CN215835724U - Anti-vibration power amplifier - Google Patents
Anti-vibration power amplifier Download PDFInfo
- Publication number
- CN215835724U CN215835724U CN202121960422.5U CN202121960422U CN215835724U CN 215835724 U CN215835724 U CN 215835724U CN 202121960422 U CN202121960422 U CN 202121960422U CN 215835724 U CN215835724 U CN 215835724U
- Authority
- CN
- China
- Prior art keywords
- power amplifier
- circuit board
- amplifier circuit
- buffer
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an anti-seismic power amplifier, which comprises a shell, a power amplifier circuit board and a buffer assembly, wherein the power amplifier circuit board is arranged on the shell; the shell is provided with an inner cavity; the power amplifier circuit board is arranged in the inner cavity; the buffer assembly comprises a buffer base plate, the buffer base plate is connected to the side wall of the power amplifier circuit board, and a plurality of through holes are formed in the buffer base plate. According to the technical scheme, the power amplifier circuit board is arranged in the inner cavity of the shell, so that the shell has a good protection effect on the power amplifier circuit board. Furthermore, the buffer base plate is connected to the side wall of the power amplifier circuit board, so that the buffer base plate can achieve a good buffer effect for the power amplifier circuit board, and the side wall of the power amplifier circuit board is prevented from directly impacting the inner wall of the shell. In addition, through the through holes formed in the buffer base plate, heat generated by the power amplifier circuit board during working can be timely dissipated through the through holes.
Description
Technical Field
The utility model relates to the technical field of microwave assemblies, in particular to a power amplifier.
Background
Power amplifiers are used in electronics and to some extent have an important effect on whether the overall system can provide a good output. Once the power amplifier is subjected to impact force in the using process, the internal power amplifier circuit board is easy to damage, and the existing power amplifier does not have the anti-seismic effect on the power amplifier circuit board or has a poor anti-seismic effect on the power amplifier circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide an anti-seismic power amplifier, aiming at solving the problem that the existing power amplifier does not have the anti-seismic effect on a power amplifier circuit board.
In order to achieve the purpose, the anti-seismic power amplifier provided by the utility model comprises a shell, a power amplifier circuit board and a buffer assembly; the shell is provided with an inner cavity; the power amplifier circuit board is arranged in the inner cavity; the buffer assembly comprises a buffer base plate, the buffer base plate is connected to the side wall of the power amplifier circuit board, and a plurality of through holes are formed in the buffer base plate.
Optionally, the cushion assembly further comprises a first elastic member embedded in the cushion pad.
Optionally, the buffering assembly further comprises a first elastic member, one end of the first elastic member is connected to the buffering cushion plate, and the other end of the first elastic member is connected to the inner wall of the housing.
Optionally, one end of the first elastic element is embedded in the buffer backing plate; and/or, the inner wall of casing is equipped with the mounting groove, the other end of first elastic component inserts in the mounting groove.
Optionally, an anti-seismic support assembly is disposed on a bottom wall of the inner cavity, and the power amplifier circuit board is disposed on the anti-seismic support assembly.
Optionally, the anti-seismic support assembly comprises a support block and a second elastic member; the supporting block is connected to the bottom wall of the inner cavity; one end of the second elastic piece is embedded into the supporting block, and the other end of the second elastic piece extends towards the direction departing from the bottom wall of the inner cavity and is connected with the power amplifier circuit board.
Optionally, the second elastic element extends perpendicular to the bottom wall of the inner cavity; or the extending direction of the second elastic piece and the bottom wall of the inner cavity form an acute angle.
Optionally, the housing further has a plurality of heat dissipation holes, and the housing further rotatably connects to a dust cap, and the dust cap can open or cover at least a portion of the heat dissipation holes.
