CN215785051U - Palladium removal control device for electroplating through hole etching line - Google Patents
Palladium removal control device for electroplating through hole etching line Download PDFInfo
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- CN215785051U CN215785051U CN202122010798.6U CN202122010798U CN215785051U CN 215785051 U CN215785051 U CN 215785051U CN 202122010798 U CN202122010798 U CN 202122010798U CN 215785051 U CN215785051 U CN 215785051U
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Abstract
The utility model discloses a palladium removal control device for an electroplated through hole etching line, which comprises an etching area, an identification area and a palladium removal area, wherein the etching area is provided with a swelling groove, a film removing groove, an etching groove, a fresh liquid groove and a water absorption groove, the identification area comprises a through hole identification device and a two-dimensional code identification device, the palladium removal area comprises a palladium removal groove, a water washing groove, a tin removing groove, a grinding plate groove and a dry plate groove, the palladium removal groove is used for removing palladium in a non-metalized hole, the etching area, the identification area and the palladium removal area are sequentially connected, and the etching area and the palladium removal area are provided with a water washing device and a roller transmission device. The palladium removal control device for the electroplating through hole etching line disclosed by the utility model can identify and distinguish the gold immersion plate and the non-gold immersion plate, is automatically controlled, solves the problem of manually closing the palladium removal groove, and effectively saves the cost.
Description
Technical Field
The utility model relates to an automatic control device for removing palladium, in particular to a control device for removing palladium of an electroplating through hole etching line.
Background
The activation process in the PTH plating process adopts palladium metal as the main agent of the bath solution and utilizes the catalytic action of the palladium metal film to reduce the energy barrier of metal copper formed by the reduction reaction of chemical copper ions in the later stage, that is, chemical copper exists in the presence of chemical palladium. In the gold deposition process, if palladium residues in the non-plated through holes can deposit gold on the non-plated through holes, therefore, the etching lines have a flow, namely palladium removal, and palladium in the non-plated through holes is removed by using a palladium inactivator, so that the processing quality of the post-process is ensured.
However, it is wasteful to remove palladium for single-sided boards, metal substrates and non-immersion gold production boards, and therefore, some factories use manual operation to stop the palladium removal tank and then wash the palladium removal tank with water to save cost, but the manual control mode has a great risk, and the whole batch of boards may be scrapped if the palladium removal tank is forgotten to be opened during the production of immersion gold boards.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects in the prior art, the utility model aims to provide a palladium removal control device for an electroplating through hole etching line, which can distinguish a gold immersion plate from a non-gold immersion plate, automatically control, solve the problem of manually closing a palladium removal tank and effectively save the cost.
The technical scheme adopted by the utility model for solving the technical problems is as follows:
the utility model provides an electroplate palladium controlling means that removes of through-hole etching line, includes etching district, identification area and removes the palladium district, the etching district is equipped with the inflation groove, moves back the membrane groove, etches groove, fresh solution groove and the groove that absorbs water, the identification area includes through-hole identification device and two-dimensional code identification device, it includes palladium groove, wash bowl, tin bath, abrasive disc groove and dry plate groove to remove the palladium district, it is used for the downthehole palladium of non-metallization to get rid of to remove the palladium groove, etching district, identification area and remove the palladium district and connect gradually, the etching district with remove the palladium district and be equipped with washing unit and gyro wheel transmission device.
As a further improvement of the utility model: the water washing device comprises an upper spraying mechanism and a lower spraying mechanism, the water washing device is used for cleaning the circuit board, and the etching area and the water washing device except the palladium area are independently controlled.
As a further improvement of the utility model: the roller transmission device comprises an upper roller transmission mechanism and a lower roller transmission mechanism, and the roller transmission device is used for transmitting a circuit board in the palladium removal control device.
As a further improvement of the utility model: the roller transmission device is arranged between the upper spraying device and the lower spraying device of the washing device and is arranged on the same level.
