CN215731637U

CN215731637U - Wafer bracket and wafer film coating machine with same

Info

Publication number: CN215731637U
Application number: CN202121357436.8U
Authority: CN
Inventors: 张健宁; 李永胜; 吴洽; 田耕涛
Original assignee: Zhongshan Kaixuan Vacuum Science and Technology Co Ltd
Current assignee: Zhongshan Kaixuan Vacuum Science and Technology Co Ltd
Priority date: 2021-06-11
Filing date: 2021-06-11
Publication date: 2022-02-01
Anticipated expiration: 2031-06-11

Abstract

The utility model relates to the technical field of film coating machines, and provides a wafer bracket and a wafer film coating machine with the same. The wafer carrier includes: a main body having an accommodating space; the turntable platform is positioned in the accommodating space and is provided with a plurality of through holes; the wafer bearing discs are arranged on the turntable platform, at least part of the wafer bearing discs are positioned in the through holes, and the wafer bearing discs are rotatably arranged relative to the through holes; the driving mechanism is in driving connection with the rotary table platform and the wafer bearing disc through the transmission mechanism to drive the rotary table platform to rotate around the first axis, and each wafer bearing disc rotates around the corresponding second axis while rotating around the first axis, namely, the rotary table platform drives each wafer bearing disc to revolve around the first axis while rotating around the second axis, so that the coating layers of the wafers on the wafer bearing disc are more uniform, and the coating yield is improved.

Description

Wafer bracket and wafer film coating machine with same

Technical Field

The utility model relates to the technical field of film coating machines, in particular to a wafer bracket and a wafer film coating machine with the same.

Background

In some processes in the manufacturing process of semiconductor device wafers, the wafers are carried on a wafer carrier, and films are plated on the surfaces of the wafers in a physical or chemical vapor deposition mode.

Wafer bracket among the prior art adopts the integral type mostly, has many places trompil on it, and trompil department is equipped with the recess, places the wafer in the recess, makes the membrane material can deposit on the wafer of groove through the vapor deposition mode.

SUMMERY OF THE UTILITY MODEL

The utility model provides a wafer bracket and a wafer coating machine with the same, which are used for improving the service performance of the wafer bracket.

According to a first aspect of the present invention, there is provided a wafer carrier comprising:

a main body having an accommodating space;

the turntable platform is positioned in the accommodating space and is provided with a plurality of through holes;

the wafer bearing discs are arranged on the turntable platform, at least part of the wafer bearing discs are positioned in the through holes, and the wafer bearing discs are rotatably arranged relative to the through holes;

the driving mechanism is in driving connection with the rotary table platform and the wafer bearing discs through the transmission mechanism so as to drive the rotary table platform to rotate around the first axis, and each wafer bearing disc rotates around the corresponding second axis while rotating around the first axis.

In one embodiment of the utility model, the transmission mechanism comprises:

the driving wheel is connected with the turntable platform and is connected with the driving mechanism;

the driven wheels are respectively connected with the wafer bearing discs;

the first transmission belt is sleeved on the driving wheel and one driven wheel;

and the second transmission belt is sleeved on the driven wheels so that the driven wheels synchronously rotate when the driving mechanism drives the driving wheel to rotate.

In one embodiment of the utility model, the first drive belt is a first flat belt and the second drive belt is a second flat belt.

In one embodiment of the utility model, the driven wheel is arranged on the inner side of the wafer bearing disc in a penetrating way and is connected with the wafer bearing disc through a fastening piece.

In one embodiment of the utility model, the driving wheel is welded with the turntable platform and is connected with a motor shaft of the driving mechanism through a key.

In one embodiment of the present invention, the wafer carrier further comprises:

and a tensioner disposed on the main body to be pressed on the second transmission belt.

In one embodiment of the utility model, the body comprises:

a housing having an accommodating space;

the cover body is detachably arranged on the shell to seal or release the accommodating space;

the briquetting, the briquetting setting is in the lid towards accommodation space's one side, and the briquetting contacts with wafer bearing plate to avoid the wafer on the wafer bearing plate to break away from wafer bearing plate.

In one embodiment of the utility model, the pressing block is a rubber pressing block, the pressing block is multiple, and the multiple pressing blocks and the multiple wafer bearing disks are arranged in a one-to-one correspondence manner.

In one embodiment of the utility model, the wafer carrier plate comprises a first section and a second section which are connected, wherein the first section is positioned in the through hole, the second section is supported on the opening of the through hole, and the second section is provided with a groove for accommodating a wafer.

According to a second aspect of the utility model, a wafer coater is provided, which comprises the wafer bracket.

