CN215819271U

CN215819271U - Heat dissipation type test circuit board

Info

Publication number: CN215819271U
Application number: CN202122307930.XU
Authority: CN
Inventors: 刘奔; 翁丽丽; 黄健
Original assignee: Suzhou Yuchen Automation Technology Co ltd
Current assignee: Suzhou Yuchen Automation Technology Co ltd
Priority date: 2021-09-23
Filing date: 2021-09-23
Publication date: 2022-02-11
Anticipated expiration: 2031-09-23

Abstract

The utility model discloses a heat dissipation type test circuit board, which comprises a heat dissipation base, a circuit board and a cover plate, the heat dissipation base is internally provided with a heat dissipation mechanism, a circuit board is fixed in the heat dissipation base through a fixing mechanism, the upper end of the heat dissipation base is fixed with a cover plate through a clamping mechanism, the heat dissipation mechanism comprises a heat dissipation groove, a condenser, a condensation conduit, a circulating pump and a heat dissipation fin which are arranged in the heat dissipation base, the heat dissipation groove is internally provided with a condensing duct, the head end and the tail end of the condensing duct are respectively and fixedly connected with the inlet end and the outlet end of the circulating pump, a condenser is also arranged between the condensing conduits, a plurality of radiating fins are also fixed on the condensing conduits, the radiating fin structure is simple in structure, the radiating fin is convenient to disassemble, assemble and replace, the radiating effect is effectively improved, and convenience can be brought to the technical field of circuit boards.

Description

Heat dissipation type test circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a heat dissipation type test circuit board.

Background

The circuit board is an important element in an electric appliance, is small enough to electronic components such as an electronic watch, a calculator and computer communication electronic equipment, and the circuit board is used for electrical interconnection among the electronic components. In recent years, electronic technology has been rapidly advanced, electronic devices have become more precise, and particularly, in the case of miniaturization and densification of electronic components, the use effect of components mounted on a circuit board is affected if the heat dissipation treatment of the circuit board is not good because the heat generated by the electronic components is more and more. But the existing circuit board has single heat dissipation mode, unsatisfactory heat dissipation effect and inconvenient plug-in mounting for maintaining the circuit board.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a heat dissipation type test circuit board, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a heat dissipation type test circuit board, includes heat dissipation base, circuit board and apron, the inside heat dissipation mechanism that is provided with of heat dissipation base, be fixed with the circuit board through fixed establishment in the heat dissipation base, the heat dissipation base upper end is fixed with the apron through clamping the mechanism, heat dissipation mechanism includes radiating groove, condenser, condensation pipe, circulating pump and the fin of seting up in the heat dissipation base, install the condensation pipe in the radiating groove, condensation pipe head and tail both ends respectively with entrance point, the exit end fixed connection of circulating pump, still install the condenser between the condensation pipe, still be fixed with a plurality of fins on the condensation pipe, the other end and the circuit board conflict of fin are connected.

Preferably, the condensing duct has an intermediate portion disposed in the heat radiating groove in an S-shape.

Preferably, the lower end of the radiating fin is provided with a clamping groove, and the radiating fin is clamped outside the condensing duct through the clamping groove.

Preferably, the fixing mechanism comprises a plurality of fixed telescopic rods, fixed springs and a fixed seat which are installed on the inner side wall of the heat dissipation base, the fixed springs are sleeved on the fixed telescopic rods, the fixed seat is further installed at the telescopic end of each fixed telescopic rod, and two ends of each fixed spring are respectively connected with the outer side of the fixed seat and the side wall of the heat dissipation base in an abutting mode.

Preferably, the clamping mechanism comprises a strip-shaped groove formed in the upper end of the cover plate, clamping blocks, reset springs and a clamping groove formed in the upper end of the heat dissipation base, a pair of clamping blocks are slidably mounted in the strip-shaped groove, a plurality of reset springs are fixed between the clamping blocks, two ends of each reset spring are respectively connected with the inner sides of the corresponding clamping blocks in an abutting mode, protrusions extend from the lower ends of the clamping blocks, and grooves are formed in the positions, corresponding to the protrusions, of the clamping grooves.

Preferably, a heat dissipation through hole is formed in the middle position of the upper end of the cover plate, a heat dissipation fan is installed in the heat dissipation through hole, a plurality of air holes are further formed in the upper end of the cover plate, a breathable film is arranged in the air holes, and a plurality of heat conducting fins are further installed at the lower end of the cover plate.

