CN215774027U

CN215774027U - Electronic component with stable vibration frequency

Info

Publication number: CN215774027U
Application number: CN202121838809.3U
Authority: CN
Inventors: 朱荣华; 李电成; 李刚
Original assignee: Changshu Baoyanni Plastic Products Co ltd
Current assignee: Changshu Baoyanni Plastic Products Co ltd
Priority date: 2021-08-06
Filing date: 2021-08-06
Publication date: 2022-02-08
Anticipated expiration: 2031-08-06

Abstract

The utility model relates to the technical field of electronic elements, in particular to an electronic element with stable vibration frequency, which solves the problem that the heat dissipation performance of the electronic element for controlling the vibration frequency on a circuit board in the prior art needs to be improved. The electronic component with stable vibration frequency comprises an electronic component arranged on a circuit board, wherein a heat absorption block is arranged at the position, corresponding to the installation position of the electronic component, of the lower end face of the circuit board, and a support rod in an X-shaped structure is arranged below the circuit board. When the electronic element is electrified and operated in the circuit board, the heat generated by the electronic element is guided into the heat absorption block from the bottom and then is dissipated by the heat dissipation fins, the heat of the heat dissipation block and the heat dissipation auxiliary assembly exchanges heat in the heat dissipation cavity, the elastic heat dissipation folded plate leads the heat to the outer wall of the equipment, and the heat at the bottom of the electronic element is dissipated timely, so that the heat dissipation performance of the electronic element during operation is improved, and the stability of the control frequency of the electronic element is improved.

Description

Electronic component with stable vibration frequency

Technical Field

The present invention relates to the field of electronic device technologies, and in particular, to an electronic device with stable vibration frequency.

Background

The vibration frequency f is the number of vibration cycles per second of the object, and the international unit is hertz. There are also vibration frequency meters in the prior art for detecting the vibration frequency of general machinery equipment. In the vibration equipment, electronic elements for controlling the equipment to vibrate at a fixed frequency are mostly added on a circuit board, so that the regular vibration control of the equipment is realized.

However, for the electronic component of the high frequency conversion, the electronic component is mostly a main heating component on the control circuit board, and the existing electronic component for controlling the vibration frequency has large heat productivity due to untimely heat dissipation after the equipment works for a long time, so that a fault occurs, the circuit board is short-circuited, and the equipment cannot normally operate;

therefore, an electronic component with a stable vibration frequency has been proposed to solve the above-mentioned problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an electronic component with stable vibration frequency, which solves the problem that the heat dissipation performance of the electronic component for controlling the vibration frequency on a circuit board in the prior art needs to be improved.

In order to achieve the purpose, the utility model adopts the following technical scheme:

an electronic component with stable vibration frequency comprises an electronic component mounted on a circuit board, a heat absorbing block is mounted at the lower end of the circuit board corresponding to the mounting position of the electronic component, a supporting rod in an X-shaped structure is arranged below the circuit board, the upper end surface of the supporting rod is abutted against the lower end surface of the heat absorbing block, so as to position the heat absorption block, a plurality of elastic heat dissipation folded plates are arranged on the lower end surface of the support rod, the bottom ends of the elastic heat dissipation folded plates are connected with the inner wall of the equipment, a plurality of positioning screws are arranged on the circuit board at the periphery of the electronic element, the bottom ends of the positioning screws are arranged on the inner wall of the equipment, the plurality of positioning screws respectively penetrate through the support rod, the heat absorption block is arranged on the inner wall of the equipment, and the circuit board is arranged on the inner wall of the equipment.

Preferably, a positioning groove is formed in the position, opposite to the electronic element, of the lower end face of the circuit board, the heat absorbing block is connected with the positioning groove in an inserting mode, and a gap is reserved between the upper end face of the supporting rod and the upper end face of the circuit board.

Preferably, the positioning screw is sleeved with a damping spring, and the top end and the bottom end of the damping spring are respectively abutted against the supporting rod and the inner wall of the equipment.

Preferably, the circuit board is provided with a screw hole for screwing and connecting a positioning screw, and the support rod is provided with a sliding hole for penetrating the positioning screw.

Preferably, the heat dissipation auxiliary assembly consists of a first transmission spring, a second transmission spring and a heat absorption plate, the first transmission spring and the second transmission spring are respectively connected with the circuit board and the inner wall of the equipment, and the upper end and the lower end of the heat absorption plate are respectively connected with the first transmission spring and the second transmission spring.

Preferably, the vertical axes of the first transmission spring and the second transmission spring are not on the same vertical line, so that the heat absorbing plate is in an inclined state.

