CN215698644U

CN215698644U - Reflow soldering equipment of PCB board

Info

Publication number: CN215698644U
Application number: CN202121215194.9U
Authority: CN
Inventors: 吴辉
Original assignee: Anhui Hongfa Intelligent Technology Co ltd
Current assignee: Anhui Hongfa Intelligent Technology Co ltd
Priority date: 2021-06-01
Filing date: 2021-06-01
Publication date: 2022-02-01
Anticipated expiration: 2031-06-01

Abstract

The utility model discloses a reflow soldering device of a PCB (printed circuit board), which comprises a case, wherein both sides of the case are provided with board inlet openings, the middle part of the inner side of the case is provided with a transmission gear belt, both sides of the transmission gear belt respectively penetrate through the board inlet openings on both sides of the case and extend outwards, the inside of the case is sequentially divided into a preheating zone, a heating zone and a cooling zone, one side of the preheating zone is provided with a first heat insulation assembly, a second heat insulation assembly is arranged between the preheating zone and the heating zone, a third heat insulation assembly is arranged between the heating zone and the cooling zone, both sides of the preheating zone are respectively provided with a first drainage fan and a second drainage fan, both sides of the heating zone are respectively provided with a first circulation fan and a second circulation fan, the upper side of the heating zone is provided with an infrared heater, both sides of the cooling zone are respectively provided with a refrigeration fan, and the temperatures of all the positions in the heating zone are in a balanced mode of double heating by hot air and infrared, the heat utilization efficiency is improved, the heat loss is reduced, and the energy-saving efficiency is improved.

Description

Reflow soldering equipment of PCB board

Technical Field

The utility model belongs to the technical field of electronic part welding, and particularly relates to reflow soldering equipment for a PCB (printed circuit board).

Background

The PCB board, also called as the printed circuit board, is the provider of electrical connection of electronic components, its development has been in history for more than 100 years, its design is mainly the territory design, the main advantage of adopting the circuit board is to greatly reduce the mistake of routing and assembly, has improved automation level and production labor rate, can be divided into single-sided board, double-sided board, four-layer board, six-layer board and other multilayer circuit boards according to the number of layers of circuit board, the printed circuit board develops from single-layer to double-sided board, multilayer board and flexbile board, and constantly develop to the direction of high precision, high density and high reliability, make the printed circuit board still keep powerful vitality in the development process of the future electronic product.

The current PCB has been developed to double-sided boards and multilayer boards, and reflow soldering can not be carried out on two sides simultaneously, so that the working efficiency is reduced, the labor load is increased, meanwhile, the heat loss is very large in the heating process, the energy is wasted, the temperature of the surrounding production environment is very high due to a large amount of lost heat, the influence on production personnel is caused, and the labor efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide reflow soldering equipment for a PCB (printed circuit board), which can solve the problem of large heat loss in the prior art.

The purpose of the utility model can be realized by the following technical scheme:

the utility model provides a reflow soldering equipment of PCB board, which comprises a case, the board inlet has all been seted up to the both sides of quick-witted case, the inboard mid-mounting of quick-witted case has the conveying gear area, the both sides of conveying gear area run through the board inlet of quick-witted case both sides respectively and outwards stretch out, the inside of quick-witted case divide into preheating zone in proper order, the zone of heating and cooling district, first thermal-insulated subassembly is installed to one side of preheating zone, install the second thermal-insulated subassembly between preheating zone and the zone of heating, install the third thermal-insulated subassembly between the zone of heating and the cooling district, first drainage fan and second drainage fan are installed respectively to the both sides of preheating zone, first circulation fan and second circulation fan are installed respectively to the both sides of the zone of heating, infrared heater is installed to the upside of the zone of heating, cooling fan is all installed to the both sides of cooling district.

Preferably, first thermal-insulated subassembly and third thermal-insulated subassembly all are provided with first heat insulating board, square logical groove has been seted up at the middle part of first heat insulating board, the conveying gear area runs through square logical groove, first water conservancy diversion fan is all installed on one side upper portion and the lower part of first heat insulating board, first water conservancy diversion fan is provided with a plurality ofly and is the equidistance and distributes, the first water conservancy diversion fan of upper and lower both sides is the one-to-one and all vertical downwards, first return fan is all installed to the both sides lower part of first heat insulating board, first return fan runs through the opposite side of first heat insulating board, and first return fan is linked together with the first water conservancy diversion fan of downside, the input of the first water conservancy diversion fan that is located the upside runs through the opposite side of first heat insulating board.

Preferably, the second heat insulation assembly comprises a second heat insulation plate, the conveying gear belt runs through the middle part of the second heat insulation plate, second diversion fans are installed on the upper side and the lower side of the second heat insulation plate, the second diversion fans are arranged in a plurality of equal-distance distribution, the second diversion fans on the upper side and the lower side are in one-to-one correspondence and are vertical downwards, temperature control fans are installed at two corners of the upper side of the second heat insulation plate, second backflow fans are installed at two corners of the lower side of the second heat insulation plate, two temperature control fans run through the second heat insulation plate, the preheating area and the heating area are communicated through the temperature control fans, the two second backflow fans are communicated with the second diversion fans located on the lower side respectively, and the two second backflow fans run through one side of the second heat insulation plate respectively.

Preferably, the inner side wall of the preheating zone and the inner side wall of the heating zone are both provided with heat insulation layers, the evaporation end of the refrigeration fan is positioned in the cooling zone, and the condensation heat dissipation end of the refrigeration fan is positioned in the preheating zone.

Preferably, the upper side and the lower side of the two plate inlets are provided with dust shields.

The utility model has the beneficial effects that: in the preheating zone, the wind direction of the first drainage fan is opposite to that of the second drainage fan, so that airflow in the preheating zone is circulated and forms circulation, the temperature of the airflow in the preheating zone is balanced through circulation, the wind direction of the first circulation fan is opposite to that of the second circulation fan in the heating zone, the airflow in the heating zone is circulated and forms circulation, the heating of the PCB by the infrared heater on the top side is kept balanced, the temperatures of all parts in the heating zone are balanced through a hot air and infrared double heating mode, the PCB is heated in a balanced manner, the phenomenon that edge warping is caused by uneven heating is prevented, the upper surface and the lower surface of the PCB are heated uniformly by means of circulation, and double-surface welding is carried out;

the first guide fan on the upper side blows air downwards to form an air wall so as to isolate heat loss, meanwhile, the first guide fan on the lower side guides airflow into the preheating zone and the heating zone through the first return fan, the temperature control fan guides a part of heat flow in the heating zone into the preheating zone so as to control the temperature in the heating zone, and the surplus heat is utilized to preheat a PCB in the preheating zone so as to prolong the temperature change curve of the PCB, so that the PCB is prevented from being damaged due to too fast heating;

the evaporation end of the refrigeration fan takes away the heat of the welded PCB, so that the welded PCB can be taken away by a worker conveniently, the heat is guided into a preheating region through the condensation heat dissipation end of the refrigeration fan, the PCB which is not welded is preheated, the heat using efficiency is improved, the heat loss is reduced, and the energy-saving efficiency is improved.

Drawings

In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.

FIG. 1 is an overall front perspective view of the present invention;

FIG. 2 is a top view of the internal structure of the whole body of the present invention;

FIG. 3 is an elevational view of the interior construction of a first insulation assembly in accordance with the present invention;

FIG. 4 is an elevational view of the interior construction of a second insulation assembly in accordance with the present invention;

fig. 5 is a front cross-sectional view of a heating zone of the present invention.

In the figure: 1. a chassis; 2. a plate inlet; 3. a transfer gear belt; 4. a first insulation assembly; 5. a second insulation assembly; 6. a third insulation assembly; 7. a refrigeration fan; 8. a preheating zone; 9. a heating zone; 10. a cooling zone; 11. a first drainage fan; 12. a second drainage fan; 13. a first circulation fan; 14. a second circulation fan; 15. a first heat insulation plate; 16. a first guide fan; 17. a first return fan; 18. a second heat insulation plate; 19. a second guide fan; 20. a temperature control fan; 21. a second return fan; 22. an infrared heater; 23. a dust shield.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, a reflow soldering apparatus for PCB includes a chassis 1, both sides of the chassis 1 are provided with board inlets 2, a transmission gear belt 3 is installed in the middle of the inner side of the chassis 1, both sides of the transmission gear belt 3 respectively penetrate through the board inlets 2 of both sides of the chassis 1 and extend outward, the interior of the chassis 1 is sequentially divided into a preheating zone 8, a heating zone 9 and a cooling zone 10, a first heat insulation assembly 4 is installed at one side of the preheating zone 8, a second heat insulation assembly 5 is installed between the preheating zone 8 and the heating zone 9, a third heat insulation assembly 6 is installed between the heating zone 9 and the cooling zone 10, a first flow guiding fan 11 and a second flow guiding fan 12 are respectively installed at both sides of the preheating zone 8, the wind direction of the first flow guiding fan 11 is opposite to the wind direction of the second flow guiding fan 12, so as to circulate and form a circular flow in the preheating zone 8, and the temperature of the air flow in the preheating zone 8 is balanced through the circular flow, a first circulation fan 13 and a second circulation fan 14 are respectively arranged at two sides of the heating area 9, the wind direction of the first circulation fan 13 is opposite to that of the second circulation fan 14, so that the airflow of the heating area 9 is circulated to form circulation, the temperature of each part in the heating area 9 is balanced, the PCB is uniformly heated, the edge warping caused by uneven heating is prevented, an infrared heater 22 is arranged at the upper side of the heating area 9, a refrigerating fan 7 is arranged at two sides of the cooling area 10, the heat utilization rate is improved by double heating of hot air and the infrared heater 22, the heat in the preheating area 8 is isolated from the outside through a first heat insulation assembly 4, the heat in the middle of the heating area 9 is isolated from the preheating area 8 through a second heat insulation assembly 5, and the heat in the heating area 9 is isolated from the cooling area 10 through a third heat insulation assembly 6, thereby, each area is subjected to energy conservation and heat preservation, and the heat loss is prevented.

