CN216465077U - Circuit board appearance stamping die - Google Patents
Circuit board appearance stamping die Download PDFInfo
- Publication number
- CN216465077U CN216465077U CN202122675561.XU CN202122675561U CN216465077U CN 216465077 U CN216465077 U CN 216465077U CN 202122675561 U CN202122675561 U CN 202122675561U CN 216465077 U CN216465077 U CN 216465077U
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- China
- Prior art keywords
- sets
- mounting
- die
- circuit board
- stamping die
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 239000000741 silica gel Substances 0.000 claims description 11
- 229910002027 silica gel Inorganic materials 0.000 claims description 11
- 230000001105 regulatory effect Effects 0.000 claims description 9
- 230000006835 compression Effects 0.000 claims description 5
- 238000007906 compression Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000000712 assembly Effects 0.000 abstract description 6
- 238000000429 assembly Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 abstract description 4
- 239000000872 buffer Substances 0.000 abstract description 3
- 238000004080 punching Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 230000008859 change Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The utility model discloses a circuit board appearance stamping die which comprises a lower die, wherein four groups of guide assemblies are fixedly mounted on the upper surface of the lower die, an upper die is fixedly mounted between the upper surface positions of the four groups of guide assemblies, sliding grooves are formed in the front wall and the rear wall of the upper die, a sliding block is movably mounted on the upper die through the sliding grooves, connecting rods are movably mounted inside the sliding block, an adjusting plate is fixedly mounted between the front surface position and the rear surface position, close to each other, of the two groups of connecting rods, two groups of hollow tubes are fixedly mounted on the outer wall of one side of the adjusting plate, and cross rods are movably mounted inside the hollow tubes. The utility model relates to a circuit board appearance stamping die, which can effectively simplify the replacement step of a stamping head, is more convenient during use and maintenance, and can effectively buffer the vibration of the stamping die in the use process, thereby reducing the possibility of inclination or side turning of the stamping die in the use process and greatly improving the stability of the stamping die.
Description
Technical Field
The utility model relates to the technical field of stamping dies, in particular to a circuit board appearance stamping die.
Background
The stamping die is a special process equipment for processing materials into parts in cold stamping processing, and is called as a cold stamping die. Stamping is a press working method in which a die mounted on a press is used to apply pressure to a material at room temperature to cause separation or plastic deformation of the material, thereby obtaining a desired part.
Traditional circuit board appearance stamping die is when using, and in long-time use, the punching press head easily takes place comparatively serious wearing and tearing to effectual its subsequent punching press effect of influence, and stamping die can't effectually carry out quick replacement to its punching press head again, easily produces vibrations simultaneously in the use engineering, makes its stamping die wholly produce the slope or turn on one's side, thereby very big influence circuit board appearance stamping die's use.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a circuit board appearance stamping die which can effectively solve the problems in the background technology.
In order to achieve the purpose, the utility model adopts the technical scheme that:
a circuit board appearance stamping die comprises a lower die, wherein four groups of guide assemblies are fixedly mounted on the upper surface of the lower die, an upper die is fixedly mounted between the upper surface positions of the guide assemblies, four groups of guide assemblies are fixedly mounted on the upper surface positions of the guide assemblies, sliding grooves are formed in the front wall and the rear wall of the upper die respectively, a sliding block is movably mounted on the upper die through the sliding grooves, a connecting rod is movably mounted in the sliding block, two groups of connecting rods are fixedly mounted between the front surface position and the rear surface position close to each other, two groups of hollow tubes are fixedly mounted on the outer wall of one side of each adjusting plate, cross rods are movably mounted in the hollow tubes, two groups of compression springs are fixedly mounted between the inner wall of one side of the upper die and the outer wall position of one side of each adjusting plate, mounting plates are fixedly mounted on the lower surfaces of the upper die and the lower surfaces of the adjusting plates respectively, and stamping heads are movably mounted between the upper surface positions of the two groups of mounting plates, the front surface and the rear surface of the mounting plate are respectively movably provided with a screw.
Preferably, the hollow pipe and the cross rod are positioned on the same central axis, and the hollow pipe and the cross rod are vertically connected in a penetrating manner.
Preferably, the lower ends of the two groups of mounting plates are arranged on the same plane, and the stamping head is located between the two groups of mounting plates.
Preferably, the two groups of connecting rods are horizontally distributed, and the connecting rods and the sliding blocks are vertically connected in a penetrating manner.
Preferably, movable mounting has the base between the both sides inner wall position of bed die, the lower fixed surface of bed die installs two sets of silica gel pads, the lower surface of silica gel pad and the lower surface of base have all seted up flutedly, the inside movable mounting of recess has two sets of slides, and the two sets of that are close to each other movable mounting has the backup pad between the upper and lower surface position that the slide is close to each other, and adjacent two sets of movable mounting has the bolt between the front and back surface position of backup pad, and adjacent two sets of fixed mounting has two sets of coil spring between the upper and lower surface position that the backup pad is close to each other.
