CN215856468U - Chip pasting tool - Google Patents
Chip pasting tool Download PDFInfo
- Publication number
- CN215856468U CN215856468U CN202120144774.7U CN202120144774U CN215856468U CN 215856468 U CN215856468 U CN 215856468U CN 202120144774 U CN202120144774 U CN 202120144774U CN 215856468 U CN215856468 U CN 215856468U
- Authority
- CN
- China
- Prior art keywords
- chip
- probe
- pool
- glue
- upper liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 claims abstract description 72
- 239000003292 glue Substances 0.000 claims abstract description 45
- 238000009434 installation Methods 0.000 claims abstract description 34
- 239000000523 sample Substances 0.000 claims description 36
- 238000001712 DNA sequencing Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 10
- 230000009471 action Effects 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
Images
Abstract
The utility model discloses a chip pasting tool, which comprises a chip positioning block, an installation boss, a glue flow groove and a liquid feeding pool, wherein the installation boss is used for placing a chip, the glue flow groove surrounds the installation boss, the bottom surface of the glue flow groove is lower than the placing surface, the liquid feeding pool is arranged in a through hole of the installation boss, and the chip positioning block is used for positioning and installing the chip on the installation boss. Above-mentioned frock is pasted to chip has improved the mode of pasting of chip in last liquid pond, ensures the chip location accuracy through prepositioning, pastes the chip under the effect of capillary phenomenon through the glue in glue groove, still has the characteristics of pasting evenly and the leakproofness is good.
Description
Technical Field
The utility model relates to the technical field of nanopore DNA sequencing, in particular to a chip pasting tool.
Background
Solid-state nanopore monomolecular DNA sequencing is a DNA sequencing method, the chip of which has nanopores running through both sides; when DNA sequencing is carried out, DNA molecules move in the nano holes, conductive liquid is arranged on two sides of the chip, voltage is applied to the two sides of the chip to enable the nano holes to generate current, the moving DNA molecules influence current signals in the nano holes at the moment, and sequences of four basic groups on the DNA can be detected through the change of the current.
In the conventional chip mounting method, a chip is usually adhered to a liquid applying tank, so that conductive liquids on both sides of the chip can be communicated only through a nanopore. The existing pasting method comprises the following steps: firstly, glue is applied to the liquid applying pool, then the chip is placed on the glue, the glue is solidified, the pasting and installation of the chip are completed, and the following defects exist: the chip is placed after the glue is applied, so that the chip cannot be adjusted after the chip is placed, and the problem that the chip bonding angle is inclined or the nano holes are blocked before the chip is bonded is easy to occur; the contact area between the glue and the chip is limited, and the sealing performance is poor; the glue spreading amount is not controllable, and uneven chip pasting caused by uneven glue spreading is easy to realize.
Therefore, how to provide a die attaching tool that provides a positioning function during attaching to ensure that the die is attached accurately and stably is a technical problem that needs to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a chip pasting tool, which improves the pasting mode of a chip on an upper liquid pool, ensures accurate chip positioning through pre-positioning, pastes the chip through glue in a glue groove under the action of capillary phenomenon, and has the characteristics of uniform pasting and good sealing property.
In order to achieve the purpose, the utility model provides a chip pasting tool, which comprises a chip positioning block, an installation boss for placing a chip, a glue flow groove surrounding the installation boss and being lower than a placing surface on the bottom surface of the glue flow groove, and a liquid feeding pool arranged in a through hole of the installation boss, wherein the chip positioning block is used for positioning and installing the chip on the installation boss.
Preferably, the chip mounting device comprises a probe which is arranged above the upper liquid pool and used for pressing the chip to the mounting boss.
Preferably, the device comprises a liquid feeding pool positioning block which is arranged on the periphery of the liquid feeding pool and used for positioning and installing the liquid feeding pool.
Preferably, the probe is arranged on a height adjusting device which can adjust the pressure of the probe on the chip in a lifting way.
Preferably, a cavity filled with a liquid medium is arranged at the end of the probe pressing the chip.
Preferably, a spring for extending and contracting the probe is arranged in the probe.
Preferably, the number of the upper liquid pool positioning blocks is multiple, and the upper liquid pool positioning blocks are arranged on one side of the upper liquid pool in the length direction and one side of the upper liquid pool in the width direction.
Preferably, the height adjusting device comprises a lifting rod, a lifting seat slidably sleeved on the lifting rod, and a fixing lock for fixing the lifting seat to the lifting rod, and the probe is arranged on the lifting seat.
Preferably, the liquid medium is in particular a conductive liquid for DNA sequencing.
Preferably, the chip pasting tool is made of aluminum and/or stainless steel.
