CN215734191U - Heat dissipation device for photovoltaic wafer - Google Patents
Heat dissipation device for photovoltaic wafer Download PDFInfo
- Publication number
- CN215734191U CN215734191U CN202121939096.XU CN202121939096U CN215734191U CN 215734191 U CN215734191 U CN 215734191U CN 202121939096 U CN202121939096 U CN 202121939096U CN 215734191 U CN215734191 U CN 215734191U
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- Prior art keywords
- heat dissipation
- heat
- cavity
- photovoltaic
- pipeline
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 72
- 230000007246 mechanism Effects 0.000 claims abstract description 44
- 238000010521 absorption reaction Methods 0.000 claims abstract description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000009434 installation Methods 0.000 claims abstract description 5
- 230000005855 radiation Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 11
- 239000000110 cooling liquid Substances 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 5
- 238000010248 power generation Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Photovoltaic Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat dissipation device for a photovoltaic wafer, which comprises the photovoltaic wafer, wherein a circulating mechanism is arranged below the photovoltaic wafer, the circulating mechanism consists of a switching pipeline, a first pipeline, a circulating pump body, a second pipeline, a circulating water tank and a return pipeline, a heat absorption mechanism is arranged at the lower part of the photovoltaic wafer, the heat absorption mechanism consists of a reflector, a communicating pipe, a heat absorption cavity and an installation groove, and a heat dissipation mechanism is arranged at one end of the return pipeline. According to the photovoltaic solar water heater, the heat absorption mechanism, the circulation mechanism and the heat dissipation mechanism are arranged, the heat absorption mechanism can take away heat on a photovoltaic wafer, due to the special shape of the heat absorption cavity, the contact area is increased, the heat exchange rate is improved, the heat dissipation effect is good, the circulation mechanism can recycle cooling liquid, energy is saved, meanwhile, the heat dissipation mechanism improves the heat dissipation efficiency of the heat dissipation cavity, and the photovoltaic solar water heater is convenient to use.
Description
Technical Field
The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device for a photovoltaic wafer.
Background
Photovoltaic: the solar photovoltaic power generation system is a short-term solar photovoltaic power generation system, is a novel power generation system which directly converts solar radiation energy into electric energy by utilizing the photovoltaic effect of a solar cell semiconductor material, has two modes of independent operation and grid-connected operation, and is classified into a centralized type, such as a large northwest ground photovoltaic power generation system; one is distributed (with >6MW as boundary), such as factory building roof photovoltaic power generation system of industry and commerce, resident house roof photovoltaic power generation system.
The photovoltaic wafer is an important component in a photovoltaic system, and in the using process, in order to prolong the service life, a heat dissipation device is often arranged and used for dissipating heat of the photovoltaic wafer, but the existing heat dissipation effect is not ideal enough and the use is inconvenient.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provides a heat dissipation device for a photovoltaic wafer.
In order to achieve the purpose, the utility model adopts the following technical scheme: a heat dissipation device for a photovoltaic wafer comprises the photovoltaic wafer, wherein a circulation mechanism is arranged below the photovoltaic wafer and consists of a switching pipeline, a first pipeline, a circulation pump body, a second pipeline, a circulation water tank and a return pipeline, a heat absorption mechanism is arranged at the lower part of the photovoltaic wafer and consists of a reflecting plate, a communicating pipe, a heat absorption cavity and a mounting groove;
one end of the backflow pipeline is provided with a heat dissipation mechanism, the heat dissipation mechanism is composed of an airflow cavity, a mounting frame, a heat dissipation fan and a heat dissipation cavity, and the heat dissipation fan is fixedly connected with the mounting frame.
As a further description of the above technical solution:
the first pipeline is fixedly connected with the output end of the circulating pump body, and the return pipeline is fixedly connected with the circulating water tank.
As a further description of the above technical solution:
the airflow cavity is positioned on the inner side of the circulating water tank, and the cooling fan is positioned in front of the airflow cavity.
As a further description of the above technical solution:
the heat dissipation cavity is communicated with the circulating water tank and is positioned in front of the heat dissipation fan.
As a further description of the above technical solution:
the second pipeline is fixedly connected with the heat dissipation cavity, and the number of the heat absorption mechanisms is more than one.
As a further description of the above technical solution:
the reflector panel is located the inside of mounting groove, and sets up for the slope.