The utility model has at least the following beneficial effects:

when the electronic element is powered on and operates in the circuit board, heat generated by the electronic element is guided into the heat absorption block from the bottom and is dissipated by the plurality of heat dissipation fins at the bottom of the heat absorption block, meanwhile, the plurality of heat dissipation auxiliary assemblies improve the heat dissipation performance of the circuit board, so that heat of the heat dissipation block and the heat dissipation auxiliary assemblies exchanges heat in the heat dissipation cavity, and the plurality of elastic heat dissipation folded plates at the bottom of the supporting rod are used for leading the heat to the outer wall of equipment, so that the heat at the bottom of the electronic element and nearby heat can be dissipated timely.

The utility model also has the following beneficial effects:

1. through damping spring, first transmission spring and second transmission spring's setting, can dispel the decomposition to the power of the vibrations of equipment inner wall to improve the stability of electronic component and circuit board installation greatly, the vibrations of first transmission spring and second transmission spring make the absorber plate up-and-down motion of slope, thereby accelerate the air flow in the heat dissipation chamber, further improve the radiating effect, further improve the stability of electronic component and circuit board work.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic front view of a circuit board;

FIG. 2 is a schematic view of a lower end surface of a circuit board;

FIG. 3 is a schematic view of a vertical cross-sectional structure of the circuit board at the positioning slot;

fig. 4 is a partial side view schematic of a circuit board device installation.

In the figure: 1. a circuit board; 2. an electronic component; 3. a heat dissipation auxiliary assembly; 301. a first transmission spring; 302. a heat absorbing plate; 303. a second transmission spring; 4. a set screw; 5. a support rod; 6. an elastic heat dissipation folded plate; 7. a heat absorbing block; 8. heat dissipation fins; 9. a damping spring; 10. a slide hole; 11. positioning a groove; 12. and a screw hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

Referring to fig. 1-4, an electronic component with stable vibration frequency comprises an electronic component 2 mounted on a circuit board 1, a heat absorption block 7 is mounted at a position corresponding to a mounting position of the electronic component 2 at a lower end surface of the circuit board 1, a support rod 5 in an X-shaped structure is arranged below the circuit board 1, an upper end surface of the support rod 5 abuts against a lower end surface of the heat absorption block 7 to position the heat absorption block 7, a plurality of elastic heat dissipation folded plates 6 are mounted at a lower end surface of the support rod 5, bottom ends of the elastic heat dissipation folded plates 6 are connected with an inner wall of a device, a plurality of positioning screws 4 are mounted on the circuit board 1 around a periphery of the electronic component 2, bottom ends of the positioning screws 4 are mounted with the inner wall of the device, and the plurality of positioning screws 4 respectively penetrate through the support rod 5 to position the support rod 5, heat dissipation fins 8 are mounted at a lower end surface of the heat absorption block 7, a plurality of heat dissipation auxiliary assemblies 3 are mounted between the circuit board 1 and the inner wall of the device, so that a heat dissipation cavity is formed between the circuit board 1 and the inner wall of the equipment; specifically, the area of the heat absorbing block 7 is larger than the mounting area of the electronic component 2;

the scheme has the following working processes: when the electronic element 2 is powered on and operated in the circuit board 1, the heat generated by the electronic element 2 is led into the heat absorption block 7 from the bottom, and then is dissipated by the plurality of heat dissipation fins 8 at the bottom of the heat absorption block 7, meanwhile, the plurality of heat dissipation auxiliary assemblies 3 improve the heat dissipation performance of the circuit board 1, so that the heat of the heat absorption block 7 and the heat dissipation auxiliary assemblies 3 exchanges heat in the heat dissipation cavity, and the plurality of elastic heat dissipation folded plates 6 at the bottom of the support rod 5 are used for leading the heat to the outer wall of equipment, thereby realizing the timely dissipation of the heat at the bottom of the electronic element 2 and nearby heat, and improving the heat dissipation performance of the electronic element 2 during working by the improvement, thereby improving the working stability of the electronic element 2 and controlling the frequency more stably.

Further, the lower terminal surface of circuit board 1 is just having seted up constant head tank 11 to electronic component 2 position department, and heat absorption block 7 pegs graft with constant head tank 11, leaves the space between the up end of die-pin 5 and the up end of circuit board 1, and is concrete, the setting of constant head tank 11 not only realizes the better location of heat absorption block 7, still makes the thickness of circuit board 1 of electronic component 2 installation department diminish, improves the efficiency that heat on the electronic component 2 led to heat absorption block 7.