The first heat insulation assembly 4 and the third heat insulation assembly 6 are both provided with a first heat insulation plate 15, a square through groove is formed in the middle of the first heat insulation plate 15, the conveying gear belt 3 penetrates through the square through groove, first guide fans 16 are installed on the upper portion and the lower portion of one side of the first heat insulation plate 15, the first guide fans 16 are arranged in a plurality of equal-distance distribution, the first guide fans 16 on the upper side and the lower side correspond to each other one by one and are vertically downward, first return fans 17 are installed on the lower portions of the two sides of the first heat insulation plate 15, the first return fans 17 penetrate through the other side of the first heat insulation plate 15, the first return fans 17 are communicated with the first guide fans 16 on the lower side, the input end of the first guide fan 16 on the upper side penetrates through the other side of the first heat insulation plate 15, air is blown downwards through the first guide fans 16 on the upper side to form an air wall so as to isolate heat loss, meanwhile, the first guide fans 16 on the lower side guide air flow into the preheating region 8 and the heating region 9 through the first return fans 17, reducing heat loss.

The second heat insulation assembly 5 comprises a second heat insulation plate 18, the conveying gear belt 3 penetrates through the middle of the second heat insulation plate 18, second guide fans 19 are respectively installed on the upper side and the lower side of the second heat insulation plate 18, the second guide fans 19 are arranged in a plurality and are distributed at equal intervals, the second guide fans 19 on the upper side and the lower side are in one-to-one correspondence and are vertically downward, temperature control fans 20 are respectively installed at two corners of the upper side of the second heat insulation plate 18, second return fans 21 are respectively installed at two corners of the lower side of the second heat insulation plate 18, the two temperature control fans 20 penetrate through the second heat insulation plate 18, the preheating region 8 is communicated with the heating region 9 through the temperature control fans 20, the two second return fans 21 are respectively communicated with the second guide fans 19 on the lower side, the two second return fans 21 respectively penetrate through one side of the second heat insulation plate 18, the temperature control fans 20 guide part of heat flow in the heating region 9 into the preheating region 8, therefore, the temperature in the heating area 9 is controlled, the PCB in the preheating area 8 is preheated by the redundant heat, the temperature change curve of the PCB is prolonged, and the PCB is prevented from being damaged due to too fast heating, the second return fan 21 guides the air wall airflow generated by the second guide fan 19 into the lower side of the heating area 9, and the airflow is guided into the circulation flow by the first circulation fan 13, so that the temperature in the heating area 9 is kept balanced, the PCB is heated at constant temperature, the welding agent is uniformly melted, and the yield is improved.

The inner side wall of the preheating zone 8 and the inner side wall of the heating zone 9 are both provided with heat insulation layers, the evaporation end of the refrigeration fan 7 is positioned in the cooling zone 10, and the condensation heat dissipation end of the refrigeration fan 7 is positioned in the preheating zone 8, so that the heat loss is further reduced, and the utilization rate of heat is further improved.

Dust hoods 23 are mounted on the upper side and the lower side of the two board inlets 2, so that dust is prevented from falling on the PCB to affect reflow soldering.

