CN215773557U - MEMS piezoelectric speaker - Google Patents
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- CN215773557U CN215773557U CN202121473536.7U CN202121473536U CN215773557U CN 215773557 U CN215773557 U CN 215773557U CN 202121473536 U CN202121473536 U CN 202121473536U CN 215773557 U CN215773557 U CN 215773557U
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Abstract
The application discloses MEMS piezoelectric speaker, MEMS piezoelectric speaker includes: the MEMS piezoelectric actuator converts the electrical signal into a vibration signal; the PCB board is used for exciting the MEMS piezoelectric actuator; a sound film which can be driven by the MEMS piezoelectric actuator to vibrate along a first direction relative to the PCB to generate sound waves, wherein the first direction is the thickness direction of the PCB; a coupling plate for connecting the MEMS piezoelectric actuator to the sound diaphragm; the supporting structural part is used for fixing the periphery of the sound film; the support structure has freedom of movement in the first direction, enabling the diaphragm to produce pistonic motion in the first direction. The acoustic performance of output can be better by the method, and the overall reliability of the device can be improved.
Description
Technical Field
The application relates to the technical field of chip packaging, in particular to an MEMS piezoelectric loudspeaker.
Background
A speaker is a transducer device that converts an electrical signal into an acoustic signal, and micro speakers are now widely used in consumer electronics. The MEMS loudspeaker is a loudspeaker manufactured by micro-electronics and micro-machining technology, and compared with the traditional micro-loudspeaker manufacturing technology, the MEMS loudspeaker has the advantages of being capable of being produced in batches, easy to integrate, high in size precision, easy to control, low in cost and the like due to the fact that the MEMS technology is used. MEMS speakers are generally classified into three categories in terms of their operation principle: electromagnetic MEMS speakers, electrostatic MEMS speakers, and piezoelectric MEMS speakers. The MEMS piezoelectric loudspeaker is simple in structure, does not need special materials such as soft magnetism and the like, enables the processing technology and the integration technology to be simpler, and has great advantages in the aspect of realizing a light, thin and miniature high-performance loudspeaker.
Conventional MEMS speakers connect a MEMS actuator to a sound membrane so that the sound membrane can be vibrated by the MEMS actuator to form sound waves, and finally, sound reproduction is realized. However, the first resonance frequency (i.e. the natural frequency) of the conventional MEMS speaker is high, resulting in poor low frequency performance, mainly due to: the MEMS actuator introduces extra self rigidity, so compared with the traditional voice coil type micro loudspeaker, the integral rigidity of the device is higher. The first resonance frequency of the device is proportional to the square root of the stiffness, so that the MEMS speaker has a higher first resonance frequency than the conventional micro-speaker when the same sound membrane is used. If the first resonant frequency of the device is high, the low-frequency performance of the device is poor, the reproduction frequency band is narrower, and the requirement of the sound quality of the device is difficult to meet.
Generally, there are two ways to lower the first resonant frequency of the device:
firstly, the rigidity of the MEMS actuator is reduced;
secondly, the stiffness of the sound membrane is reduced.
If the rigidity of the MEMS actuator is reduced, the electromechanical coupling coefficient of the device can be reduced on the premise of not increasing the size of the MEMS, so that the sensitivity of the device is reduced; increasing the MEMS size increases the cost and is detrimental to device miniaturization.
If the rigidity of the sound film is reduced, the sound film with lower Young modulus is required to be adopted, and when the sound pressure level output requirement is higher, the sound film is required to generate larger deformation, so that the device is more prone to failure and has lower reliability; on the other hand, when the sound membrane is softer, the difference in rigidity between the sound membrane and the MEMS actuator is larger, so that the energy of the MEMS actuator is difficult to transfer to the sound membrane, which reduces the electromechanical conversion efficiency of the entire device, and eventually reduces the output sensitivity of the device. Therefore, the conventional implementation method is difficult to implement in order to lower the first resonant frequency of the device without affecting the output sensitivity of the device.
Therefore, there is a need to provide an improved MEMS piezoelectric speaker to solve the above problems.