Compared with the prior art, the chip bonding tool provided by the utility model comprises a chip positioning block and a liquid feeding pool, wherein the liquid feeding pool is provided with an installation boss, a glue flow groove and a through hole, the installation boss is used for placing a chip, the glue flow groove surrounds the installation boss, the bottom surface of the glue flow groove is lower than the placing surface of the installation boss, the through hole is formed in the installation boss, and the chip positioning block is used for positioning and installing the chip on the installation boss.
In the working process of the chip pasting tool, a chip positioning block is firstly placed in a liquid feeding pool, then a chip is placed on a mounting boss of the liquid feeding pool under the positioning and mounting effects of the chip positioning block, and at the moment, the chip is positioned accurately through pre-positioning; then drip into glue in the glue groove, glue free flow and evenly surround around in the glue groove around the chip, the contact position of chip and installation boss can be filled completely by glue under the capillary action, glue pastes evenly and sealed complete between chip and installation boss this moment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is an isometric view of a chip attach tool provided by an embodiment of the utility model;
fig. 2 is a cross-sectional view of a chip bonding tool provided in an embodiment of the present invention;
FIG. 3 is a schematic diagram of a portion of the chip of FIG. 1;
FIG. 4 is an isometric view of a fountain according to an embodiment of the present invention;
FIG. 5 is an enlarged partial view of FIG. 4 at the mounting boss;
FIG. 6 is a schematic view of the attachment of the upper liquid pool to the chip.
Wherein:
1-liquid feeding pool, 2-chip, 3-base, 4-chip positioning block, 5-liquid feeding pool positioning block, 6-probe, 11-glue flow groove, 12-installation boss, 13-through hole, 31-installation hole, 32-light transmission hole, 71-lifting seat, 72-lifting rod and 73-fixing lock.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order that those skilled in the art will better understand the disclosure, the utility model will be described in further detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1 to 6, fig. 1 is an isometric view of a chip bonding tool according to an embodiment of the present invention, fig. 2 is a cross-sectional view of the chip bonding tool according to the embodiment of the present invention, fig. 3 is a partially enlarged schematic view of a chip in fig. 1, fig. 4 is an isometric view of a liquid feeding tank according to the embodiment of the present invention, fig. 5 is a partially enlarged schematic view of a mounting boss in fig. 4, and fig. 6 is a schematic view of bonding the liquid feeding tank and the chip.
In a first specific embodiment, the die attaching tool provided by the utility model comprises a die positioning block 4 and an upper liquid pool 1, wherein the upper liquid pool 1 is provided with an installation boss 12, a glue flow groove 11 and a through hole 13, the through hole 13 is arranged on the installation boss 12, the glue flow groove 11 surrounds the installation boss 12, the bottom surface of the glue flow groove 11 is lower than the mounting surface of the installation boss 12, the installation boss 12 protrudes upwards at the central position, the glue flow groove 11 sinks downwards at the peripheral position, when the die positioning block 4 is used in combination, the die positioning block 4 is placed in the upper liquid pool 1, and the die positioning block 4 positions the installation die 2 on the installation boss 12.
In this embodiment, the chip positioning block 4 plays a role of positioning and mounting the chip 2, the chip positioning block 4 has a limiting wall surface in positioning contact with the peripheral edge of the chip 2, and the two adjacent limiting wall surfaces are in contact with two right-angle edges of the chip 2, so that the chip 2 is positioned and mounted on the mounting boss 12.
In the working process of the chip pasting tool, the chip positioning block 4 is firstly placed on the upper liquid pool 1, then the chip 2 is placed on the mounting boss 12 of the upper liquid pool 1 under the positioning and mounting effects of the chip positioning block 4, and at the moment, the chip 2 is accurately positioned through pre-positioning; and then, glue is dripped into the glue flow groove 11, the glue flows freely in the glue flow groove 11 and uniformly surrounds the periphery of the chip 2, the glue infiltration degree can be observed under a microscope, the contact position of the chip 2 and the mounting boss 12 can be completely filled with the glue under the capillary action, the glue is uniformly and completely adhered between the chip 2 and the mounting boss 12, and the adhering and mounting of the chip 2 on the upper liquid pool 1 are completed.
In this embodiment, this frock is pasted to chip utilizes chip locating piece 4 to solve the inaccurate and chip 2 problem that easily takes place to remove of gluing glue in-process chip 2 location, has still solved the poor problem of leakproofness.
For better technical effect, on the basis of providing circumferential positioning for the chip 2 by using the chip positioning block 4, the probe 6 is also used for providing axial compression effect for the chip 2.
In this embodiment, this chip bonding frock still includes the probe 6 of locating the top of going up liquid bath 1, and the end of probe 6 pushes down chip 2 for chip 2 compresses tightly in installation boss 12 under the effect of probe 6, makes chip 2 keep balance, ensures that the in-process location of pasting is accurate not squinted, ensures that the chip 2 surface level after pasting does not incline.