Compared with the prior art, the utility model has the beneficial effects that: the condenser is arranged to cool the condensate in the condensation conduit, so that the heat dissipation performance of the heat dissipation mechanism is improved; through setting up conducting strip cooperation apron, can transmit partial heat. The utility model has simple structure, is convenient to disassemble, assemble and replace the radiating fins, effectively improves the radiating effect and can bring convenience to the technical field of circuit boards.

Drawings

FIG. 1 is a schematic cross-sectional front view of a heat dissipation type test circuit board;

FIG. 2 is a schematic top view of a heat sink for a heat dissipation type test circuit board;

FIG. 3 is an enlarged schematic view of a heat dissipation type test circuit board A.

In the figure: 1-radiating base, 2-circuit board, 3-fixing mechanism, 31-fixing spring, 32-fixing telescopic rod, 33-fixing base, 4-breathable film, 5-clamping mechanism, 51-clamping block, 52-reset spring, 53-clamping groove, 54-bulge, 6-radiating mechanism, 61-radiating groove, 62-condenser, 63-condensing conduit, 64-circulating pump, 65-radiating fin, 7-radiating fan, 8-heat-conducting fin and 9-cover plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 3, the present invention provides a technical solution: the utility model provides a heat dissipation type test circuit board, includes heat dissipation base 1, circuit board 2 and apron 9, the inside heat dissipation mechanism 6 that is provided with of heat dissipation base 1, be fixed with circuit board 2 through fixed establishment 3 in the heat dissipation base 1, heat dissipation base 1 upper end is fixed with apron 9 through clamping mechanism 5, heat dissipation mechanism 6 includes radiating groove 61, condenser 62, condensation pipe 63, circulating pump 64 and the fin 65 of seting up in the heat dissipation base 1, install condensation pipe 63 in the radiating groove 61, condensation pipe 63 head and the tail both ends respectively with inlet end, the exit end fixed connection of circulating pump 64, still install condenser 62 between the condensation pipe 63, still be fixed with a plurality of fins 65 on the condensation pipe 63, the other end and the circuit board 2 conflict of fin 65 are connected. When the circuit board cooling device is used, the circuit board 2 is firstly fixed through the fixing mechanism 3 and then is installed on the cover plate 9 through the clamping mechanism 5, and when the circuit board 2 works, the heat dissipation mechanism 6 conducts heat dissipation work.

The condensing duct 63 is disposed in the radiating groove 61 in an S-shape at a middle portion thereof. By arranging the S-shaped distributed condensation ducts 63, more radiating fins 65 can be conveniently clamped, and thus the radiating effect is improved.

The lower end of the radiating fin 65 is provided with a clamping groove, and the radiating fin 65 is clamped outside the condensing duct 63 through the clamping groove. The clamping groove is arranged for clamping, and the clamping device is convenient to detach and replace.

Fixing mechanism 3 is including installing a plurality of fixed telescopic link 32, fixed spring 31 and the fixing base 33 at 1 inside wall of heat dissipation base, the cover is equipped with fixed spring 31 on the fixed telescopic link 32, fixing base 33 is still installed to the flexible end of fixed telescopic link 32, fixed spring 31's both ends are contradicted with the outside of fixing base 33, the lateral wall of heat dissipation base 1 respectively and are connected. In use, the fixing seats 33 are compressed towards both ends, the circuit board 2 is then placed therein, then the fixing seats 33 are released, and the fixing springs 31 push the fixing seats 33 to move inwards and abut against the circuit board 2, thereby fixing it.

The clamping mechanism 5 comprises a strip-shaped groove formed in the upper end of the cover plate 9, clamping blocks 51, a return spring 52 and a clamping groove 53 formed in the upper end of the heat dissipation base 1, wherein a pair of clamping blocks 51 are slidably mounted in the strip-shaped groove, a plurality of return springs 52 are fixed between the clamping blocks 51, two ends of each return spring 52 are respectively connected with the inner sides of the corresponding clamping blocks 51 in an abutting mode, a protrusion 54 also extends from the lower end of each clamping block 51, and a groove is formed in the position, corresponding to the protrusion 54, of the clamping groove 53. When the cover plate 9 is used, the clamping block 51 is pressed inwards, then the clamping block is inserted into the clamping groove 53, then the clamping block 51 is loosened, and under the action of the return spring 52, the clamping block 51 moves outwards, so that the protrusion 54 is inserted into the groove, and the clamping of the cover plate 9 is realized.

