CN215698635U

CN215698635U - Soldering machine for electronic components

Info

Publication number: CN215698635U
Application number: CN202121376198.5U
Authority: CN
Inventors: 许平
Original assignee: Guangdong Shunde Jingguang Electromechanical Co ltd
Current assignee: Guangdong Shunde Jingguang Electromechanical Co ltd
Priority date: 2021-06-21
Filing date: 2021-06-21
Publication date: 2022-02-01
Anticipated expiration: 2031-06-21

Abstract

The utility model discloses an electronic component soldering machine, wherein the electronic component soldering machine comprises: a base; the positioning seat is movably arranged on the base; the positioning seat is provided with a positioning groove which is used for positioning the electronic element; a solder assembly mounted to the base; the soldering tin assembly comprises a first movable module, a support arm, a mounting base and a plurality of soldering tin heads; the supporting arm is arranged on the first moving module and is driven by the first moving module to move relative to the positioning seat; the mounting seat is fixed on the support arm; the plurality of soldering tin heads are arranged at intervals and are oppositely arranged; the plurality of solder heads are respectively movably mounted on the mounting seats and can relatively move so as to simultaneously act on the electronic components.

Description

Soldering machine for electronic components

Technical Field

The utility model relates to the field of soldering machines, in particular to an electronic component soldering machine.

Background

Electronic component need carry out soldering tin before leaving the factory and handle to guarantee electronic component's stability, in prior art, the last soldering tin department that is equipped with of electronic component, operating personnel adopts the solder head to carry out soldering tin for a plurality of soldering tin departments of electronic component, makes a plurality of soldering tin departments of electronic component need soldering tin one by one, and the soldering tin efficiency of this artificial soldering tin's working method is lower.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problems, the utility model adopts the following technical scheme:

according to one aspect of the present invention, there is provided an electronic component soldering machine comprising: a base; the positioning seat is movably arranged on the base; the positioning seat is provided with a positioning groove which is used for positioning the electronic element; a solder assembly mounted to the base; the soldering tin assembly comprises a first movable module, a support arm, a mounting base and a plurality of soldering tin heads; the supporting arm is arranged on the first moving module and is driven by the first moving module to move relative to the positioning seat; the mounting seat is fixed on the support arm; the plurality of soldering tin heads are arranged at intervals and are oppositely arranged; the plurality of solder heads are respectively movably mounted on the mounting seats and can relatively move so as to simultaneously act on the electronic components.

Optionally, the positioning seat is connected with a second moving module, and the second moving module is perpendicular to the first moving module; the second movable module is provided with a second movable seat, and the second movable seat bears the positioning seat.

Optionally, the positioning seat is further provided with a clamping groove, and the clamping groove extends towards the positioning groove and is communicated with the positioning groove; the clamping groove is used for clamping the main body part of the electronic element; the positioning groove is used for positioning a soldering tin part of the electronic element; the soldering tin part of the electronic element is positioned on one side of the positioning groove, which is back to the clamping groove, and is exposed to the positioning groove.

Optionally, the soldering tin assembly is located above the positioning seat; the first moving module is provided with a first moving seat, and the first moving seat bears the support arm and drives the support arm to move along the width direction of the positioning seat; the plurality of solder heads are arranged with respect to a solder portion of the electronic component.

Optionally, a lifting module is installed on the support arm, and the lifting module is provided with a lifting seat, wherein the lifting seat is lifted relative to the support arm and bears the mounting seat to drive the plurality of soldering tin heads to lift simultaneously.

Optionally, an adjusting module is arranged between the plurality of solder heads and the mounting base, and the adjusting module is provided with a plurality of sliding blocks capable of sliding; each slider is arranged relative to the corresponding soldering tin head; and the soldering tin head moves under the action of the corresponding sliding block.

Optionally, the mounting base is provided with a slide rail and a guide shaft, and the slide rail is movably connected with the slide block; the sliding block is sleeved with the guide shaft and slides under the guide effect of the guide shaft.

Optionally, the solder head is swingably connected to the slider; the soldering tin head is connected with an air pipe clamping seat which is rotatably arranged on the peripheral surface of the sliding block; the air pipe clamping seat is used for clamping an air pipe.

Optionally, a locking block is connected to the slider, and the locking block engages with the slider and can abut against the slide rail to achieve relative fixation of the slider and the slide rail.

