CN215853740U

CN215853740U - Automatic stamping system for PCB

Info

Publication number: CN215853740U
Application number: CN202121752990.6U
Authority: CN
Inventors: 曾建华
Original assignee: Jiangmen Glory Faith Pcb Co ltd
Current assignee: Jiangmen Glory Faith Pcb Co ltd
Priority date: 2021-07-29
Filing date: 2021-07-29
Publication date: 2022-02-18
Anticipated expiration: 2031-07-29

Abstract

The utility model discloses an automatic stamping system for a PCB, which comprises: the PCB conveying device comprises a rack, a conveying mechanism and a control mechanism, wherein the rack is provided with the conveying mechanism which is used for conveying a PCB; the board placing device comprises a board placing table and a clamping mechanism, wherein the board placing table is arranged at the first end of the rack in a lifting mode, the board placing table is provided with a rotary table and a first detection element, the rotary table is rotatably connected with the board placing table, the first detection element controls the board placing table to move up and down and the rotary table to rotate, the clamping mechanism is arranged on the rack in a sliding mode, and the clamping mechanism is used for clamping a PCB on the rotary table onto the conveying mechanism; the stamping device is positioned at the downstream of the board placing device and is used for stamping the PCB; the board collecting device comprises a board collecting platform and a board pressing mechanism, wherein the board collecting platform is arranged at the second end of the rack in a lifting mode, a second detection element is arranged on the board collecting platform and controls the board collecting platform to move up and down, the board pressing mechanism is located above the board collecting platform and is connected with the rack in a rotating mode, and the board pressing mechanism is used for pressing and connecting a PCB.

Description

Automatic stamping system for PCB

Technical Field

The utility model relates to the technical field of PCB production, in particular to an automatic stamping system for a PCB.

Background

At present, in the production process of a PCB, products requiring ink stamping for clients are all manually operated to put and take up the PCB, and in the process of putting the PCB, the situation of wrong position of the PCB possibly exists, the PCB needs to be manually adjusted at the moment, the labor intensity is high, and the working efficiency is low.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the automatic stamping system for the PCB can realize automatic board placing and board collecting, can automatically adjust the position of the PCB while placing the board, does not need manual operation, reduces the labor intensity and improves the working efficiency.

The PCB automatic stamping system according to the embodiment of the utility model comprises: the PCB conveying device comprises a rack, a conveying mechanism and a control mechanism, wherein the rack is provided with the conveying mechanism which is used for conveying a PCB; the board placing device comprises a board placing table and a clamping mechanism, the board placing table is arranged at the first end of the rack in a lifting mode, the board placing table is provided with a rotary table and a first detection element, the rotary table is rotatably connected with the board placing table, the first detection element controls the board placing table to move up and down and the rotary table to rotate, the clamping mechanism is arranged on the rack in a sliding mode, and the clamping mechanism is used for clamping a PCB on the rotary table onto the conveying mechanism; the stamping device is positioned at the downstream of the board placing device and used for stamping the PCB; receive the board device, including receiving the pallet and pressing mechanism, it sets up to receive the pallet lift the second end of frame, it is provided with second detecting element to receive the pallet, second detecting element control receive the pallet up-and-down motion, pressing mechanism is located receive the top of pallet, just pressing mechanism with the frame rotates to be connected, pressing mechanism is used for the crimping the PCB board.

The automatic stamping system for the PCB provided by the embodiment of the utility model at least has the following beneficial effects: the first detection element and the second detection element are arranged, so that the board placing table and the board collecting table can move up and down according to the height of the PCB, automatic board placing and collecting can be realized, the structure is simple, and the operation is simple and convenient; through being provided with the carousel, can adjust PCB board position to follow-up stamp need not manual operation, reduces intensity of labour, improves work efficiency.