The heat dissipation cover plate is characterized in that a heat dissipation through hole is formed in the middle position of the upper end of the cover plate 9, a heat dissipation fan 7 is installed in the heat dissipation through hole, a plurality of air holes are further formed in the upper end of the cover plate 9, breathable films 4 are arranged in the air holes, and a plurality of heat conducting fins 8 are further installed at the lower end of the cover plate 9. After the upper cover plate 9 is mounted, the heat conducting fins 8 are in contact with the circuit board 2, heat can be transferred, heat dissipation can be achieved by arranging the heat dissipation fan 7 to be matched with the air holes, and the air permeable film 4 can effectively prevent dust and the like from entering the circuit board 2 to affect work.

The working principle of the utility model is as follows: when the circuit board 2 works, the cooling fan 7, the circulating pump 64 and the condenser 62 are turned on, then the condensate can circulate in the circulating conduit 63 and absorb the heat emitted from the cooling fins 65, so that the cooling fins 65 can better emit the heat on the circuit board 2, the condenser 62 can cool the condensate, the heat on the cooling fins 65 can be better absorbed, and the cooling fan 7 can radiate part of the heat, meanwhile, the heat conducting fins 8 can transmit partial heat through the cover plate 9, and the heat dissipation capacity of the circuit board 2 is improved.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a heat dissipation type test circuit board, includes heat dissipation base (1), circuit board (2) and apron (9), its characterized in that: a heat dissipation mechanism (6) is arranged in the heat dissipation base (1), a circuit board (2) is fixed in the heat dissipation base (1) through a fixing mechanism (3), a cover plate (9) is fixed at the upper end of the heat dissipation base (1) through a clamping mechanism (5), the heat dissipation mechanism (6) comprises a heat dissipation groove (61), a condenser (62), a condensation conduit (63), a circulating pump (64) and a heat dissipation fin (65) which are arranged in the heat dissipation base (1), a condensing duct (63) is arranged in the heat dissipation groove (61), the head end and the tail end of the condensing duct (63) are respectively and fixedly connected with the inlet end and the outlet end of a circulating pump (64), a condenser (62) is also arranged between the condensing conduits (63), a plurality of radiating fins (65) are also fixed on the condensing conduits (63), the other end of the radiating fin (65) is connected with the circuit board (2) in an abutting mode.

2. The heat dissipation type test circuit board of claim 1, wherein: the middle part of the condensing conduit (63) is arranged in the radiating groove (61) in an S shape.

3. The heat dissipation type test circuit board of claim 1, wherein: the lower end of the radiating fin (65) is provided with a clamping groove, and the radiating fin (65) is clamped outside the condensing duct (63) through the clamping groove.

4. The heat dissipation type test circuit board of claim 1, wherein: fixed establishment (3) are including installing a plurality of fixed telescopic link (32), fixed spring (31) and fixing base (33) at heat dissipation base (1) inside wall, the cover is equipped with fixed spring (31) on fixed telescopic link (32), fixing base (33) are still installed to the flexible end of fixed telescopic link (32), the both ends of fixed spring (31) are contradicted with the outside of fixing base (33), the lateral wall of heat dissipation base (1) respectively and are connected.

5. The heat dissipation type test circuit board of claim 1, wherein: clamping mechanism (5) include strip groove, fixture block (51), reset spring (52) that apron (9) upper end was seted up and draw-in groove (53) that heat dissipation base (1) upper end was seted up, strip inslot slidable mounting has a pair of fixture block (51), be fixed with a plurality of reset spring (52) between fixture block (51), reset spring (52) both ends respectively with the inboard conflict of corresponding fixture block (51) be connected, the lower extreme of fixture block (51) still extends has arch (54), the position that draw-in groove (53) correspond arch (54) is provided with the slot.

6. The heat dissipation type test circuit board of claim 1, wherein: the heat dissipation cover plate is characterized in that a heat dissipation through hole is formed in the middle position of the upper end of the cover plate (9), a heat dissipation fan (7) is installed in the heat dissipation through hole, a plurality of air holes are further formed in the upper end of the cover plate (9), breathable films (4) are arranged in the air holes, and a plurality of heat conducting fins (8) are further installed at the lower end of the cover plate (9).