Further, the set screw 4 is gone up the cover and is equipped with damping spring 9, and damping spring 9's top and bottom offset with die-pin 5 and equipment inner wall respectively, and is concrete, and damping spring 9's setting can be eliminated the decomposition to the power of vibrations on the equipment outer wall, improves the stability that electronic component 2 and circuit board 1 are connected.

Further, a screw hole 12 for screwing the positioning screw 4 is formed in the circuit board 1, and a sliding hole 10 for penetrating the positioning screw 4 is formed in the support rod 5, specifically, the bottom end of the positioning screw 4 is fixedly connected with the inner wall of the equipment, so that the stability of the heat dissipation cavity is ensured.

Further, the heat dissipation auxiliary assembly 3 is composed of a first transmission spring 301, a second transmission spring 303 and a heat absorbing plate 302, the first transmission spring 301 and the second transmission spring 303 are respectively connected with the circuit board 1 and the inner wall of the device, the upper end and the lower end of the heat absorbing plate 302 are respectively connected with the first transmission spring 301 and the second transmission spring 303, specifically, the force of vibration of the inner wall of the device can be dissipated through the arrangement of the first transmission spring 301 and the second transmission spring 303, and therefore the stability of the installation of the electronic element 2 and the circuit board 1 is greatly improved.

Further, the vertical axes of the first transmission spring 301 and the second transmission spring 303 are not on the same vertical line, so that the heat absorbing plate 302 is in an inclined state, specifically, the inclined heat absorbing plate 302 moves up and down through the vibration of the first transmission spring 301 and the second transmission spring 303, thereby accelerating the air flow in the heat dissipation cavity, further improving the heat dissipation effect, and further improving the working stability of the electronic component 2 and the circuit board 1.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the utility model, but that various changes and modifications may be made without departing from the spirit and scope of the utility model, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The electronic component with stable vibration frequency comprises an electronic component (2) arranged on a circuit board (1), and is characterized in that a heat absorption block (7) is arranged at the position, corresponding to the installation position of the electronic component (2), of the lower end face of the circuit board (1), a support rod (5) in an X-shaped structure is arranged below the circuit board (1), the upper end face of the support rod (5) abuts against the lower end face of the heat absorption block (7) to enable the heat absorption block (7) to be positioned, a plurality of elastic heat dissipation folded plates (6) are arranged at the lower end face of the support rod (5), the bottom ends of the elastic heat dissipation folded plates (6) are connected with the inner wall of equipment, a plurality of positioning screws (4) are arranged on the circuit board (1) and located around the edge of the electronic component (2), the bottom ends of the positioning screws (4) are arranged on the inner wall of the equipment, and the positioning screws (4) respectively penetrate through the support rod (5), the heat absorption device is characterized in that the support rod (5) is positioned, the lower end face of the heat absorption block (7) is provided with heat dissipation fins (8), and a plurality of heat dissipation auxiliary assemblies (3) are arranged between the circuit board (1) and the inner wall of the equipment, so that a heat dissipation cavity is formed between the circuit board (1) and the inner wall of the equipment.

2. The electronic component with stable vibration frequency according to claim 1, wherein a positioning groove (11) is formed on the lower end surface of the circuit board (1) at a position opposite to the electronic component (2), the heat absorbing block (7) is inserted into the positioning groove (11), and a gap is left between the upper end surface of the supporting rod (5) and the upper end surface of the circuit board (1).

3. The electronic component with stable vibration frequency according to claim 1, wherein the positioning screw (4) is sleeved with a damping spring (9), and the top end and the bottom end of the damping spring (9) respectively abut against the supporting rod (5) and the inner wall of the device.

4. The electronic component with stable vibration frequency according to claim 1, wherein the circuit board (1) is provided with a screw hole (12) for screwing the positioning screw (4), and the supporting rod (5) is provided with a sliding hole (10) for passing the positioning screw (4).

5. The electronic component with stable vibration frequency according to claim 1, wherein the heat dissipation auxiliary assembly (3) is composed of a first transmission spring (301), a second transmission spring (303) and a heat absorbing plate (302), the first transmission spring (301) and the second transmission spring (303) are respectively connected with the circuit board (1) and the inner wall of the device, and the upper end and the lower end of the heat absorbing plate (302) are respectively connected with the first transmission spring (301) and the second transmission spring (303).

6. An electronic component of a stable vibration frequency according to claim 5, wherein the vertical axes of the first transmission spring (301) and the second transmission spring (303) are not on the same vertical line, so that the heat absorbing plate (302) is in a tilted state.