According to the technical scheme, the embodiment of the utility model at least has the following advantages and positive effects:

in the electronic component soldering machine of the embodiment of the utility model, the positioning seat is movably arranged on the base; the positioning seat is provided with a positioning groove which is used for positioning the electronic element; the soldering tin component is arranged on the base; the soldering tin assembly comprises a first movable module, a support arm, a mounting base and a plurality of soldering tin heads; the supporting arm is arranged on the first moving module and is driven by the first moving module to move relative to the positioning seat; the mounting seat is fixed on the support arm; the plurality of soldering tin heads are arranged at intervals and are oppositely arranged; the plurality of soldering tin heads are respectively movably arranged on the mounting base and can move relatively to act on the electronic component simultaneously, so that the electronic component can be soldered at a plurality of positions, the soldering tin efficiency of the electronic component soldering tin machine relative to the electronic component is improved, in addition, the positioning base is movably arranged on the base, the supporting arm moves relative to the positioning base, the position of the plurality of soldering tin heads relative to the electronic component is convenient to adjust, the soldering tin of the electronic component is convenient, and the universality of the electronic component soldering tin machine is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a front view of an electronic component soldering machine according to the present invention;

FIG. 2 is a perspective view of an electronic component soldering machine according to the present invention;

the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1 and 2, the utility model provides an electronic component soldering machine, which includes a base 1, a positioning seat 2, and a soldering component 3, wherein the soldering component 3 and the positioning seat 2 are both mounted on the base 1, and the soldering component 3 is located above the positioning seat 2.

The base 1 is provided with a bottom plate 11 and a vertical plate 12, and the vertical plate 12 is connected to the bottom plate 11 and is perpendicular to the bottom plate 11.

The positioning seat 2 is movably arranged on a bottom plate 11 of the base 1; the positioning seat 2 is provided with a positioning groove 21, and the positioning groove 21 is used for positioning the electronic component, so that the electronic component is positioned, and the electronic component is conveniently soldered.

The positioning seat 2 is connected to a second movable module 4, the second movable module 4 is provided with a second movable seat 41, and the second movable seat 41 is movably installed on the bottom plate 11 of the base 1 and bears the positioning seat 2, so as to drive the positioning seat 2 to move relative to the base 1. Optionally, the second moving module 4 is a linear module and extends along the length direction of the base 1.

The positioning seat 2 is further provided with a clamping groove 22, and the clamping groove 22 extends towards the positioning groove 21 and is communicated with the positioning groove 21; the card slot 22 is used for clamping the main body part of the electronic element; the positioning groove 21 is used for positioning a soldering tin part of the electronic element; the soldering portion of the electronic component is located on a side of the positioning groove 21 opposite to the card slot 22 and is exposed to the positioning groove 21, so that the soldering portion of the electronic component is soldered by the soldering component 3. The stability of the electronic component relative to the positioning seat 2 is improved by the clamping groove 22 and the positioning groove 21 together positioning the electronic component.

A solder assembly 3 mounted on the base 1; the soldering tin component 3 comprises a first moving module 31, a support arm 32, a mounting base 33 and a plurality of soldering tin heads 34; the supporting arm 32 is mounted on the first moving module 31 and is driven by the first moving module 31 to move relative to the positioning seat 2; the mounting seat 33 is fixed on the support arm 32; the solder heads 34 are arranged at intervals and oppositely; the plurality of solder heads 34 are movably mounted on the mounting base 33, and can move relatively to act on the electronic component simultaneously, so as to solder the electronic component at a plurality of positions, thereby improving the soldering efficiency of the electronic component soldering machine relative to the electronic component, in addition, the positioning base 2 is movably mounted on the base 1, the support arm 32 moves relative to the positioning base 2, so as to adjust the position of the plurality of solder heads 34 relative to the electronic component, thereby facilitating the soldering of the electronic component, and improving the versatility of the electronic component soldering machine.

The first moving module 31 is provided with a first moving base 311, and the first moving base 311 bears the support arm 32 and drives the support arm 32 to move along the width direction of the positioning base 2; the plurality of solder heads 34 are arranged relative to the solder portion of the electronic component, so that the plurality of solder heads 34 move along the width direction of the positioning seat 2, so that the plurality of solder heads 34 solder the plurality of electronic components, wherein the second moving module 4 is perpendicular to the first moving module 31. Alternatively, the first moving module 31 is a linear module and extends along the width direction of the base 1.

The supporting arm 32 is provided with a lifting module 321, the lifting module 321 is provided with a lifting seat 3211, the lifting seat 3211 is lifted relative to the supporting arm 32 and bears the mounting seat 33, so as to drive the plurality of solder heads 34 to be lifted simultaneously, so that the solder heads 34 can be soldered and separated from the electronic component. Alternatively, the lifting module 321 may be a linear module or an air cylinder.

An adjusting module 35 is arranged between the plurality of soldering tin heads 34 and the mounting seat 33, the adjusting module 35 is provided with a sliding block 351 which can slide, and the sliding block 351 is provided with a plurality of blocks; each slider 351 is arranged relative to the corresponding solder head 34; the solder heads 34 move under the action of the corresponding sliders 351, so that the solder heads 34 move relatively and are respectively arranged on two sides of the electronic component, and a plurality of solder parts of the electronic component are soldered simultaneously.