In this embodiment, this chip pastes frock utilizes probe 6 to further solve the inaccurate and chip 2 problem that easily takes place to remove of gluing glue in-process chip 2 location, has still solved the problem that chip 2 pasted the back slope.
In a specific embodiment, the die attach tool may be mounted on the base 3.
In this embodiment, the planar coordinate position of the probe 6 in the base 3 may be fixed, and the position of the upper liquid pool 1 is to be determined based on the position of the probe 6; on the basis, the chip pasting tool further comprises an upper liquid pool positioning block 5, the upper liquid pool positioning block 5 is arranged on the periphery of the upper liquid pool 1, the upper liquid pool positioning block 5 is in contact with the periphery of the upper liquid pool 1, the upper liquid pool 1 is positioned and installed by utilizing the preset upper liquid pool positioning block 5, and the upper liquid pool 1, the chip 2 and the probe 6 are ensured to be positioned on the correct installation position; wherein, the position of the upper liquid pool positioning block 5 is adjustable, so that the chip 2 adhered to the mounting boss 12 in the upper liquid pool 1 is vertical to the probe 6.
Illustratively, the number of the upper liquid pool positioning blocks 5 is multiple, mounting holes 31 for mounting the upper liquid pool positioning blocks 5 are formed in multiple positions of the base 3, the mounting holes 31 are provided with internal threads, and the upper liquid pool positioning blocks 5 can be fixed in a screw manner and the like; the upper liquid pool positioning block 5 includes a positioning block I disposed on one side of the upper liquid pool 1 in the length direction and a positioning block II disposed on one side of the upper liquid pool in the width direction.
Besides, the base 3 is further provided with a light hole 32, the light hole 32 is communicated to the mounting boss 12, the light hole 32 can be used for emitting external light, and when the mounting boss 12 is pasted by using optical cement, ultraviolet light can be conveniently irradiated from the bottom of the base 3.
For better technical effect, the pressure of the probe 6 on the chip 2 is adjustable, at this time, the probe 6 is installed on the height adjusting device capable of being lifted, and the height position of the probe 6 is lifted and adjusted by utilizing the lifting function of the height adjusting device, so that the pressure change of the probe 6 on the chip 2 is adjusted.
It should be noted that, the principle and structure of the height adjusting device are not specifically limited in this embodiment, and the height adjusting device includes, but is not limited to, a lifting structure in the form of a slide rail, an air cylinder, etc., and as long as the lifting structure can achieve the above lifting function, the height adjusting device should also belong to the description scope of this embodiment.
Illustratively, the height adjusting device comprises a lifting rod 72, a lifting seat 71 slidably sleeved on the lifting rod 72, and a fixing lock 73 for locking and fixing the lifting seat 71 on the lifting rod 72; the lifting seat 71 is provided with a sliding hole for the lifting rod 72 to penetrate through, the lifting seat 71 can lift and slide along the lifting rod 72, the sliding hole is an opening, the fixing lock 73 is a threaded piece, the threaded piece penetrates through one side of the sliding hole of the opening, the opening size of the sliding hole can be changed by screwing the threaded piece, and when the opening size of the sliding hole is reduced, the lifting seat 71 is locked and fixed on the lifting rod 72; the sliding hole is formed at one end of the lifting base 71, and the probe 6 is installed at the other end.
In the present embodiment, the probe 6 itself has an elastic expansion capability, that is, the probe 6 is provided with a spring for the probe 6 to expand and contract, and the probe 6 can make an adaptive adjustment within a certain height range for the chips 2 at different height positions to ensure the chip 2 is pressed.
For better technical effect, a cavity filled with liquid medium is arranged at the end of the probe 6 pressing the chip 2, and when the probe 6 presses the chip 2, the liquid medium in the cavity flows outwards and flows into the chip 2, so that a certain protection effect is provided for the chip 2.
Illustratively, the liquid medium is specifically a conductive liquid for DNA sequencing.
In this embodiment, a cavity at the end of the probe 6 is filled with a pre-injected liquid (usually a conductive liquid used in DNA sequencing) to protect the nanopore on the chip 2, glue is dispensed around the chip 2 to be distributed around the chip 2 through natural flow, glue flows freely without uneven glue spreading, and the contact part between the chip 2 and the upper liquid pool 1 is completely filled with the glue under capillary action to seal the chip 2 completely; the chip pasting tool solves the problem that the nano-pores on the chip 2 are easily blocked in the process of gluing the chip 2 with water,
in addition, the glue selected according to the use scene needs to be resistant to water and high-concentration salt solution (1mol/mL) and has short setting time; all structures of the chip pasting tool are made of aluminum and stainless steel, and the chip pasting tool has the characteristics of salt resistance and corrosion resistance.