Preferably, the number of the grooves on the base is two, and the movable angle range between two adjacent groups of the supporting plates is fifteen degrees to sixty-five degrees.
Compared with the prior art, the utility model has the following beneficial effects:
1. go up the mould and be connected with the mounting panel through the regulating plate, thereby can directly twist the screw and make its atress and rotate under its effect of force and take out when maintaining, thereby make the punching press head lose fixed connection structure, can stimulate the mounting panel and make its atress, and pass through regulating plate and connecting rod with its power and transmit to the slider on, make the slider remove along the spout, can make the distance increase between two sets of mounting panels, thereby better change and maintain, make punching press head in use punching press effect can promote.
2. The bed die is connected with the base through the backup pad, when outside vibrations power, its power will be transmitted to silica gel pad through the bed die, silica gel pad will cushion it this moment, and the power after will buffering is used for in the backup pad, make two sets of backup pad atresss rotate under the effect of bolt, thereby change the angular position between the two, can effectually extrude coil spring, make its outside vibrations power can cushion, thereby make its holistic stability can promote, the effectual possibility of avoiding taking place the slope or turning on one's side.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a circuit board profile stamping die according to the present invention;
FIG. 2 is a schematic view of a lower mold connection structure in a circuit board outline stamping mold according to the present invention;
FIG. 3 is a schematic view of a mounting plate connection structure in a circuit board outline stamping die according to the present invention;
fig. 4 is a schematic view of a connection structure of a support plate in a circuit board profile stamping die according to the present invention.
In the figure: 1. a lower die; 2. a guide assembly; 3. an upper die; 4. a chute; 5. a slider; 6. a connecting rod; 7. an adjusting plate; 8. a hollow tube; 9. a cross bar; 10. a compression spring; 11. mounting a plate; 12. punching a head; 14. a screw; 15. a base; 16. a silica gel pad; 17. a groove; 18. a slide plate; 19. a support plate; 20. a bolt; 21. a coil spring.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
As shown in fig. 1-4, a circuit board shape stamping die comprises a lower die 1, four groups of guiding components 2 are fixedly mounted on the upper surface of the lower die 1, an upper die 3 is fixedly mounted between the upper surface positions of the four groups of guiding components 2, sliding grooves 4 are respectively formed in the front wall and the rear wall of the upper die 3, a sliding block 5 is movably mounted on the upper die 3 through the sliding grooves 4, connecting rods 6 are movably mounted in the sliding block 5, an adjusting plate 7 is fixedly mounted between the front surface position and the rear surface position of the two groups of connecting rods 6 which are close to each other, two groups of hollow tubes 8 are fixedly mounted on the outer wall of one side of the adjusting plate 7, cross rods 9 are movably mounted in the hollow tubes 8, two groups of compression springs 10 are fixedly mounted between the inner wall of one side of the upper die 3 and the outer wall of one side of the adjusting plate 7, mounting plates 11 are fixedly mounted on the lower surfaces of the upper die 3 and the adjusting plate 7, and stamping heads 12 are movably mounted between the upper surface positions of the two groups of mounting plates 11, the front and rear surfaces of the mounting plate 11 are movably mounted with screws 14.
The lower extreme setting of two sets of mounting panels 11 is on the coplanar, and the ram head 12 is located between the position of two sets of mounting panels 11, and the mounting panel 11 of horizontal distribution can be more effectual fixes the position of ram head 12, mutually supports with screw 14, makes it remain stable during the use, can not take place the possibility that drops.
Two sets of connecting rods 6 horizontal distribution, connecting rod 6 and the perpendicular through connection of slider 5, horizontal distribution's connecting rod 6 can be effectual with the atress of regulating plate 7, even transmission to slider 5 on, make it remove along spout 4 to effectual definite its removal orbit avoids taking place the possibility of skew, thereby increases its stability.
Movable mounting has base 15 between the both sides inner wall position of bed die 1, the lower fixed surface of bed die 1 installs two sets of silica gel pads 16, recess 17 has all been seted up to the lower surface of silica gel pad 16 and the lower surface of base 15, the inside movable mounting of recess 17 has two sets of slides 18, movable mounting has backup pad 19 between the upper and lower surface position that two sets of slides 18 that are close to each other, movable mounting has bolt 20 between the front and back surface position of adjacent two sets of backup pads 19, fixed mounting has two sets of coil spring 21 between the upper and lower surface position that adjacent two sets of backup pads 19 are close to each other.