Optionally, the housing is provided with a rotating shaft, the rotating shaft is arranged close to the heat dissipation holes, the dust cover is provided with a shaft hole, the shaft hole is arranged close to the edge of the dust cover, and the rotating shaft penetrates through the shaft hole; the shell is also provided with a first supporting part and a second supporting part, the first supporting part is arranged on one side of the rotating shaft away from the heat dissipation hole, and when the heat dissipation hole is opened by the dustproof cover, the dustproof cover is supported by the first supporting part; the second supporting part is arranged on one side, away from the rotating shaft, of the heat dissipation hole, and when the dust cover covers the heat dissipation hole, the dust cover is supported by the second supporting part.
Optionally, the bottom of the casing is connected with a plurality of supporting legs, and a plurality of supporting legs are arranged at intervals.
According to the technical scheme, the power amplifier circuit board is arranged in the inner cavity of the shell, so that the shell has a good protection effect on the power amplifier circuit board. Furthermore, the buffer base plate is connected to the side wall of the power amplifier circuit board, so that the buffer base plate can achieve a good buffer effect for the power amplifier circuit board, and the side wall of the power amplifier circuit board is prevented from directly impacting the inner wall of the shell. In addition, the buffer base plate is provided with the through holes, so that the buffer base plate can buffer the power amplifier circuit board, and meanwhile, heat generated by the power amplifier circuit board during working can be timely dissipated through the through holes, and the fact that electric elements on the power amplifier circuit board can continue to work normally is guaranteed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a longitudinal cross-sectional structure of an anti-vibration power amplifier according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of the anti-vibration power amplifier with the heat dissipation hole opened by the dust cap;
FIG. 3 is a schematic structural view of the anti-vibration power amplifier dust cap of the present invention when it shields the heat dissipation hole.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
110 | |
| 120 | |
130 | Mounting post |
| 140 | A first supporting |
150 | Second supporting |
| 160 | |
200 | Power |
| 300 | |
310 | |
| 311 | Through |
320 | First |
| 400 | |
410 | Supporting |
| 420 | Second |
500 | Dust- |
| 600 | Supporting foot |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides an anti-seismic power amplifier.
In the embodiment of the present invention, as shown in fig. 1, the anti-vibration power amplifier includes a housing 100, a power amplifier circuit board 200, and a buffer assembly 300; the housing 100 has an inner cavity; the power amplifier circuit board 200 is arranged in the inner cavity; the buffer assembly 300 includes a buffer pad 310, the buffer pad 310 is connected to a sidewall of the power amplifier circuit board 200, and a plurality of through holes 311 are formed on the buffer pad 310.
The mounting stability of the power amplifier circuit board 200 has a significant effect on the performance of the whole power amplifier, and the power amplifier circuit board 200 should be prevented from shaking to a greater extent during the use process. In the technical scheme of the utility model, by arranging the buffer assembly 300 and connecting the buffer base plate 310 of the buffer assembly 300 to the side wall of the power amplifier circuit board 200, the power amplifier circuit board 200 can have a good buffer effect through the buffer base plate 310 when the power amplifier circuit board 200 shakes, so that the power amplifier circuit board 200 is prevented from directly impacting the inner wall of the shell 100, and the power amplifier circuit board 200 is protected well.
Specifically, the cushion plate 310 may be a cushion foam pad, a sponge pad, a cushion rubber pad, a cushion silicone pad, or the like. Further, it can be understood that the power amplifier circuit board 200 generates heat during operation, and if the power amplifier circuit board is continuously in a high heat state, the power amplifier circuit board 200 may damage electrical components. In the above technical solution of the present invention, the plurality of through holes 311 are formed on the buffer pad 310, so that the buffer pad 310 can play a role in buffering, and can also dissipate heat generated during the operation of the power amplifier circuit board 200, thereby preventing the buffer pad 310 and the power amplifier circuit board 200 from accumulating much heat. Further, in order to realize a better heat dissipation effect, the through holes 311 of the cushion plate 310 may be provided in a plurality of numbers, the cushion plate 310 may be further provided with a heat dissipation channel perpendicular to the axis of the through holes 311, and two ports of the heat dissipation channel are respectively communicated with the through holes 311 of two opposite sides of the cushion plate 310, so that the buffering effect can be further improved on the one hand, and a better heat dissipation effect can be realized on the other hand. In addition, the surface of the cushion plate 310 may be flat or curved. It is understood that the surface of the cushion plate 310 may be wavy, so as to improve the buffering effect, increase the heat dissipation area, and improve the heat dissipation efficiency.
