CN215787326U - Reflow soldering and wave soldering multi-section type track equipment - Google Patents
Reflow soldering and wave soldering multi-section type track equipment Download PDFInfo
- Publication number
- CN215787326U CN215787326U CN202122093116.2U CN202122093116U CN215787326U CN 215787326 U CN215787326 U CN 215787326U CN 202122093116 U CN202122093116 U CN 202122093116U CN 215787326 U CN215787326 U CN 215787326U
- Authority
- CN
- China
- Prior art keywords
- reflow
- shell
- heating plate
- conveying
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides reflow soldering and wave soldering multi-section type track equipment which comprises a main body assembly, a heating assembly and a conveying assembly, wherein the main body assembly comprises a shell, a feeding hole and a discharging hole; the heating assembly is arranged inside the shell; according to the utility model, three groups of conveying assemblies are arranged, and the rotating speed of the motor is adjusted by the frequency converter in the process of conveying the circuit board by the belt, so that the speeds of the three groups of conveying assemblies for conveying the circuit board are different, the circuit board passes through the lower heating plate and the upper heating plate at different speeds, and the heating speed of the circuit board is accurately controlled.
Description
Technical Field
The utility model relates to the technical field of electronic device welding equipment, in particular to reflow soldering and wave soldering multi-section type track equipment.
Background
Wave soldering and reflow soldering equipment are common equipment in electronic manufacturing factories and are mainly used for soldering components on circuit boards. At present, the circuit boards are conveyed by equipment in a one-section type chain track mode, and the circuit boards are conveyed through a plurality of heating cavities with different temperatures to complete controllable temperature rise of the circuit boards and welding. Since the circuit board and the solder and the various components thereon have their own optimum soldering temperature requirements. Such as (temperature rising slope, temperature falling slope, highest heat-resisting temperature, highest temperature time and other parameter requirements) and the solder also has own optimal soldering temperature requirement (temperature rising slope, activation temperature, maintenance time, optimal soldering temperature and the like). Therefore, when a circuit board is welded, different temperatures are required to be set in each temperature zone of reflow soldering equipment or wave soldering equipment, and then the circuit board, elements and solder can be welded at the most appropriate welding temperature by the reflow soldering equipment or the wave soldering equipment by matching with the speed of the circuit board passing through each temperature zone.
However, the existing equipment is a one-section type track, and the process of completing the welding of the circuit board through the equipment can only set one speed. Therefore, when some products are produced, the temperature of each heating area and the speed of a single track cannot be adjusted to meet the welding temperature requirements of a circuit board, a welding flux and an element (the welding temperature requirements of the three are greatly different), and the condition that the three elements are out of order occurs.
Therefore, reflow soldering and wave soldering multi-section type track equipment is proposed.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is desirable to provide a reflow soldering wave soldering multi-section track device to solve or alleviate the technical problems in the prior art, and to provide at least one useful choice.
The technical scheme of the embodiment of the utility model is realized as follows: reflow soldering and wave-soldering multi-section type track equipment comprises a main body assembly, a heating assembly and a conveying assembly, wherein the main body assembly comprises a shell, a feeding hole and a discharging hole;
the heating assembly is arranged inside the shell;
the conveying assemblies are arranged in three groups, and the three groups of conveying assemblies are all arranged in the shell;
the conveying assembly comprises a belt, a motor, a driving gear, a rotating shaft, a driven gear and a frequency converter;
the frequency converter is arranged on the inner side of the shell, and the electrical output end of the frequency converter is electrically connected with the electrical input end of the motor.
In some embodiments: a feed inlet is formed in one side of the shell, and a discharge outlet is formed in the other side of the shell.
In some embodiments: the heating assembly comprises a lower heating plate and an upper heating plate, and the lower heating plate and the upper heating plate are both arranged in the shell.
In some embodiments: the lower heating plate is positioned below the conveying assembly, and the upper heating plate is positioned above the conveying assembly.
In some embodiments: the upper heating plate comprises a reflow soldering upper heating area and a reflow soldering cooling area;
the reflow soldering upper heating area is located on one side close to the feeding hole, and the reflow soldering cooling area is located on one side close to the discharging hole.
In some embodiments: the motor is arranged in the shell, the driving gear is sleeved on the outer side of the output shaft of the driven gear, and the outer side of the driving gear is meshed with the outer side of one driven gear.
In some embodiments: the both ends of pivot all rotate through the bearing and connect in the inner wall of casing, two driven gear have been cup jointed to the outside symmetry of pivot.
In some embodiments: the number of the rotating shafts is two, and the inner side of the belt is meshed and connected with the outer side of the driven gear.
Due to the adoption of the technical scheme, the embodiment of the utility model has the following advantages:
according to the utility model, three groups of conveying assemblies are arranged, and the rotating speed of the motor is adjusted by the frequency converter in the process of conveying the circuit board by the belt, so that the speeds of the three groups of conveying assemblies for conveying the circuit board are different, the circuit board passes through the lower heating plate and the upper heating plate at different speeds, and the heating speed of the circuit board is accurately controlled.