The mounting seat 33 is provided with a slide rail 331 and a guide shaft 332, and the slide rail 331 and the slider 351 are movably connected; the slider 351 is sleeved with the guide shaft 332 and slides under the guide action of the guide shaft 332, so that the sliding stability of the slider 351 is improved, and the soldering accuracy of the soldering tin head 34 is improved.

In addition, the solder head 34 is swingably connected to the slider 351 so as to adjust a solder direction of the solder head 34 with respect to the electronic component to solder the electronic component in a plurality of orientations, and specifically, the solder head 34 is provided with an arc groove, and the slider 351 is provided with a screw hole with respect to the arc groove. The fixed connection between the solder head 34 and the slider 351 is realized by screws. The soldering tin head 34 is connected with an air pipe clamping seat which is rotatably arranged on the peripheral surface of the sliding block 351; the air pipe clamping seat is used for clamping an air pipe.

Further, a locking block is connected to the slider 351, and the locking block engages with the slider 351 and can abut against the slide rail 331 to fix the slider 351 and the slide rail 331 relative to each other.

in the electronic component soldering machine of the embodiment of the utility model, the positioning seat 2 is movably arranged on the base 1; a positioning groove 21 is arranged on the positioning seat 2, and the positioning groove 21 is used for positioning the electronic element; a solder assembly 3 mounted on the base 1; the soldering tin component 3 comprises a first moving module 31, a support arm 32, a mounting base 33 and a plurality of soldering tin heads 34; the supporting arm 32 is mounted on the first moving module 31 and is driven by the first moving module 31 to move relative to the positioning seat 2; the mounting seat 33 is fixed on the support arm 32; the solder heads 34 are arranged at intervals and oppositely; the plurality of solder heads 34 are movably mounted on the mounting base 33, and can move relatively to act on the electronic component simultaneously, so as to solder the electronic component at a plurality of positions, thereby improving the soldering efficiency of the electronic component soldering machine relative to the electronic component, in addition, the positioning base 2 is movably mounted on the base 1, the support arm 32 moves relative to the positioning base 2, so as to adjust the position of the plurality of solder heads 34 relative to the electronic component, thereby facilitating the soldering of the electronic component, and improving the versatility of the electronic component soldering machine.

The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. An electronic component soldering machine, comprising:

a base;

the positioning seat is movably arranged on the base; the positioning seat is provided with a positioning groove which is used for positioning the electronic element;

a solder assembly mounted to the base; the soldering tin assembly comprises a first movable module, a support arm, a mounting base and a plurality of soldering tin heads; the supporting arm is arranged on the first moving module and is driven by the first moving module to move relative to the positioning seat; the mounting seat is fixed on the support arm; the plurality of soldering tin heads are arranged at intervals and are oppositely arranged; the plurality of solder heads are respectively movably mounted on the mounting seats and can relatively move so as to simultaneously act on the electronic components.

2. A soldering machine for electronic components according to claim 1, wherein a second moving module is connected to the positioning base, the second moving module being perpendicular to the first moving module; the second movable module is provided with a second movable seat, and the second movable seat bears the positioning seat.

3. A soldering machine for electronic components according to claim 2, wherein the positioning base is further provided with a notch extending toward and communicating with the positioning groove; the clamping groove is used for clamping the main body part of the electronic element; the positioning groove is used for positioning a soldering tin part of the electronic element; the soldering tin part of the electronic element is positioned on one side of the positioning groove, which is back to the clamping groove, and is exposed to the positioning groove.

4. The electronic component soldering machine according to claim 1, wherein the solder assembly is located above the positioning seat; the first moving module is provided with a first moving seat, and the first moving seat bears the support arm and drives the support arm to move along the width direction of the positioning seat; the plurality of solder heads are arranged with respect to a solder portion of the electronic component.

5. An electronic component soldering machine as claimed in claim 4, wherein the arm is provided with a lifting module having a lifting base which is lifted relative to the arm and carries the mounting base to move the plurality of solder heads up and down simultaneously.

6. An electronic component soldering machine according to claim 5, wherein an adjustment module is provided between a plurality of the solder heads and the mount base, the adjustment module being provided with a slidable slider having a plurality of sliders; each slider is arranged relative to the corresponding soldering tin head; and the soldering tin head moves under the action of the corresponding sliding block.

7. An electronic component soldering machine according to claim 6, wherein the mount base is provided with a slide rail and a guide shaft, the slide rail and the slider being movably connected; the sliding block is sleeved with the guide shaft and slides under the guide effect of the guide shaft.

8. An electronic component soldering machine according to claim 7, wherein the solder head is swingably connected to the slider; the soldering tin head is connected with an air pipe clamping seat which is rotatably arranged on the peripheral surface of the sliding block; the air pipe clamping seat is used for clamping an air pipe.

9. An electronic component soldering machine according to claim 8, wherein a locking piece is attached to the slider, the locking piece engaging the slider and being capable of abutting against the rail to effect relative fixing of the slider and the rail.