CN215863308U - Semiconductor electric heating boiler - Google Patents
Semiconductor electric heating boiler Download PDFInfo
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- CN215863308U CN215863308U CN202122266938.6U CN202122266938U CN215863308U CN 215863308 U CN215863308 U CN 215863308U CN 202122266938 U CN202122266938 U CN 202122266938U CN 215863308 U CN215863308 U CN 215863308U
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Abstract
The utility model discloses a semiconductor electric heating boiler, which relates to the technical field of heating equipment and comprises a water inlet pipe, a water outlet pipe and a plurality of semiconductor heating elements, wherein each semiconductor heating element comprises an aluminum pipe subjected to surface oxidation treatment and PTC (positive temperature coefficient) ceramics wrapped on the circumference of the aluminum pipe, and two ends of the aluminum pipe are respectively communicated with the water inlet pipe and the water outlet pipe. So set up, solved the electric boiler among the prior art heating performance unstable, life is shorter, the electrothermal tube is easy because of the problem of dry combustion breakdown.
Description
Technical Field
The utility model relates to the technical field of heating equipment, in particular to a semiconductor electric heating boiler.
Background
The electric boiler is a common device for providing hot water, has no pollution, no noise, small occupied area, convenient installation and use and thermal efficiency of more than 98 percent, and is a green and environment-friendly product.
In the prior art, a common electric boiler heats water by arranging an electric heating pipe. The electric heating pipe realizes the heating function by putting a coiled resistance wire into a metal pipe and electrifying the resistance wire to generate heat and transmitting the heat to the metal pipe. However, in the use process of the electric heating tube, because the electric heating tube is continuously heated, the electric heating tube may be dried and broken down due to dehydration in the tube. Moreover, the metal tube of the electric heating tube is usually a tube with an electroplating coating on the surface, such as nickel plating of a copper tube, and the electroplating coating on the tube wall is easy to disappear gradually along with the lapse of the service time due to the fact that the tube is in an environment with great temperature change of long-term high temperature or sudden cold and sudden hot temperature, so that the power attenuation is serious and normal heat transfer cannot be continued, the heating performance of the electric heating boiler is unstable, and the service life is short.
Therefore, how to solve the problems of unstable heating performance, short service life and easy breakdown of the electric heating tube due to dry burning of the electric heating boiler in the prior art becomes an important technical problem to be solved by technical personnel in the field.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a semiconductor electric boiler, which solves the problems of unstable heating performance and short service life compared with the electric boiler in the prior art. The technical effects that can be produced by the preferred technical scheme in the technical schemes provided by the utility model are described in detail in the following.
In order to achieve the purpose, the utility model provides the following technical scheme:
the utility model provides a semiconductor electric boiler, comprising:
a water inlet pipe;
a water outlet pipe;
the semiconductor heating elements comprise aluminum tubes with surfaces subjected to oxidation treatment and PTC ceramics wrapped on the peripheries of the aluminum tubes, and two ends of the aluminum tubes are respectively communicated with the water inlet pipe and the water outlet pipe.
Preferably, the semiconductor heating element is provided with a plurality of parallel semiconductor heating elements, the inlet of the water inlet pipe and the outlet of the water outlet pipe are positioned on the same side, the water inlet pipe is arranged in a winding manner, and the semiconductor heating element communicated with the tail end of the water inlet pipe is close to the outlet of the water outlet pipe.
Preferably, a heat exchange reinforcing structure is arranged on the inner wall of the aluminum pipe.
Preferably, the inner wall of the aluminum pipe is coated with an insulating nano oxidation resistant layer.
Preferably, the water outlet pipe is communicated with the water inlet pipe.
Preferably, the heating device further comprises a control cabinet, and a microcomputer in communication connection with the semiconductor heating element is arranged in the control cabinet.
Preferably, the microcomputer controls the semiconductor heating element to perform stepping heating on water.
Preferably, a display screen in communication connection with the microcomputer is arranged on the control cabinet.
Preferably, the semiconductor heating device further comprises a furnace body, and the semiconductor heating element, the water inlet pipe and the water outlet pipe are all arranged in the furnace body.
Preferably, the heat exchange enhancing structure is a heat radiating fin or a heat radiating tooth.