As a further improvement of the utility model: one end of the etching area is provided with a feeding port, the feeding port is connected with the bulking groove, one end of the palladium removing area is provided with a discharging port, and the discharging port is connected with the dry plate groove.
As a further improvement of the utility model: the through hole recognition device comprises a drilling machine and a recognizer, wherein the drilling machine is connected with the recognizer.
As a further improvement of the utility model: the through hole recognition device carries out matching recognition through the through hole of the circuit board and the drilling machine, and recognition data is returned to the recognizer for judgment.
Compared with the prior art, the utility model has the beneficial effects that:
the palladium removal control device for the electroplating through-hole etching line can identify and distinguish the gold immersion plate and the non-gold immersion plate, is automatically controlled, solves the problem of manually closing the palladium removal groove, and effectively saves cost.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Detailed Description
The utility model will now be further described with reference to the accompanying description and examples:
referring to fig. 1, a palladium removing control device for an electroplating through-hole etching line comprises an etching area A, an identification area B and a palladium removing area C, wherein the etching area A is provided with a swelling groove 2, a film stripping groove 3, an etching groove 4, a fresh water groove 5 and a water absorption groove 6, the identification area B comprises a through-hole identification device 13 and a two-dimensional code identification device 14, the palladium removing area C comprises a palladium removing groove 7, a water washing groove 8, a tin stripping groove 9, a grinding plate groove 10 and a dry plate groove 11, the palladium removing groove 7 is used for removing palladium in a non-metallization hole, the etching area A, the identification area B and the palladium removing area C are sequentially connected, and the etching area A and the palladium removing area C are provided with a water washing device and a roller transmission device.
The water washing device comprises an upper spraying mechanism 15 and a lower spraying mechanism 16, the water washing device is used for cleaning the circuit board, and the etching area A and the water washing device of the palladium removing area C are independently controlled.
The roller transmission device comprises an upper roller transmission mechanism 17 and a lower roller transmission mechanism 18, the roller transmission device is used for transmitting a circuit board in the palladium removal control device, the roller transmission device is arranged between an upper spraying device 15 and a lower spraying device 16 of the washing device, and the roller transmission devices are arranged on the same level.
A feeding port 1 is formed in one end of the etching area A, the feeding port 1 is connected with the expansion groove 2, a discharging port 12 is formed in one end of the palladium removing area C, and the discharging port 12 is connected with the dry plate groove 11.
The through hole recognition device 14 comprises a drilling machine and a recognizer, the drilling machine is connected with the recognizer, the through hole recognition device 14 carries out matching recognition through the through hole of the circuit board and the drilling machine, and recognition data is transmitted back to the recognizer for judgment.
The working principle of the utility model is as follows:
firstly, putting a circuit board into a material inlet 1, then adjusting the circuit board to a proper angle, starting to transmit the circuit board by a roller transmission mechanism, transmitting the circuit board into a swelling groove 2, spraying swelling agent by a spraying device of the swelling groove 2, swelling and softening the circuit board, transmitting the circuit board to a film removing groove 3 after spraying, spraying film removing liquid medicine for the circuit board by the film removing groove 3, removing a dry film on the outer layer of the circuit board, washing the overflow water of the circuit board by the spraying device after film removing treatment, then carrying out film removing inspection on the circuit board, transmitting the circuit board to an etching groove 4 in the next step, spraying etching liquid medicine by the spraying device of the etching groove 4, transmitting the circuit board to a new liquid groove 5 after etching, spraying new etching liquid medicine to the circuit board by the new liquid groove 5 for etching again, allowing the etched liquid medicine to flow into the etching groove 4, and supplementing the liquid medicine to the spraying device of the etching groove 4, the circuit board is conveyed to a water absorption tank 6, a spraying device of the water absorption tank 6 is used for spraying and washing overflow of the circuit board, the circuit board is dried after being washed, then the circuit board is conveyed to an identification area C to be identified, whether the circuit board is a gold-deposited board or not is judged, a two-dimensional code identification device 13 is used for identifying a two-dimensional code arranged on the circuit board, when the two-dimensional code identification device 13 cannot identify the circuit board, a through hole identification device 14 is used for identifying the circuit board, when the circuit board is identified as a gold-deposited board and enters a palladium removal tank 7, a spraying device of the palladium removal tank 7 is used for spraying palladium removal agent on the circuit board to remove palladium, after palladium removal, the circuit board enters a water washing tank 8, the spraying device of the water washing tank 8 is continuously opened to carry out overflow washing on the circuit board, the circuit board enters a tin removal tank 9, a spraying device of the tin removal tank 9 is used for spraying tin removal agent on the circuit board, after tin removal, the spraying device carries out overflow washing on the circuit board, the circuit board enters a board grinding groove 10, the board grinding groove 10 carries out board grinding treatment on the circuit board, after the board grinding is finished, a spraying device of the board grinding groove 10 carries out overflow water washing on the circuit board, the circuit board enters a dry board groove 11, the dry board groove 11 dries the moisture on the surface of the circuit board, and the dried circuit board is transmitted to a discharge hole 12; when the circuit board is identified as a non-immersion gold plate, the spraying device of the palladium removing area C is closed, and only circuit board transmission is carried out until the circuit board is transmitted to the discharge hole 12.
In summary, after reading the present disclosure, those skilled in the art can make various other corresponding changes without creative mental labor according to the technical solutions and concepts of the present disclosure, and all of them are within the protection scope of the present disclosure.
Claims (6)
1. The utility model provides an electroplate palladium controlling means that removes of through-hole etching line, a serial communication port, including etching district, identification area and remove the palladium district, the etching district is equipped with the inflation groove, moves back the membrane groove, etches groove, fresh solution groove and water absorption tank, the identification area includes through-hole recognition device and two-dimensional code recognition device, it includes palladium groove, wash bowl, tin stripping groove, abrasive plate groove and dry plate groove to remove the palladium district, it is used for the downthehole palladium of non-metallization to get rid of to remove the palladium groove, etching district, identification area and remove the palladium district and connect gradually, the etching district with remove the palladium district and be equipped with washing unit and gyro wheel transmission device.
2. The apparatus of claim 1, wherein the water washing device comprises an upper spraying mechanism and a lower spraying mechanism, the water washing device is used for cleaning the circuit board, and the water washing devices of the etching area and the palladium removing area are independently controlled.
3. The apparatus of claim 1, wherein the roller conveyor comprises an upper roller conveyor and a lower roller conveyor, and the roller conveyor is configured to convey the circuit board within the apparatus.
4. The apparatus for controlling palladium removal for an electroplated through-hole etching line as recited in claim 1 or 2, wherein the roller conveyor is disposed between the upper and lower showers of the water washing apparatus, and the roller conveyor is disposed on the same level.
5. The apparatus as claimed in claim 1, wherein the etching zone has a material inlet connected to the bulking tank, and a material outlet connected to the dry plate tank.
6. The apparatus of claim 1, wherein the through-hole recognition device comprises a drill and a recognizer, the drill being coupled to the recognizer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122010798.6U CN215785051U (en) | 2021-08-25 | 2021-08-25 | Palladium removal control device for electroplating through hole etching line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122010798.6U CN215785051U (en) | 2021-08-25 | 2021-08-25 | Palladium removal control device for electroplating through hole etching line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215785051U true CN215785051U (en) | 2022-02-11 |
Family
ID=80149253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122010798.6U Active CN215785051U (en) | 2021-08-25 | 2021-08-25 | Palladium removal control device for electroplating through hole etching line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215785051U (en) |
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2021
- 2021-08-25 CN CN202122010798.6U patent/CN215785051U/en active Active
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