SUMMERY OF THE UTILITY MODEL
In view of the above-described disadvantages, it is an object of the present application to provide a MEMS piezoelectric speaker capable of not only making the acoustic performance of the output better, but also improving the reliability of the device as a whole.
At least one purpose is achieved, and the following technical scheme is adopted in the application:
a MEMS piezoelectric speaker, comprising:
the MEMS piezoelectric actuator converts the electrical signal into a vibration signal;
the PCB board is used for exciting the MEMS piezoelectric actuator;
a sound film which can be driven by the MEMS piezoelectric actuator to vibrate along a first direction relative to the PCB to generate sound waves, wherein the first direction is the thickness direction of the PCB;
a coupling plate for connecting the MEMS piezoelectric actuator to the sound diaphragm;
the supporting structural part is used for fixing the periphery of the sound film; the support structure has freedom of movement in the first direction, enabling the diaphragm to produce pistonic motion in the first direction.
In a preferred embodiment, the support structure is restrained in a second direction perpendicular to the first direction.
As a preferred embodiment, the PCB board has opposite first and second sides; the supporting structure is located on the first side of the PCB, a dust screen is arranged on the second side of the PCB, and a rear cavity is formed between the dust screen and the PCB and between the dust screen and the MEMS piezoelectric actuator.
In a preferred embodiment, the support structure is a spring structure that is retractable along the first direction.
As a preferred embodiment, the support structures are in full communication in a second direction perpendicular to the first direction.
As a preferred embodiment, the support structure is provided with at least one elastic layer having a predetermined thickness along the first direction, and the elastic layer is a material layer having a young's modulus within a predetermined range.
As a preferred embodiment, the predetermined range of young's modulus is 100kPa to 100MPa, and the elastic layer includes any one or a combination of the following: foam layer, rubber layer.
In a preferred embodiment, the sound membrane is provided with a plurality of corners, a fixed layer is provided at a first position between the corners and the PCB, and an elastic layer is provided at a second position other than the corners, wherein the young's modulus of the fixed layer is greater than the young's modulus of the elastic layer.
As a preferred implementation manner, a mass block is further disposed between the coupling plate and the MEMS piezoelectric actuator, the number of the mass blocks is one, and the mass block is located at the center of the MEMS piezoelectric actuator and the sound membrane.
As a preferred implementation manner, a mass block is further disposed between the coupling plate and the MEMS piezoelectric actuator, a structural beam is disposed in the middle of the MEMS piezoelectric actuator, the number of the mass blocks is multiple, and the mass blocks are distributed between the structural beam and the sound diaphragm at intervals.
Has the advantages that:
the MEMS piezoelectric loudspeaker provided by the embodiment of the application has the core improvement that a soft supporting structural member is used, and the structure can not limit the longitudinal vibration of a sound membrane; furthermore, it may limit the lateral movement of the diaphragm, so that the displacement of the diaphragm to produce the piston motion is maximized. The soft supporting structural part is arranged to change the boundary condition of the sound film from conventional fixation to at least partial freedom, so that the overall rigidity of the device is reduced under the condition of not changing the structure and the material of the sound film; finally, the first resonant frequency of the device can be greatly reduced under the condition of not influencing the output sensitivity and reliability of the device, and the low-frequency performance of the device is improved.
Specific embodiments of the present invention are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the utility model may be employed. It should be understood that the embodiments of the utility model are not so limited in scope.
Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.
It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic view of a speaker provided with a MEMS piezoelectric speaker provided in a first embodiment of the present application;
FIG. 2 is a schematic view of a loudspeaker provided with a MEMS piezoelectric loudspeaker according to a second embodiment of the present application;
fig. 3 is a schematic view of a speaker provided with a MEMS piezoelectric speaker provided in a third embodiment of the present application;
fig. 4 is a simulation result of output sound pressure level frequency responses of a MEMS speaker with a soft support structure and a conventional MEMS speaker.