According to the technical scheme provided by the utility model, the semiconductor electric heating boiler comprises a water inlet pipe, a water outlet pipe and a plurality of semiconductor heating elements, wherein each semiconductor heating element comprises an aluminum pipe subjected to surface oxidation treatment and PTC (positive temperature coefficient) ceramics wrapped on the circumference of the aluminum pipe, and two ends of the aluminum pipe are respectively communicated with the water inlet pipe and the water outlet pipe. According to the arrangement, water enters from the water inlet pipe and flows into the semiconductor heating element, the PTC ceramic is electrified to generate heat, the PTC ceramic transfers the heat to the aluminum pipe, the aluminum pipe is contacted with the water to heat, then the manufactured hot water flows out from the water outlet pipe for use, the PTC ceramic is used as a heating source, electron oxygen vacancy is realized by utilizing the cavity principle, electrons are promoted to collide under the strong field condition, electric energy is combined and converted into heat energy in a planar form on molecular bonds of a working medium, the service life is long, meanwhile, the surface of the aluminum pipe is a compact aluminum oxide protective film due to oxidation treatment, the chemical property is stable, the service life is prolonged, the heating performance of the semiconductor heating element is stable and reliable, and not only is the PTC ceramic is an insulator when no water exists in the semiconductor heating element and no-load is caused by the fact that the PTC ceramic rapidly rises after heating reaches 200 ℃, the electric heating water heater has the advantages that no current and no power exist, heating can not be continued, the water heater can not be burnt out even if no water is used for dry heating for a long time, heating can be recovered when the temperature is reduced or water is introduced into the pipeline, and the potential safety hazard that the pipeline is punctured by dry heating is avoided. The problems that the electric heating boiler in the prior art is unstable in heating performance, short in service life and easy to break down due to dry burning of the electric heating pipe are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a semiconductor electric boiler according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a control cabinet according to an embodiment of the present invention.
In fig. 1-2:
1. a water inlet pipe; 2. a water outlet pipe; 3. a semiconductor heating element; 4. a control cabinet; 5. a furnace body; 11. entering a section; 12. a fold-back section; 31. an aluminum tube; 32. PTC ceramic.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood as appropriate to those of ordinary skill in the art.
An object of the present embodiment is to provide a semiconductor electric boiler, which can solve the problems of unstable heating performance, short service life and easy breakdown of an electric heating tube due to dry burning in the electric boiler in the prior art.
Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The embodiments described below do not limit the scope of the utility model described in the claims. Further, the entire contents of the configurations shown in the following embodiments are not limited to those necessary as a solution of the utility model described in the claims.
Referring to fig. 1-2, the present embodiment provides a semiconductor electric boiler, which includes a water inlet pipe 1, a water outlet pipe 2 and a plurality of semiconductor heating elements 3, wherein the water inlet pipe 1 is used for communicating with an external water source, the water outlet pipe 2 is used for communicating with an external water structure, the semiconductor heating elements 3 include an aluminum pipe 31 with surface oxidation treatment and a PTC ceramic 32 wrapped around the aluminum pipe 31, a dense aluminum oxide protective film is formed on the inner wall of the aluminum pipe 31, two ends of the aluminum pipe 31 are respectively communicated with the water inlet pipe 1 and the water outlet pipe 2, water enters from the water inlet pipe 1 and flows into the semiconductor heating elements 3, the PTC ceramic 32 generates heat by electricity, which transfers heat to the aluminum pipe 31, the aluminum pipe 31 heats the water by contact, and the manufactured hot water flows out from the water outlet pipe 2 for use, because the PTC ceramic 32 is used as a heat generating source, it utilizes the cavity principle, the electronic oxygen vacancy is realized, electrons are promoted to collide under the strong field condition, electric energy is combined with molecular bonds of a working medium in a planar mode to convert heat energy, the service life is long, meanwhile, the surface of the aluminum pipe 31 is a compact aluminum oxide protective film due to oxidation treatment, the chemical property is stable, the service life is also prolonged, the heating performance of the semiconductor heating element 3 is stable and reliable, and moreover, when no water exists in the semiconductor heating element 3 and no load exists, the PTC resistance value rises sharply after the PTC ceramic 32 heats to 200 ℃, the PTC ceramic is an insulator at the moment, no current and no power exist, heating cannot be continued any more, the PTC ceramic cannot be burnt out even if no water is burnt for a long time, and when the temperature is reduced or water is introduced into the pipeline, heating can be recovered, and the potential safety hazard that the pipeline is broken by dry burning is avoided. The problems that the electric heating boiler in the prior art is unstable in heating performance, short in service life and easy to break down due to dry burning of the electric heating pipe are solved.
As a preferred embodiment, the semiconductor heating element 3 is provided with a plurality of parallel-connected semiconductor heating elements, the inlet of the water inlet pipe 1 and the outlet of the water outlet pipe 2 are positioned on the same side, the water inlet pipe 1 is arranged in a winding way, namely the water inlet pipe 1 comprises an inlet section 11 and a return section 12 which are parallel and communicated with each other, the inlet water flows from the inlet to the farthest end and returns, the semiconductor heating element 3 is communicated with the return section 12, the semiconductor heating element 3 communicated with the tail end of the water inlet pipe 1 is close to the outlet of the water outlet pipe 2, and the arrangement is favorable for the uniform temperature of the outlet water.