According to the technical scheme of the utility model, the power amplifier circuit board 200 is arranged in the inner cavity of the shell 100, so that the shell 100 has a good protection effect on the power amplifier circuit board 200. Further, by attaching the buffer pad 310 to the sidewall of the power amplifier circuit board 200, the buffer pad 310 can provide a better buffer effect for the power amplifier circuit board 200, so as to prevent the sidewall of the power amplifier circuit board 200 from directly impacting the inner wall of the housing 100. In addition, through the plurality of through holes 311 formed in the buffer backing plate 310, the buffer backing plate 310 can buffer the power amplifier circuit board 200, and simultaneously can timely dissipate heat generated during the operation of the power amplifier circuit board 200 through the plurality of through holes 311, thereby ensuring that electrical components on the power amplifier circuit board 200 can continue to operate normally.
In one embodiment, as shown in fig. 1, the cushion assembly 300 further includes a first elastic member 320, and the first elastic member 320 is embedded in the cushion plate 310.
By embedding the first elastic member 320 in the cushion plate 310, the first elastic member 320 and the cushion plate 310 can simultaneously have a buffering effect on the power amplifier circuit board 200. In addition, the strength of the cushion plate 310 can be further improved by embedding the first elastic member 320 into the cushion plate 310, and the first elastic member 320 is embedded into the cushion plate 310 based on the effect of improving the shock resistance, so that the space of the inner cavity of the housing 100 is not occupied too much by the added first elastic member 320.
Specifically, the first elastic element 320 may be a spring or a leaf spring. When the first elastic member 320 is a spring, one end of the first elastic member 320 is close to the power amplifier circuit board 200, and the other end extends in a direction away from the power amplifier circuit board 200. The first elastic element 320 may be disposed perpendicular to the sidewall of the power amplifier circuit board 200, or disposed at an acute angle with respect to the sidewall of the power amplifier circuit board 200.
In another embodiment, as shown in fig. 1, the buffering assembly 300 further includes a first elastic member 320, one end of the first elastic member 320 is connected to the buffering plate 310, and the other end is connected to the inner wall of the casing 100.
In this embodiment, one end of the first elastic member 320 is connected to the cushion plate 310, and the other end is connected to the inner wall of the housing 100, so that the buffering effect on the power amplifier circuit board 200 can still be further improved. In addition, due to the arrangement, the buffer pad 310 does not directly contact with the inner wall of the casing 100, and heat generated by the buffer pad 310 due to the work of the power amplifier circuit board 200 can be dissipated through the gap between the buffer pad and the casing 100, so that the heat dissipation efficiency is improved.
As shown in fig. 1, in the present embodiment, one end of the first elastic member 320 is embedded in the cushion plate 310 based on a scheme that one end of the first elastic member 320 is connected to the cushion plate 310 and the other end is connected to the inner wall of the housing 100.
By embedding one end of the first elastic member 320 into the cushion plate 310, the end of the first elastic member 320 embedded into the cushion plate 310 can be protected.
Further, the inner wall of the housing 100 is provided with a mounting groove 120, and the other end of the first elastic member 320 is inserted into the mounting groove 120. With such an arrangement, a better protection effect can be provided for the end of the first elastic element 320 inserted into the mounting groove 120.
Specifically, the first elastic member 320 may be connected by welding with the bottom wall of the mounting groove 120 when being mounted in the mounting groove 120. Further, the bottom wall of the mounting groove 120 is convexly provided with the mounting post 130, the first elastic member 320 is a spring, and one end of the first elastic member 320, which is far away from the cushion pad 310, is sleeved outside the first mounting post 130.
Further, as shown in fig. 1, the bottom wall of the inner cavity is provided with an anti-vibration support assembly 400, and the power amplifier circuit board 200 is arranged on the anti-vibration support assembly 400.