According to the automatic PCB stamping system provided by the embodiment of the utility model, the stamping device comprises a support and a stamp, the support is positioned above the conveying mechanism, the support is fixedly connected with the rack, and the stamp is arranged on the support in a lifting manner.

According to the automatic PCB stamping system provided by the embodiment of the utility model, the support is provided with the mounting plate in a lifting manner, and the stamp is fixed at the bottom of the mounting plate.

According to the automatic stamping system for the PCB, disclosed by the embodiment of the utility model, a spring is arranged between the stamp and the mounting plate (320).

According to the automatic PCB stamping system provided by the embodiment of the utility model, the stamping device further comprises a baffle, the baffle is arranged on the rack in a lifting mode, and the baffle is used for limiting the PCB to advance.

According to the automatic PCB stamping system provided by the embodiment of the utility model, the bracket is provided with the sensor, the sensor is connected with the baffle, and the sensor controls the baffle to move.

According to the automatic PCB stamping system provided by the embodiment of the utility model, the conveying mechanism comprises a first conveying part and a second conveying part, the first conveying part is conveyed by a belt, the second conveying part is conveyed by a travelling winch, the plate placing device is positioned at one end of the first conveying part, which is far away from the second conveying part, the stamping device is positioned at the first conveying part, and the plate collecting device is positioned at one end of the second conveying part, which is far away from the first conveying part.

According to the automatic PCB stamping system provided by the embodiment of the utility model, the second conveying part is provided with a drying mechanism, the drying mechanism is positioned between the stamping device and the board collecting device, and the drying mechanism is used for drying marks on a PCB.

According to the automatic PCB stamping system provided by the embodiment of the utility model, the first conveying part is provided with a limiting mechanism, the limiting mechanism is positioned between the plate placing device and the stamping device, and the limiting mechanism is used for correcting the position of a PCB.

According to the automatic PCB stamping system provided by the embodiment of the utility model, the limiting mechanisms comprise limiting plates positioned on two sides of the conveying mechanism, the limiting plates are obliquely arranged, and the distance between the limiting plates is gradually narrowed from the plate placing device to one end of the stamping device.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of an automatic stamping system for a PCB according to an embodiment of the present invention.

Description of reference numerals:

a frame 100; a first conveyance unit 110; a second conveyance section 120; a drying mechanism 130; a limit plate 140; a pallet placing table 210; a clamping mechanism 220; a turntable 230; a first detection element 240; a support 310; a mounting plate 320; a baffle 330; a sensor 340; a plate collecting table 410; a platen mechanism 420.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

Referring to fig. 1, an embodiment of the present invention provides an automatic stamping system for a PCB, including a rack 100, a board placing device, a stamping device, and a board collecting device. The rack 100 is provided with a conveying mechanism for conveying the PCB; the board placing device comprises a board placing table 210 and a clamping mechanism 220, the board placing table 210 is arranged at the first end of the rack 100 in a lifting mode, the board placing table 210 is provided with a turntable 230 and a first detection element 240, the turntable 230 is rotatably connected with the board placing table 210, the first detection element 240 controls the board placing table 210 to move up and down and the turntable 230 to rotate, the clamping mechanism 220 is arranged on the rack 100 in a sliding mode, and the clamping mechanism 220 is used for clamping a PCB on the turntable 230 onto the conveying mechanism; the stamping device is positioned at the downstream of the board placing device and is used for stamping the PCB; the board collecting device comprises a board collecting platform 410 and a board pressing mechanism 420, the board collecting platform 410 is arranged at the second end of the rack 100 in a lifting mode, a second detection element is arranged on the board collecting platform 410 and controls the board collecting platform 410 to move up and down according to the height of a PCB on the board collecting platform 410, the board pressing mechanism 420 is located above the board collecting platform 410, the board pressing mechanism 420 is rotatably connected with the rack 100, and the board pressing mechanism 420 is used for pressing the PCB.

