CN215771107U

CN215771107U - Circuit chip packaging device with good shock resistance

Info

Publication number: CN215771107U
Application number: CN202121887466.XU
Authority: CN
Inventors: 王潺; 王一帆; 康小明
Original assignee: Jiangxi Xinbao Display Technology Co ltd
Current assignee: Jiangxi Xinbao Display Technology Co ltd
Priority date: 2021-08-13
Filing date: 2021-08-13
Publication date: 2022-02-08
Anticipated expiration: 2031-08-13

Abstract

The utility model discloses a packaging device for a circuit chip with good shock resistance, which comprises a packaging chip, wherein the packaging chip comprises a shell and pins, the pins are fixedly arranged on two sides of the shell, top plates are slidably clamped on two sides of the shell and above the pins, an outer side plate is slidably attached to the bottom of each top plate and one side of each pin, far away from the shell, and a base is fixedly arranged at the bottom of each outer side plate; according to the utility model, the inner side plate, the outer side plate, the base and the top plate are arranged, the protective shell is formed outside the pins to protect the pins and prevent the pins from deforming and damaging in a vibration, collision and extrusion mode, the structures such as the inner side plate, the outer side plate, the base and the top plate can be disassembled through the movable groove, the connecting mechanism and the clamping groove during use, the normal use of a chip cannot be hindered, meanwhile, the disassembled parts can be recycled again, and the purposes of saving and convenient use are achieved.

Description

Circuit chip packaging device with good shock resistance

Technical Field

The utility model relates to the technical field of chip packaging equipment, in particular to a packaging device for a circuit chip with good shock resistance.

Background

Chip packaging is the process of assembling an integrated circuit into a chip final product, in short, an integrated circuit bare chip produced by a foundry is put on a substrate which plays a bearing role, pins are led out, and then the integrated circuit bare chip is fixedly packaged into a whole, and when the chip is packaged, a chip packaging device is required to be used.

When the existing packaging device is used, the anti-seismic performance is poor, the pins are easily damaged after being vibrated, and a structure for protecting and supporting the pins is lacked, so that the packaging device for the circuit chip with good anti-seismic performance needs to be provided.

SUMMERY OF THE UTILITY MODEL

The present invention has been made in an effort to solve the above-mentioned problems occurring in the prior art, and an object of the present invention is to provide a circuit chip package device having an excellent shock resistance, which has an advantage of protecting a pin.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a good circuit chip packaging hardware of shock resistance, includes the encapsulation chip, the encapsulation chip includes casing and pin, pin fixed mounting is in the both sides of casing, the both sides of casing and the top that is located the pin all slide clamping have the roof, the bottom of roof just is located one side that the casing was kept away from to the pin and slides the laminating and have the outer panel, the bottom fixed mounting of outer panel has the base, the top of base just is located one side fixed mounting who keeps away from the outer panel and has the interior plate, the interior plate is located one side that the pin is close to the casing, be formed with the cavity between interior plate, outer panel and the base, the pin is located the inside of cavity, one side fixed mounting that the base is close to the casing has coupling mechanism, coupling mechanism's top and the bottom slip joint of casing.

Preferably, coupling mechanism includes the first plate body, the one end of first plate body and the one side welding that the base is close to the casing, the one end fixed mounting that the base was kept away from to the first plate body has the second plate body, the top of second plate body and the bottom joint of casing.

Preferably, the bottom of the base is provided with a clamping groove matched with the second plate body, and the top of the second plate body extends to an inner cavity of the clamping groove.

Preferably, an elastic clamping block is fixedly installed on one side of the inner cavity of the clamping groove, teeth matched with the elastic clamping block are formed in the top of one side of the second plate body, and one end of the elastic clamping block is meshed with the surfaces of the teeth.

Preferably, the inner cavity of the cavity is fixedly provided with a sponge lining, and the surface of the pin is attached to the inner surface of the sponge lining.

Preferably, the both sides of casing all seted up with roof looks adaptation shifting chute, the one end of roof is through the surperficial slip joint of shifting chute with the casing.

Preferably, the bottom of roof fixed mounting has first sponge piece, the top of first sponge piece and the top laminating of pin, the top fixed mounting of interior plate has the second sponge piece, the top of second sponge piece and the surface laminating of pin.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the inner side plate, the outer side plate, the base and the top plate are arranged, and the protective shell is formed outside the pin to protect the pin and prevent the pin from deforming and damaging in modes of vibration, collision, extrusion and the like;

2. according to the utility model, through the movable groove, the connecting mechanism and the clamping groove, the structures such as the inner side plate, the outer side plate, the base and the top plate can be disassembled when the chip is used, so that the normal use of the chip is not hindered, and meanwhile, the disassembled parts can be recycled, so that the purposes of saving and convenient use are achieved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic front view of the present invention;

FIG. 3 is a schematic top view of the elastic clamping block of the present invention;

FIG. 4 is an enlarged view of a portion of the area A in FIG. 2 according to the present invention.

In the figure: 1. packaging the chip; 2. a housing; 3. a pin; 4. a top plate; 5. an outer panel; 6. a base; 7. an inner side plate; 8. a cavity; 9. a connecting mechanism; 10. a first plate body; 11. a second plate body; 12. a card slot; 13. an elastic clamping block; 14. teeth; 15. a sponge lining; 16. a moving groove; 17. a first sponge block; 18. and a second sponge block.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a packaging device for a circuit chip with good shock resistance comprises a packaging chip 1, wherein the packaging chip 1 comprises a shell 2 and pins 3, the pins 3 are fixedly installed on two sides of the shell 2, top plates 4 are slidably clamped on two sides of the shell 2 and above the pins 3, moving grooves 16 matched with the top plates 4 are formed in two sides of the shell 2, one end of each top plate 4 is slidably clamped with the surface of the shell 2 through the moving grooves 16, and the moving grooves 16 are arranged for supporting and limiting the top plates 4 and facilitating the disassembly of the top plates 4;

an outer side plate 5 is attached to the bottom of the top plate 4 and located on one side, far away from the shell 2, of the pin 3 in a sliding mode, a base 6 is fixedly installed at the bottom of the outer side plate 5, an inner side plate 7 is fixedly installed on the top of the base 6 and located on one side, far away from the outer side plate 5, of the base, and the inner side plate 7 is located on one side, close to the shell 2, of the pin 3;

a first sponge block 17 is fixedly arranged at the bottom of the top plate 4, the top of the first sponge block 17 is attached to the top of the pin 3, a second sponge block 18 is fixedly arranged at the top of the inner side plate 7, and the top of the second sponge block 18 is attached to the surface of the pin 3; the first sponge block 17 and the second sponge block 18 are arranged for protecting multiple parts of the pins 3 and preventing the pins 3 from being damaged after friction with the top plate 4 and the inner side plate 7;

a cavity 8 is formed among the inner side plate 7, the outer side plate 5 and the base 6, the pins 3 are positioned in the cavity 8, a sponge lining 15 is fixedly arranged in the inner cavity of the cavity 8, the surfaces of the pins 3 are attached to the inner surface of the sponge lining 15, and the sponge lining 15 is used for protecting the pins 3 and buffering inertia force generated by vibration;

a connecting mechanism 9 is fixedly installed on one side of the base 6 close to the shell 2, and the top of the connecting mechanism 9 is in sliding clamping connection with the bottom of the shell 2; the connecting mechanism 9 comprises a first plate body 10, one end of the first plate body 10 is welded with one side, close to the shell 2, of the base 6, a second plate body 11 is fixedly installed at one end, far away from the base 6, of the first plate body 10, the top of the second plate body 11 is clamped with the bottom of the shell 2, and the base 6 is fixed by arranging the connecting mechanism 9;

the bottom of the base 6 is provided with a clamping groove 12 matched with the second plate body 11, and the top of the second plate body 11 extends to the inner cavity of the clamping groove 12. The clamping groove 12 is arranged for limiting the second plate body 11;

one side fixed mounting of draw-in groove 12 inner chamber has elasticity fixture block 13, and the tooth 14 of elasticity fixture block 13 looks adaptation is seted up at the top of second plate body 11 one side, and the one end of elasticity fixture block 13 and the surface toothing of tooth 14 through setting up elasticity fixture block 13 and tooth 14, have improved the frictional force between second plate body 11 and casing 2 for the removal to second plate body 11 is injectd, prevents that second plate body 11 from sliding at will.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a good circuit chip packaging hardware of shock resistance, includes packaged chip (1), packaged chip (1) includes casing (2) and pin (3), pin (3) fixed mounting is in the both sides of casing (2), its characterized in that: the two sides of the shell (2) and the upper part of the pin (3) are all clamped with a top plate (4) in a sliding way, an outer side plate (5) is slidably attached to the bottom of the top plate (4) and positioned on one side of the pins (3) far away from the shell (2), a base (6) is fixedly arranged at the bottom of the outer side plate (5), an inner side plate (7) is fixedly arranged at the top of the base (6) and positioned at one side far away from the outer side plate (5), the inner side plate (7) is positioned at one side of the pin (3) close to the shell (2), a cavity (8) is formed among the inner side plate (7), the outer side plate (5) and the base (6), the pin (3) is positioned in the cavity (8), one side of the base (6) close to the shell (2) is fixedly provided with a connecting mechanism (9), the top of the connecting mechanism (9) is in sliding clamping connection with the bottom of the shell (2).

2. The package device for circuit chips with good shock resistance according to claim 1, wherein: coupling mechanism (9) include first plate body (10), the one end of first plate body (10) and base (6) are close to the one side welding of casing (2), the one end fixed mounting that base (6) were kept away from in first plate body (10) has second plate body (11), the top of second plate body (11) and the bottom joint of casing (2).

3. The package device for circuit chips with good shock resistance according to claim 2, wherein: the bottom of base (6) is seted up draw-in groove (12) with second plate body (11) looks adaptation, the top of second plate body (11) extends to the inner chamber of draw-in groove (12).

4. The package device for circuit chips with good shock resistance according to claim 3, wherein: an elastic clamping block (13) is fixedly installed on one side of the inner cavity of the clamping groove (12), teeth (14) matched with the elastic clamping block (13) are formed in the top of one side of the second plate body (11), and one end of the elastic clamping block (13) is meshed with the surface of the teeth (14).

5. The package device for circuit chips with good shock resistance according to claim 1, wherein: the inner chamber fixed mounting of cavity (8) has sponge inside lining (15), the surface of pin (3) and the interior surface laminating of sponge inside lining (15).

6. The package device for circuit chips with good shock resistance according to claim 1, wherein: the both sides of casing (2) have all been seted up with roof (4) looks adaptation shifting chute (16), the surface slip joint of shifting chute (16) and casing (2) is passed through to the one end of roof (4).

7. The package device for circuit chips with good shock resistance according to claim 1, wherein: the bottom fixed mounting of roof (4) has first sponge piece (17), the top of first sponge piece (17) and the top laminating of pin (3), the top fixed mounting of interior plate (7) has second sponge piece (18), the top of second sponge piece (18) and the surface laminating of pin (3).