In a more preferred embodiment, the inner wall of the aluminum pipe 31 is provided with a heat exchange enhancing structure to improve the heating efficiency. Specifically, the heat exchange enhancing structure may be provided as a heat radiating fin or a heat radiating tooth.
As an alternative embodiment, the inner wall of the aluminum tube 31 is coated with an insulating nano oxidation-resistant layer to further enhance the stability of the semiconductor heating element 3 and prolong the service life.
Furthermore, a liquid pump communicated with the water outlet pipe 2 or the water inlet pipe 1 can be optionally arranged to assist water in the semiconductor electric heating boiler to form turbulent flow and enhance the heating efficiency of the water.
As a specific embodiment, the semiconductor electric boiler also comprises a boiler body 5, and the semiconductor heating element 3, the water inlet pipe 1 and the water outlet pipe 2 are all arranged in the boiler body 5.
In addition, the semiconductor electric boiler also comprises a control cabinet 4 arranged on the furnace body 5, a microcomputer which is in communication connection with the PTC ceramics 32 of the semiconductor heating element 3 is arranged in the control cabinet 4, a connecting probe which is in communication connection with the microcomputer is arranged on the water outlet pipe 2 or the water inlet pipe 1, the connecting probe can be set as a temperature sensor so as to sense the water temperature and transmit the water temperature to the microcomputer, and the microcomputer carries out corresponding power-on and power-off control on the semiconductor heating element 3 according to the water temperature.
Further, the microcomputer controls the semiconductor heating element 3 to perform stepping heating on the water.
Moreover, the control cabinet 4 is provided with a display screen in communication connection with the microcomputer so as to display related data information and facilitate manual checking.
It is understood that the same or similar parts in the above embodiments may be mutually referred to, and the same or similar parts in other embodiments may be referred to for the content which is not described in detail in some embodiments. The multiple schemes provided by the utility model comprise basic schemes, are independent from each other and are not restricted with each other, but can be combined with each other under the condition of no conflict, so that multiple effects are realized together.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A semiconductor electric boiler, comprising:
a water inlet pipe (1);
a water outlet pipe (2);
the heating device comprises a plurality of semiconductor heating elements (3), wherein each semiconductor heating element (3) comprises an aluminum pipe (31) with the surface subjected to oxidation treatment and PTC ceramics (32) wrapped on the circumference of the aluminum pipe (31), and two ends of each aluminum pipe (31) are respectively communicated with the water inlet pipe (1) and the water outlet pipe (2).
2. A semiconductor electric boiler in accordance with claim 1, characterized by, that said semiconductor heating element (3) is provided in parallel a plurality, the inlet of said water inlet pipe (1) is located at the same side as the outlet of said water outlet pipe (2), said water inlet pipe (1) is arranged in a winding way, said semiconductor heating element (3) communicating with the end of said water inlet pipe (1) is close to the outlet of said water outlet pipe (2).
3. A semiconductor electric boiler in accordance with claim 1, characterized in that the inner wall of the aluminum tubes (31) is provided with a heat exchange enhancement structure.
4. A semiconductor electric boiler in accordance with claim 1, characterized in that the inner walls of the aluminum tubes (31) are coated with an insulating nano oxidation resistant layer.
5. A semiconductor electric boiler in accordance with claim 1, characterized by further comprising a liquid pump communicating with said outlet pipe (2).
6. A semiconductor electric boiler in accordance with claim 1, characterized by that, it also includes a control cabinet (4), and a microcomputer connected with the semiconductor heating element (3) in communication is arranged in the control cabinet (4).
7. A semiconductor electric boiler in accordance with claim 6, characterized by that, the microcomputer controls the semiconductor heating element (3) to heat the water step by step.
8. A semiconductor electric boiler as claimed in claim 6, characterized in that the control cabinet (4) is provided with a display screen in communication connection with the microcomputer.
9. A semiconductor electric boiler in accordance with claim 1, characterized by that, it also includes a furnace body (5), the semiconductor heating element (3), the water inlet pipe (1) and the water outlet pipe (2) are all arranged in the furnace body (5).
10. A semiconductor electric boiler in accordance with claim 3, characterized in that the heat exchange enhancing structure is a fin or a tooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122266938.6U CN215863308U (en) | 2021-09-16 | 2021-09-16 | Semiconductor electric heating boiler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122266938.6U CN215863308U (en) | 2021-09-16 | 2021-09-16 | Semiconductor electric heating boiler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215863308U true CN215863308U (en) | 2022-02-18 |
Family
ID=80254953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122266938.6U Active CN215863308U (en) | 2021-09-16 | 2021-09-16 | Semiconductor electric heating boiler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215863308U (en) |
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2021
- 2021-09-16 CN CN202122266938.6U patent/CN215863308U/en active Active
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