CN215805997U

CN215805997U - Automatic rigging machine of gum

Info

Publication number: CN215805997U
Application number: CN202121987100.XU
Authority: CN
Inventors: 耿德国; 苏本卫; 牛朋飞; 郑永松; 贾猛
Original assignee: Kunshan Guanxu Electronic Material Co ltd
Current assignee: Kunshan Guanxu Electronic Material Co ltd
Priority date: 2021-08-23
Filing date: 2021-08-23
Publication date: 2022-02-11
Anticipated expiration: 2031-08-23

Abstract

The utility model provides an automatic back adhesive laminating machine. Automatic rigging machine of gum includes: the heat dissipation device comprises a first base and a second base, wherein the second base is fixedly installed on the outer wall of one side of the first base, a heat dissipation assembly is arranged on the first base and comprises a first groove, a box body, a heat absorption plate and a flow guide pipe, the first groove is formed in the top of the first base, the box body is fixedly installed on the first groove, the heat absorption plate is arranged at the top of the box body, the flow guide pipe is fixedly installed on the outer wall of one side of the box body, and the bottom end of the flow guide pipe extends to the lower side of the first base. The automatic laminating machine for the back glue has the advantages that the heat dissipation and cooling can be carried out on the inside of the laminating machine for the back glue, the damage and the aging aggravation effect on equipment caused by overhigh internal heat are avoided, and the adverse effect on the operation of the laminating machine caused by the vibration generated in the walking process of people can be prevented.

Description

Automatic rigging machine of gum

Technical Field

The utility model belongs to the technical field of automatic back adhesive laminating machines, and particularly relates to an automatic back adhesive laminating machine.

Background

Gum rigging machine is on laminating the gum to products such as cell-phone, an important equipment in the product course of working such as cell-phone, in the correlation technique, a full-automatic gum rigging machine is disclosed, which comprises a support, gum feeding mechanism, assembly line conveying mechanism, the pad pasting module, the carrier, work platform, lateral shifting mechanism and longitudinal movement mechanism, gum feeding mechanism installs on the frame, assembly line conveying mechanism vertically installs on the frame and is located the front end of gum feeding mechanism, the carrier is installed on assembly line conveying mechanism, work platform installs on the frame and is located one side of gum feeding mechanism, lateral shifting mechanism installs on the frame, longitudinal movement mechanism installs on lateral shifting mechanism, the pad pasting module is installed on lateral shifting mechanism and is located the top of gum feeding mechanism. Make it utilize the first module of paster will treat that laminating product and gum will be adsorbed on work platform after with the gum laminating on treating the product of laminating, adsorb the carrier with the product again and carry away, can realize the full-automatic gum laminating of product automatically, save the laminating cycle, improve laminating efficiency.

However, there are still deficiencies in the above-mentioned structure, especially gum rigging machine adopts the very simple fixed bolster base of structure, and its stability performance and heat dispersion are all very poor, and gum rigging machine is in the in-process of using, and its inside drive unit can produce a large amount of heats, and if these heats can not in time be discharged, will cause equipment aggravation ageing to when the workman is operating and control gum rigging machine, its walking easily causes the influence to the operation of machine. Therefore, it is necessary to provide a new automatic adhesive tape applying machine to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

The utility model solves the technical problem of providing the automatic back adhesive laminating machine which can cool the interior of the back adhesive laminating machine, avoid the effects of damaging equipment and aggravating aging due to overhigh internal heat and prevent the operation of the back adhesive laminating machine from being adversely affected by vibration generated in the walking process of people.

In order to solve the technical problem, the automatic adhesive tape laminating machine provided by the utility model comprises: the heat dissipation device comprises a first base and a second base, wherein the second base is fixedly arranged on the outer wall of one side of the first base, a heat dissipation assembly is arranged on the first base and comprises a first groove, a box body, a heat absorption plate and a flow guide pipe, the first groove is formed in the top of the first base, the box body is fixedly arranged on the first groove, the heat absorption plate is arranged at the top of the box body, the flow guide pipe is fixedly arranged on the outer wall of one side of the box body, and the bottom end of the flow guide pipe extends to the position below the first base; the second base is provided with a buffer assembly, the buffer assembly comprises a second groove, four telescopic rods, a pedal, four buffer springs, two connecting blocks, a concave block, a slide rod, a slide block and two first connecting rods, the second groove is formed in the top of the second base, the four telescopic rods are all fixedly arranged on the inner wall of the bottom of the second groove, the top ends of the telescopic rods extend to the upper portion of the second groove, the four telescopic rods are distributed in a rectangular array mode, the pedal is fixedly arranged at the top ends of the four telescopic rods, the four buffer springs are respectively sleeved on the four telescopic rods in a sliding mode, the top ends of the buffer springs are fixedly connected with the bottom of the pedal, the bottom ends of the buffer springs are fixedly connected with the inner wall of the bottom of the second groove, the two connecting blocks are all arranged in the second groove, the concave block is fixedly arranged on the corresponding connecting block, and the slide rod is fixedly arranged on the corresponding connecting block, the bottom of the pedal is hinged with two second connecting rods, and the bottom ends of the two second connecting rods are hinged with the two corresponding connecting blocks respectively.

Preferably, the bottom of the first base is provided with an opening, the opening is communicated with the first groove, the opening is provided with a refrigeration assembly, the refrigeration assembly comprises a cold end radiator, a hot end radiator, a semiconductor refrigeration sheet set, a cold end heat dissipation fan and a hot end heat dissipation fan, the semiconductor refrigeration sheet set is arranged between the cold end radiator and the hot end radiator, the cold end heat dissipation fan is arranged on the cold end radiator, and the hot end heat dissipation fan is arranged on the hot end radiator.

Preferably, the semiconductor refrigerating sheet group comprises a first semiconductor refrigerating sheet, a second semiconductor refrigerating sheet and a third semiconductor refrigerating sheet, the hot end of the first semiconductor refrigerating sheet is tightly attached to a hot end radiator, the cold end of the first semiconductor refrigerating sheet is tightly attached to the hot end of the second semiconductor refrigerating sheet, the cold end of the second semiconductor refrigerating sheet is tightly attached to the hot end of the third semiconductor refrigerating sheet, and the cold end of the third semiconductor refrigerating sheet is tightly attached to the cold end radiator.

Preferably, an elastic spring is fixedly installed on the inner wall of one side of the concave block, and one end of the elastic spring is fixedly connected with the outer wall of one side of the sliding block.

Preferably, a liquid inlet pipe is fixedly mounted on the outer wall of one side of the box body, one end, far away from the box body, of the liquid inlet pipe extends to the first base, and a piston is arranged on the liquid inlet pipe.

Preferably, the pedal is provided with an elastic pad, the pedal is connected with the elastic pad through a magic tape, the guide pipe is a copper pipe, and the guide pipe is provided with an electromagnetic valve.

Compared with the prior art, the automatic back adhesive laminating machine provided by the utility model has the following beneficial effects:

1. the back adhesive laminating machine has the advantages that the heat dissipation assembly and the refrigeration assembly are matched with each other, so that the inside of the back adhesive laminating machine can be subjected to heat dissipation and cooling, and damage and accelerated aging of equipment caused by overhigh internal heat are avoided;

2. according to the utility model, the buffering component is arranged, so that the adverse effect on the operation of the back adhesive laminating machine caused by the vibration generated in the walking process of people can be prevented.

Drawings

In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.

FIG. 1 is a schematic front sectional view of an automatic adhesive-backed laminating machine according to the present invention;

FIG. 2 is an enlarged schematic view of portion A of FIG. 1;

fig. 3 is a schematic structural view of the refrigeration unit in fig. 1.

In the figure: 1. a first base; 2. a second base; 3. a box body; 4. a heat absorbing plate; 5. a flow guide pipe; 6. a telescopic rod; 7. treading a pedal; 8. a buffer spring; 9. connecting blocks; 10. a concave block; 11. a slide bar; 12. a slider; 13. a first connecting rod; 14. a refrigeration assembly 14; 15. a cold side heat sink; 16. a hot end heat sink; 17. a semiconductor refrigerating sheet set; 170. a first semiconductor refrigeration chip; 171. a second semiconductor refrigeration chip; 172. a third semiconductor refrigeration chip; 18. a cold end heat radiation fan; 19. a hot end heat radiation fan.