The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and following detailed description.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments or technical descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a block diagram of the present invention;
FIG. 2 is a side view structural diagram of the present invention;
FIG. 3 is an internal structural view of the housing of the present invention;
fig. 4 is a schematic view showing a positional structure of an upper heating plate, a lower heating plate and a belt according to the present invention.
Reference numerals: 10. a body assembly; 11. a housing; 12. a feed inlet; 13. a discharge port; 20. a heating assembly; 21. a lower heating plate; 22. an upper heating plate; 221. reflow soldering the upper heating zone; 222. a reflow soldering cooling zone; 30. a delivery assembly; 31. a belt; 32. a motor; 33. a driving gear; 34. a rotating shaft; 35. a driven gear; 36. and a frequency converter.
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 4, the embodiment of the present invention provides a reflow soldering wave-soldering multi-section track device, which includes a main body assembly 10, a heating assembly 20 and a conveying assembly 30, wherein the main body assembly 10 includes a housing 11, a feeding port 12 and a discharging port 13;
the heating assembly 20 is installed inside the housing 11;
the conveying assemblies 30 are arranged in three groups, and the three groups of conveying assemblies 30 are all arranged in the shell 11;
the conveying assembly 30 comprises a belt 31, a motor 32, a driving gear 33, a rotating shaft 34, a driven gear 35 and a frequency converter 36;
the frequency converter 36 is installed inside the housing 11, and an electrical output end of the frequency converter 36 is electrically connected to an electrical input end of the motor 32.
In one embodiment: a feed inlet 12 is formed in one side of the shell 11, and a discharge outlet 13 is formed in the other side of the shell 11; the electronic device to be heated is put in through the feed inlet 12 and leaves through the discharge outlet 13 after welding.
In one embodiment: the heating unit 20 includes a lower heating plate 21 and an upper heating plate 22, and both the lower heating plate 21 and the upper heating plate 22 are installed inside the housing 11.
In one embodiment: the lower heating plate 21 is positioned below the conveying assembly 30, and the upper heating plate 22 is positioned above the conveying assembly 30; the circuit board to be soldered is transported by the upper and lower heating plates in cooperation with the transport module 30, and is heated by the lower and upper heating plates 21 and 22 at a set speed to complete soldering.
In one embodiment: the upper heating plate 22 includes a reflow soldering upper heating zone 221 and a reflow soldering cooling zone 222;
the reflow soldering upper heating zone 221 is positioned at one side close to the feed port 12, and the reflow soldering cooling zone 222 is positioned at one side close to the discharge port 13; through above setting, the conveying component 30 of three groups of cooperation to the welded circuit board of speed transportation needs of difference, under the unchangeable condition of zone of heating temperature, the fast circuit board temperature of heating of track speed is low, and the slow circuit board heating temperature of track speed is high, plays better welding effect.
In one embodiment: the motor 32 is arranged in the shell 11, the driving gear 33 is sleeved on the outer side of an output shaft of the driven gear 35, and the outer side of the driving gear 33 is meshed and connected with the outer side of one driven gear 35; through the above arrangement, the motor 32 drives the driving gear 33 to rotate, and the driven gear 35 is driven to rotate.
In one embodiment: both ends of the rotating shaft 34 are rotatably connected to the inner wall of the shell 11 through bearings, and two driven gears 35 are symmetrically sleeved on the outer side of the rotating shaft 34; with the above arrangement, the rotary shaft 34 carries the driven gear 35 for rotation.
In one embodiment: the quantity of pivot 34 is two, and the inboard outside meshing with driven gear 35 of belt 31 is connected, and two pivots 34 bear four driven gear 35, and is effectual to the support of belt 31, and when a driven gear 35 rotated, can drive other driven gear 35 and rotate to make belt 31 make a round trip to rotate, accomplish the transportation.
The utility model is in operation: the circuit board to be welded is placed on a belt 31 in a shell 11 through a feeding hole 12, three groups of conveying assemblies 30 are arranged on the track equipment, the temperatures of a lower heating plate 21 and an upper heating plate 22 are set before transportation, the rotating speed of a motor 32 is adjusted through a frequency converter 36 in the process of transporting the circuit board by the belt 31, so that the speeds of the three groups of conveying assemblies 30 for transporting the circuit board are different, the circuit board passes through the lower heating plate 21 and the upper heating plate 22 at different speeds, the heating speed of the circuit board is accurately controlled, the heating temperature of the circuit board at a high track speed is low, the heating temperature of the circuit board at a low track speed is high, the circuit board can be controlled to pass through a specific area at different speeds, and the heating temperature of the circuit board can be more accurately controlled, so that the process window is greatly widened, the adjustment difficulty is simplified, and the process accuracy is improved, the quality is improved.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive various changes or substitutions within the technical scope of the present invention, and these should be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (8)
1. Reflow soldering, wave-soldering multistage formula track equipment, including main part subassembly (10), heating element (20) and conveying component (30), its characterized in that: the main body component (10) comprises a shell (11), a feeding hole (12) and a discharging hole (13);
the heating assembly (20) is arranged inside the shell (11);
the conveying assemblies (30) are arranged in three groups, and the three groups of conveying assemblies (30) are all arranged in the shell (11);
the conveying assembly (30) comprises a belt (31), a motor (32), a driving gear (33), a rotating shaft (34), a driven gear (35) and a frequency converter (36);
the frequency converter (36) is arranged on the inner side of the shell (11), and the electrical output end of the frequency converter (36) is electrically connected with the electrical input end of the motor (32).
2. The reflow, wave solder multi-section track set of claim 1, wherein: a feeding hole (12) is formed in one side of the shell (11), and a discharging hole (13) is formed in the other side of the shell (11).
3. The reflow, wave solder multi-section track set of claim 1, wherein: the heating assembly (20) comprises a lower heating plate (21) and an upper heating plate (22), and the lower heating plate (21) and the upper heating plate (22) are both arranged inside the shell (11).
4. The reflow, wave solder multi-section track set of claim 3, wherein: the lower heating plate (21) is positioned below the conveying assembly (30), and the upper heating plate (22) is positioned above the conveying assembly (30).
5. The reflow, wave solder multi-section track set of claim 3, wherein: the upper heating plate (22) comprises a reflow soldering upper heating zone (221) and a reflow soldering cooling zone (222);
the reflow soldering upper heating area (221) is located on one side close to the feeding hole (12), and the reflow soldering cooling area (222) is located on one side close to the discharging hole (13).
6. The reflow, wave solder multi-section track set of claim 1, wherein: the motor (32) is installed in the shell (11), the driving gear (33) is sleeved on the outer side of an output shaft of the driven gear (35), and the outer side of the driving gear (33) is meshed and connected with the outer side of one driven gear (35).
7. The reflow, wave solder multi-section track set of claim 1, wherein: the both ends of pivot (34) all rotate through the bearing and connect in the inner wall of casing (11), two driven gear (35) have been cup jointed to the outside symmetry of pivot (34).
8. The reflow, wave solder multi-section track set of claim 1, wherein: the number of the rotating shafts (34) is two, and the inner side of the belt (31) is in meshed connection with the outer side of the driven gear (35).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122093116.2U CN215787326U (en) | 2021-09-01 | 2021-09-01 | Reflow soldering and wave soldering multi-section type track equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122093116.2U CN215787326U (en) | 2021-09-01 | 2021-09-01 | Reflow soldering and wave soldering multi-section type track equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215787326U true CN215787326U (en) | 2022-02-11 |
Family
ID=80154650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122093116.2U Active CN215787326U (en) | 2021-09-01 | 2021-09-01 | Reflow soldering and wave soldering multi-section type track equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215787326U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114515881A (en) * | 2022-03-26 | 2022-05-20 | 宁波诚兴道电子科技有限公司 | PCBA circuit board welding equipment and process |
-
2021
- 2021-09-01 CN CN202122093116.2U patent/CN215787326U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114515881A (en) * | 2022-03-26 | 2022-05-20 | 宁波诚兴道电子科技有限公司 | PCBA circuit board welding equipment and process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN215787326U (en) | Reflow soldering and wave soldering multi-section type track equipment | |
| CN109186233B (en) | Vertical oven for circuit board and drying method thereof | |
| CN213003173U (en) | Double-track nitrogen gas stove that PCB circuit board reflow soldering used | |
| CN212264799U (en) | Stable tin runner structure of carrying of soldering tin machine | |
| CN106328564B (en) | Integrated circuit packaging production line equipment | |
| CN106764568B (en) | A kind of LED light bar cooling system | |
| CN214392718U (en) | Reflow soldering equipment used in SMT production line | |
| CN215401457U (en) | PCBA panel turnover machine | |
| CN216944927U (en) | High-stability anti-vibration automatic conveying device of reflow oven | |
| CN210587537U (en) | Anti-vibration conveying device of reflow oven | |
| CN211637403U (en) | Multi-rail multi-position parallel test sorting device for integrated circuit chip | |
| CN210689109U (en) | Bio-chemical fertilizer screening plant with stoving function | |
| CN216347607U (en) | Be used for adjustable wired oven of PCB board | |
| CN218595233U (en) | PCB board conveyer | |
| CN209758307U (en) | Material vertical steering L-shaped spiral conveying equipment | |
| CN210339284U (en) | Conveying device capable of controlling conveying direction for processing PCB inner layer board | |
| CN207731907U (en) | A kind of MB bridges heap bonding machine | |
| CN215545638U (en) | Aluminum substrate reflow soldering machine | |
| CN209783240U (en) | Drying device is used in processing of copper facing additive | |
| CN211860710U (en) | Welding-proof wiring device for special circuit board with asymmetric male and female copper stacking structure | |
| CN215738495U (en) | Energy-saving oven with external driving device | |
| CN207869523U (en) | A kind of wiring board clamping plate turning-over conveying unit | |
| CN211763418U (en) | Carrier tape forming device | |
| CN216531999U (en) | SMT (surface mount technology) mounting process system for circuit board | |
| CN211495879U (en) | Circuit board track transfer trolley and track transfer conveying device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |