CN215815793U

CN215815793U - Electronic wafer quality detection device

Info

Publication number: CN215815793U
Application number: CN202121660654.9U
Authority: CN
Inventors: 顾卫民; 吴熙文; 吴卓鸿; 张梅
Original assignee: Wuxi Xinqibo Technology Co ltd
Current assignee: Wuxi Xinqibo Technology Co ltd
Priority date: 2021-07-21
Filing date: 2021-07-21
Publication date: 2022-02-11
Anticipated expiration: 2031-07-21

Abstract

The utility model discloses an electronic wafer quality detection device which comprises a machine body, wherein four groups of toothed sliding rails are fixedly arranged on the front surface and the rear surface of the machine body, a baffle is movably arranged between two groups of toothed sliding rails on the front surface and the rear surface of the machine body, sliding grooves are formed in the outer walls of the sides, close to each other, of the machine body and the baffle, two groups of silica gel pads are movably arranged on the machine body and the baffle through the sliding grooves, an adjusting rod is movably arranged between the outer wall positions, close to each other, of the two groups of silica gel pads, far away from each other, and a bolt is movably arranged between the upper surface position and the lower surface position of the two groups of adjusting rods. The utility model relates to an electronic wafer quality detection device which can effectively buffer external force, thereby reducing damage of the external force to the electronic wafer quality detection device, effectively increasing the stability of the detection device, and simultaneously fixing a wafer to be detected, thereby reducing the movement of the wafer in the detection process and increasing the accuracy of the detection process.

Description

Electronic wafer quality detection device

Technical Field

The utility model relates to the technical field of electronic wafer quality detection, in particular to an electronic wafer quality detection device.

Background

Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. At present, the domestic wafer production line mainly takes 8 inches and 12 inches, and the wafer production line can be used after the surface of the wafer is effectively detected by a detection device after the wafer is produced.

Traditional electron wafer quality detection device is when using, and the wafer that can't effectually be detected is fixed to often take place to squint or slope in the testing process, thereby very big influence its accuracy that detects, simultaneously and can't cushion outside impact, often make detection device bump or rub, thereby very big influence electron wafer quality detection device's use.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to an electronic wafer quality inspection apparatus, which can effectively solve the problems of the related art.

In order to achieve the purpose, the utility model adopts the technical scheme that:

an electronic wafer quality detection device comprises a machine body, wherein four groups of toothed sliding rails are fixedly arranged on the front surface and the rear surface of the machine body, a baffle plate is movably arranged between two groups of toothed sliding rail positions on the front surface and the rear surface of the machine body, sliding grooves are formed in the outer wall of one side, close to each other, of the machine body and the baffle plate, two groups of silica gel pads are movably arranged on the machine body and the baffle plate through the sliding grooves, adjusting rods are movably arranged between the outer wall positions of one side, close to each other, of the two groups of silica gel pads, bolts are movably arranged between the upper surface position and the lower surface position of the two groups of adjusting rods, two groups of compression springs are fixedly arranged between the outer wall positions of one side, close to each other, of the two adjacent groups of adjusting rods, two groups of hollow pipes and a cross rod are respectively and fixedly arranged on the outer wall of one side, close to each other, of the two groups of adjusting rods are respectively provided with two groups of grooves, and transverse plates are movably arranged on the front wall and the rear wall of the hollow pipes through the grooves, adjacent two sets of the equal fixed mounting in surface has the connecting rod around the diaphragm is close to each other, and the last fixed surface of organism installs the mounting bracket, the preceding fixed surface of mounting bracket installs electronic slide rail, and the mounting bracket has the detection head through electronic slide rail movable mounting, the last fixed surface of organism installs the fixed plate, and the both sides inner wall of fixed plate and the equal fixed mounting of preceding back wall have the rubber strip.

Preferably, the four groups of rubber strips form a clip structure, and the outer wall of one side of each rubber strip is provided with a mounting groove.

Preferably, the cross section of the baffle is concave, and the baffle is vertically connected with the machine body in a penetrating manner.

Preferably, two adjacent groups of the silica gel pads are located on the same central axis, and the silica gel pads and the baffle are horizontally distributed.

Preferably, two adjacent groups of the adjusting rods are movably connected through bolts, and the movable angle range between the two adjacent groups of the adjusting rods is five degrees to fifteen degrees.

Preferably, the lower ends of the two adjacent sliding grooves are arranged on the same plane, and the silica gel pad is located inside the sliding grooves.

Preferably, two adjacent groups of the compression springs are horizontally distributed, and the machine body and the baffle are vertically distributed with the compression springs.

Preferably, two adjacent groups of the connecting rods are horizontally distributed, and the cross rods and the hollow pipes are vertically connected in a penetrating manner.

Compared with the prior art, the utility model has the following beneficial effects:

1. the organism is connected with the baffle through adjusting the pole and taking the tooth slide rail, when the baffle atress, can effectually transmit power to silica gel pad, make its atress and cushion power, transmit power to the regulation pole after will cushioning on, make the regulation pole atress change its self contained angle along the bolt, and make it remove along the spout through silica gel pad, thereby change its self position, extrude compression spring, make the compression spring atress produce deformation and shorten, and the reaction force of the compression spring after shortening will cushion with external force, thereby carry out shock attenuation processing, and the horizontal pole also will move along the recess through connecting rod and diaphragm at the atress, its removal orbit has effectually been confirmed, it is more stable to make its shock attenuation processing.

2. The organism is connected with the rubber strip through the fixed plate, can effectually place the wafer in the inside of rubber strip to carry out effectual fixing to it through the mounting groove on the rubber strip, thereby reduce the wafer and take place to remove in the testing process, increase the stability of its detection.

Drawings

FIG. 1 is a schematic diagram of an overall structure of an electronic wafer quality inspection apparatus according to the present invention;

FIG. 2 is a schematic view of a fixing plate connection structure in an electronic wafer quality inspection apparatus according to the present invention;

FIG. 3 is a schematic diagram of a connection structure of an adjustment rod in an electronic wafer quality inspection apparatus according to the present invention;

FIG. 4 is a schematic diagram of an internal structure of a hollow tube in an electronic wafer quality inspection apparatus according to the present invention.

In the figure: 1. a body; 2. a slide rail with teeth; 3. a baffle plate; 4. a chute; 5. a silica gel pad; 6. adjusting a rod; 7. a bolt; 8. a compression spring; 9. a hollow tube; 10. a groove; 11. a transverse plate; 12. a connecting rod; 13. a cross bar; 14. a mounting frame; 15. an electric slide rail; 16. a detection head; 17. a fixing plate; 18. a rubber strip.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

As shown in fig. 1-4, an electronic wafer quality detection device comprises a machine body 1, four sets of toothed sliding rails 2 are fixedly installed on the front and rear surfaces of the machine body 1, a baffle 3 is movably installed between two sets of toothed sliding rails 2 on the front and rear surfaces of the machine body 1, sliding grooves 4 are respectively formed on the outer walls of the sides of the machine body 1 and the baffle 3 close to each other, two sets of silica gel pads 5 are movably installed on the machine body 1 and the baffle 3 through the sliding grooves 4, an adjusting rod 6 is movably installed between the outer wall positions of the sides of the two sets of silica gel pads 5 far away from each other close to each other, a bolt 7 is movably installed between the upper and lower surface positions of the two sets of adjusting rods 6, two sets of compression springs 8 are fixedly installed between the outer wall positions of the sides of the two adjacent sets of adjusting rods 6 close to each other, and two sets of hollow tubes 9 and cross rods 13 are respectively fixedly installed on the outer walls of the sides of the two adjacent sets of adjusting rods 6 close to each other, two sets of recesses 10 have all been seted up to the preceding back wall of hollow tube 9, and hollow tube 9 has diaphragm 11 through recess 10 movable mounting, the equal fixed mounting in surface has connecting rod 12 around adjacent two sets of diaphragm 11 are close to each other, and the last fixed surface of organism 1 installs mounting bracket 14, the preceding fixed surface of mounting bracket 14 installs electronic slide rail 15, and mounting bracket 14 has detection head 16 through electronic slide rail 15 movable mounting, the last fixed surface of organism 1 installs fixed plate 17, and the equal fixed mounting of both sides inner wall and the preceding back wall of fixed plate 17 has rubber strip 18.

Four sets of rubber strips 18 constitute and return the shape structure, and the mounting groove has been seted up to one side outer wall of rubber strip 18, and the mounting groove on the rubber strip 18 carries out effectual fixed to the wafer to reduce the wafer and take place to remove in the testing process, increase the stability of its detection.

The cross sectional shape of baffle 3 is the spill, and baffle 3 and organism 1 perpendicular through connection, and the inside of baffle 3 can be effectively arranged in organism 1 to the spill structure to make baffle 3 can be better protect organism 1, effectual its security that increases.

Two sets of adjacent silica gel pads 5 are located same axis, and silica gel pads 5 and 3 horizontal distributions of baffle, when 3 atresss of baffle, can be effectual with all transmission to silica gel pads 5 with power for silica gel pads 5 are effectual cushions the outside impact, thereby reduce the possibility of baffle 3 slope.

Adjacent two sets of regulation poles 6 pass through bolt 7 swing joint, and adjacent two sets of movable angle ranges of adjusting between pole 6 are at five degrees to fifteen degrees, and when adjusting pole 6 atress, adjust pole 6 and will rotate along bolt 7 to effectual regulation is adjacent two sets of contained angle size of adjusting between the pole 6, thereby extrudees compression spring 8, carries out the buffering.

The lower extreme setting of two sets of adjacent spout 4 is on the coplanar, and silica gel pad 5 is located the inside of spout 4, when adjusting pole 6 atress, can effectually make it remove along spout 4 through silica gel pad 5 to change its self angular position.

Two sets of adjacent compression spring 8 horizontal distribution, and organism 1 and baffle 3 all distribute perpendicularly with compression spring 8, when extrusion compression spring 8, compression spring 8 produces the atress deformation and shortens, and the reaction force of the compression spring 8 after shortening will cushion with external force to carry out shock attenuation processing.

Two adjacent sets of connecting rods 12 horizontal distribution, and horizontal pole 13 and hollow tube 9 perpendicular through connection, horizontal pole 13 will move along recess 10 through connecting rod 12 and diaphragm 11 when the atress, and the effectual removal orbit that has confirmed regulating plate 6 makes its shock attenuation handle more stable.

It should be noted that, before using, the machine body 1 is horizontally placed, i.e. the wafer can be placed inside the rubber strip 18, so as to effectively fix the wafer through the mounting groove on the rubber strip 18, thereby reducing the movement of the wafer in the detection process and increasing the detection stability, when an external force impacts the baffle 3, the baffle 3 can effectively transmit the force to the silica gel pad 5, so that the force is applied to and buffered by the silica gel pad 5, the buffered force is transmitted to the adjusting rod 6, so that the force applied to the adjusting rod 6 changes its own included angle along the bolt 7, and the silica gel pad 5 moves along the sliding groove 4, so as to change its own position, squeeze the compression spring 8, so that the compression spring 8 is deformed and shortened due to the force applied to the compression spring 8, and the reaction force of the shortened compression spring 8 is buffered with the external force, so as to perform the shock absorption treatment, and the cross bar 13 is moved along the groove 10 through the connecting rod 12 and the transverse plate 11 under the force applied, the moving track of the adjusting plate 6 is effectively determined, so that the damping treatment is more stable. The utility model relates to an electronic wafer quality detection device which can effectively buffer external force, thereby reducing damage of the external force to the electronic wafer quality detection device, effectively increasing the stability of the detection device, and simultaneously fixing a wafer to be detected, thereby reducing the movement of the wafer in the detection process and increasing the accuracy of the detection process.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. An electronic wafer quality detection device comprises a machine body (1), and is characterized in that: the front surface and the rear surface of the machine body (1) are fixedly provided with four groups of toothed sliding rails (2), a baffle (3) is movably arranged between two groups of toothed sliding rails (2) on the front surface and the rear surface of the machine body (1), the outer wall of one side, close to each other, of the machine body (1) and the baffle (3) is provided with a sliding groove (4), the machine body (1) and the baffle (3) are movably provided with two groups of silica gel pads (5) through the sliding groove (4), an adjusting rod (6) is movably arranged between the outer wall positions of one side, close to each other, of the two groups of silica gel pads (5), a bolt (7) is movably arranged between the upper surface position and the lower surface position of the two groups of adjusting rods (6), two groups of compression springs (8) are fixedly arranged between the outer wall positions of one side, close to each other, of the two adjacent groups of adjusting rods (6), and two groups of hollow pipes (9) and a cross rod (13) are fixedly arranged on the outer wall of one side, close to each other, respectively, two sets of recess (10) have all been seted up to the preceding back wall of hollow tube (9), and hollow tube (9) have diaphragm (11), adjacent two sets of through recess (10) movable mounting there is connecting rod (12) around diaphragm (11) is close to each other, and the last fixed surface of organism (1) installs mounting bracket (14), the preceding fixed surface of mounting bracket (14) installs electronic slide rail (15), and mounting bracket (14) have detection head (16) through electronic slide rail (15) movable mounting, the last fixed surface of organism (1) installs fixed plate (17), and the both sides inner wall of fixed plate (17) and the equal fixed mounting of preceding back wall have rubber strip (18).

2. The electronic wafer quality inspection device of claim 1, wherein: the four groups of rubber strips (18) form a clip-shaped structure, and an installation groove is formed in the outer wall of one side of each rubber strip (18).

3. The electronic wafer quality inspection device of claim 1, wherein: the cross section of the baffle (3) is concave, and the baffle (3) is vertically connected with the machine body (1) in a penetrating way.

4. The electronic wafer quality inspection device of claim 1, wherein: two adjacent groups of silica gel pads (5) are located on the same central axis, and silica gel pads (5) and baffle (3) are horizontally distributed.

5. The electronic wafer quality inspection device of claim 1, wherein: two adjacent groups of the adjusting rods (6) are movably connected through bolts (7), and the movable angle range between the two adjacent groups of the adjusting rods (6) is five degrees to fifteen degrees.

6. The electronic wafer quality inspection device of claim 1, wherein: the lower ends of the two adjacent groups of sliding grooves (4) are arranged on the same plane, and the silica gel pad (5) is located inside the sliding grooves (4).

7. The electronic wafer quality inspection device of claim 1, wherein: two adjacent groups of compression springs (8) are horizontally distributed, and the machine body (1) and the baffle (3) are vertically distributed with the compression springs (8).

8. The electronic wafer quality inspection device of claim 1, wherein: two adjacent groups of the connecting rods (12) are horizontally distributed, and the cross rods (13) are vertically connected with the hollow pipes (9) in a penetrating manner.