Description of reference numerals:
1. an MEMS piezoelectric actuator;
2. a PCB board;
3. a sound membrane;
4. a coupling plate; 41. a mass block;
5. a support structure; 51. an elastic layer; 52. a fixed layer;
6. a dust screen;
7. a rear cavity.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Compared with the related art, the MEMS piezoelectric loudspeaker provided by the application specification has the core improvement that a soft supporting structural member is used, and the structure can not limit the longitudinal vibration of the sound membrane; furthermore, it may limit the lateral movement of the diaphragm, so that the displacement of the diaphragm to produce the piston motion is maximized. The soft supporting structural part is arranged to change the boundary condition of the sound film from conventional fixation to at least partial freedom, so that the overall rigidity of the device is reduced under the condition of not changing the structure and the material of the sound film; finally, the first resonant frequency of the device can be greatly reduced under the condition of not influencing the output sensitivity and reliability of the device, and the low-frequency performance of the device is improved.
The MEMS piezoelectric speaker will be described in detail below with reference to specific embodiments and the accompanying drawings.
Referring to fig. 1 to 4, the present application provides a MEMS piezoelectric speaker, which mainly includes: the MEMS piezoelectric actuator 1 is used for converting an electrical signal into a vibration signal; the PCB board 2 is used for exciting the MEMS piezoelectric actuator 1; a sound membrane 3 which is driven by the MEMS piezoelectric actuator 1 to vibrate along a first direction with respect to the PCB 2 to generate sound waves, wherein the first direction is a thickness direction of the PCB 2; a coupling plate 4 for connecting the MEMS piezoelectric actuator 1 to the sound membrane 3; a support structure 5 for fixing the periphery of the sound membrane 3; the support structure 5 has a freedom of movement in the first direction, enabling the diaphragm 3 to be pistonically moved in the first direction.
In this specification, there is provided a MEMS piezoelectric speaker including a soft support structure, which may include: a support structure 5, wherein the support structure 5 is used for fixing the periphery of the sound membrane 3; a sound diaphragm 3 capable of vibrating vertically with respect to the PCB board 2; the coupling plate 4 is used for connecting the MEMS piezoelectric actuator 1 and the sound film 3; the MEMS piezoelectric actuator 1 converts the electrical signal into a vibration signal and drives the sound film 3 to generate sound waves; and the PCB 2 is used for exciting the MEMS piezoelectric actuator 1.
In addition, the MEMS piezoelectric speaker may further include a dust screen 6 and a rear chamber 7. Specifically, the PCB board 2 has a first side and a second side opposite to each other; the supporting structure 5 is located on the first side of the PCB 2, a dust screen 6 is arranged on the second side of the PCB 2, and a rear cavity 7 is formed between the dust screen 6 and the PCB 2 and between the MEMS piezoelectric actuator 1.
The MEMS piezoelectric speaker provided in the present specification is centered around the use of a soft support structure 5, which can limit the lateral (second direction) movement of the diaphragm 3, but not limit the longitudinal (i.e. first direction) vibration of the diaphragm 3 (i.e. the support structure 5 has freedom of movement in the first direction, enabling the diaphragm 3 to generate a pistonic motion in the first direction, and the support structure 5 is limited in the second direction perpendicular to the first direction), so that the displacement of the piston motion generated by the diaphragm 3 is maximized, without introducing additional noise.
How the support structure 5 of the MEMS piezoelectric speaker performs the above-mentioned functions will be described in detail with reference to the following specific embodiments and the accompanying drawings.
The first embodiment is as follows:
the support structure 5 may be a longitudinal spring structure as shown in fig. 1, i.e. a spring structure that is retractable in said first direction. Further, the support structure 5 may be completely connected in a second direction perpendicular to the first direction, i.e. the springs may be completely connected in a lateral direction, forming a ring structure in a circumferential direction. The spring may be provided with a plurality of repeated folded structures in the longitudinal direction, for example, a single folded structure may have a spring shape of S-shape, Z-shape, or the like. The supporting structural member 5 in the spring form can be made of metal materials such as stainless steel and the like, and is manufactured through a traditional stamping forming process. Due to the structural design of the component, the sound film 3 is more prone to longitudinal movement and less prone to lateral movement.
Further, the two ends of the support structure 5 are reinforced at the connection with the PCB 2 and the sound film 3, so that the reliability of the device is improved. Specifically, the connection between the spring-shaped support structure 5 and the sound diaphragm 3 and the PCB 2 may be rounded, so that the connection area between the longitudinal spring and the sound diaphragm 3 is increased, and the connection is not easy to fall off when the spring performs vertical telescopic motion.
Example two:
as shown in fig. 2, the support structure 5 is provided with at least one elastic layer having a predetermined thickness along the first direction, wherein the elastic layer is a material layer having a young's modulus within a predetermined range.
In particular, the supporting structure 5 may be partially or entirely made of composite material. Part or all of the support structure 5 may be of a material with a very low young's modulus, such as polyimide foam, rubber, etc. Specifically, the Young's modulus is in the range of 100kPa to 100 MPa. Theoretically, as the young's modulus of the material is lower, the up-and-down movement of the diaphragm 3 is less restricted, so that a sound with a larger output sound pressure level can be generated; however, if the young's modulus of the material is too low, the support structure 5 will be insufficiently rigid, resulting in a reduction in device stability. Therefore, in summary, the Young's modulus of the material in the above range can be optimized.
Further, the support structure 5 may also contain fiber materials in specific directions for limiting the lateral movement of the diaphragm 3. Wherein the specific direction refers to a first direction with a main direction being up and down, and a second direction with left and right can be randomly arranged with a certain angle deflection (< 30 degrees), and the deflection in the angle range can be understood as the angle deflection in the space range. The fiber material can be glass fiber, metal fiber, plant fiber, etc. and is characterized in that the shape is strip-shaped in microscopic observation, so that the fiber material is easy to bend and deform but not easy to stretch and deform.
Generally, when the MEMS piezoelectric speaker is in operation, the MEMS piezoelectric actuator 1 moves the middle mass 41 up and down, so that the sound membrane 3 also moves up and down, that is, the main movement of the sound membrane 3 is up and down, so the support structure 5 mainly stretches and compresses longitudinally. When the diaphragm 3 is displaced in the lateral direction, a large longitudinal tensile deformation of the support structure 5 is necessarily accompanied. If this lateral displacement is to be limited, a large longitudinal displacement of the support structure 5 needs to be limited, so that a longitudinal distribution of the fibre material can be distributed therein, which effect can be produced.
When the fibre material is distributed in a specific direction inside the support structure 5, the fibre units will limit the stretching of the body material if a large displacement of the sound membrane 3 is required, thereby avoiding excessive lateral movement of the support. However, this limiting capability is limited, and therefore the Young's modulus of the host material cannot be too low. At the same time, the presence of these fibrous materials also affects the longitudinal movement of the sound membrane 3, so that the density of the fibrous materials cannot be excessive (for example: bulk density < 40%).
Example three:
as shown in fig. 3, the sound membrane 3 is provided with a plurality of corners, a fixed layer 52 is provided at a first position between the corners and the PCB 2, the sound membrane 3 is provided with an elastic layer 51 at a second position other than the corners, and the young's modulus of the fixed layer 52 is greater than that of the elastic layer 51.
That is, the fixing layer 52 is formed of a first material having a large young's modulus at the apex of the MEMS piezoelectric speaker and fixed, and the elastic layer 51 is formed of a second material having an extremely small young's modulus at the edge for preventing an acoustic short circuit without affecting the longitudinal vibration of the acoustic membrane 3. In particular, the second material may have a Young's modulus of between 100kPa and 100 MPa.
An acoustic short circuit means that the sound waves are in phase opposition when the sound membrane 3 of the loudspeaker is moved upwards or downwards, resulting in the sound waves cancelling each other out. When the second material as the elastic layer 51 is present, the downward propagating sound waves generated by the vibration of the diaphragm 3 hardly meet the upward propagating sound waves generated by the vibration of the diaphragm 3 through the second material outgoing speaker, so that an acoustic short circuit does not occur. In other words, if the second material is not present and the support structure 5 only comprises the first material at the apex, the downwardly propagating sound waves generated by the vibration of the diaphragm 3 will be transmitted out of the loudspeaker and meet the upwardly propagating sound waves generated by the vibration of the diaphragm 3, resulting in an acoustic short circuit.
Specifically, when the support structure 5 is a rectangle with a hollowed-out center, the vertices are located at the four corners of the rectangle, the vertices are made of a first material having an area along the length of the device side ranging from about 1/5 to about 1/3, and the rest is made of a second material.
In some embodiments, a mass block 41 is further disposed between the coupling plate 4 and the MEMS piezoelectric actuator 1, the number of the mass blocks 41 is one, and the mass block 41 is located at the center of the MEMS piezoelectric actuator 1 and the sound membrane 3.
In other embodiments, a mass block 41 is further disposed between the coupling plate 4 and the MEMS piezoelectric actuator 1, a structural beam (not shown in the drawings) is disposed in the middle of the MEMS piezoelectric actuator 1, the number of the mass blocks 41 is multiple, and the mass blocks 41 are distributed between the structural beam and the sound diaphragm 3 at intervals.
In the present embodiment, the piezoelectric speaker device may include a plurality of MEMS piezoelectric actuators 1. The MEMS piezoelectric actuators 1 are connected with the sound membrane 3 together and drive the sound membrane 3 to vibrate.
As shown in fig. 4, for a comparison curve of simulation results, after the soft support structure is provided, the low-frequency output sound pressure level of the speaker is greatly improved, and the medium-high frequency output sound pressure level is almost unchanged.
The main principle is as follows: the first resonant frequency (natural frequency) of the device is proportional to (E/m)eff)1/2Where E represents the overall equivalent stiffness of the device structure, meffRepresenting the equivalent mass of the device structure. And the overall equivalent stiffness of the device is related to the stiffness of the vibration film layer material and the boundary condition of the vibration film layer. In general, the greater the material stiffness, the more fixed the boundary conditions, and the greater the overall equivalent stiffness of the device. On the other hand, when the device operating frequency is lower than the first resonant frequency, the device output sensitivity is dominated by the equivalent stiffness of the device, and when the device operating frequency is higher than the first resonant frequency, the device output sensitivity is dominated by the equivalent mass of the device.
The vibrating membrane layer in the application comprises the vibrating membrane in the MEMS piezoelectric actuator 1 and the sound membrane 3, and when the boundary condition of the sound membrane 3 is changed from fixed to free, the overall equivalent rigidity of the device is reduced, namely the first resonant frequency of the device can be reduced. Since no modification is made to the MEMS piezoelectric actuator 1 and the acoustic membrane 3, i.e. the equivalent mass of the device is not changed, the output sensitivity of the device at high frequencies (higher than the first resonant frequency) is not changed. In the present application, this effect can be achieved only by changing the boundary conditions of the sound diaphragm 3 without any other modification. The simulation result also verifies the effect.
Any numerical value recited herein includes all values from the lower value to the upper value, in increments of one unit, provided that there is a separation of at least two units between any lower value and any higher value. For example, if it is stated that the number of a component or a value of a process variable (e.g., temperature, pressure, time, etc.) is from 1 to 90, preferably from 20 to 80, and more preferably from 30 to 70, it is intended that equivalents such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also expressly enumerated in this specification. For values less than 1, one unit is suitably considered to be 0.0001, 0.001, 0.01, 0.1. These are only examples of what is intended to be explicitly recited, and all possible combinations of numerical values between the lowest value and the highest value that are explicitly recited in the specification in a similar manner are to be considered.
Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. The use of "about" or "approximately" with a range applies to both endpoints of the range. Thus, "about 20 to about 30" is intended to cover "about 20 to about 30", including at least the endpoints specified.
All articles and references disclosed, including patent applications and publications, are hereby incorporated by reference for all purposes. The term "consisting essentially of …" describing a combination shall include the identified element, ingredient, component or step as well as other elements, ingredients, components or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe combinations of elements, components, or steps herein also contemplates embodiments that consist essentially of such elements, components, or steps. By using the term "may" herein, it is intended to indicate that any of the described attributes that "may" include are optional.
A plurality of elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, component or step is not intended to foreclose other elements, ingredients, components or steps.
It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of the subject matter that is disclosed herein is not intended to forego such subject matter, nor should the applicants be construed as having contemplated such subject matter as being part of the disclosed subject matter.
Claims (10)
1. A MEMS piezoelectric speaker, comprising:
the MEMS piezoelectric actuator converts the electrical signal into a vibration signal;
the PCB board is used for exciting the MEMS piezoelectric actuator;
a sound film which can be driven by the MEMS piezoelectric actuator to vibrate along a first direction relative to the PCB to generate sound waves, wherein the first direction is the thickness direction of the PCB;
a coupling plate for connecting the MEMS piezoelectric actuator to the sound diaphragm;
the supporting structural part is used for fixing the periphery of the sound film; the support structure has freedom of movement in the first direction, enabling the diaphragm to produce pistonic motion in the first direction.
2. The MEMS piezoelectric speaker of claim 1, wherein the support structure is restrained in a second direction perpendicular to the first direction.
3. The MEMS piezoelectric speaker of claim 1, wherein the PCB board has opposing first and second sides; the supporting structure is located on the first side of the PCB, a dust screen is arranged on the second side of the PCB, and a rear cavity is formed between the dust screen and the PCB and between the dust screen and the MEMS piezoelectric actuator.
4. The MEMS piezoelectric speaker of claim 1, wherein the support structure is a spring structure that is retractable along the first direction.
5. The MEMS piezoelectric speaker of claim 4, wherein the support structure is in full communication in a second direction perpendicular to the first direction.
6. The MEMS piezoelectric speaker according to claim 1, wherein the support structure is provided with at least one elastic layer having a predetermined thickness along the first direction, the elastic layer being a material layer having a young's modulus within a predetermined range.
7. The MEMS piezoelectric speaker of claim 6, wherein the predetermined range of young's modulus is 100kPa-100MPa, and the elastic layer comprises any one or a combination of the following: foam layer, rubber layer.
8. The MEMS piezoelectric speaker according to claim 1, wherein the acoustic membrane is provided with a plurality of vertices, a fixed layer is provided at a first position between the vertices and the PCB, and an elastic layer is provided at a second position other than the vertices, and a young's modulus of the fixed layer is larger than a young's modulus of the elastic layer.
9. The MEMS piezoelectric speaker according to claim 1, wherein a mass block is further disposed between the coupling plate and the MEMS piezoelectric actuator, the number of the mass blocks is one, and the mass block is located at a central position of the MEMS piezoelectric actuator and the sound film.
10. The MEMS piezoelectric speaker according to claim 1, wherein a mass block is further disposed between the coupling plate and the MEMS piezoelectric actuator, a structural beam is disposed in a middle of the MEMS piezoelectric actuator, the number of the mass blocks is plural, and the mass blocks are spaced between the structural beam and the sound diaphragm.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117061969A (en) * | 2023-10-12 | 2023-11-14 | 共达电声股份有限公司 | Driving mechanism and vibrating device |
| WO2024099045A1 (en) * | 2022-11-08 | 2024-05-16 | 深圳市韶音科技有限公司 | Loudspeaker |
-
2021
- 2021-06-30 CN CN202121473536.7U patent/CN215773557U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024099045A1 (en) * | 2022-11-08 | 2024-05-16 | 深圳市韶音科技有限公司 | Loudspeaker |
| CN117061969A (en) * | 2023-10-12 | 2023-11-14 | 共达电声股份有限公司 | Driving mechanism and vibrating device |
| CN117061969B (en) * | 2023-10-12 | 2024-02-27 | 共达电声股份有限公司 | Driving mechanism and vibrating device |
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