By disposing the anti-vibration support assembly 400 on the bottom wall of the inner cavity and disposing the power amplifier circuit board 200 on the anti-vibration support assembly 400, the bottom of the power amplifier circuit board 200 can be supported by the anti-vibration support assembly 400 and has a better buffering effect.
Specifically, as shown in fig. 1, the anti-seismic support assembly 400 includes a support block 410 and a second elastic member 420, the support block 410 being connected to a bottom wall of the inner cavity; the second elastic member 420 has one end embedded in the supporting block 410 and the other end extending away from the bottom wall of the cavity and connected to the power amplifier circuit board 200.
By providing the supporting block 410, the circuit board may be supported by the supporting block 410. By providing the second elastic member 420, and one end of the second elastic member 420 is embedded into the supporting block 410, and the other end extends in a direction away from the bottom wall of the cavity and is connected to the power amplifier circuit board 200, the second elastic member 420 can play a role in buffering the impact trend of the power amplifier circuit board 200 in the downward direction, thereby preventing the second elastic member 420 from directly impacting the supporting block 410 or the bottom wall of the housing 100.
Further, the support block 410 may be an elastic support block 410 or a non-elastic support block 410. Two supporting blocks 410 can be arranged, and the two supporting blocks 410 respectively correspond to two opposite edge positions of the power amplifier circuit board 200, so that the two opposite edges of the power amplifier circuit board 200 are both supported well, and the power amplifier circuit board 200 is prevented from being placed unstably. In addition, the supporting blocks 410 are disposed below two opposite edges of the corresponding power amplifier circuit board 200, so that the middle position of the power amplifier circuit board 200 can be suspended, and the heat dissipation efficiency of the power amplifier circuit board 200 is further improved.
Further, as shown in fig. 1, the second elastic member 420 extends perpendicular to the bottom wall of the inner cavity.
The second elastic member 420 extends perpendicular to the bottom wall of the cavity, so that the second elastic member 420 has a better buffering effect on the power amplifier circuit board 200 in the direction perpendicular to the bottom wall of the cavity.
Alternatively, in another embodiment, the extending direction of the second elastic member 420 forms an acute angle with the bottom wall of the inner cavity. So configured, the second elastic member 420 can also resist the impact force from the oblique direction.
It should be noted that a plurality of second elastic members 420 may be provided, and the plurality of second elastic members 420 may extend perpendicular to the bottom wall direction of the inner cavity; alternatively, the extending directions of the second elastic members 420 may all form an acute angle with the bottom wall of the inner cavity; or, a part of the second elastic members 420 of the plurality of second elastic members 420 extends perpendicular to the bottom wall of the inner cavity, and an included angle between the extending direction of the other part of the second elastic members 420 and the bottom wall of the inner cavity is an acute angle.
Further, referring to fig. 2 and fig. 3, the housing 100 further has a plurality of heat dissipation holes 110, the housing 100 is further rotatably connected with a dust cover 500, and the dust cover 500 can open or cover at least a portion of the heat dissipation holes 110.
Through the plurality of heat dissipation holes 110 formed in the housing 100, heat in the housing 100 can be dissipated, so as to ensure that electrical components on the power amplifier circuit board 200 can work normally. In addition, the housing 100 is further rotatably connected with the dust cap 500, the dust cap 500 can open or cover at least part of the heat dissipation holes 110, and when the dust cap 500 opens the heat dissipation holes 110, the heat in the housing 100 can be dissipated through the heat dissipation holes 110; when the dust cap 500 covers at least a portion of the heat dissipation holes 110, dust or impurities can be prevented from entering the housing 100 through the heat dissipation holes 110 covered by the dust cap 500, thereby achieving a certain dust-proof effect.
Further, the heat dissipation holes 110 may be disposed corresponding to the buffer board 310 to expose a portion of the buffer board 310, so that heat transferred from the buffer board 310 to the power amplifier circuit board 200 may be directly dissipated through the heat dissipation holes 110, thereby reducing heat dissipation paths and improving heat dissipation efficiency.
