CN215794721U - Grain transfer mechanism for chip packaging - Google Patents
Grain transfer mechanism for chip packaging Download PDFInfo
- Publication number
- CN215794721U CN215794721U CN202122306661.5U CN202122306661U CN215794721U CN 215794721 U CN215794721 U CN 215794721U CN 202122306661 U CN202122306661 U CN 202122306661U CN 215794721 U CN215794721 U CN 215794721U
- Authority
- CN
- China
- Prior art keywords
- plate
- transfer mechanism
- supporting plate
- bottom plate
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model belongs to the technical field of semiconductor manufacturing, and discloses a crystal grain transfer mechanism for chip packaging, which comprises a bottom plate, wherein a vertical plate is fixed at one end of the upper surface wall of the bottom plate, a first supporting plate and a second supporting plate are arranged on the upper surface wall of the bottom plate, the second supporting plate is positioned between the first supporting plate and the vertical plate, a mounting plate is fixed at the top end of the vertical plate, a first air cylinder is arranged at one side of the top end of the mounting plate, the output end of the first air cylinder is connected with a second mounting frame through a telescopic rod, and a second air cylinder is arranged in the second mounting frame. The left and right positions of the suction nozzle can be conveniently adjusted.
Description
Technical Field
The utility model belongs to the technical field of semiconductor manufacturing, and particularly relates to a crystal grain transfer mechanism for chip packaging.
Background
In a semiconductor manufacturing process, a circuit pattern is transferred to a manufactured wafer, and the completed wafer is sent to a downstream IC packaging and testing factory for packaging and testing.
However, the existing crystal grain transfer mechanism has certain defects, the traditional crystal grain transfer mechanism has complex structure, high manufacturing cost and poorer transfer flexibility, and in addition, the traditional crystal grain transfer mechanism is not provided with a PCB (printed circuit board) placing plate which is convenient to mount and dismount, so that the traditional crystal grain transfer mechanism is inconvenient for subsequent replacement.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a crystal grain transfer mechanism for chip packaging, which aims to solve the problems of complex structure, high manufacturing cost and poor transfer flexibility of the traditional crystal grain transfer mechanism in the background art, and in addition, the problem that a PCB (printed circuit board) placing plate which is convenient to mount and dismount is not arranged, and the subsequent replacement is inconvenient is solved.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a crystalline grain transfer mechanism for chip package, includes the bottom plate, the last wall one end of bottom plate is fixed with the riser, and the last wall of going up of bottom plate installs first layer board and second layer board, the second layer board is located between first layer board and the riser, the top of riser is fixed with the mounting panel, first cylinder is installed to top one side of mounting panel, the output of first cylinder is connected with the second installing frame through the telescopic link, the internally mounted of second installing frame has the second cylinder, the output of second cylinder is connected with first installing frame through the telescopic link, the internally mounted of first installing frame has the negative pressure pump, the end of breathing in of negative pressure pump is connected with the suction nozzle through the trachea, logical groove has been seted up to the last wall of mounting panel.
Preferably, the bottom end of the first supporting plate is symmetrically fixed with sliding strips, and the upper surface wall of the bottom plate is provided with sliding grooves matched with the sliding strips.
Preferably, the bottom end of the second mounting frame is symmetrically fixed with limiting strips, and limiting grooves matched with the limiting strips are symmetrically formed in the two sides of the upper surface wall of the bottom plate, which are located on the through groove.
Preferably, PCB placing grooves are formed in the upper surface wall of the first supporting plate at equal intervals, and anti-skid grains are formed in the upper surface wall of the PCB placing grooves.
Preferably, the handles are installed on the front wall and the rear wall of the first supporting plate, and the rubber sleeve is sleeved outside the handles.
Preferably, the upper surface wall of the bottom plate is provided with mounting holes at positions close to corners.
Compared with the prior art, the utility model has the beneficial effects that:
(1) the suction nozzle is simple in structure and convenient to move, the left and right positions and the upper and lower positions of the suction nozzle can be changed through the matching of the first air cylinder and the second air cylinder, the positions can be flexibly changed according to needs to place crystal grains, and the suction nozzle is more flexible.
(2) According to the utility model, the movable installation of the first supporting plate is realized by utilizing the matching of the sliding strip and the sliding groove, when the placing position of the crystal grains needs to be changed, the position of the first supporting plate can be changed back and forth to carry the crystal grains by utilizing the sliding of the sliding strip in the sliding groove, so that the carrying is more convenient, and the movable first supporting plate is convenient to rapidly dismount and install.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of the mounting plate of the present invention;
FIG. 3 is a top view of a first pallet of the present invention;
FIG. 4 is an enlarged view of portion A of FIG. 1;
in the figure: 1. a base plate; 2. a first pallet; 3. a slide bar; 4. a second pallet; 5. a vertical plate; 6. mounting a plate; 7. a first cylinder; 8. a first mounting frame; 9. a second cylinder; 10. a second mounting frame; 11. a negative pressure pump; 12. a suction nozzle; 13. a through groove; 14. a limiting groove; 15. a PCB placement slot; 16. a chute; 17. and (5) a limiting strip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides the following technical solutions: a crystal grain transfer mechanism for chip packaging comprises a bottom plate 1, wherein a vertical plate 5 is fixed at one end of the upper surface wall of the bottom plate 1, a first supporting plate 2 and a second supporting plate 4 are installed on the upper surface wall of the bottom plate 1, the second supporting plate 4 is positioned between the first supporting plate 2 and the vertical plate 5, a mounting plate 6 is fixed at the top end of the vertical plate 5, a first air cylinder 7 is installed at one side of the top end of the mounting plate 6, the output end of the first air cylinder 7 is connected with a second mounting frame 10 through a telescopic rod, a second air cylinder 9 is installed inside the second mounting frame 10, the output end of the second air cylinder 9 is connected with a first mounting frame 8 through a telescopic rod, a negative pressure pump 11 is installed inside the first mounting frame 8, the negative pressure pump 11 is a miniature negative pressure pump, the air suction end of the negative pressure pump 11 is connected with a suction nozzle 12 through an air pipe, a through groove 13 is formed in the upper surface wall of the mounting plate 6, and the first air cylinder 7 is matched with the second air cylinder 9, the change of the left and right positions and the up and down positions of the suction nozzle 12 can be realized, the position can be flexibly changed as required to place crystal grains, the flexibility is higher, in addition, the through groove 13 can avoid blocking the second air cylinder 9, and the left and right position adjustment of the suction nozzle 12 is facilitated.
Further, the bottom symmetry of first layer board 2 is fixed with draw runner 3, and the spout 16 with draw runner 3 looks adaptation is seted up to the last wall of bottom plate 1, when the position of placing of change crystalline grain around needs, only need utilize the slip of draw runner 3 in spout 16, can change the position of first layer board 2 around and carry out accepting of crystalline grain, and is comparatively convenient, and secondly, movable first layer board 2 also is convenient for it to lift off fast and install.
Further, the bottom symmetry of second installing frame 10 is fixed with spacing 17, and bottom plate 1 top surface wall just lies in the bilateral symmetry that leads to groove 13 and sets up the spacing groove 14 with spacing 17 looks adaptation, and when second installing frame 10 removed, spacing 17 can remove along spacing groove 14, can increase the stability that second installing frame 10 removed on the one hand, and on the other hand can play the supporting role, reduces the bearing of first cylinder 7 output.
Further, PCB shelving grooves 15 are formed in the upper surface wall of the first supporting plate 2 at equal intervals, anti-slip patterns are formed in the upper surface wall of the PCB shelving grooves 15, the PCB shelving grooves 15 are used for placing PCBs, and the formed anti-slip patterns can increase the placing stability of the PCBs.
Further, the handle is all installed to the preceding back wall of first layer board 2, and the outside cover of handle is equipped with the rubber sleeve, utilizes first layer board 2 of handle push-and-pull, and the hand application of force of being convenient for is comparatively convenient.
Further, the upper surface wall of the bottom plate 1 is provided with mounting holes at positions close to corners, and bolts penetrate through the mounting holes to stably fix the bottom plate 1.
The working principle and the using process of the utility model are as follows: when the utility model is used, the crystal grains can be arranged on the second supporting plate 4, the PCB is arranged in the PCB laying groove 15 arranged on the first supporting plate 2 and is placed, then the negative pressure pump 11 can be started, the suction nozzle 12 is used for absorbing the crystal grains through the negative pressure absorption effect, then the change of the left and right positions and the up and down positions of the suction nozzle 12 can be realized through the matching of the first air cylinder 7, the second air cylinder 9 and the like, the position can be flexibly changed according to the requirement for placing the crystal grains, in addition, when the placing position of the crystal grains is changed front and back as required, the position of the first supporting plate 2 can be changed front and back only by using the sliding of the sliding strip 3 in the sliding groove 16, the carrying of the crystal grains is convenient, in addition, when the second mounting frame 10 is moved, the limiting strip 17 can be moved along the limiting groove 14, on one hand, the stability of the movement of the second mounting frame 10 can be increased, on the other hand, the supporting effect can be realized, the load bearing of the output end of the first cylinder 7 is reduced.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A grain transfer mechanism for chip packaging is characterized in that: comprises a bottom plate (1), wherein a vertical plate (5) is fixed at one end of the upper wall of the bottom plate (1), a first supporting plate (2) and a second supporting plate (4) are installed on the upper wall of the bottom plate (1), the second supporting plate (4) is positioned between the first supporting plate (2) and the vertical plate (5), a mounting plate (6) is fixed at the top end of the vertical plate (5), a first air cylinder (7) is installed at one side of the top end of the mounting plate (6), the output end of the first air cylinder (7) is connected with a second mounting frame (10) through a telescopic rod, a second air cylinder (9) is installed inside the second mounting frame (10), the output end of the second air cylinder (9) is connected with a first mounting frame (8) through a telescopic rod, a negative pressure pump (11) is installed inside the first mounting frame (8), and the air suction end of the pump (11) is connected with a suction nozzle (12) through an air pipe, the upper surface wall of the mounting plate (6) is provided with a through groove (13).
2. The die transfer mechanism of claim 1, wherein: the bottom of the first supporting plate (2) is symmetrically fixed with sliding strips (3), and the upper wall of the bottom plate (1) is provided with sliding grooves (16) matched with the sliding strips (3).
3. The die transfer mechanism of claim 1, wherein: the bottom end of the second mounting frame (10) is symmetrically fixed with limiting strips (17), and limiting grooves (14) matched with the limiting strips (17) are symmetrically formed in the two sides of the upper surface wall of the bottom plate (1) and located in the through grooves (13).
4. The die transfer mechanism of claim 1, wherein: PCB placing grooves (15) are formed in the upper surface wall of the first supporting plate (2) at equal intervals, and anti-skid grains are formed in the upper surface wall of the PCB placing grooves (15).
5. The die transfer mechanism of claim 1, wherein: the handle is all installed to the preceding back wall of first layer board (2), the outside cover of handle is equipped with the rubber sleeve.
6. The die transfer mechanism of claim 1, wherein: mounting holes are formed in the positions, close to the corners, of the upper surface wall of the bottom plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122306661.5U CN215794721U (en) | 2021-09-23 | 2021-09-23 | Grain transfer mechanism for chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122306661.5U CN215794721U (en) | 2021-09-23 | 2021-09-23 | Grain transfer mechanism for chip packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215794721U true CN215794721U (en) | 2022-02-11 |
Family
ID=80165661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122306661.5U Active CN215794721U (en) | 2021-09-23 | 2021-09-23 | Grain transfer mechanism for chip packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215794721U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114668665A (en) * | 2022-04-22 | 2022-06-28 | 长沙市中医医院（长沙市第八医院） | Traditional chinese medical science internal medicine moxibustion therapy fixer |
-
2021
- 2021-09-23 CN CN202122306661.5U patent/CN215794721U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114668665A (en) * | 2022-04-22 | 2022-06-28 | 长沙市中医医院（长沙市第八医院） | Traditional chinese medical science internal medicine moxibustion therapy fixer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN215794721U (en) | Grain transfer mechanism for chip packaging | |
| CN205771971U (en) | The Liftable conveying device of thin sheet glass plated film | |
| CN208182164U (en) | A kind of multistation placement equipment based on double X-axis independent controls | |
| CN216177563U (en) | Laser marking machine with vacuum adsorption tool | |
| CN216849850U (en) | Chip packaging device based on information technology control | |
| CN215469329U (en) | Full-automatic bilateral material taking type component inserter | |
| CN215600344U (en) | Slide glass device of packaging substrate | |
| CN210449743U (en) | IC surface glue coating platform mechanism | |
| CN211470018U (en) | Unloader of heat transfer machine | |
| CN210272323U (en) | Clamping device convenient to integrated circuit board | |
| CN209291519U (en) | A kind of full-automatic plate-absorbing machine | |
| CN210445808U (en) | Cloth supporting model for clothing design | |
| CN217705902U (en) | Circuit board fixing device transport vechicle that possesses cooling function | |
| CN215030640U (en) | Automatic adhesive deposite device of interior china rice of adjustable temperature controller screw rod | |
| CN111900121A (en) | Automatic wafer loading equipment for quartz wafer production | |
| CN220866547U (en) | Adjustable sucking disc formula moves and carries conveying mechanism | |
| CN217571654U (en) | Etching device for integrated circuit device | |
| CN221488114U (en) | Stepped high-frequency circuit board | |
| CN213706773U (en) | Adjustable conveyer belt of limit for width of calico printing machine | |
| CN215794722U (en) | Packing plant for glass processing | |
| CN220387008U (en) | Chip packaging glue temperature-returning placing device | |
| CN221873619U (en) | Industrial printer frame structure | |
| CN211683902U (en) | Fixing device is used in production of marble composite sheet | |
| CN213715704U (en) | A novel LED exposure machine for galley is made | |
| CN215699559U (en) | Equipment of full-automatic lock screw is carried out keyboard equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |