pitch to 0.25 mm. The elastic adjustment member 323 is a spring.

The guide assembly 33 includes a guide cylinder 331, a guide block 332 and a guide bolt 333, wherein a receiving cavity is disposed in the middle of the guide cylinder 331, and the bottom of the feed knob 321, the adjusting block 322 and the elastic adjusting member 323 are disposed in the receiving cavity. The other end of the elastic adjusting part 323 is connected with the top of the guide block 332, two opposite guide grooves 334 are arranged at the bottom of the guide column 331, the guide bolt 333 is arranged on the guide block 332 in a penetrating manner, two ends of the guide bolt 333 are respectively arranged in the two guide grooves 334, and the flexible pressure head 31 is connected with the guide block 332.

The present embodiment can adjust the compression amount of the elastic adjusting member 323 by adjusting the feeding distance of the feeding knob 321, so that different pressures are applied to the flexible pressure head 31 through the elastic adjusting member 323, thereby ensuring that the pressure of the flexible pressure head 31 on the battery piece is very small, and preventing the battery piece from being damaged. Meanwhile, the flexible pressure head 31 is used for vertically pressing the battery piece, so that the battery piece is prevented from displacing, and the bending of the battery piece is avoided or the bending of the battery piece is reduced within a minimum range.

The temperature feedback mechanism 5 of the present embodiment includes a temperature sensor 51 and a detection fixing plate 52, and the temperature feedback mechanism 5 measures the temperature of the silicon wafer placing site 13 through the temperature sensor 51. The detection fixing plate 52 is fixed on the side of the fixing base 1, and the temperature sensor 51 is fixed on the detection fixing plate 52.

The device adopts the PLC system control operation, and the temperature that temperature sensor 51 was measured can directly be transmitted to the PLC system to through the operation of PLC system control elevating system 2 and infrared heating mechanism 4.

When the device is used for heating and bonding the battery piece, the battery piece is firstly placed at the silicon chip placing position 13, and then the lifting mechanism 2 drives the silicon chip positioning mechanism 3 and the infrared heating mechanism 4 to move downwards. After the silicon wafer positioning mechanism 3 and the infrared heating mechanism 4 move to the preset positions, the battery piece is heated by the infrared heating mechanism 4, and the temperature of the battery piece is measured in real time through the temperature feedback mechanism 5 in the heating process, so that the heating temperature of the battery piece is accurately controlled, the damage to the battery piece caused by overhigh temperature is avoided, and the service life of the battery piece is prevented from being influenced. The present embodiment achieves the purpose of heat bonding of the battery cell by applying a slight pressure to the battery cell and by heat radiation of the infrared heating assembly 42. The device is applicable to the battery piece of different specifications, can be whole battery piece, also can be half battery piece, and application range is wide.

The embodiments of the present invention are not limited thereto, and according to the above-mentioned contents of the present invention, the present invention can be modified, substituted or combined in other various forms without departing from the basic technical idea of the present invention.

Claims

1. Battery piece hot pressing bonding device, its characterized in that includes fixing base, elevating system, silicon chip positioning mechanism, infrared heating mechanism and temperature feedback mechanism, it places the position to be equipped with the silicon chip on the fixing base, elevating system temperature feedback mechanism all is fixed in on the fixing base, silicon chip positioning mechanism infrared heating mechanism respectively with elevating system links to each other, silicon chip positioning mechanism infrared heating mechanism all is located directly over the position is placed to the silicon chip, temperature feedback mechanism includes temperature sensor at least, temperature feedback mechanism measures the temperature of the silicon chip that the position was placed to the silicon chip through temperature sensor.

2. The thermal press bonding apparatus for battery plates according to claim 1, wherein the lifting mechanism comprises a lifting driving member and a lifting fixing plate, the lifting driving member is connected to the lifting fixing plate, the silicon wafer positioning mechanism and the infrared heating mechanism are both fixed to the lifting fixing plate, and the lifting fixing member drives the silicon wafer positioning mechanism and the infrared heating mechanism to move toward or away from the silicon wafer placement position.

3. The thermal compression bonding device for battery plates according to claim 1, wherein the infrared heating mechanism comprises a fixed hanging plate, an infrared heating assembly and a height adjusting assembly, the fixed hanging plate is connected with the lifting mechanism, the height adjusting assembly is movably connected with the fixed hanging plate, the height adjusting assembly is connected with the infrared heating assembly, and an infrared lamp tube is arranged on the infrared heating assembly.

4. The cell slice hot-press bonding device according to claim 3, wherein the height adjusting assembly comprises an adjusting bolt and at least two adjusting nuts, the fixed hanging plate is provided with an adjusting groove, one end of the adjusting bolt passes through the adjusting groove and then is connected with the infrared heating assembly, the two adjusting nuts are respectively sleeved on the adjusting bolt, and the two adjusting nuts are respectively fixed on the upper surface and the lower surface of the fixed hanging plate.

5. The cell wafer thermocompression bonding apparatus of any one of claims 1 to 4, wherein the silicon wafer positioning mechanism comprises a flexible pressure head, a pressure regulating assembly, and a guide assembly, wherein the guide assembly is connected to the pressure regulating assembly, and the pressure regulating assembly is connected to the flexible pressure head.

6. The cell wafer thermocompression bonding apparatus of claim 5, wherein the pressure adjustment assembly comprises a feed knob, an adjustment block, and an elastic adjustment member, the adjustment block is located between the feed knob and the elastic adjustment member, one end of the elastic adjustment member is connected to the adjustment block, and the other end of the elastic adjustment member is connected to the guide assembly.

7. The cell bonding apparatus of claim 6, wherein the guiding assembly comprises a guiding cylinder, a receiving cavity is formed in the middle of the guiding cylinder, and the bottom of the feeding knob, the adjusting block and the elastic adjusting member are located in the receiving cavity.

8. The cell hot-press bonding device according to claim 7, wherein the guide assembly further comprises a guide block and a guide bolt, the other end of the elastic adjusting member is connected with the top of the guide block, the bottom of the guide column is provided with two opposite guide grooves, the guide bolt is arranged on the guide block in a penetrating manner, two ends of the guide bolt are respectively arranged in the two guide grooves, and the flexible pressing head is connected with the guide block.

9. The thermal compression bonding device for battery plates as claimed in claim 1, wherein the number of the silicon wafer positioning mechanisms is plural, and the plural silicon wafer positioning mechanisms are respectively located at different positions above the silicon wafer placing position.

10. The thermal compression bonding device for battery plates according to claim 1, wherein the temperature feedback mechanism further comprises a detection fixing plate, the detection fixing plate is fixed on the side of the fixing seat, and the temperature sensor is fixed on the detection fixing plate.