Further, referring to fig. 2 and fig. 3, the housing 100 is provided with a rotating shaft 160, the rotating shaft 160 is disposed near the heat dissipating hole 110, the dust cap 500 is provided with a shaft hole, the shaft hole is disposed near the edge of the dust cap 500, and the rotating shaft 160 penetrates the shaft hole; the housing 100 is further provided with a first supporting portion 140 and a second supporting portion 150, the first supporting portion 140 is disposed on a side of the rotating shaft 160 away from the heat dissipating hole 110, and when the heat dissipating hole 110 is opened by the dust cap 500, the first supporting portion 140 supports the dust cap 500; the second supporting portion 150 is disposed on a side of the heat dissipating hole 110 away from the rotating shaft 160, and when the dust cap 500 covers the heat dissipating hole 110, the second supporting portion 150 supports the dust cap 500.
Through set up pivot 160 on casing 100, pivot 160 is close to louvre 110 setting, and shield 500 is equipped with the shaft hole that is close to its edge, and then shield 500 can revolve around pivot 160, and when shield 500 revolved pivot 160 and rotated, shield 500 can realize opening louvre 110 and sheltering from louvre 110's two kinds of states. In addition, by providing the first supporting portion 140 on the housing 100, and providing the first supporting portion 140 on the side of the rotating shaft 160 away from the heat dissipation hole 110, it can be understood that, in the process of rotating the dust cap 500 around the rotating shaft 160, the edge of the dust cap 500 away from the rotating shaft 160 can have a state close to the first supporting portion 140 and supported by the first supporting portion 140, so as to achieve the effect of opening the heat dissipation hole 110 by the dust cap 500, and ensure that the dust cap 500 can maintain a stable state when being in a state of opening the heat dissipation hole 110. In addition, by providing the second supporting portion 150 on the housing 100, the second supporting portion 150 is disposed on one side of the heat dissipation hole 110 away from the rotating shaft 160, it can be understood that, in the process of rotating the dust cap 500 around the rotating shaft 160, the edge of the dust cap 500 away from the rotating shaft 160 can have a state close to the second supporting portion 150 and supported by the second supporting portion 150, so as to achieve the effect of covering the heat dissipation hole 110 with the dust cap 500, and ensure that the dust cap 500 can maintain a stable state when being in a state of covering the heat dissipation hole 110. Specifically, the first supporting portion 140 and the second supporting portion 150 are respectively disposed at the left and right sides of the heat dissipation hole 110.
Of course, in other embodiments, only one supporting portion may be provided, and the supporting portion is disposed above the heat dissipation hole 110 and can support the dust cap 500 so that the dust cap 500 maintains a stable state.
Further, as shown in fig. 1, 2 or 3, a plurality of support legs 600 are connected to the bottom of the housing 100, and the support legs 600 are disposed at intervals.
The bottom of the shell 100 is connected with the plurality of supporting feet 600 which are arranged at intervals, so that on one hand, the supporting feet 600 can support the shell 100, and the situation that the whole bottom wall of the shell 100 is seriously abraded is avoided; on the other hand, the power amplifier in the technical scheme of the utility model is convenient for users to carry.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An anti-vibration power amplifier, comprising:
a housing having an interior cavity;
the power amplifier circuit board is arranged in the inner cavity; and
the buffer assembly comprises a buffer base plate, the buffer base plate is connected to the side wall of the power amplifier circuit board, and a plurality of through holes are formed in the buffer base plate.
2. An anti-seismic power amplifier according to claim 1, wherein the buffer assembly further comprises a first elastic member embedded within the buffer backing plate.
3. An anti-seismic power amplifier according to claim 1, wherein the buffer assembly further comprises a first elastic member, the first elastic member having one end connected to the buffer pad and the other end connected to an inner wall of the housing.
4. An anti-seismic power amplifier according to claim 3, wherein one end of the first elastic member is embedded in the cushion pad; and/or, the inner wall of casing is equipped with the mounting groove, the other end of first elastic component inserts in the mounting groove.