It is noted that, in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities.
The above provides a detailed description of the die attach tool provided by the present invention. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. The utility model provides a frock is pasted to chip, its characterized in that includes chip locating piece (4) and has installation base (12), the encircleing that supplies chip (2) to lay installation base (12), tank bottom surface are less than glue groove (11) of laying the face and locate last liquid bath (1) of perforating hole (13) of installation base (12), chip locating piece (4) location installation chip (2) in installation base (12).
2. The tool for sticking the chip as claimed in claim 1, comprising a probe (6) which is arranged above the upper liquid pool (1) and presses the chip (2) against the mounting boss (12).
3. The die attaching tool according to claim 2, comprising a liquid feeding pool positioning block (5) disposed on the periphery of the liquid feeding pool (1) and used for positioning and installing the liquid feeding pool (1).
4. The tool according to claim 2, wherein the probe (6) is mounted on a height adjusting device capable of adjusting the pressure of the probe (6) on the chip (2) in a lifting manner.
5. The tool for sticking the chip as claimed in claim 2, wherein a chamber into which a liquid medium is injected is provided at the end of the probe (6) pressing the chip (2).
6. The tool for sticking the chip as claimed in claim 2, wherein a spring for stretching the probe (6) is arranged in the probe (6).
7. The chip bonding tool according to claim 3, wherein the number of the upper liquid pool positioning blocks (5) is plural, and the upper liquid pool positioning blocks (5) are arranged on one side of the upper liquid pool (1) in the length direction and one side of the upper liquid pool in the width direction.
8. The die attaching tool according to claim 4, wherein the height adjusting device comprises a lifting rod (72), a lifting seat (71) slidably sleeved on the lifting rod (72), and a fixing lock (73) for locking and fixing the lifting seat (71) on the lifting rod (72), and the probe (6) is arranged on the lifting seat (71).
9. The chip bonding tool according to claim 5, wherein the liquid medium is a conductive liquid for DNA sequencing.
10. The die attaching tool according to any one of claims 1 to 9, wherein the die attaching tool is made of aluminum or stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120144774.7U CN215856468U (en) | 2021-01-19 | 2021-01-19 | Chip pasting tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120144774.7U CN215856468U (en) | 2021-01-19 | 2021-01-19 | Chip pasting tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215856468U true CN215856468U (en) | 2022-02-18 |
Family
ID=80237984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120144774.7U Expired - Fee Related CN215856468U (en) | 2021-01-19 | 2021-01-19 | Chip pasting tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215856468U (en) |
-
2021
- 2021-01-19 CN CN202120144774.7U patent/CN215856468U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102120207B (en) | Device for coating heat-conducting silicone grease on radiation surface of insulated gate bipolar translator (IGBT) module and related coating method | |
| CN215856468U (en) | Chip pasting tool | |
| FR2964786B1 (en) | METHOD FOR PRODUCING CHIP ELEMENTS WITH WIRE INSERTION GROOVES | |
| CN109801902B (en) | Packaging substrate, semiconductor device and manufacturing method thereof | |
| CN107402180B (en) | Glue bonding strength measuring device | |
| CN210650416U (en) | Ionization chamber clamp | |
| CN212702708U (en) | Coating device for perovskite thin film | |
| CN210215165U (en) | Coating device for hollow glass production | |
| CN216742333U (en) | Magnetic core bonding frock | |
| CN208845524U (en) | A kind of bonding jig for Silicone Rubber Coated precise forming | |
| CN106437094A (en) | Multifunctional trowel for glue for tiles | |
| CN215004877U (en) | Detachable flexible side wall permeameter | |
| KR101165360B1 (en) | Adhesive stamping apparatus for die bonder | |
| CN209961132U (en) | Coating thickness measuring device | |
| CN205604030U (en) | Asphalt spraying measures testing arrangement | |
| CN211179198U (en) | Adhesive curing detection mold | |
| CN110261193B (en) | Tool and method for preparing adhesive T-shaped stripping sample | |
| CN206283780U (en) | The positioning seat of detector manufacture | |
| CN210834626U (en) | UV (ultraviolet) adhesive force detection device for plastic part processing | |
| CN211385090U (en) | Leveling type coating table for laboratory | |
| CN216717241U (en) | Novel adjustment instrument of multilayer fountain layer level | |
| CN218340237U (en) | Quick clamping base device | |
| CN206158130U (en) | Split type ceramic tile interval locator | |
| CN204544629U (en) | Novel LED light bar coating unit | |
| CN206326533U (en) | The carrier used on detector base during pasting chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220218 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |