CN215735627U - Electromagnetic shielding film and circuit board - Google Patents
Electromagnetic shielding film and circuit board Download PDFInfo
- Publication number
- CN215735627U CN215735627U CN202121108984.7U CN202121108984U CN215735627U CN 215735627 U CN215735627 U CN 215735627U CN 202121108984 U CN202121108984 U CN 202121108984U CN 215735627 U CN215735627 U CN 215735627U
- Authority
- CN
- China
- Prior art keywords
- layer
- film
- thickness
- copper
- electromagnetic shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates to an electromagnetic shielding film and a circuit board, comprising: a carrier film; the insulating layer is arranged on the bearing film; the first nickel-chromium alloy layer is arranged on one side of the insulating layer, which is far away from the bearing film; the copper layer is arranged on one side, far away from the insulating layer, of the first nickel-chromium alloy layer; the second nickel-chromium alloy layer is arranged on one side of the copper layer, which is far away from the first nickel-chromium alloy layer; the conductive adhesive layer is arranged on one side, far away from the copper layer, of the second nickel-chromium alloy layer; and the protective film is arranged on one side of the conductive adhesive layer, which is far away from the second nichrome layer. The both sides on copper layer are equipped with first and second nichrome layer in above-mentioned electromagnetic shielding film, and first nichrome layer can effectively separate insulating layer and copper layer, and second nichrome layer can effectively separate copper layer and conducting resin layer, can play the effect that effectively prevents the copper face on copper layer from being oxidized, and then has avoided the solvent of conducting resin layer formation in-process to the oxidation of copper face and the oxidation that the water molecule permeates the copper face and leads to under the high temperature and high humidity condition, has improved electromagnetic shielding film's ground connection resistance stability.
Description
Technical Field
The utility model relates to the technical field of shielding films, in particular to an electromagnetic shielding film and a circuit board.
Background
Electromagnetic shielding, i.e. blocking or attenuating electromagnetic energy propagation from the shielded area to the outside by using a shielding material. The electromagnetic shielding principle is to utilize the reflection, absorption and guiding functions of the shielding body on electromagnetic energy flow, and the electromagnetic shielding functions are closely related to electric charges, electric currents and polarization phenomena induced on the surface of the shielding structure and inside the shielding body.
The electromagnetic shielding film is a film material which can play a role of electromagnetic shielding. 3C products such as notebook computers, GPS, ADSL and mobile phones will generate noise due to high frequency electromagnetic interference, which affects the communication quality. In addition, with the widespread use of these 3C products, the human body may be susceptible to cancerous lesions if exposed to a strong electromagnetic field for a long period of time. Therefore, the electro-magnetic shielding film is widely used in these 3C products.
The traditional electromagnetic shielding film comprises a carrier film, an insulating layer, a shielding layer, a conductive adhesive layer and a protective film which are sequentially stacked. One commonly used shielding layer in emi (electromagnetic interference) electromagnetic shielding films is a copper plated layer. However, it is found in practical production and application that the grounding resistance value of the EMI shielding film is very unstable, and the variation rate of the grounding resistance value is high. The conventional art is in need of improvement.
SUMMERY OF THE UTILITY MODEL
In view of this, it is necessary to provide an electromagnetic shielding film capable of effectively improving the stability of the ground resistance.
The utility model is realized by the following technical scheme:
the present invention provides an electromagnetic shielding film, comprising:
a carrier film;
the insulating layer is arranged on the bearing film;
the first nickel-chromium alloy layer is arranged on one side of the insulating layer, which is far away from the bearing film;
the copper layer is arranged on one side, far away from the insulating layer, of the first nickel-chromium alloy layer;
the second nickel-chromium alloy layer is arranged on one side of the copper layer, which is far away from the first nickel-chromium alloy layer;
the conductive adhesive layer is arranged on one side, far away from the copper layer, of the second nickel-chromium alloy layer; and
and the protective film is arranged on one side of the conductive adhesive layer, which is far away from the second nichrome layer.
The electromagnetic shielding film provided by the utility model comprises a bearing film, an insulating layer, a first nickel-chromium alloy layer, a copper layer, a second nickel-chromium alloy layer, a conductive adhesive layer and a protective film which are arranged in a stacked mode, wherein the first nickel-chromium alloy layer and the second nickel-chromium alloy layer which are used as oxidation resistant layers are respectively arranged on two sides of the copper layer, the first nickel-chromium alloy layer can effectively separate the insulating layer from the copper layer, the second nickel-chromium alloy layer can effectively separate the copper layer from the conductive adhesive layer, and therefore the effect of effectively preventing the copper surface of the copper layer from being oxidized is achieved, the solvent in the forming process of the conductive adhesive layer is prevented from oxidizing the copper surface, the water molecules are prevented from permeating into the copper surface from the insulating layer or the conductive adhesive layer under the high-temperature and high-humidity conditions to cause oxidation, and the stability of the grounding resistance of the electromagnetic shielding film is improved.
In some embodiments, the thickness of the first nichrome layer is 1nm to 100nm in a direction perpendicular to the carrier film. The thickness of the first nickel-chromium alloy layer can have good adhesive force in the range, and meanwhile, the first nickel-chromium alloy layer has good antioxidation effect, so that the electromagnetic shielding film has good stability of grounding resistance.
In some embodiments, the thickness of the second nichrome layer is 1nm to 100nm in a direction perpendicular to the carrier film. The thickness of the second nichrome layer can have good adhesive force in the range, and meanwhile, the second nichrome layer has good antioxidation effect, so that the electromagnetic shielding film has good stability of grounding resistance.
In some embodiments, the thickness of the copper layer is 5nm to 5000nm in a direction perpendicular to the carrier film. The thickness of the copper layer is within the range, and the electromagnetic shielding film has a good electromagnetic shielding effect.
In some of the embodiments, the thickness of the first nichrome layer is 15nm to 30nm in the direction perpendicular to the carrier film; and/or the presence of a gas in the gas,
the thickness of the second nickel-chromium alloy layer is 15 nm-30 nm along the direction vertical to the bearing film; and/or the presence of a gas in the gas,
and the thickness of the copper layer is 200 nm-600 nm along the direction vertical to the bearing film.
Through experimental research, the thickness of the first nickel-chromium alloy layer, the thickness of the second nickel-chromium alloy layer and the thickness of the copper layer are controlled in the ranges, so that a better anti-oxidation effect and an electromagnetic shielding effect can be obtained in a smaller thickness range, and the electromagnetic shielding film can be controlled to have better stability of grounding resistance value at a lower cost.
In some embodiments, the thickness of the carrier film is 25 μm to 150 μm in the direction perpendicular to the carrier film; and/or the presence of a gas in the gas,
the thickness of the insulating layer is 2-30 μm along the direction vertical to the bearing film; and/or the presence of a gas in the gas,
the thickness of the conductive adhesive layer is 2-30 μm along the direction vertical to the bearing film; and/or the presence of a gas in the gas,
the thickness of the protective film is 25-100 mu m along the direction vertical to the bearing film.
Through experimental research, the thickness of the carrier film, the thickness of the insulating layer, the thickness of the conductive adhesive layer and the thickness of the protective film are controlled in the above ranges, and the electromagnetic shielding film can meet the requirements of most electromagnetic shielding films.
In some of these embodiments, the insulating layer is a black insulating ink layer.
In some of these embodiments, the carrier film is a PET carrier film; and/or
The protective film is a PET protective film.
In some embodiments, the thickness of the carrier film is 48 μm to 52 μm in the direction perpendicular to the carrier film;
the thickness of the insulating layer is 6-10 mu m along the direction vertical to the bearing film;
the thickness of the first nickel-chromium alloy layer is 20nm along the direction vertical to the bearing film;
the thickness of the copper layer is 400nm along the direction vertical to the bearing film;
the thickness of the second nickel-chromium alloy layer is 20nm along the direction vertical to the bearing film;
the thickness of the conductive adhesive layer is 5-7 mu m along the direction vertical to the bearing film;
the thickness of the protective film is 72-78 μm along the direction vertical to the bearing film.
Research shows that the thicknesses of the bearing film, the insulating layer, the first nichrome layer, the copper layer, the second nichrome layer, the conductive adhesive layer and the protective film are controlled within the range, so that the electromagnetic shielding film can obtain the optimal stability of the grounding resistance value at the lowest thickness cost.
In some of these embodiments, the copper layer comprises a vacuum copper plating layer and an electroless copper plating layer in a stacked arrangement, the vacuum copper plating layer being located between the first nichrome layer and the electroless copper plating layer, the electroless copper plating layer being located between the vacuum copper plating layer and the second nichrome layer.
So will range upon range of the vacuum copper-plated layer that sets up and chemical copper-deposition layer as the copper layer, the vacuum copper-plated layer has higher density and has better adhesive force, and chemical copper-deposition layer has low cost and the copper layer that forms is thicker, combines the advantage of two kinds of different technologies, can satisfy the demand of copper layer to great thickness at less cost, makes the electromagnetic shielding film have good cohesion simultaneously.
Another object of the present invention is to provide a circuit board, which includes a circuit board body and the electromagnetic shielding film according to any one of the above aspects, wherein the electromagnetic shielding film is disposed on the circuit board body.
Drawings
Fig. 1 is a sectional view of an electromagnetic shielding film according to an embodiment of the present invention;
fig. 2 is a detailed sectional view of the electro-magnetic shielding film of fig. 1;
fig. 3 is a sectional view of an electromagnetic shielding film of comparative example 1.
Detailed Description
To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Researchers find that the grounding resistance of the EMI (electromagnetic interference) electromagnetic shielding film is very unstable, and the change rate of the grounding resistance is high; the reason for this is that the surface of the copper plating layer in the electromagnetic shielding film is easily oxidized. Particularly, when a conductive adhesive layer is formed on a copper plating layer, the copper surface of the copper plating layer is easily oxidized due to the fact that the coated conductive adhesive contains a large amount of butanone solvent. In addition, when the electromagnetic shielding film is used for subsequent double 85 tests, because the temperature and humidity of the double 85 tests are higher, water molecules can permeate into a copper surface from an insulating layer or a conductive adhesive layer to generate an oxidation reaction in the high-temperature and high-humidity test process, so that the copper surface oxidation of a copper-plated layer is promoted to be aggravated, the resistance value of the electromagnetic shielding film is increased, the change rate is increased, and the performance of the electromagnetic shielding film is unstable.
Referring to fig. 1, the present invention provides an electromagnetic shielding film 100, including:
a carrier film 110;
an insulating layer 120 disposed on the carrier film 110;
the first nichrome layer 130 is arranged on one side of the insulating layer 120, which is far away from the carrier film 110;
a copper layer 140 disposed on a side of the first nichrome layer 130 away from the insulating layer 120;
a second nichrome layer 150 disposed on a side of the copper layer 140 away from the first nichrome layer 130;
the conductive adhesive layer 160 is arranged on one side of the second nichrome layer 150 far away from the copper layer 140; and
and the protective film 170 is arranged on one side of the conductive adhesive layer 160 far away from the second nichrome layer 150.
The electromagnetic shielding film 100 of the present invention includes a carrier film 110, an insulating layer 120, a first nichrome layer 130, a copper layer 140, a second nichrome layer 150, a conductive adhesive layer 160, and a protective film 170, wherein, the first nichrome layer 130 and the second nichrome layer 150 are respectively arranged on the two sides of the copper layer 140 as oxidation resistant layers, the first nichrome layer 130 can effectively separate the insulating layer 120 from the copper layer 140, the second nichrome layer 150 can effectively separate the copper layer 140 from the conductive adhesive layer 160, and then can play the effective copper face that prevents copper layer 140 from being oxidized effect, and then avoided the solvent in the conductive adhesive layer 160 formation process to the oxidation of copper face, also avoided the oxidation that water molecule permeates the copper face from insulating layer 120 or conductive adhesive layer 160 and leads to under the high temperature and high humidity condition, so improved the stability of the ground resistance of electromagnetic shielding film 100.
In some embodiments, the thickness of the first nichrome layer 130 is 1nm to 100nm in a direction perpendicular to the support film 110. The thickness of the first nichrome layer 130 can have a good adhesion within this range, and at the same time, has a good oxidation resistance, so that the electromagnetic shielding film 100 has a good stability of the ground resistance. Further, the thickness of the first nichrome layer 130 is 10nm to 80nm along the direction perpendicular to the carrier film 110; further, the thickness of the first nichrome layer 130 is 10nm to 50nm in a direction perpendicular to the carrier film 110.
In some embodiments, the thickness of the second nichrome layer 150 is 1nm to 100nm in a direction perpendicular to the support film 110. The thickness of the second nichrome layer 150 can have a good adhesion within this range, and at the same time, has a good oxidation resistance, so that the electromagnetic shielding film 100 has a good stability of the ground resistance. Further, the thickness of the second nichrome layer 150 is 10nm to 80nm along the direction perpendicular to the carrier film 110; further, the thickness of the second nichrome layer 150 is 10nm to 50nm in a direction perpendicular to the support film 110.
In some embodiments, the thickness of the copper layer 140 is 5nm to 5000nm in a direction perpendicular to the carrier film 110. The thickness of the copper layer 140 is within this range, the electro-magnetic shielding film 100 can have a superior electro-magnetic shielding effect. Further, the thickness of the copper layer 140 is 10nm to 1000nm along the direction perpendicular to the carrier film 110; further, the thickness of the copper layer 140 is 100nm to 600nm in a direction perpendicular to the carrier film 110.
In some embodiments, the thickness of the first nichrome layer 130 is 15nm to 30nm in a direction perpendicular to the support film 110. In some embodiments, the thickness of the second nichrome layer 150 is 15nm to 30nm in a direction perpendicular to the support film 110. In some embodiments, the thickness of the copper layer 140 is 200nm to 600nm in a direction perpendicular to the carrier film 110.
Through experimental research, the thickness of the first nichrome layer 130, the thickness of the second nichrome layer 150, and the thickness of the copper layer 140 are controlled within the above ranges, so that a better antioxidant effect and an electromagnetic shielding effect can be obtained within a smaller thickness range, and thus the stability of the grounding resistance of the electromagnetic shielding film 100 can be controlled at a lower cost.
In some embodiments, the thickness of the carrier film 110 is 25 μm to 150 μm in a direction perpendicular to the carrier film 110. In some embodiments, the insulating layer 120 has a thickness of 2 μm to 30 μm in a direction perpendicular to the carrier film 110. In some embodiments, the thickness of the conductive adhesive layer 160 is 2 μm to 30 μm in a direction perpendicular to the carrier film 110. In some embodiments, the thickness of the protective film 170 is 25 μm to 100 μm in a direction perpendicular to the carrier film 110.
Through experimental studies, the thickness of the carrier film 110, the thickness of the insulating layer 120, the thickness of the conductive adhesive layer 160 and the thickness of the protective film 170 are controlled within the above ranges, which can be suitable for most of the requirements of the electromagnetic shielding film 100.
In some of these embodiments, the insulating layer 120 is a black insulating ink layer.
In some of these embodiments, the carrier film 110 is a PET carrier film. In some of these embodiments, protective film 170 is a PET protective film. It is understood that the kinds of the carrier film and the protective film are not limited thereto.
In some embodiments, the thickness of the carrier film 110 is 48 μm to 52 μm in a direction perpendicular to the carrier film 110; the thickness of the insulating layer 120 is 6 μm to 10 μm in a direction perpendicular to the carrier film 110; the thickness of the first nichrome layer 130 is 20nm in a direction perpendicular to the carrier film 110; the thickness of the copper layer 140 is 400nm along the direction perpendicular to the carrier film 110; the thickness of the second nichrome layer 150 is 20nm in a direction perpendicular to the carrier film 110; the thickness of the conductive adhesive layer 160 is 5 μm to 7 μm along the direction perpendicular to the carrier film 110; the thickness of the protective film 170 is 72 μm to 78 μm in a direction perpendicular to the carrier film 110.
It is found that the above ranges of the thicknesses of the carrier film 110, the insulating layer 120, the first nichrome layer 130, the copper layer 140, the second nichrome layer 150, the conductive adhesive layer 160, and the protective film 170 are controlled simultaneously, so that the electromagnetic shielding film 100 can obtain the best stability of the ground resistance value at the lowest thickness cost.
Referring to fig. 2, the copper layer 140 further includes a vacuum copper plating layer 141 and an electroless copper plating layer 142 stacked together, the vacuum copper plating layer 141 is located between the first nicr alloy layer 130 and the electroless copper plating layer 142, and the electroless copper plating layer 142 is located between the vacuum copper plating layer 141 and the second nicr alloy layer 150.
The vacuum copper plating layer 141 may be a copper plating layer formed by a vacuum magnetron sputtering method or a vacuum evaporation method, and the electroless copper plating layer 142 refers to a copper layer deposited by a solution method, such as acid-base chemical deposition.
Like this with the vacuum copper plating layer 141 and the electroless copper plating layer 142 of range upon range of setting as copper layer 140, vacuum copper plating layer 141 has higher density and has better adhesive force, and electroless copper plating layer 142 has low cost and the copper layer that forms is thicker, combines the advantage of the copper layer of two kinds of different technologies, can satisfy the demand of copper layer 140 to great thickness at less cost, makes electromagnetic shielding film 100 have good cohesion simultaneously.
Further, the thickness of the vacuum copper plating layer 141 is 5nm to 300nm along the direction perpendicular to the carrier film 110; the electroless copper plating layer 142 has a thickness of 50nm to 5000nm in a direction perpendicular to the carrier film 110.
Further, the conductive adhesive layer 160 may be a silver conductive adhesive layer, a copper conductive adhesive layer, or a nickel conductive adhesive layer.
The following are specific examples.
Concrete example 1
The structure of the electromagnetic shielding film of specific example 1 is shown in fig. 2, and includes a carrier film 110, an insulating layer 120, a first nichrome layer 130, a copper layer 140, a second nichrome layer 150, a conductive adhesive layer 160, and a protective film 170, which are stacked.
The carrier film 110 is a PET carrier film, the insulating layer 120 is a black insulating ink layer, the protective film 170 is a PET protective film, and the conductive adhesive layer 160 is a nickel conductive adhesive layer. The copper layer 141 includes a vacuum copper plated layer 141 and an electroless copper plated layer 142 which are stacked.
The thickness of the carrier film 110 is 48-52 μm along the direction perpendicular to the carrier film 110; the thickness of the insulating layer 120 is 6 μm to 10 μm in a direction perpendicular to the carrier film 110; the thickness of the first nichrome layer 130 is 20nm in a direction perpendicular to the carrier film 110; the thicknesses of the vacuum copper plating layer 141 and the electroless copper plating layer 142 are each 400nm in a direction perpendicular to the carrier film 110; the thickness of the second nichrome layer 150 is 20nm in a direction perpendicular to the carrier film 110; the thickness of the conductive adhesive layer 160 is 5 μm to 7 μm along the direction perpendicular to the carrier film 110; the thickness of the protective film 170 is 72 μm to 78 μm in a direction perpendicular to the carrier film 110.
Comparative example 1
Referring to fig. 3, the structure of the electro-magnetic shielding film of comparative example 1 is substantially the same as that of the electro-magnetic shielding film of specific example 1 except that: the first nichrome layer 130 and the second nichrome layer 150 are omitted; namely, the carrier film 110, the insulating layer 120, the copper layer 140, the conductive adhesive layer 160 and the protective film 170 are stacked.
The electromagnetic shielding films of the specific example 1 and the comparative example 1 were subjected to a double 85 test, and the ground resistance obtained by the test was changed with time as shown in the following table, wherein the diameter of the hole means the diameter of an effective circular hole which was in contact with the copper layer at the time of the test.
As can be seen from the above table, compared to comparative example 1, in the case that other conditions are not changed, the specific example 1 has the first nichrome layer 130 and the second nichrome layer 150 as the oxidation prevention layer, and the change rate of the ground resistance of the electromagnetic shielding film with time is small, and the stability of the ground resistance is better.
Another embodiment of the present invention provides a circuit board, which includes a circuit board body and the electromagnetic shielding film of any of the above embodiments, wherein the electromagnetic shielding film is disposed on the circuit board body.
The type of the circuit board body can be set according to actual use conditions. Preferably, the circuit board body in the embodiment may be one of a flexible single-sided circuit board, a flexible double-sided circuit board, a flexible multilayer board, or a rigid-flex printed circuit board.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An electromagnetic shielding film, comprising:
a carrier film;
the insulating layer is arranged on the bearing film;
the first nickel-chromium alloy layer is arranged on one side of the insulating layer, which is far away from the bearing film;
the copper layer is arranged on one side, far away from the insulating layer, of the first nickel-chromium alloy layer;
the second nickel-chromium alloy layer is arranged on one side of the copper layer, which is far away from the first nickel-chromium alloy layer;
the conductive adhesive layer is arranged on one side, far away from the copper layer, of the second nickel-chromium alloy layer; and
and the protective film is arranged on one side of the conductive adhesive layer, which is far away from the second nichrome layer.
2. The electromagnetic shielding film according to claim 1, wherein the thickness of the first nichrome layer in a direction perpendicular to the carrier film is 1nm to 100 nm; and/or the presence of a gas in the gas,
and the thickness of the second nickel-chromium alloy layer is 1 nm-100 nm along the direction vertical to the bearing film.
3. The electro-magnetic shielding film of claim 1, wherein the copper layer has a thickness of 5nm to 5000nm in a direction perpendicular to the carrier film.
4. The electromagnetic shielding film according to claim 1, wherein the thickness of the first nichrome layer in a direction perpendicular to the carrier film is 15nm to 30 nm; and/or
The thickness of the second nickel-chromium alloy layer is 15 nm-30 nm along the direction vertical to the bearing film; and/or
And the thickness of the copper layer is 200 nm-600 nm along the direction vertical to the bearing film.
5. The electro-magnetic shielding film of any one of claims 1 to 4, wherein the thickness of the carrier film in a direction perpendicular to the carrier film is 25 μm to 150 μm; and/or the presence of a gas in the gas,
the thickness of the insulating layer is 2-30 μm along the direction vertical to the bearing film; and/or the presence of a gas in the gas,
the thickness of the conductive adhesive layer is 2-30 μm along the direction vertical to the bearing film; and/or the presence of a gas in the gas,
the thickness of the protective film is 25-100 mu m along the direction vertical to the bearing film.
6. The electro-magnetic shielding film of any one of claims 1 to 4, wherein the insulating layer is a black insulating ink layer.
7. The electromagnetic shielding film according to any one of claims 1 to 4, wherein the carrier film is a PET carrier film; and/or the presence of a gas in the gas,
the protective film is a PET protective film.
8. The electromagnetic shielding film according to any one of claims 1 to 4,
the thickness of the carrier film is 48-52 μm along the direction vertical to the carrier film;
the thickness of the insulating layer is 6-10 mu m along the direction vertical to the bearing film;
the thickness of the first nickel-chromium alloy layer is 20nm along the direction vertical to the bearing film;
the thickness of the copper layer is 400nm along the direction vertical to the bearing film;
the thickness of the second nickel-chromium alloy layer is 20nm along the direction vertical to the bearing film;
the thickness of the conductive adhesive layer is 5-7 mu m along the direction vertical to the bearing film;
the thickness of the protective film is 72-78 μm along the direction vertical to the bearing film.
9. The electromagnetic shielding film according to any one of claims 1 to 4, wherein the copper layer comprises a vacuum copper plating layer and an electroless copper plating layer, which are stacked, the vacuum copper plating layer being located between the first nichrome layer and the electroless copper plating layer, and the electroless copper plating layer being located between the vacuum copper plating layer and the second nichrome layer.
10. A wiring board comprising a wiring board body and the electromagnetic shielding film of any one of claims 1 to 9, the electromagnetic shielding film being provided on the wiring board body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121108984.7U CN215735627U (en) | 2021-05-21 | 2021-05-21 | Electromagnetic shielding film and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121108984.7U CN215735627U (en) | 2021-05-21 | 2021-05-21 | Electromagnetic shielding film and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215735627U true CN215735627U (en) | 2022-02-01 |
Family
ID=80032326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121108984.7U Active CN215735627U (en) | 2021-05-21 | 2021-05-21 | Electromagnetic shielding film and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215735627U (en) |
-
2021
- 2021-05-21 CN CN202121108984.7U patent/CN215735627U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2515624B1 (en) | Electromagnetic noise absorbing fabric | |
| US9526195B2 (en) | Ultrathin shielding film of high shielding effectiveness and manufacturing method thereof | |
| US8952273B2 (en) | Near-field noise suppression sheet | |
| US20120205146A1 (en) | Heat-resistant copper foil and method of producing the same, circuit board, and copper-clad laminate and method of producing the same | |
| KR102323306B1 (en) | Copper clad laminate and method for manufacturing copper clad laminate | |
| JP4976316B2 (en) | Electromagnetic wave absorbing film | |
| JP6208394B1 (en) | Electromagnetic wave absorption filter | |
| JP2008162245A (en) | Plating-method two-layer copper polyimide laminated film, and method for manufacturing the same | |
| KR20200089113A (en) | Multilayer film for electromagnetic interference shielding | |
| CN215735627U (en) | Electromagnetic shielding film and circuit board | |
| CN101480112B (en) | noise suppressing wiring member and printed wiring board | |
| JP2007221107A (en) | Composite electromagnetic wave shielding material and method for fabrication thereof | |
| TWI464956B (en) | Graded junction conductive film and high frequency transmission line and high frequency filter using it | |
| WO2003056058A1 (en) | A method of producing a composite electroconductive material | |
| JP4459360B2 (en) | Circuit board and manufacturing method thereof | |
| CN216600683U (en) | Electromagnetic shielding film and printed circuit board with shielding structure | |
| KR102538130B1 (en) | Copper clad layer, electronic device including the same, and method of preparing the copper clad layer | |
| KR102388449B1 (en) | Electromagnetic wave shielding material and method for producing the same | |
| KR102442175B1 (en) | Alloy Film Shielding Electromagnetic Field by Frequency Band and Manufacturing Method Thereof | |
| TWI671004B (en) | Electromagnetic interference (emi) shielding film | |
| US20230065194A1 (en) | Electromagnetic interference shielding film and preparing methods thereof | |
| JP5973099B1 (en) | Near-field electromagnetic wave absorbing film | |
| JP2008021977A (en) | Composite electromagnetic wave shielding material and method for fabrication thereof | |
| JP2005251918A (en) | Electromagnetic wave noise suppressor | |
| CN116613322A (en) | Copper foil and preparation method thereof, current collector, electrode plate, secondary battery and power utilization device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220507 Address after: Room 1020, 2nd floor, Yangke Road, Xinchang District, Xinjiang District, Jiangxi Province Patentee after: Jiangxi Xinfei New Material Co.,Ltd. Address before: 330117 room 422, floor 4, building 1, Linrui youth apartment, No. 955, rulehu street, Linkong Economic Zone, Nanchang City, Jiangxi Province Patentee before: Jiangxi zhanyao Microelectronics Co.,Ltd. |