As a further description of the above technical solution:
the communicating pipe is fixedly connected with the heat absorption cavity, and the heat absorption cavity is triangular.
As a further description of the above technical solution:
the switching pipeline is located the outside of heat absorption cavity.
The utility model has the following beneficial effects:
1. compared with the prior art, the heat dissipation device for the photovoltaic wafer is provided with the heat absorption mechanism, the heat absorption mechanism can take away heat on the photovoltaic wafer, the contact area is increased due to the special shape of the heat absorption cavity, the heat exchange rate is improved, and the heat dissipation effect is good.
2. Compared with the prior art, the heat dissipation device for the photovoltaic wafer is provided with the circulating mechanism and the heat dissipation mechanism, the circulating mechanism can recycle the cooling liquid, energy is saved, meanwhile, the heat dissipation mechanism improves the heat dissipation efficiency of the heat dissipation cavity, and the use is convenient.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device for a photovoltaic wafer according to the present invention;
fig. 2 is a top view of a heat dissipation device for a photovoltaic wafer according to the present invention;
FIG. 3 is a front view of a heat dissipation device for a photovoltaic wafer according to the present invention;
fig. 4 is a schematic structural diagram of a heat absorbing mechanism of a heat dissipating device of a photovoltaic wafer according to the present invention;
fig. 5 is a schematic partial structural view of a heat dissipation device for a photovoltaic wafer according to the present invention.
Illustration of the drawings:
1. a photovoltaic wafer; 2. a circulating mechanism; 3. a heat dissipation mechanism; 4. a heat absorbing mechanism; 201. transferring a pipeline; 202. a first conduit; 203. a circulating pump body; 204. a second conduit; 205. a circulating water tank; 206. a return line; 301. an airflow chamber; 302. a mounting frame; 303. a heat radiation fan; 304. a heat dissipation cavity; 401. a reflector; 402. a communicating pipe; 403. a heat absorbing cavity; 404. and (4) mounting the groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-5, one embodiment of the present invention is provided: a heat dissipating device for a photovoltaic wafer comprises a photovoltaic wafer 1, wherein a circulating mechanism 2 is arranged below the photovoltaic wafer 1, the circulating mechanism 2 is composed of a switching pipeline 201, a first pipeline 202, a circulating pump body 203, a second pipeline 204, a circulating water tank 205 and a return pipeline 206, when the circulating mechanism 2 works, the circulating pump body 203 pumps cooling liquid cooled inside a heat dissipating cavity 304 into the heat dissipating cavity, the cooling liquid enters a heat absorbing mechanism 4 through the second pipeline 204 and the first pipeline 202, after the heat absorbing mechanism 4 absorbs heat, the cooling liquid with raised temperature flows back into the circulating water tank 205 from the return pipeline 206 and then enters the heat dissipating cavity 304 again to finish recycling, and energy is saved;
the adapter pipe 201 is located outside the heat absorption cavity 403, the adapter pipe 201 is used for communicating adjacent heat absorption cavities 403, the second pipe 204 is fixedly connected with the heat dissipation cavity 304, the first pipe 202 is fixedly connected with the output end of the circulation pump body 203, the return pipe 206 is fixedly connected with the circulation water tank 205, the lower portion of the photovoltaic wafer 1 is provided with more than one heat absorption mechanism 4, the heat absorption mechanism 4 is composed of a reflecting plate 401, a communicating pipe 402, the heat absorption cavity 403 and a mounting groove 404, cooling liquid entering the heat absorption cavity 403 can absorb heat on the photovoltaic wafer 1 and then flows back into the circulation water tank 205 through the return pipe 206, the reflecting plate 401 is located inside the mounting groove 404 and is arranged obliquely, the communicating pipe 402 is fixedly connected with the heat absorption cavity 403, the heat absorption cavity 403 is triangular, and the heat absorption cavity 403 is special in shape, the contact area is increased, the heat exchange rate is improved, and the heat dissipation effect is good;
one end of the backflow pipeline 206 is provided with the heat dissipation mechanism 3, the heat dissipation mechanism 3 is composed of an airflow cavity 301, an installation frame 302, a heat dissipation fan 303 and a heat dissipation cavity 304, the airflow cavity 301 is used for air inflow, in operation, the heat dissipation fan 303 blows out airflow to take away heat on the heat dissipation cavity 304, the heat dissipation efficiency of the heat dissipation cavity 304 is improved, the airflow cavity 301 is located on the inner side of the circulating water tank 205, the heat dissipation fan 303 is located in front of the airflow cavity 301, the heat dissipation cavity 304 is communicated with the circulating water tank 205, the heat dissipation cavity 304 is located in front of the heat dissipation fan 303, and the heat dissipation fan 303 is fixedly connected with the installation frame 302.