The PCB is placed on the board placing table 210, the first detection element 240 controls the rotary disc 230 to rotate according to the stamping position of the PCB, the position of the PCB is adjusted, so that the PCB can be stamped conveniently subsequently, meanwhile, the first detection element 240 controls the board placing table 210 to move according to the height of the PCB on the board placing table 210, the clamping mechanism 220 can clamp the PCB, the PCB is conveyed onto the conveying mechanism, the PCB moves along with the conveying mechanism and reaches the stamping device to be stamped, the PCB which is stamped is conveyed to the board receiving device, the PCB is pressed and connected through the board pressing mechanism 420, the PCB is prevented from directly falling off from the conveying mechanism, and finally, the second detection element controls the board receiving table 410 to move according to the height of the PCB on the board receiving table 410, so that the PCB on the board pressing mechanism 420 is received, and the board is received.

Referring to fig. 1, the conveying mechanism includes a first conveying portion 110 and a second conveying portion 120, the first conveying portion 110 is conveyed by a belt, the second conveying portion 120 is conveyed by a roller, the plate placing device is located at one end of the first conveying portion 110 far away from the second conveying portion 120, the stamping device is located at the first conveying portion 110, and the plate collecting device is located at one end of the second conveying portion 120 far away from the first conveying portion 110. The first conveying part 110 is conveyed by a belt, so that the conveying is more stable; by using the row roller for the second conveying part 120, the solidification of the mark on the PCB board can be accelerated. It is conceivable that the first conveying part 110 is provided with a limiting mechanism between the board placing device and the stamping device, the limiting mechanism being used to correct the position of the PCB board. Specifically, stop gear is including the limiting plate 140 that is located the conveying mechanism both sides, and limiting plate 140 slope sets up, and the distance between the limiting plate 140 narrows down towards the device one end of stamping from putting the board device gradually, realizes the accurate of PCB board and carries. The second conveying part 120 is provided with a drying mechanism 130, the drying mechanism 130 is located between the stamping device and the board collecting device, and the drying mechanism 130 is used for drying marks on the PCB board. Through being provided with stoving mechanism 130, can accelerate the seal of a government organization in old china solidification on the PCB board, improve work efficiency.

Referring to fig. 1, in some embodiments, the stamping device includes a support 310 and a stamp, the support 310 is located above the conveying mechanism, the support 310 is fixedly connected with the frame 100, and the stamp is disposed on the support 310 in a lifting manner. Specifically, the bracket 310 is provided with a mounting plate 320 in a lifting manner, and the stamp is fixed at the bottom of the mounting plate 320. The mounting plate 320 drives the stamp to move, thereby realizing the imprinting of the PCB. The seal is fixed in a magnetic type mode, the position of the seal is convenient to adjust, the seal is suitable for sealing of different PCB boards, the application range is expanded, and the cost is reduced. It is contemplated that a spring is disposed between the stamp and the mounting plate 320. Through being provided with the spring, can play the cushioning effect, prevent that the seal from descending and crushing PCB board. The seal is connected with the ink tube, and the ink tube is used for conveying ink, so that the ink can be conveniently added to the seal, and the operation is simple and convenient.

Referring to fig. 1, in some embodiments, the stamping device further includes a barrier 330, the barrier 330 is disposed on the frame 100 in a lifting manner, and the barrier 330 is used for limiting the PCB to advance. Specifically, when the PCB is transported to a position below the stamp, the shutter 330 moves upward to restrict the movement of the PCB, thereby facilitating the stamp to imprint the PCB. It is contemplated that the bracket 310 is provided with a sensor 340, the sensor 340 is coupled to the flapper 330, and the sensor 340 controls the movement of the flapper 330. The sensor 340 detects the movement of the PCB and feeds back the movement, and the baffle 330 moves upward to block the movement of the PCB, thereby improving the movement accuracy and the product quality.