The wafer bracket comprises a main body, a turntable platform, a plurality of wafer bearing disks, a driving mechanism and a transmission mechanism, wherein the wafer bearing disks are respectively arranged in the through holes, and the driving mechanism is in driving connection with the turntable platform and the wafer bearing disks through the transmission mechanism, so that the turntable platform can drive the wafer bearing disks to revolve around a first axis and rotate around a second axis simultaneously, the uniformity of film coating layers of wafers on the wafer bearing disks is ensured, and the film coating yield is improved.

Drawings

Various objects, features and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the utility model, when considered in conjunction with the accompanying drawings. The drawings are merely exemplary of the utility model and are not necessarily drawn to scale. In the drawings, like reference characters designate the same or similar parts throughout the different views. Wherein:

FIG. 1 is a schematic diagram illustrating a wafer carrier according to an exemplary embodiment;

FIG. 2 is a cross-sectional view of a wafer carrier according to an exemplary embodiment;

FIG. 3 is a schematic diagram of a partial cross-sectional structure of a wafer carrier in accordance with an exemplary embodiment;

FIG. 4 is another partial cross-sectional view of a wafer carrier shown in accordance with an exemplary embodiment;

fig. 5 is a schematic diagram of a tensioner for a wafer carrier according to an exemplary embodiment.

The reference numerals are explained below:

1. a wafer; 10. a main body; 11. an accommodating space; 12. a housing; 13. a cover body; 14. briquetting; 15. a first seal ring; 20. a turntable platform; 21. a through hole; 30. a wafer carrying tray; 31. a first stage; 32. a second stage; 321. a groove; 40. a drive mechanism; 41. a motor shaft; 42. a key; 43. a servo motor; 44. a motor reducer; 45. a fixing member; 46. a vacuum flange; 47. a second seal ring; 48. a third seal ring; 50. a transmission mechanism; 51. a driving wheel; 52. a driven wheel; 53. a first drive belt; 54. a second belt; 55. a fastener; 60. a tensioner; 61. a screw; 70. a film coating mechanism.

Detailed Description

Exemplary embodiments that embody features and advantages of the utility model are described in detail below. It is to be understood that the utility model is capable of other and different embodiments and its several details are capable of modification without departing from the scope of the utility model, and that the description and drawings are accordingly to be regarded as illustrative in nature and not as restrictive.

In the following description of various exemplary embodiments of the disclosure, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration various exemplary structures, systems, and steps in which aspects of the disclosure may be practiced. It is to be understood that other specific arrangements of parts, structures, example devices, systems, and steps may be utilized, and structural and functional modifications may be made without departing from the scope of the present disclosure. Moreover, although the terms "over," "between," "within," and the like may be used in this specification to describe various example features and elements of the disclosure, these terms are used herein for convenience only, e.g., in accordance with the orientation of the examples in the figures. Nothing in this specification should be construed as requiring a specific three dimensional orientation of structures in order to fall within the scope of this disclosure.

Referring to fig. 1 to 4, a wafer carrier according to an embodiment of the present invention includes: a body 10, the body 10 having an accommodation space 11; the turntable platform 20 is positioned in the accommodating space 11, and a plurality of through holes 21 are formed in the turntable platform 20; the wafer bearing disks 30 are arranged on the turntable platform 20, at least part of the wafer bearing disks 30 are positioned in the through holes 21, and the wafer bearing disks 30 are rotatably arranged relative to the through holes 21; the driving mechanism 40 is in driving connection with both the turntable platform 20 and the wafer carrying disks 30 through the transmission mechanism 50, so as to drive the turntable platform 20 to rotate around a first axis, and each wafer carrying disk 30 rotates around a corresponding second axis while rotating around the first axis.

The wafer bracket of one embodiment of the utility model comprises a main body 10, a turntable platform 20, a plurality of wafer bearing disks 30, a driving mechanism 40 and a transmission mechanism 50, wherein the plurality of wafer bearing disks 30 are respectively arranged in the plurality of through holes 21, and the driving mechanism 40 is in driving connection with the turntable platform 20 and the wafer bearing disks 30 through the transmission mechanism 50, so that the turntable platform 20 can drive the wafer bearing disks 30 to revolve around a first axis and rotate around a second axis simultaneously, the coating layers of the wafers 1 on the wafer bearing disks 30 are ensured to be more uniform, and the coating yield is improved.

In some embodiments, the transmission mechanism 50 may be a gear assembly, and the driving mechanism 40 drives the turntable platform 20 to rotate through the gear assembly, so that the turntable platform 20 drives each wafer carrier 30 to revolve around the first axis, and the gear assembly simultaneously drives each wafer carrier 30 to rotate around the second axis. The structure of the gear assembly is not limited, and the gear assembly can rotate according to actual requirements. Alternatively, the drive mechanism 50 may be a pulley assembly, a sprocket assembly, or the like.

In one embodiment, as shown in fig. 1-3, the transmission mechanism 50 includes: the driving wheel 51, the driving wheel 51 is connected with the turntable platform 20 and is connected with the driving mechanism 40; a plurality of driven wheels 52, wherein the driven wheels 52 are respectively connected with the wafer bearing disks 30; a first transmission belt 53, wherein the first transmission belt 53 is sleeved on the driving wheel 51 and one driven wheel 52; and the second transmission belt 54 is sleeved on the driven wheels 52, so that the driven wheels 52 rotate synchronously when the driving mechanism 40 drives the driving wheel 51 to rotate.

Specifically, referring to fig. 2 and 4, the driving mechanism 40 includes a servo motor 43 and a motor reducer 44, the servo motor 43 is connected to the motor reducer 44, and a motor shaft 41 of the motor reducer 44 is drivingly connected to a driving wheel 51, so that when the motor shaft 41 rotates, the motor shaft 41 drives the turntable platform 20 to rotate through the driving wheel 51, the driving wheel 51 drives one driven wheel 52 to rotate through a first transmission belt 53, and the rotating driven wheel 52 drives the other driven wheels 52 to rotate through a second transmission belt 54, so as to rotate each wafer carrier tray 30 connected to the driven wheel 52.

In one embodiment, the first belt 53 is a first flat belt, the second belt 54 is a second flat belt, and the flat belts have high transmission power, high tensile strength, and low price, thereby reducing the cost.

In one embodiment, as shown in fig. 3, the driven wheel 52 is disposed through the inner side of the wafer carrier 30 and connected to the wafer carrier 30 by a fastener 55, so as to ensure a reliable connection between the driven wheel 52 and the wafer carrier 30.

Alternatively, there may be a plurality of fasteners 55, and a plurality of fasteners 55 connect the driven pulley 52 and the wafer carrier plate 30 to ensure the stability of the connection.

In one embodiment, as shown in FIG. 3, the drive pulley 51 is welded to the turntable platform 20 and is connected to the motor shaft 41 of the drive mechanism 40 via the key 42 to ensure a secure connection.

In one embodiment, a vacuum flange 46 is connected to the motor reducer 44 of the driving mechanism 40, the vacuum flange 46 is connected to the housing 12 of the main body 10 through a fixing member 45, the fixing member 45 may be multiple, a second sealing ring 47 is disposed between the vacuum flange 46 and the housing 12, and a third sealing ring 48 is disposed inside the vacuum flange 46. The fixing piece 45 is a socket head cap screw, the second sealing ring 47 is an O-shaped rubber sealing ring, and the third sealing ring 48 is an O-shaped sealing ring.

In one embodiment, as shown in fig. 1 and 5, the wafer carrier further includes: and a tensioner 60, the tensioner 60 being provided on the body 10 to press the second belt 54, thereby securing the tightness of the second belt 54. The tensioner 60 may be a spring tensioner, and further, the tensioner 60 may be plural.

Note that the tensioner 60 is attached to the body 10 by a screw 61. The specific structure of the tensioner 60 is not limited and may be a structure in the related art, for example, the tensioner 60 may include a pressing roller that presses the second belt 54.

In one embodiment, as shown in fig. 2, the body 10 includes: a housing 12, the housing 12 having an accommodating space 11; a cover 13, the cover 13 being detachably provided on the housing 12 to close or release the accommodating space 11; the pressing block 14, the pressing block 14 is disposed on a side of the cover 13 facing the accommodating space 11, and the pressing block 14 contacts the wafer tray 30 to prevent the wafer 1 on the wafer tray 30 from separating from the wafer tray 30. The housing 12 and the cover 13 form a sealed space to ensure that the wafer 1 is coated in the accommodating space 11, and the pressing block 14 disposed on the cover 13 can ensure that the wafer 1 is reliably disposed on the wafer tray 30, so as to prevent the wafer 1 from separating from the wafer tray 30 when the wafer tray 30 drives the wafer 1 to rotate.

Optionally, a first sealing ring 15 is disposed between the housing 12 and the cover 13, so as to ensure reliable sealing between the housing 12 and the cover 13. The first seal ring 15 may be an O-ring rubber seal ring.

In some embodiments, the pressing block 14 may be a rubber pressing block, and one pressing block 14 may be simultaneously in contact with a plurality of wafer carrier plates 30, thereby preventing the wafer from being separated due to centrifugation and vibration. Wafer carrier 30 may rotate relative to press block 14.

Optionally, the pressing block 14 is a rubber pressing block, the number of pressing blocks 14 is multiple, and the plurality of pressing blocks 14 and the plurality of wafer bearing disks 30 are arranged in a one-to-one correspondence manner. Further, the compact 14 is a soft rubber compact.

In one embodiment, as shown in fig. 3, the wafer carrier 30 includes a first section 31 and a second section 32 connected to each other, the first section 31 is located in the through hole 21, the second section 32 is supported on the opening of the through hole 21, and a groove 321 for receiving the wafer 1 is formed on the second section 32, so that the wafer 1 can be securely placed in the groove 321.

The wafer bracket of the utility model ensures that the film coating layer of the wafer is more uniform through the revolution and the rotation of the wafer bracket, thereby improving the film coating yield. The wafer bracket has a compact structure, can realize long-distance transmission by adopting belt transmission, and is more economical and simpler than gear transmission. The flat belt has high transmission power, high tensile strength, low price and low cost. The soft rubber pressing block can limit the jumping and dropping of the wafer, so that the wafer is kept fixed, and the rejection rate can be greatly reduced.

The embodiment of the utility model also provides a wafer coating machine which comprises the wafer bracket.

The wafer coater may further include a coating mechanism 70, and the coating mechanism 70 may include a sputtering source or an ion source, as shown in fig. 2, the coating mechanism 70 may be plural, and a plurality of coating mechanisms 70 may be disposed corresponding to the plurality of wafer carrying trays 30.

Other embodiments of the utility model will be apparent to those skilled in the art from consideration of the specification and practice of the utility model disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the utility model following, in general, the principles of the utility model and including such departures from the present disclosure as come within known or customary practice within the art to which the utility model pertains. It is intended that the specification and exemplary embodiments be considered as exemplary only, with a true scope and spirit of the utility model being indicated by the following claims.

It will be understood that the utility model is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the utility model is limited only by the appended claims.

Claims

1. A wafer carrier, comprising:

a main body (10), the main body (10) having an accommodation space (11);

the turntable platform (20), the turntable platform (20) is positioned in the accommodating space (11), and a plurality of through holes (21) are formed in the turntable platform (20);

a plurality of wafer bearing disks (30), wherein the wafer bearing disks (30) are arranged on the turntable platform (20), at least part of the wafer bearing disks (30) are positioned in the through holes (21), and the wafer bearing disks (30) are rotatably arranged relative to the through holes (21);

the wafer bearing device comprises a driving mechanism (40) and a transmission mechanism (50), wherein the driving mechanism (40) is connected with the turntable platform (20) and the wafer bearing disks (30) in a driving mode through the transmission mechanism (50) to drive the turntable platform (20) to rotate around a first axis, and each wafer bearing disk (30) rotates around a corresponding second axis while rotating around the first axis.

2. The wafer carrier as recited in claim 1, wherein the transmission mechanism (50) comprises:

the driving wheel (51), the driving wheel (51) is connected with the turntable platform (20) and is connected with the driving mechanism (40);

the driven wheels (52), the driven wheels (52) are respectively connected with the wafer bearing disks (30);

a first transmission belt (53), wherein the first transmission belt (53) is sleeved on the driving wheel (51) and one driven wheel (52);

and the second transmission belt (54) is sleeved on the driven wheels (52), so that when the driving mechanism (40) drives the driving wheel (51) to rotate, the driven wheels (52) synchronously rotate.

3. The wafer carrier according to claim 2, characterized in that the first belt (53) is a first flat belt and the second belt (54) is a second flat belt.

4. The wafer carrier as claimed in claim 2, wherein the driven wheel (52) is disposed through the inner side of the wafer carrier plate (30) and is connected to the wafer carrier plate (30) by a fastener (55).

5. The wafer carrier as recited in claim 2, characterized in that the drive wheel (51) is welded to the turntable platform (20) and connected to a motor shaft (41) of the drive mechanism (40) by a key (42).

6. The wafer carrier as claimed in claim 2, further comprising:

a tensioner (60), said tensioner (60) being disposed on said body (10) to press on said second drive belt (54).

7. The wafer carrier according to any of claims 1 to 6, characterized in that the body (10) comprises:

a housing (12), the housing (12) having the accommodating space (11);

a cover (13), wherein the cover (13) is detachably arranged on the shell (12) to close or release the accommodating space (11);

the pressing block (14), the pressing block (14) is arranged on one side, facing the accommodating space (11), of the cover body (13), and the pressing block (14) is in contact with the wafer bearing plate (30) so as to prevent the wafer (1) on the wafer bearing plate (30) from being separated from the wafer bearing plate (30).

8. The wafer carrier as claimed in claim 7, wherein the pressing block (14) is a rubber pressing block, the pressing block (14) is plural, and the plural pressing blocks (14) and the plural wafer carrying trays (30) are arranged in one-to-one correspondence.

9. A wafer carrier as claimed in any one of claims 1 to 6, characterized in that the wafer carrier plate (30) comprises a first section (31) and a second section (32) connected, the first section (31) being located in the through hole (21), the second section (32) being supported on an aperture of the through hole (21), the second section (32) being provided with a recess (321) for receiving a wafer (1).

10. A wafer coater comprising the wafer carrier of any one of claims 1 to 9.