The working principle is as follows: when the circulation mechanism 2 works, the circulation pump body 203 pumps the cooling liquid cooled inside the heat dissipation cavity 304, the cooling liquid enters the heat absorption mechanism 4 through the second pipeline 204 and the first pipeline 202, the cooling liquid enters the heat absorption cavity 403, heat on the photovoltaic wafer 1 can be absorbed, the cooling liquid with the increased temperature flows back into the circulation water tank 205 from the return pipeline 206, then the cooling liquid enters the heat dissipation cavity 304 again, the heat on the heat dissipation cavity 304 is taken away by the airflow blown out by the cooling fan 303, at the moment, the temperature of the cooling liquid becomes low, the heat dissipation efficiency of the heat dissipation cavity 304 is improved, and energy is saved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.
Claims (8)
1. A heat sink for photovoltaic wafers, comprising a photovoltaic wafer (1), characterized in that: a circulating mechanism (2) is arranged below the photovoltaic wafer (1), the circulating mechanism (2) is composed of a switching pipeline (201), a first pipeline (202), a circulating pump body (203), a second pipeline (204), a circulating water tank (205) and a return pipeline (206), a heat absorbing mechanism (4) is arranged at the lower part of the photovoltaic wafer (1), and the heat absorbing mechanism (4) is composed of a reflecting plate (401), a communicating pipe (402), a heat absorbing cavity (403) and a mounting groove (404);
one end of the backflow pipeline (206) is provided with a heat dissipation mechanism (3), the heat dissipation mechanism (3) is composed of an airflow cavity (301), an installation frame (302), a heat dissipation fan (303) and a heat dissipation cavity (304), and the heat dissipation fan (303) is fixedly connected with the installation frame (302).
2. The heat dissipation device for photovoltaic wafers as recited in claim 1, wherein: the first pipeline (202) is fixedly connected with the output end of the circulating pump body (203), and the return pipeline (206) is fixedly connected with the circulating water tank (205).
3. The heat dissipation device for photovoltaic wafers as recited in claim 1, wherein: the airflow cavity (301) is positioned at the inner side of the circulating water tank (205), and the heat radiation fan (303) is positioned in front of the airflow cavity (301).
4. The heat dissipation device for photovoltaic wafers as recited in claim 1, wherein: the heat dissipation cavity (304) is communicated with the circulating water tank (205), and the heat dissipation cavity (304) is located in front of the heat dissipation fan (303).
5. The heat dissipation device for photovoltaic wafers as recited in claim 1, wherein: the second pipeline (204) is fixedly connected with the heat dissipation cavity (304), and the number of the heat absorption mechanisms (4) is more than one.
6. The heat dissipation device for photovoltaic wafers as recited in claim 1, wherein: the reflector (401) is positioned in the mounting groove (404) and is obliquely arranged.
7. The heat dissipation device for photovoltaic wafers as recited in claim 1, wherein: the communicating pipe (402) is fixedly connected with a heat absorption cavity (403), and the heat absorption cavity (403) is triangular.
8. The heat dissipation device for photovoltaic wafers as recited in claim 1, wherein: the adapter pipe (201) is positioned outside the heat absorption cavity (403).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121939096.XU CN215734191U (en) | 2021-08-18 | 2021-08-18 | Heat dissipation device for photovoltaic wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121939096.XU CN215734191U (en) | 2021-08-18 | 2021-08-18 | Heat dissipation device for photovoltaic wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215734191U true CN215734191U (en) | 2022-02-01 |
Family
ID=79997891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121939096.XU Expired - Fee Related CN215734191U (en) | 2021-08-18 | 2021-08-18 | Heat dissipation device for photovoltaic wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215734191U (en) |
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2021
- 2021-08-18 CN CN202121939096.XU patent/CN215734191U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220201 |