5. An anti-seismic power amplifier according to any of claims 1-4, wherein the bottom wall of the internal cavity is provided with an anti-seismic support assembly, and the power amplifier circuit board is provided on the anti-seismic support assembly.
6. An anti-seismic power amplifier according to claim 5, wherein the anti-seismic support assembly comprises:
the supporting block is connected to the bottom wall of the inner cavity; and
and one end of the second elastic piece is embedded into the supporting block, and the other end of the second elastic piece extends towards the direction departing from the bottom wall of the inner cavity and is connected with the power amplifier circuit board.
7. An anti-seismic power amplifier according to claim 6, wherein the second resilient member extends perpendicular to the bottom wall of the internal cavity; or the extending direction of the second elastic piece and the bottom wall of the inner cavity form an acute angle.
8. An aseismatic power amplifier according to any one of claims 1 to 4, characterized in that the housing further has a plurality of heat dissipation apertures, and that the housing is further rotatably connectable with a dust cap that can open or cover at least part of the heat dissipation apertures.
9. The anti-seismic power amplifier according to claim 8, wherein the housing has a shaft disposed adjacent to the heat dissipation holes, the dust cap has a shaft hole disposed adjacent to an edge of the dust cap, and the shaft hole is penetrated by the shaft;
the shell is also provided with a first supporting part and a second supporting part, the first supporting part is arranged on one side of the rotating shaft away from the heat dissipation hole, and when the heat dissipation hole is opened by the dustproof cover, the dustproof cover is supported by the first supporting part; the second supporting part is arranged on one side, away from the rotating shaft, of the heat dissipation hole, and when the dust cover covers the heat dissipation hole, the dust cover is supported by the second supporting part.
10. An anti-seismic power amplifier according to claim 9, wherein a plurality of support feet are connected to the bottom of the housing, the plurality of support feet being spaced apart.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121960422.5U CN215835724U (en) | 2021-08-19 | 2021-08-19 | Anti-vibration power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121960422.5U CN215835724U (en) | 2021-08-19 | 2021-08-19 | Anti-vibration power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215835724U true CN215835724U (en) | 2022-02-15 |
Family
ID=80195720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121960422.5U Active CN215835724U (en) | 2021-08-19 | 2021-08-19 | Anti-vibration power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215835724U (en) |
-
2021
- 2021-08-19 CN CN202121960422.5U patent/CN215835724U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210670131U (en) | Switch easy to radiate heat | |
| CN215835724U (en) | Anti-vibration power amplifier | |
| CN210605609U (en) | Totally-enclosed dustproof industrial personal computer | |
| CN212783432U (en) | Novel ESD transistor | |
| CN210739257U (en) | Mounting device with damping function for energy storage equipment | |
| CN212229537U (en) | Remove convenient computer machine case | |
| CN216648137U (en) | Keyboard with buffer structure | |
| CN220188946U (en) | Fan bracket structure of server | |
| CN217061622U (en) | Combined type mounting structure of chip thermistor | |
| CN212569584U (en) | Electronic device | |
| CN211321446U (en) | Quick detachable wireless communication gateway | |
| CN213518096U (en) | Multifunctional shell of notebook computer | |
| CN211149311U (en) | Dustproof shock attenuation slot of computer | |
| CN220730764U (en) | Low noise host computer power shell | |
| CN211352823U (en) | Anti-seismic copper-clad plate easy to install | |
| CN213182525U (en) | Mainframe box for big data statistics and calculation | |
| CN211448987U (en) | Peristaltic pump with novel mounting structure | |
| CN217404812U (en) | Computer hard disk mounting plate | |
| CN213872924U (en) | Mobile air conditioner comdenstion water suction pump shock-absorbing structure and mobile air conditioner | |
| CN213518151U (en) | A shock attenuation support fixed foot for computer circuit board | |
| CN213042955U (en) | Lithium battery module with self-protection function | |
| CN218497452U (en) | Computer heat dissipation shell | |
| CN215734001U (en) | Power adapter with shock-resistant and drop-resistant structure | |
| CN213365428U (en) | Mainboard shockproof structure | |
| CN211506395U (en) | External radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |