CN215751811U

CN215751811U - Thermal management device and thermal management system

Info

Publication number: CN215751811U
Application number: CN202121183463.8U
Authority: CN
Inventors: 不公告发明人
Original assignee: Zhejiang Sanhua Automotive Components Co Ltd
Current assignee: Zhejiang Sanhua Automotive Components Co Ltd
Priority date: 2021-05-28
Filing date: 2021-05-28
Publication date: 2022-02-08
Anticipated expiration: 2031-05-28

Abstract

The application relates to a heat management device and a heat management system, wherein the heat management device comprises a heat exchanger, an expansion valve controller and at least one first sensor, the first sensor is electrically connected or in signal connection with a circuit board of the expansion valve controller, at least one part of a sensing part of the first sensor is connected with a cooling liquid channel part of the heat exchanger, so that the connection of the sensor and an external wiring harness can be relatively reduced, the difficulty of circuit layout is reduced, and the cost is relatively reduced.

Description

Thermal management device and thermal management system

Technical Field

The utility model relates to the technical field of thermal management, in particular to a thermal management device and a thermal management system.

Background

The heat management device comprises a heat exchanger, a sensor and an expansion valve, a controller of the heat management system controls the expansion valve to operate according to relevant parameters acquired from the heat management device, the controller of the heat management system is electrically connected with the sensor through a wire harness, and the controller of the heat management system is electrically connected with a circuit board of the expansion valve through the wire harness.

SUMMERY OF THE UTILITY MODEL

It is an object of the present invention to provide a thermal management device that facilitates solving the above problems.

One embodiment of the present application provides a thermal management device comprising a heat exchanger, an expansion valve controller, and at least one first sensor; the expansion valve controller comprises a stator assembly and a circuit board, wherein the stator assembly is electrically and/or signal-connected with the circuit board, the first sensor comprises a sensing part, the first sensor is electrically and/or signal-connected with the circuit board, and at least one part of the sensing part of the first sensor is connected with the cooling liquid channel part of the heat exchanger.

Another embodiment of the present application further provides a heat management system, including a compressor, a condenser and the above heat management device, wherein an outlet of the compressor is communicated with one port of a refrigerant passage of the heat management device through the condenser, and another port of the heat management device is communicated with an inlet of the compressor.

In the thermal management device and the thermal management system provided in the above embodiments, at least a part of the sensing portion of the first sensor is connected to the coolant passage portion of the heat exchanger, and the first sensor is electrically connected or signal-connected to the circuit board of the expansion valve controller, so that connection between the sensor and an external wiring harness can be relatively reduced, the difficulty in circuit layout is reduced, and the cost is relatively reduced.

Drawings

Fig. 1 is a schematic perspective view of a thermal management device according to an embodiment of the present invention.

Fig. 2 is a schematic structural view of fig. 1 from another view angle.

Fig. 3 is a schematic sectional view in the direction of a-a shown in fig. 2.

Fig. 4 is a schematic structural view of fig. 1 from another view angle.

Fig. 5 is a schematic cross-sectional view taken along the direction B-B shown in fig. 4.

Fig. 6 is a schematic cross-sectional view in the direction C-C shown in fig. 4.

Fig. 7 is a schematic structural diagram of a thermal management device according to a second embodiment of the present invention.

Fig. 8 is a schematic structural view of fig. 7 from another view angle.

Fig. 9 is a schematic cross-sectional view in the direction D-D shown in fig. 8.

Fig. 10 is a schematic structural diagram of a thermal management device according to a third embodiment of the present invention.

Fig. 11 is a schematic structural view of fig. 10 from another angle.

Fig. 12 is a schematic structural diagram of a thermal management device according to a fourth embodiment of the present invention.

Fig. 13 is a schematic structural view of fig. 12 from another angle.

Fig. 14 is a schematic structural diagram of a thermal management device according to a fifth embodiment of the present invention.

Fig. 15 is a schematic structural view of fig. 14 from another view angle.

Fig. 16 is a schematic cross-sectional view in the direction of E-E shown in fig. 15.

Fig. 17 is a schematic structural diagram of a thermal management device according to a sixth embodiment of the present invention.

Fig. 18 is a schematic structural diagram of another view angle of fig. 17.

Fig. 19 is a schematic cross-sectional view in the direction F-F shown in fig. 18.

Fig. 20 is a schematic sectional view in the direction G-G shown in fig. 18.

100. A thermal management device; 10. an expansion valve controller; 11. a circuit board; 12. a housing; 121. a first opening; 122. a plug-in part; 123. a second opening; 124. an interface section; 125. a first housing portion; 126. a second housing portion; 13. a second sensor; 20. a first sensor; 21. a sensing portion; 30. a wire harness; 40. a connector assembly; 50. a heat exchanger; 51. a coolant passage portion; 52. an adapter; 60. the valve body is expanded.

Detailed Description

The present invention will now be described in more detail with reference to the accompanying drawings, in which the description of the utility model is given by way of illustration and not of limitation. The various embodiments may be combined with each other to form other embodiments not shown in the following description.

Example one

Referring to fig. 1 to 6, in the present embodiment, a thermal management device 100 is provided, and the thermal management device 100 can measure relevant parameters (including temperature data or pressure data, etc.) of the cooling liquid in the cooling liquid passage portion 51 of the heat exchanger 50, so as to relatively reduce hardware connections and relatively reduce cost.

The thermal management device 100 includes: a heat exchanger 50, an expansion valve controller 10 and at least one first sensor 20. The heat exchanger 50 comprises a heat exchange core 53 and a cooling liquid channel part 51, wherein the cooling liquid channel part 51 is provided with a cooling liquid channel, and at least part of the cooling liquid channel is positioned on the heat exchange core 53; the expansion valve controller 10 comprises a housing 12, a stator assembly and a circuit board 11, wherein the stator assembly and the circuit board 11 are fixedly arranged in the housing 12, the stator assembly is electrically and/or signally connected with the circuit board 11, each first sensor 20 is positioned outside the housing 12 and is mounted at an inlet or an outlet of a cooling liquid channel of the heat exchanger 50, the first sensor 20 is electrically or signally connected with the circuit board 11, a part of a sensing part 21 of the first sensor 20 extends into the cooling liquid channel of the cooling liquid channel part 51 or is positioned in a cavity communicated with the cooling liquid channel to be in contact with the cooling liquid in the cooling liquid channel, the circuit board 11 can collect data monitored by the first sensor 20, and the circuit board 11 can process the collected data to obtain corresponding signals and directly transmit the signals to an external control device. In the present embodiment, the sensing portion 21 is located at an inlet or an outlet of the coolant passage of the thermal management device.

The heat management device further comprises a rotor and a valve core, when the heat management device works, under electromagnetic excitation, the stator component can enable the rotor to act, and further enables the valve core to act, so that the opening degree of a valve port of the heat management device is adjusted.

Wherein, casing 12 is formed with first opening 121, and first sensor 20 includes pencil 30, and partial pencil 30 stretches out first opening 121, so sets up, can realize each first sensor 20 and circuit board 11 based on pencil 30 and collect the mesh as an organic whole mutually, is convenient for gather the response data.

In order to facilitate the connection between the circuit board 11 and the external control device, the housing 12 is extended to form at least one interface 124, pins of the interface 124 are connected to the circuit board 11, a communication portion fixedly disposed on the circuit board 11 can pass through the interface 124 to be in communication connection with the external control device, and the circuit board 11 transmits the processed sensing signal to the external control device to implement information interaction.

The thermal management device 100 further comprises an expansion valve body 60, the heat exchanger 50 and the expansion valve controller 10 are both fixedly mounted on the expansion valve body 60, the heat exchanger 50 is provided with at least one cooling liquid channel part 51 for cooling liquid to flow, and the first sensor 20 is fixedly mounted on the cooling liquid channel part 51; the sensing portion 21 of the first sensor 20 extends into the cooling liquid channel of the cooling liquid channel portion 51 or is located in a cavity communicated with the cooling liquid channel, so that corresponding sensing data can be accurately detected in real time, and the sensing data is data containing the temperature of the cooling liquid.

Preferably, the inside of the housing 12 is provided with a second sensor 13 for acquiring temperature data of the refrigerant, while the expansion valve body 60 is formed with a refrigerant passage communicating with the heat exchanger 50, and the second sensor 13 partially extends into the refrigerant passage to sense and acquire data of the temperature or pressure of the refrigerant in real time. In a preferred embodiment, the first sensor 20 is a temperature sensor and the second sensor 13 is a temperature sensor or a temperature pressure sensor.

Example two

Referring to fig. 7 to 9, the thermal management apparatus 100 of the present embodiment includes a heat exchanger 50, an expansion valve body 60, an expansion valve controller 10, and a first sensor 20. Expansion valve controller 10 includes casing 12, stator module, circuit board 11, and the stator module is connected with circuit board 11 electricity and/or signal connection, and stator module and circuit board 11 are fixed built-in the inside of casing 12, and first sensor 20 includes pencil 30, and the one end that pencil 30 kept away from first sensor 20 is connected at circuit board 11. The housing 12 is extended to form at least one interface portion 124, pins of the interface portion 124 are connected to the circuit board 11, and a communication portion fixedly disposed on the circuit board 11 can be connected to an external control device through the interface portion 124.

The difference from the first embodiment is that: in order to monitor the temperature data of the inlet or the outlet of the coolant passage of the external heat exchanger (other heat exchanger not connected to the expansion valve body 60), in the thermal management device 100 provided in the present embodiment, the at least one first sensor 20 can be fixedly disposed in the coolant passage portion 51 of the external heat exchanger, and the sensing portion 21 of the at least one first sensor 20 can be fixedly disposed in the interior or the exterior wall of the coolant passage portion 51 of the external heat exchanger or in a cavity communicated with the coolant passage of the coolant passage portion 51, so that the temperature or the pressure of the coolant inside the coolant passage portion 51 of the external heat exchanger can be accurately monitored in real time, and the flexibility of the thermal management device 100 is effectively increased.

EXAMPLE III

Referring to fig. 10 and 11, the thermal management apparatus 100 of the present embodiment includes a heat exchanger 50, an expansion valve body 60, an expansion valve controller 10, and a first sensor 20. Expansion valve controller 10 includes casing 12, stator module, circuit board 11, and the stator module is connected with circuit board 11 electricity and/or signal connection, and stator module and circuit board 11 are fixed built-in the inside of casing 12, and first sensor 20 includes pencil 30, and the one end that pencil 30 kept away from first sensor 20 is connected at circuit board 11. The housing 12 is extended to form at least one interface portion 124, pins of the interface portion 124 are connected to the circuit board 11, and a communication portion fixedly disposed on the circuit board 11 can be connected to an external control device through the interface portion 124.

The difference from the above embodiment is that: at least a portion of the first sensor 20 clamps the adapter 52 of the heat exchanger 50 via a clamp (not shown), and the sensing portion 21 of the first sensor 20 extends into the coolant passage inside the adapter 52 or is located in a cavity communicating with the coolant passage, so as to monitor the temperature of the coolant inside the coolant passage.

Example four

Referring to fig. 12 and 13, the thermal management apparatus 100 of the present embodiment includes a heat exchanger 50, an expansion valve body 60, an expansion valve controller 10, and a first sensor 20. Expansion valve controller 10 includes a housing 12, a stator assembly and a circuit board 11, the stator assembly being electrically and/or signally connected to circuit board 11, the stator assembly and circuit board 11 being fixedly disposed within housing 12, each first sensor 20 including a wiring harness 30, an end of wiring harness 30 remote from first sensor 20 being connected to circuit board 11. The housing 12 is extended to form at least one interface portion 124, pins of the interface portion 124 are connected to the circuit board 11, and a communication portion fixedly disposed on the circuit board 11 can be connected to an external control device through the interface portion 124.

The difference from the above embodiment is that: in the thermal management device 100 provided in this embodiment, at least a portion of the first sensor 20 clamps the adapter 52 of the heat exchanger 50 through a clamping member (not shown), so that the first sensor 20 and the heat exchanger 50 are connected in a limited manner, the sensing portion 21 of the first sensor 20 is connected to an outer wall of the adapter 52, and the temperature of the coolant inside the adapter 52 is monitored by monitoring the temperature of the outer wall.

EXAMPLE five

Referring to fig. 14 to 16, the thermal management device 100 of the present embodiment includes a heat exchanger 50, an expansion valve body 60, an expansion valve controller 10, and a first sensor 20. The expansion valve controller 10 comprises a housing 12, a stator assembly, a circuit board 11, the stator assembly being electrically and/or signally connected to the circuit board 11, the stator assembly and the circuit board 11 being fixedly built into the housing 12. The housing 12 is extended to form at least one interface portion 124, pins of the interface portion 124 are connected to the circuit board 11, and a communication portion fixedly disposed on the circuit board 11 can be connected to an external control device through the interface portion 124.

The difference from the above embodiment is that:

in the thermal management device 100 provided in this embodiment, the first sensor 20 includes the wire harness 30, one end of the wire harness 30 away from the first sensor 20 is provided with one or more than two connectors 40, the outer wall of the housing 12 extends to form patch sections 122 with the same number as the connectors 40, the pins of the patch sections 122 are connected with the circuit board 11, and the connectors 40 can be fixed to the patch sections 122 in an inserted manner and connected with the pins of the patch sections 122.

EXAMPLE six

Referring to fig. 17 to 20, the thermal management device 100 of the present embodiment includes a heat exchanger 50, an expansion valve body 60, an expansion valve controller 10, and a first sensor 20. Expansion valve controller 10 includes casing 12, stator module, circuit board 11, and the stator module is connected with circuit board 11 electricity and/or signal connection, and stator module and circuit board 11 are fixed built-in the inside of casing 12, and first sensor 20 includes pencil 30, and the one end that pencil 30 kept away from first sensor 20 is connected at circuit board 11. The housing 12 is extended to form at least one interface portion 124, pins of the interface portion 124 are connected to the circuit board 11, and a communication portion fixedly disposed on the circuit board 11 can be connected to an external control device through the interface portion 124.

The difference from the above embodiment is that:

in the thermal management device 100 provided in this embodiment, the housing 12 includes a first housing portion 125 and a second housing portion 126 that are communicated with each other, the circuit board 11 and at least a portion of the second sensor 13 are disposed inside the first housing portion 125, at least a portion of the first sensor 20 is disposed inside the second housing portion 126, the second housing portion 126 is provided with at least one second opening 123, wherein the sensing portions 21 of the first sensor 20, which are partially disposed inside the second housing portion 126, protrude from the respective second openings 123 in a one-to-one correspondence manner, and the sensing portions 21, which protrude from the respective second openings 123, can protrude into the cooling liquid channel of the cooling liquid channel portion 51 or be disposed in a cavity communicated with the cooling liquid channel. It will be appreciated that when the sensing portion 21 of the first sensor 20, which is located partially within the housing 12, extends into the coolant passage to the coolant passage portion 51, the coolant passage portion 51 forms a sealed structure with the second housing portion 126, and the first sensor 20, which is located partially within the second housing portion 126, is isolated from the environment. In addition, one end of the first sensor 20 is directly and fixedly connected to the circuit board 11, and data transmission between the first sensor 20 and the circuit board 11 can be realized without arranging the wiring harness 30 and the connector 40.

It is understood that the connection manner of the first sensor 20 and the circuit board 11 may be: one end of the first sensor 20 is directly fixed on the circuit board 11; one end of a wire harness 30 of the first sensor 20 is connected with the circuit board 11; third, the harness 30 of the first sensor 20 is connected to the connector 40, and the connector 40 is mated with the patch section 122 and connected to the circuit board 11. It should be noted that the connection manner between the first sensor 20 and the circuit board 11 is various and is not limited to the above-mentioned manner.

An embodiment of the present application further provides a thermal management system, which includes a compressor, a condenser and the above thermal management device, wherein an outlet of the compressor is communicated with one port of a refrigerant channel of the thermal management device through the condenser, and another port of the thermal management device is communicated with an inlet of the compressor. In the heat management system, the first sensor is electrically connected or in signal connection with the circuit board of the expansion valve controller, at least one part of the sensing part of the first sensor is connected with the cooling liquid channel part of the heat exchanger, so that the cooling liquid parameters of the heat exchanger monitored by the first sensor can be acquired through the circuit board, and the controller of the heat management system is connected with the interface part, so that hardware connection is relatively reduced, the circuit layout is relatively simple, and the cost is relatively reduced.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.

Claims

1. A thermal management device comprising a heat exchanger (50), an expansion valve controller (10) and at least one first sensor (20); the expansion valve controller (10) comprises a stator assembly and a circuit board (11), wherein the stator assembly is electrically and/or signally connected with the circuit board, the first sensor (20) comprises a sensing part (21), the first sensor (20) is electrically or signally connected with the circuit board (11), and at least one part of the sensing part (21) of the first sensor (20) is connected with a cooling liquid channel part (51) of the heat exchanger (50).

2. The thermal management device according to claim 1, wherein the heat exchanger (50) comprises a heat exchange core (53), the coolant passage portion (51) has a coolant passage, at least a portion of the coolant passage is located in the heat exchange core (53), the first sensor (20) is fixedly connected or position-limited to the heat exchanger (50), and at least a portion of the sensing portion (21) of the first sensor (20) is located in the coolant passage of the heat exchange core (53); or the heat exchanger (50) comprises an adapter (52), the first sensor (20) is fixedly connected with the adapter (52) or is in limited connection, and a sensing part (21) of the first sensor (20) is connected with the outer wall of the adapter (52) or is positioned in a cooling liquid channel of the adapter (52).

3. The thermal management device according to claim 2, wherein the expansion valve controller (10) further comprises a housing (12), the circuit board (11) being disposed within the housing (12), the housing (12) being formed with a first opening (121), the first sensor (20) comprising a wiring harness (30), a portion of the wiring harness (30) being located at the first opening (121), an end of the wiring harness (30) remote from the first sensor (20) being electrically and/or signally connected to the circuit board (11).

4. A heat management device according to claim 3, characterized in that the housing (12) is formed with at least one patch section (122), the pins of the patch section (122) being connected to the circuit board (11), and that the end of the wire harness (30) remote from the sensor (20) is provided with at least one connector (40), the connector (40) being plugged into the patch section (122) and being connected to the pins of the patch section (122).

5. The thermal management device according to claim 1, characterized in that the expansion valve controller (10) further comprises a housing (12), the circuit board (11) being arranged in the housing (12), the first sensor (20) being connected to the circuit board (11) directly or by means of wires, at least a part of the first sensor (20) being arranged in the housing (12), the housing (12) being provided with at least one second opening (123), at least a part of the sensing portion (21) of the first sensor (20) protruding through the second opening (123), and the sensing portion (21) of the first sensor (20) being located in the coolant channel of the heat exchanger (50) or in a cavity communicating with the coolant channel.

6. The thermal management device of claim 5, wherein the housing (12) includes a first housing portion (125) and a second housing portion (126), a cavity of the first housing portion (125) communicating with a cavity of the second housing portion (126), the circuit board (11) being disposed within the first housing portion (125), at least a portion of the first sensor (20) being disposed in the second housing portion (126), the second opening (123) being disposed in the second housing portion (126).

7. A heat management arrangement according to any of claims 3 to 6, characterized in that the housing (12) comprises at least one interface part (124), the pins of the interface part (124) being connected to the circuit board (11), the circuit board (11) being connected to an external device via the interface part (124).

8. The thermal management device according to any of claims 1 to 7, further comprising an expansion valve body (60), wherein a refrigerant passage is formed in the expansion valve body (60), wherein the thermal management device further comprises a second sensor (13), wherein the second sensor (13) is electrically or signally connected to the circuit board (11), and wherein at least a part of a sensing portion of the second sensor (13) is disposed in the refrigerant passage or in a cavity communicating with the refrigerant passage.

9. The thermal management apparatus of claim 8, wherein the expansion valve controller (10) is disposed to the expansion valve body (60); the first sensor (20) is a temperature sensor, and the second sensor (13) is a temperature sensor or a temperature pressure sensor.

10. A thermal management system comprising a compressor, a condenser and a thermal management device (100) according to any of claims 1 to 9, an outlet of the compressor communicating with one port of a refrigerant channel of the thermal management device through the condenser, and another port of the thermal management device communicating with an inlet of the compressor.