CN215846226U - Welding equipment for semiconductor product production - Google Patents
Welding equipment for semiconductor product production Download PDFInfo
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- CN215846226U CN215846226U CN202122131502.6U CN202122131502U CN215846226U CN 215846226 U CN215846226 U CN 215846226U CN 202122131502 U CN202122131502 U CN 202122131502U CN 215846226 U CN215846226 U CN 215846226U
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Abstract
The utility model relates to welding equipment for semiconductor product production, which comprises a bottom plate, a supporting rod, a cross rod, an air cylinder and a welding unit, wherein the supporting rod is vertically arranged on the bottom plate, one end of the cross rod is connected with the upper end of the supporting rod through a bearing, the air cylinder is vertically arranged on the cross rod downwards, the welding unit is arranged at the top of an air rod of the air cylinder, the welding unit comprises a shell, a reel, a guide assembly and a heating head, and the welding equipment for semiconductor product production not only can realize the function of automatically conveying welding wires, but also can play a role in guiding the conveying of the welding wires through the arrangement of the guide unit, thereby improving the automation degree of the equipment and the practicability.
Description
Technical Field
The utility model relates in particular to a welding device for the production of semiconductor products.
Background
In the production of semiconductor products, welding operation is required, and the existing welding equipment generally adopts manual installation and welding wire receiving and feeding, so that the operation is very inconvenient.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: in order to overcome the defects of the prior art, a welding device for semiconductor product production is provided.
The technical scheme adopted by the utility model for solving the technical problems is as follows: a welding device for semiconductor product production comprises a bottom plate, a supporting rod, a cross rod, an air cylinder and a welding unit, wherein the supporting rod is vertically arranged on the bottom plate, one end of the cross rod is connected with the upper end of the supporting rod through a bearing, the air cylinder is vertically arranged on the cross rod downwards, and the welding unit is arranged at the top of an air rod of the air cylinder;
the welding unit includes casing, reel, direction subassembly and heating head, the gas pole top at the cylinder is fixed to the casing, casing cavity sets up, the reel is located the casing, it has the welding wire to coil on the reel, the direction subassembly is located the reel below, the direction subassembly includes a plurality of direction units, and each direction unit sets gradually from top to bottom, the direction unit includes two gyro wheels that set up side by side, and the outer peripheral face of two gyro wheels is tangent, be equipped with the cross-section on the outer peripheral face of gyro wheel and be semicircular ring channel, the ring channel of two gyro wheels is just to setting up, the welding wire passes the ring channel of two gyro wheels, the heating head is located the lower extreme of casing.
Preferably, the roller is a rubber wheel, and the diameter of the annular groove of the roller is slightly smaller than that of the welding wire.
The welding equipment for producing the semiconductor products has the advantages that through the arrangement of the guide unit, the function of automatically conveying the welding wires can be realized, the guide effect of conveying the welding wires can be realized, the automation degree of the equipment is improved, and the practicability is improved.
Drawings
The utility model is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural view of a bonding apparatus for semiconductor product production of the present invention;
in the figure: 1. the device comprises a bottom plate, 2. a support rod, 3. a cross rod, 4. a cylinder, 5. a shell, 6. a reel, 7. a roller and 8. a heating head.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in fig. 1, a welding device for semiconductor product production comprises a bottom plate 1, a support rod 2, a cross rod 3, a cylinder 4 and a welding unit, wherein the support rod 2 is vertically arranged on the bottom plate 1, one end of the cross rod 3 is connected with the upper end of the support rod 2 through a bearing, the cylinder 4 is vertically arranged downwards on the cross rod 3, and the welding unit is arranged at the top of a gas rod of the cylinder 4;
welding element includes casing 5, reel 6, direction subassembly and heating head 8, casing 5 is fixed at the gas pole top of cylinder 4, 5 cavity settings of casing, reel 6 is located casing 5, it has the welding wire to coil on reel 6, the direction subassembly is located reel 6 below, the direction subassembly includes a plurality of direction units, and each direction unit sets gradually from top to bottom, the direction unit includes two gyro wheels 7 that set up side by side, and the outer peripheral face of two gyro wheels 7 is tangent, be equipped with the cross-section on the outer peripheral face of gyro wheel 7 and be semicircular ring channel, the ring channel of two gyro wheels 7 is just to setting up, the welding wire passes the ring channel of two gyro wheels 7, heating head 8 is located casing 5's lower extreme.
Preferably, the roller 7 is a rubber wheel, and the diameter of the annular groove of the roller 7 is slightly smaller than that of the welding wire.
When in use, the welding wire is preset on the reel 6, the whole reel can be replaced, the welding wire passes through the annular grooves of the two rollers 7 to the heating head 8, the heating head 8 melts the welding wire by heating to realize welding, the cross bar 3 is connected with the support bar 2 through a bearing, mainly to enable the cross bar 3 to rotate and enlarge the working range, the cylinder 4 is arranged to realize lifting, the annular grooves of the two rollers 5 of the same guide unit here in fact form a circular hole at the contact, the circular hole is in interference fit with the welding wire, so that the welding wire on the reel 6 can be pulled when the roller 5 rotates, automatic transmission is realized, the roller 5 is actually driven by a motor, and a rubber wheel is adopted here, mainly for increasing friction force and better driving the welding wire, and also for reducing rigid contact and preventing the welding wire from being pinched off.
Compared with the prior art, this a welding equipment for semiconductor product production passes through the setting of guide unit, not only can realize the function of automatic welding wire of carrying, but also can play the guide effect to the welding wire conveying, has promoted the degree of automation of equipment, has improved the practicality.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations can be made by the worker in the light of the above teachings without departing from the spirit of the utility model. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (2)
1. The welding equipment for producing the semiconductor product is characterized by comprising a bottom plate, a supporting rod, a cross rod, an air cylinder and a welding unit, wherein the supporting rod is vertically arranged on the bottom plate, one end of the cross rod is connected with the upper end of the supporting rod through a bearing, the air cylinder is vertically arranged on the cross rod downwards, and the welding unit is arranged at the top of an air rod of the air cylinder;
the welding unit includes casing, reel, direction subassembly and heating head, the gas pole top at the cylinder is fixed to the casing, casing cavity sets up, the reel is located the casing, it has the welding wire to coil on the reel, the direction subassembly is located the reel below, the direction subassembly includes a plurality of direction units, and each direction unit sets gradually from top to bottom, the direction unit includes two gyro wheels that set up side by side, and the outer peripheral face of two gyro wheels is tangent, be equipped with the cross-section on the outer peripheral face of gyro wheel and be semicircular ring channel, the ring channel of two gyro wheels is just to setting up, the welding wire passes the ring channel of two gyro wheels, the heating head is located the lower extreme of casing.
2. The bonding apparatus for semiconductor product production as claimed in claim 1, wherein the roller is a rubber wheel, and the annular groove of the roller has a diameter slightly smaller than the diameter of the bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122131502.6U CN215846226U (en) | 2021-09-03 | 2021-09-03 | Welding equipment for semiconductor product production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122131502.6U CN215846226U (en) | 2021-09-03 | 2021-09-03 | Welding equipment for semiconductor product production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215846226U true CN215846226U (en) | 2022-02-18 |
Family
ID=80245870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122131502.6U Active CN215846226U (en) | 2021-09-03 | 2021-09-03 | Welding equipment for semiconductor product production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215846226U (en) |
-
2021
- 2021-09-03 CN CN202122131502.6U patent/CN215846226U/en active Active
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| GR01 | Patent grant | ||
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