When the PCB reflow soldering machine is used, a plurality of mounted PCBs are placed on the conveying gear belt 3 one by one, the PCBs to be reflow soldered sequentially pass through the preheating zone 8, the heating zone 9 and the cooling zone 10 through the conveying gear belt 3 to be preheated, reflow soldered and cooled for recovery, the wind direction of the first drainage fan 11 and the wind direction of the second drainage fan 12 are opposite in the preheating zone 8, so that the airflow in the preheating zone 8 is circulated and forms circulation, the airflow in the preheating zone 8 passes through the circulation to be balanced in temperature, the wind direction of the first circulation fan 13 and the wind direction of the second circulation fan 14 are opposite in the heating zone 9, so that the airflow in the heating zone 9 is circulated and forms circulation, the heating of the PCBs by the infrared heater 22 on the top side is kept balanced, and the temperatures of all parts in the heating zone 9 are balanced through a hot wind and infrared double heating mode, the PCB is heated in a balanced manner, the edge warping caused by uneven heating is prevented, in the whole process, the first diversion fan 16 on the upper side blows air downwards to form an air wall so as to isolate heat loss, meanwhile, the first diversion fan 16 on the lower side guides air flow into the preheating zone 8 and the heating zone 9 through the first return fan 17, the temperature control fan 20 guides part of heat flow in the heating zone 9 into the preheating zone 8 so as to control the temperature in the heating zone 9, the PCB in the preheating zone 8 is preheated by utilizing the redundant heat, the temperature change curve of the PCB is prolonged, the PCB is prevented from being damaged due to too fast heating, the second return fan 21 guides the air flow generated by the second diversion fan 19 into the lower side of the heating zone 9, and the air flow is guided into the circulation flow through the first circulation fan 13 so as to reduce heat loss, and the evaporation end of the refrigeration fan 7 takes away the heat of the welded PCB, therefore, the PCB which is welded can be taken away by workers conveniently, heat is guided into the preheating zone 8 through the condensation and heat dissipation end of the refrigerating fan 7, and the PCB which is not welded is preheated.

The preferred embodiments of the utility model disclosed above are intended to be illustrative only. The preferred embodiments are not exhaustive and do not limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. The reflow soldering equipment for the PCB is characterized by comprising a case (1), plate inlet openings (2) are formed in two sides of the case (1), a conveying gear belt (3) is installed in the middle of the inner side of the case (1), two sides of the conveying gear belt (3) penetrate through the plate inlet openings (2) in the two sides of the case (1) respectively and extend outwards, the inside of the case (1) is divided into a preheating area (8), a heating area (9) and a cooling area (10) in sequence, a first heat insulation assembly (4) is installed on one side of the preheating area (8), a second heat insulation assembly (5) is installed between the preheating area (8) and the heating area (9), a third heat insulation assembly (6) is installed between the heating area (9) and the cooling area (10), a first drainage fan (11) and a second drainage fan (12) are installed on two sides of the preheating area (8) respectively, the device is characterized in that a first circulation fan (13) and a second circulation fan (14) are respectively installed on two sides of the heating area (9), an infrared heater (22) is installed on the upper side of the heating area (9), and refrigerating fans (7) are installed on two sides of the cooling area (10).

2. The reflow soldering apparatus of a PCB board according to claim 1, wherein the first heat insulation assembly (4) and the third heat insulation assembly (6) are both provided with a first heat insulation board (15), a square through groove is formed in the middle of the first heat insulation board (15), the conveying gear belt (3) penetrates through the square through groove, first guide fans (16) are installed on the upper portion and the lower portion of one side of the first heat insulation board (15), the first guide fans (16) are arranged in a plurality and are distributed at equal intervals, the first guide fans (16) on the upper side and the lower side correspond to each other and are vertically downward, first reflow fans (17) are installed on the lower portions of the two sides of the first heat insulation board (15), the first reflow fans (17) penetrate through the other side of the first heat insulation board (15), and the first reflow fans (17) are communicated with the first guide fans (16) on the lower side, the input end of the first diversion fan (16) positioned at the upper side penetrates the other side of the first heat insulation plate (15).

3. The reflow soldering apparatus of a PCB board according to claim 1, wherein the second heat insulation assembly (5) comprises a second heat insulation board (18), the conveying gear belt (3) penetrates through the middle of the second heat insulation board (18), second guiding fans (19) are installed on the upper and lower sides of the second heat insulation board (18), the second guiding fans (19) are arranged in a plurality and are distributed at equal intervals, the second guiding fans (19) on the upper and lower sides are in one-to-one correspondence and are vertically downward, temperature control fans (20) are installed at two corners of the upper side of the second heat insulation board (18), second reflow fans (21) are installed at two corners of the lower side of the second heat insulation board (18), the two temperature control fans (20) penetrate through the second heat insulation board (18), the preheating region (8) and the heating region (9) are communicated through the temperature control fans (20), the two second backflow fans (21) are respectively communicated with the second diversion fan (19) positioned on the lower side, and the two second backflow fans (21) respectively penetrate through one side of the second heat insulation plate (18).

4. The reflow soldering apparatus of PCB board according to claim 1, wherein the inner side wall of the preheating zone (8) and the inner side wall of the heating zone (9) are installed with heat insulation layer, the evaporation end of the cooling fan (7) is located in the cooling zone (10), and the condensation heat dissipation end of the cooling fan (7) is located in the preheating zone (8).

5. Reflow soldering apparatus for PCB board according to claim 1, wherein dust-proof covers (23) are installed on both upper and lower sides of the two board inlet openings (2).