CN215823767U

CN215823767U - Wafer cleaning clamp

Info

Publication number: CN215823767U
Application number: CN202122219685.7U
Authority: CN
Inventors: 潘相成; 陈虹
Original assignee: Changzhou C Pe Photo Electricity Scientific And Technical Co ltd
Current assignee: Changzhou C Pe Photo Electricity Scientific And Technical Co ltd
Priority date: 2021-09-14
Filing date: 2021-09-14
Publication date: 2022-02-15
Anticipated expiration: 2031-09-14

Abstract

The utility model discloses a wafer cleaning clamp, and particularly relates to the technical field of wafer processing. According to the wafer cleaning machine, the wafers are placed in the first article placing groove formed in the top of the lower clamping plate, the upper clamping plate is placed on the top of the lower clamping plate, the threaded rod is held, the threaded sleeve is rotated, the upper clamping plate is driven to move downwards, the wafers are limited and fixed, the wafers cannot move or slide off in the cleaning process, the structure is simple, the operation is convenient, the wafer clamping efficiency is high, and the high-pressure water gun can clean the tops of the wafers through the water inlet grooves, so that each wafer can be cleaned uniformly.

Description

Wafer cleaning clamp

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a wafer cleaning clamp.

Background

In the semiconductor equipment manufacturing industry, a wafer clamping process exists, and a wafer clamping tool is required in the process; so as to ensure that the wafer is not displaced, deformed and damaged in the clamping process. In the process of clamping and cleaning the small-size wafer at present, a basket cleaning mode is usually adopted for clamping and cleaning the wafer. In the prior art, the wafers are placed in a basket and then washed by a high-pressure water gun, and the wafer clamping efficiency is low in the mode, so that the problem that each wafer cannot be uniformly cleaned is solved.

The above information disclosed in this background section is only for enhancement of understanding of the background of the disclosure and therefore it may contain information that does not constitute prior art that is already known to a person of ordinary skill in the art.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a wafer cleaning fixture to solve the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a wafer cleaning clamp, includes the lower plate, a plurality of first thing groove of putting has been seted up on the lower plate top, the lower plate top is equipped with the punch holder, the punch holder bottom has been seted up a plurality of seconds and has been put the thing groove, and is a plurality of the second is put the thing groove and is located a plurality of first thing groove tops of putting respectively, the punch holder top is equipped with two threaded rods, set up two first logical grooves, two on the punch holder threaded rod one end passes two first logical grooves respectively, the punch holder top is equipped with two thread bushings, two the thread bushing is movable sleeve respectively and is established at two threaded rod outer peripheral faces.

In a preferred embodiment, a plurality of drainage grooves are formed in the top end of the lower splint, and the drainage grooves are respectively communicated with the first storage grooves.

In a preferred embodiment, the lower clamping plate is provided with two thread grooves, and the bottom ends of the two thread rods respectively extend into the two thread grooves.

In a preferred embodiment, a plurality of water inlet grooves are formed in the top end of the upper clamping plate, and the plurality of water inlet grooves are respectively communicated with the plurality of second storage grooves.

In a preferred embodiment, two sides of each of the two threaded rods are provided with a sliding rod, the upper clamping plate is provided with four second through grooves, one ends of the four sliding rods respectively penetrate through the four second through grooves, and the bottom ends of the four sliding rods are fixedly connected with the top end of the lower clamping plate.

In a preferred embodiment, four springs are arranged between the lower clamping plate and the upper clamping plate, and the four springs are respectively movably sleeved on the peripheral surfaces of the four sliding rods.

The utility model has the technical effects and advantages that:

the utility model fixes the threaded rod and the lower clamp plate by rotating the threaded rod, then puts the wafer into the first object placing groove arranged at the top of the lower clamp plate, respectively sleeves four springs on the peripheral surfaces of four sliding rods, then puts the upper clamp plate on the top of the lower clamp plate, and one end of each of the two threaded rods respectively passes through two first through grooves, and one end of each of the four sliding rods respectively passes through four second through grooves, thereby limiting the upper clamp plate, preventing the upper clamp plate from deflecting, enabling the second object placing groove to be positioned right above the first object placing groove, then holds the threaded rod and rotates the threaded sleeve, the threaded sleeve moves downwards on the threaded rod, thereby driving the upper clamp plate to move downwards, enabling the top of the wafer to be positioned in the second object placing groove, thereby limiting and fixing the wafer, enabling the wafer not to move or slide down in the process of being cleaned, and having simple structure, convenient operation and high wafer clamping efficiency, through setting up a plurality of intake chambers, the high-pressure squirt can wash the wafer top through a plurality of intake chambers for every wafer can both receive even washing.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.

FIG. 1 is a perspective view of the overall structure of the present invention;

FIG. 2 is a perspective view of the lower splint of the present invention;

FIG. 3 is a bottom perspective view of the upper jaw of the present invention;

in the figure: 1. a lower splint; 2. an upper splint; 3. a slide bar; 4. a threaded sleeve; 5. a water inlet groove; 6. a spring; 7. a water discharge tank; 8. a first storage groove; 9. a threaded rod; 10. a second storage tank; 11. a thread groove; 12. a first through groove; 13. a second through slot.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided to give a thorough understanding of example embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, steps, and so forth. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the disclosure.

Referring to the attached drawings 1-3 of the specification, the wafer cleaning clamp comprises a lower clamp plate 1, a plurality of first object placing grooves 8 are formed in the top end of the lower clamp plate 1, wafers are convenient to place, an upper clamp plate 2 is arranged at the top of the lower clamp plate 1, a plurality of second object placing grooves 10 are formed in the bottom end of the upper clamp plate 2, the wafers are convenient to limit and fix, the object placing grooves 10 are respectively located at the tops of the first object placing grooves 8, two threaded rods 9 are arranged at the top of the upper clamp plate 2, two first through grooves 12 are formed in the upper clamp plate 2, one ends of the two threaded rods 9 respectively penetrate through the two first through grooves 12, two threaded sleeves 4 are arranged at the top of the upper clamp plate 2, the threaded sleeves 4 downwards move on the threaded rods 9, and the upper clamp plate 2 is driven to downwards move, and the two threaded sleeves 4 are respectively movably sleeved on the outer peripheral surfaces of the two threaded rods 9.

Referring to the attached drawings 1-2 of the specification, a plurality of water drainage grooves 7 have been seted up on 1 top of lower plate, the first water of putting in the thing groove 8 can be discharged through water drainage groove 7, conveniently discharge sewage, a plurality of water drainage grooves 7 are linked together with a plurality of first thing groove 8 of putting respectively, refer to attached drawing 2 of the specification, two thread grooves 11 have been seted up on lower plate 1, reverse threaded rod 9 makes threaded rod 9 shift out in the thread groove 11, conveniently change threaded rod 9, inside two thread grooves 11 were extended into respectively to two threaded rod 9 bottoms, refer to attached drawings 1 and 3 of the specification, a plurality of intake chambers 5 have been seted up on 2 tops of upper plate, the high-pressure squirt can wash the wafer top through a plurality of intake chambers 5, make every wafer can both receive even washing, a plurality of intake chambers 5 are linked together with a plurality of second thing groove 10 respectively.

Referring to the attached drawing 1 of the specification, two 9 both sides of threaded rod all are equipped with slide bar 3, it is spacing to punch holder 2, prevent punch holder 2 from deflecting, four second through grooves 13 have been seted up on punch holder 2, inside four second through grooves 13 were passed respectively to four 3 one ends of slide bar, and four 3 bottoms of slide bar all with 1 top fixed connection of punch holder, refer to attached drawing 1 of the specification, be equipped with four springs 6 between punch holder 1 and the punch holder 2, four springs 6 carry out simple support to punch holder 2, prevent that punch holder 2 from falling down rapidly under the effect of self gravity, thereby cause the damage to the wafer, four springs 6 movable sleeve establish respectively at four slide bar 3 outer peripheral faces.

The using method of the embodiment comprises the following steps: a worker inserts two threaded rods 9 into two threaded grooves 11 respectively, rotates the threaded rods 9 to fix the threaded rods 9 with the lower clamp plate 1, reverses the threaded rods 9 to move the threaded rods 9 out of the threaded grooves 11 similarly to facilitate replacement of the threaded rods 9, then places wafers into a first storage groove 8 formed in the top of the lower clamp plate 1, sleeves four springs 6 on the outer peripheral surfaces of four sliding rods 3 respectively, then places the upper clamp plate 2 on the top of the lower clamp plate 1, wherein one end of each of the two threaded rods 9 penetrates through two first through grooves 12 respectively, one end of each of the four sliding rods 3 penetrates through four second through grooves 13 respectively, so that the upper clamp plate 2 is limited to prevent the upper clamp plate 2 from deflecting, the second storage groove 10 is located right above the first storage groove 8, then holds the threaded rods 9 and rotates the threaded sleeves 4, and the threaded sleeves 4 are fixedly connected with the threaded rods 9 in a movable sleeve manner, so that the threaded sleeves 4 move downwards on the threaded rods 9, thereby driving the upper clamp plate 2 to move downwards, leading the top of the wafer to be positioned inside the second object placing groove 10, thereby limiting and fixing the wafer, leading the wafer not to move or slide off in the cleaning process, having simple structure, convenient operation and high wafer clamping efficiency, leading the plurality of water inlet grooves 5 to be respectively communicated with the plurality of second object placing grooves 10, leading a high-pressure water gun to clean the top of the wafer through the plurality of water inlet grooves 5, leading each wafer to be capable of being cleaned evenly, simultaneously leading the plurality of water drainage grooves 7 to be respectively communicated with the plurality of first object placing grooves 8 through arranging the plurality of water drainage grooves 7, leading the water in the first object placing grooves 8 to be discharged through the water drainage grooves 7, being convenient for discharging sewage, leading the four springs 6 to be respectively movably sleeved on the peripheral surfaces of the four slide bars 3 through arranging the four springs 6, when the upper clamp plate 2 moves downwards, leading the upper clamp plate 2 to drive the springs 6 to compress, the four springs 6 simply support the upper plate 2, and prevent the upper plate 2 from rapidly falling down under the action of self gravity, thereby damaging the wafer.

While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the utility model.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the utility model, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the utility model can be combined with each other without conflict;

and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.

Claims

1. The utility model provides a wafer cleaning clamp, includes lower plate (1), its characterized in that: lower plate (1) top has been seted up a plurality of first thing groove (8) of putting, lower plate (1) top is equipped with punch holder (2), punch holder (2) bottom has been seted up a plurality of seconds and has been put thing groove (10), and is a plurality of the second is put thing groove (10) and is located a plurality of first thing groove (8) tops of putting respectively, punch holder (2) top is equipped with two threaded rods (9), two first logical groove (12), two have been seted up on punch holder (2) threaded rod (9) one end passes two first logical groove (12) respectively, punch holder (2) top is equipped with two thread bush (4), two thread bush (4) movable sleeve is established respectively at two threaded rod (9) outer peripheral faces.

2. The wafer cleaning fixture of claim 1, wherein: a plurality of water drainage tank (7) have been seted up on lower plate (1) top, and is a plurality of water drainage tank (7) are linked together with a plurality of first thing groove (8) of putting respectively.

3. The wafer cleaning fixture of claim 1, wherein: two thread grooves (11) are formed in the lower clamping plate (1), and the bottom ends of the two threaded rods (9) extend into the two thread grooves (11) respectively.

4. The wafer cleaning fixture of claim 1, wherein: a plurality of water inlet tanks (5) are arranged at the top end of the upper splint (2), and the water inlet tanks (5) are respectively communicated with the second storage tanks (10).

5. The wafer cleaning fixture of claim 1, wherein: two threaded rod (9) both sides all are equipped with slide bar (3), four logical groove (13), four have been seted up to the second on punch holder (2) slide bar (3) one end pass four second respectively and lead to inside groove (13), and four slide bar (3) bottom all with lower plate (1) top fixed connection.

6. The wafer cleaning fixture of claim 5, wherein: four springs (6) are arranged between the lower clamping plate (1) and the upper clamping plate (2), and the four springs (6) are movably sleeved on the peripheral surfaces of the four sliding rods (3) respectively.