Detailed Description

Referring to fig. 1-3, the automatic adhesive tape applying machine includes: the heat dissipation device comprises a first base 1 and a second base 2, wherein the second base 2 is fixedly arranged on the outer wall of one side of the first base 1, a heat dissipation assembly is arranged on the first base 1 and comprises a first groove, a box body 3, a heat absorption plate 4 and a flow guide pipe 5, the first groove is formed in the top of the first base 1, the box body 3 is fixedly arranged on the first groove, the heat absorption plate 4 is arranged at the top of the box body 3, the flow guide pipe 5 is fixedly arranged on the outer wall of one side of the box body 3, and the bottom end of the flow guide pipe 5 extends to the position below the first base 1;

the base II 2 is provided with a buffer assembly, the buffer assembly comprises a second groove, four telescopic rods 6, a pedal 7, four buffer springs 8, two connecting blocks 9, a concave block 10, a slide rod 11, a slide block 12 and two first connecting rods 13, the second groove is arranged at the top of the base II 2, the four telescopic rods 6 are all fixedly arranged on the inner wall of the bottom of the second groove, the top ends of the telescopic rods 6 extend to the upper part of the second groove, the four telescopic rods 6 are distributed in a rectangular array, the pedal 7 is fixedly arranged at the top ends of the four telescopic rods 6, the four buffer springs 8 are respectively sleeved on the four telescopic rods 6 in a sliding manner, the top ends of the buffer springs 8 are fixedly connected with the bottom of the pedal 7, the bottom ends of the buffer springs 8 are fixedly connected with the inner wall of the bottom of the second groove, and the two connecting blocks 9 are all arranged in the second groove, concave type piece 10 fixed mounting is on corresponding connecting block 9, slide bar 11 fixed mounting is on corresponding connecting block 9, the one end of slide bar 11 extend to in concave type piece 10 and with concave type piece 10 sliding connection, slider 12 sliding mounting is in concave type piece 10, slider 12 and slide bar 11's one end fixed connection, two head rods 13 articulate respectively on two corresponding connecting blocks 9, and the bottom of two head rods 13 all articulates with the bottom inner wall of second recess mutually, the bottom of trample 7 articulates there are two second connecting rods, and the bottom of two second connecting rods articulates with two corresponding connecting blocks 9 respectively and is connected.

As shown in fig. 1 and 3, a through hole is formed in the bottom of the first base 1, the through hole is communicated with the first groove, a refrigeration assembly 14 is arranged on the through hole, the refrigeration assembly 14 comprises a cold-end radiator 15, a hot-end radiator 16, a semiconductor refrigeration sheet group 17, a cold-end cooling fan 18 and a hot-end cooling fan 19, the semiconductor refrigeration sheet group 17 is arranged between the cold-end radiator 15 and the hot-end radiator 16, the cold-end cooling fan 18 is arranged on the cold-end radiator 15, and the hot-end cooling fan 19 is arranged on the hot-end radiator 16.

As shown in fig. 3, the semiconductor chilling plate group 17 includes a first semiconductor chilling plate 170, a second semiconductor chilling plate 171 and a third semiconductor chilling plate 172, a hot end of the first semiconductor chilling plate 170 is closely attached to the hot end radiator 16, a cold end of the first semiconductor chilling plate 170 is closely attached to a hot end of the second semiconductor chilling plate 171, a cold end of the second semiconductor chilling plate 171 is closely attached to a hot end of the third semiconductor chilling plate 172, and a cold end of the third semiconductor chilling plate 172 is closely attached to the cold end radiator 15;

under the mutual cooperation of the first semiconductor refrigeration piece 170, the second semiconductor refrigeration piece 171 and the third semiconductor refrigeration piece 172, the temperature is reduced by sequentially decreasing the surface area, so that the temperature reduction work is completed.

As shown in fig. 2, an elastic spring is fixedly installed on the inner wall of one side of the concave block 10, and one end of the elastic spring is fixedly connected with the outer wall of one side of the sliding block 12; through setting up elasticity spring, make it can reach spacing cushioning effect, make its cooperation other equipment can reach the effect of shock attenuation buffering.

As shown in fig. 1, a liquid inlet pipe is fixedly installed on the outer wall of one side of the box body 3, one end of the liquid inlet pipe, which is far away from the box body 3, extends out of the first base 1, and a piston is arranged on the liquid inlet pipe; through setting up the feed liquor pipe, can inject the coolant liquid into box 3, make its radiator unit can normal operating.

As shown in fig. 1, an elastic pad is arranged on the pedal 7, the pedal 7 is connected with the elastic pad through a hook-and-loop fastener, the draft tube 5 is a copper tube, and an electromagnetic valve is arranged on the draft tube 5.

The working principle of the automatic adhesive tape laminating machine provided by the utility model is as follows: the box body 3 is internally provided with cooling liquid, and the main body part of the back adhesive laminating machine is arranged on the first base 1; the first step is as follows: when the gum laminating machine needs to be monitored, a worker stands on the pedal 7, the pedal 7 drives the telescopic rod 6 to retract due to the weight relationship, the pedal 7 extrudes the buffer spring 8, and the buffer spring 8 can play a role in shock absorption and buffering under the mutual matching of the second connecting rod, the first connecting rod 13, the sliding block 12, the elastic spring, the sliding rod 11, the concave block 10 and the connecting block 9, so that the operation of the gum laminating machine is prevented from being adversely affected by the vibration generated in the walking process of people;

the second step is as follows: when the driving part of the back adhesive laminating machine generates heat, the heat is absorbed and transferred into the box body 3 through the heat absorbing plate 4, so that cooling liquid in the box body 3 is heated to be gasified, the electromagnetic valve is opened, and the gasified heat is discharged out of the base 1 through the flow guide pipe 5 to achieve the purpose of heat dissipation;

the third step: when the refrigeration assembly 14 is powered on, the semiconductor refrigeration sheet set 17 is operated to achieve the purposes of cooling and heat dissipation.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides an automatic rigging machine of gum, its characterized in that includes: the heat dissipation device comprises a first base and a second base, wherein the second base is fixedly arranged on the outer wall of one side of the first base, a heat dissipation assembly is arranged on the first base and comprises a first groove, a box body, a heat absorption plate and a flow guide pipe, the first groove is formed in the top of the first base, the box body is fixedly arranged on the first groove, the heat absorption plate is arranged at the top of the box body, the flow guide pipe is fixedly arranged on the outer wall of one side of the box body, and the bottom end of the flow guide pipe extends to the position below the first base; the second base is provided with a buffer assembly, the buffer assembly comprises a second groove, four telescopic rods, a pedal, four buffer springs, two connecting blocks, a concave block, a slide rod, a slide block and two first connecting rods, the second groove is formed in the top of the second base, the four telescopic rods are all fixedly arranged on the inner wall of the bottom of the second groove, the top ends of the telescopic rods extend to the upper portion of the second groove, the four telescopic rods are distributed in a rectangular array mode, the pedal is fixedly arranged at the top ends of the four telescopic rods, the four buffer springs are respectively sleeved on the four telescopic rods in a sliding mode, the top ends of the buffer springs are fixedly connected with the bottom of the pedal, the bottom ends of the buffer springs are fixedly connected with the inner wall of the bottom of the second groove, the two connecting blocks are all arranged in the second groove, the concave block is fixedly arranged on the corresponding connecting block, and the slide rod is fixedly arranged on the corresponding connecting block, the bottom of the pedal is hinged with two second connecting rods, and the bottom ends of the two second connecting rods are hinged with the two corresponding connecting blocks respectively.

2. The automatic laminating machine of back adhesive of claim 1, characterized in that: the bottom of the first base is provided with an opening, the opening is communicated with the first groove, a refrigeration assembly is arranged on the opening and comprises a cold end radiator, a hot end radiator, a semiconductor refrigeration sheet set, a cold end cooling fan and a hot end cooling fan, the semiconductor refrigeration sheet set is arranged between the cold end radiator and the hot end radiator, the cold end cooling fan is arranged on the cold end radiator, and the hot end cooling fan is arranged on the hot end radiator.

3. The automatic laminating machine of back adhesive of claim 2, characterized in that: the semiconductor refrigerating sheet group comprises a first semiconductor refrigerating sheet, a second semiconductor refrigerating sheet and a third semiconductor refrigerating sheet, wherein the hot end of the first semiconductor refrigerating sheet is tightly attached to a hot end radiator, the cold end of the first semiconductor refrigerating sheet is tightly attached to the hot end of the second semiconductor refrigerating sheet, the cold end of the second semiconductor refrigerating sheet is tightly attached to the hot end of the third semiconductor refrigerating sheet, and the cold end of the third semiconductor refrigerating sheet is tightly attached to the cold end radiator.

4. The automatic laminating machine of back adhesive of claim 2, characterized in that: and an elastic spring is fixedly arranged on the inner wall of one side of the concave block, and one end of the elastic spring is fixedly connected with the outer wall of one side of the sliding block.

5. The automatic laminating machine of back adhesive of claim 1, characterized in that: the outer wall fixed mounting of one side of box has the feed liquor pipe, the one end that the box was kept away from to the feed liquor pipe extends to outside the base, be equipped with the piston on the feed liquor pipe.

6. The automatic laminating machine of back adhesive of claim 1, characterized in that: the pedal is provided with an elastic pad, the pedal is connected with the elastic pad through a magic tape, the guide pipe is a copper pipe, and the guide pipe is provided with an electromagnetic valve.