According to the automatic PCB stamping system provided by the embodiment of the utility model, the first detection element 240 and the second detection element are arranged, so that the board placing table 210 and the board collecting table 410 can move up and down according to the height of a PCB to realize automatic board placing and collecting, the structure is simple, and the operation is simple and convenient; through being provided with carousel 230, can adjust PCB board position to follow-up stamp need not manual operation, reduces intensity of labour, improves work efficiency.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the utility model have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the utility model, the scope of which is defined by the claims and their equivalents.

Claims

1. The utility model provides a PCB board automatic stamping system which characterized in that includes:

a rack (100) provided with a conveying mechanism for conveying the PCB;

the board placing device comprises a board placing table (210) and a clamping mechanism (220), wherein the board placing table (210) is arranged at the first end of the rack (100) in a lifting mode, the board placing table (210) is provided with a rotary disc (230) and a first detection element (240), the rotary disc (230) is rotatably connected with the board placing table (210), the first detection element (240) controls the board placing table (210) to move up and down and the rotary disc (230) to rotate, the clamping mechanism (220) is arranged on the rack (100) in a sliding mode, and the clamping mechanism (220) is used for clamping a PCB (printed circuit board) on the rotary disc (230) to the conveying mechanism;

the stamping device is positioned at the downstream of the board placing device and is used for stamping the PCB;

receive the board device, including receiving board platform (410) and pressure board mechanism (420), it sets up to receive board platform (410) lift the second end of frame (100), it is provided with second detecting element to receive board platform (410), second detecting element control receive board platform (410) up-and-down motion, pressure board mechanism (420) are located receive the top of board platform (410), just pressure board mechanism (420) with frame (100) rotate and are connected, pressure board mechanism (420) are used for the crimping the PCB board.

2. The automatic PCB stamping system according to claim 1, wherein the stamping device comprises a support (310) and a stamp, the support (310) is located above the conveying mechanism, the support (310) is fixedly connected with the rack (100), and the stamp is arranged on the support (310) in a lifting mode.

3. The automatic PCB stamping system according to claim 2, wherein the bracket (310) is provided with a mounting plate (320) in a lifting manner, and the stamp is fixed at the bottom of the mounting plate (320).

4. The PCB board automatic stamping system of claim 3, wherein a spring is disposed between the stamp and the mounting plate (320).

5. The automatic PCB stamping system according to claim 2, wherein the stamping device further comprises a baffle (330), the baffle (330) is arranged on the rack (100) in a lifting mode, and the baffle (330) is used for limiting the advance of the PCB.

6. The PCB automatic stamping system according to claim 5, wherein a sensor (340) is arranged on the bracket (310), the sensor (340) is connected with the baffle (330), and the sensor (340) controls the baffle (330) to move.

7. The automatic PCB stamping system according to claim 1, wherein the conveying mechanism comprises a first conveying part (110) and a second conveying part (120), the first conveying part (110) adopts belt conveying, the second conveying part (120) adopts traveling roller conveying, the plate releasing device is positioned at one end of the first conveying part (110) far away from the second conveying part (120), the stamping device is positioned at the first conveying part (110), and the plate collecting device is positioned at one end of the second conveying part (120) far away from the first conveying part (110).

8. The PCB automatic stamping system of claim 7, wherein the second conveying part (120) is provided with a drying mechanism (130), the drying mechanism (130) is positioned between the stamping device and the board collecting device, and the drying mechanism (130) is used for drying the marks on the PCB.

9. The automatic PCB stamping system according to claim 7, wherein the first conveying part (110) is provided with a limiting mechanism, the limiting mechanism is positioned between the board placing device and the stamping device, and the limiting mechanism is used for correcting the position of the PCB.

10. The automatic PCB stamping system according to claim 9, wherein the limiting mechanism comprises limiting plates (140) arranged on two sides of the conveying mechanism, the limiting plates (140) are arranged obliquely, and the distance between the limiting plates (140) is gradually narrowed from the plate placing device to one end of the stamping device.