The quantity of recess 17 on base 15 is two sets of, and the activity angle range between two sets of adjacent backup pads 19 is at fifteen degrees to sixty-five degrees, can effectually move under its power of effect when backup pad 9 atress to extrude coil spring 21 between the two and make it cushion to external force, thereby remain stable.
It should be noted that, when in use, the base 1 can be placed on the ground, so that the lower die 1 and the upper die 3 are both horizontally placed, that is, a workpiece can be placed in the lower die 1, so that the upper die 3 drives the punch 12 to perform downward punching operation, external vibration force generated during the operation is transmitted to the silica gel pad 16 through the lower die 1, at this time, the silica gel pad 16 buffers the workpiece, the buffered force acts on the support plates 19, so that the two groups of support plates 19 rotate under the action of the bolts 20, so as to change the angular position between the two, the spiral spring 21 can be effectively extruded, the external vibration force can be buffered, the screw 14 can be directly screwed to be stressed and rotate under the action of the force during maintenance, so that the punch 12 loses the fixed connection structure, and the mounting plate 11 can be pulled to be stressed, and transmit its power to the slider 5 through regulating plate 7 and connecting rod 6 for the slider 5 moves along spout 4, can make the distance increase between two sets of mounting panels 11, thereby better change the maintenance, make the punching press head 12 in use punching press effect can promote. The utility model relates to a circuit board appearance stamping die, which can effectively simplify the replacement step of a stamping head, is more convenient during use and maintenance, and can effectively buffer the vibration of the stamping die in the use process, thereby reducing the possibility of inclination or side turning of the stamping die in the use process and greatly improving the stability of the stamping die.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a circuit board appearance stamping die, includes bed die (1), its characterized in that: last fixed surface of bed die (1) installs four group's direction subassembly (2), four groups fixed mounting has last mould (3) between the upper surface position of direction subassembly (2), spout (4) have all been seted up to the front and back wall of going up mould (3), it has slider (5) through spout (4) movable mounting to go up mould (3), the inside movable mounting of slider (5) has connecting rod (6), and is two sets of fixed mounting has regulating plate (7) between the front and back surface position that connecting rod (6) are close to each other, one side outer wall fixed mounting of regulating plate (7) has two sets of hollow tube (8), the inside movable mounting of hollow tube (8) has horizontal pole (9), fixed mounting has two sets of compression spring (10) between the one side inner wall of going up mould (3) and one side outer wall position of regulating plate (7), the equal fixed mounting of lower surface of going up mould (3) and the lower surface of regulating plate (7) has mounting panel(s) (1), (3) respectively) 11) And two sets of movable mounting has stamping head (12) between the upper surface position of mounting panel (11), the equal movable mounting in surface has screw (14) around mounting panel (11).
2. The circuit board profile stamping die of claim 1, wherein: the hollow pipe (8) and the cross rod (9) are positioned on the same central axis, and the hollow pipe (8) and the cross rod (9) are vertically connected in a penetrating mode.
3. The circuit board profile stamping die of claim 1, wherein: the lower ends of the two groups of mounting plates (11) are arranged on the same plane, and the stamping heads (12) are positioned between the positions of the two groups of mounting plates (11).
4. The circuit board profile stamping die of claim 1, wherein: two sets of connecting rod (6) horizontal distribution, connecting rod (6) and slider (5) perpendicular through connection.
5. The circuit board profile stamping die of claim 1, wherein: movable mounting has base (15) between the both sides inner wall position of bed die (1), the lower fixed surface of bed die (1) installs two sets of silica gel pads (16), the lower surface of silica gel pads (16) and the lower surface of base (15) all set up fluted (17), the inside movable mounting of recess (17) has two sets of slide (18), and the two sets of that are close to each other movable mounting has backup pad (19) between the upper and lower surface position that slide (18) are close to each other, adjacent two sets of movable mounting has bolt (20) between the front and back surface position of backup pad (19), and adjacent two sets of fixed mounting has two sets of coil spring (21) between the upper and lower surface position that backup pad (19) are close to each other.
6. The circuit board profile stamping die of claim 5, wherein: the number of the grooves (17) on the base (15) is two, and the movable angle range between two adjacent groups of the supporting plates (19) is fifteen degrees to sixty-five degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122675561.XU CN216465077U (en) | 2021-11-04 | 2021-11-04 | Circuit board appearance stamping die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122675561.XU CN216465077U (en) | 2021-11-04 | 2021-11-04 | Circuit board appearance stamping die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216465077U true CN216465077U (en) | 2022-05-10 |
Family
ID=81446280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122675561.XU Expired - Fee Related CN216465077U (en) | 2021-11-04 | 2021-11-04 | Circuit board appearance stamping die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216465077U (en) |
-
2021
- 2021-11-04 CN CN202122675561.XU patent/CN216465077U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220510 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |