CN215682782U - Combined ball-planting clamp - Google Patents
Combined ball-planting clamp Download PDFInfo
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- CN215682782U CN215682782U CN202122308106.6U CN202122308106U CN215682782U CN 215682782 U CN215682782 U CN 215682782U CN 202122308106 U CN202122308106 U CN 202122308106U CN 215682782 U CN215682782 U CN 215682782U
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Abstract
The utility model discloses a combined ball planting fixture which comprises a bottom die and a ball planting die, wherein a workpiece groove for placing a workpiece is formed in the bottom die, and the ball planting die is arranged above the bottom die and can move close to or far away from the bottom die; the bottom end of the ball planting die is provided with a plurality of ball planting holes, and the ball planting holes penetrate through to the top end surface of the ball planting die; and the ball planting holes are used for corresponding to the workpiece grooves after the ball planting mold moves close to the bottom mold. The combined ball-planting fixture can accurately plant a plurality of solder balls on the circuit board through a plurality of ball-planting holes on the ball-planting die, thereby improving the ball-planting efficiency and quality.
Description
Technical Field
The utility model relates to the technical field of circuit board production, in particular to a combined ball mounting fixture.
Background
At present, during production of a circuit board, tin-free balls are processed on the surface of the circuit board (the surface of a bonding pad is a gold-plating treatment process), and SMT (surface mount technology) patch welding can be performed after the ball planting is generally processed, however, the existing ball planting process mainly depends on manual work, firstly, tin paste is coated on the circuit board in a scraping mode, then, solder balls are planted, the efficiency is low, and deviation is easily generated in positions of the solder balls.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a combined ball-planting fixture, which can accurately plant a plurality of solder balls on a circuit board through a plurality of ball-planting holes on a ball-planting die, thereby improving the ball-planting efficiency and quality.
The purpose of the utility model is realized by adopting the following technical scheme:
a combined ball planting fixture comprises a bottom die and a ball planting die, wherein a workpiece groove for placing a workpiece is formed in the bottom die, and the ball planting die is arranged above the bottom die and can move close to or far away from the bottom die; the bottom end of the ball planting die is provided with a plurality of ball planting holes, and the ball planting holes penetrate through to the top end surface of the ball planting die; and the ball planting holes are used for corresponding to the workpiece grooves after the ball planting mold moves close to the bottom mold.
Furthermore, a plurality of positioning grooves are formed in two sides of the workpiece groove, the positioning grooves are distributed in the length direction of the workpiece groove at intervals, and the positioning grooves penetrate through the workpiece groove.
Furthermore, a boss is arranged on the top end face of the bottom die, and the workpiece groove is formed in the boss; the bottom end of the ball planting mold is provided with a first groove, and the first groove is matched with the boss structure; the ball planting holes are formed in the bottom wall of the first groove.
Furthermore, a second groove is formed in the top end of the ball planting die, and the plurality of ball planting holes penetrate into the second groove.
Furthermore, a notch is formed in the side edge of the second groove.
Furthermore, a plurality of positioning holes are formed in the bottom die; the positioning holes are arranged around the periphery of the boss; the ball planting die is provided with a plurality of positioning columns, and the positioning columns are used for being inserted into the positioning holes in a one-to-one correspondence mode.
Compared with the prior art, the utility model has the beneficial effects that: it is when planting the ball, can place the circuit board at the work piece inslot, then make the ball planting mould be close to the die block motion, will help the just piece of soldering paste to place the top at the ball planting mould afterwards, apply paint at the just piece of soldering paste of helping through instruments such as knife, the tin cream on the tin cream steel sheet of helping can correspond a plurality of ball planting holes and shift to the ball planting face of circuit board, afterwards, will help the tin cream steel sheet to take off, then will inlay the ball steel sheet of planting and place on the ball planting mould, the rolling tin ball makes the tin ball should plant the position that the correspondence coating has the tin cream on the circuit board through a plurality of ball planting holes, improve ball planting efficiency and ball planting quality.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of a bottom mold of the present invention;
FIG. 3 is a schematic structural diagram of a ball-planting mold according to the present invention;
fig. 4 is another perspective structural diagram of the ball planting mold of the present invention.
In the figure: 10. planting a ball mould; 11. planting ball holes; 12. a second groove; 13. positioning holes; 14. a first groove; 20. bottom die; 21. a workpiece groove; 22. a boss; 23. positioning a groove; 24. and a positioning column.
Detailed Description
The utility model will be further described with reference to the accompanying drawings and the detailed description below:
a combined ball-planting jig as shown in fig. 1-4 comprises a bottom mold 20 and a ball-planting mold 10, wherein a workpiece slot 21 is formed in the bottom mold 20, and the workpiece slot 21 can be used for placing a workpiece. The ball-planting mold 10 is disposed above the bottom mold 20, and the ball-planting mold 10 can move closer to or away from the bottom mold 20.
Specifically, a plurality of ball mounting holes 11 are formed in the bottom end of the ball mounting die 10, the ball mounting holes 11 are communicated with the top end face of the ball mounting die 10, and the plurality of ball mounting holes 11 can correspond to the workpiece groove 21 after the ball mounting die 10 moves close to the bottom die 20.
On the basis of the structure, when the combined ball-planting fixture is used, a workpiece is taken as an example for explanation, when the ball is planted, the circuit board can be placed in the workpiece groove 21, then the ball-planting mold 10 is moved close to the bottom mold 20, then the soldering paste assistant rigid sheet is placed at the top end of the ball-planting mold 10, the soldering paste assistant rigid sheet is coated with paint through tools such as a knife, the tin paste on the soldering paste assistant steel sheet can be transferred to the ball-planting surface of the circuit board corresponding to the plurality of ball-planting holes 11, then the soldering paste steel sheet is taken down, then the ball-embedding steel sheet is placed on the ball-planting mold 10, and the solder balls are rolled to be planted on the positions, coated with the tin paste, of the circuit board through the plurality of ball-planting holes 11, so that the ball-planting efficiency and the ball-planting quality are improved.
After the ball attachment is completed, the ball attachment mold 10 may be moved away from the bottom mold 20, and the ball-attached circuit board in the workpiece groove 21 may be taken out.
Of course, in this embodiment, the up-and-down movement of the ball planting mold 10 relative to the bottom mold 20 can be achieved manually, or can be achieved by an external driving structure (such as an air cylinder, a screw rod transmission mechanism, etc.).
Further, can also be that both sides at work piece groove 21 are equipped with a plurality of constant head tanks 23, with a plurality of constant head tanks 23 at the length direction interval distribution of work piece groove 21, and constant head tank 23 link up to the work piece groove 21 in, that is to say, place back in work piece groove 21 on the circuit board, can be in constant head tank 23 place the location that the setting element (such as positioning screw or positioning pin or locating piece isotructure) goes on the side of circuit board, can the circuit board take place to shift at the ball planting in-process, ball planting process circuit board stable in structure, the circuit board is planted the ball and is stabilized.
Furthermore, a boss 22 may be provided on the top end surface of the bottom die 20, and the workpiece groove 21 may be provided on the boss 22; correspondingly, a first groove 14 may be provided at the bottom end of the ball-planting mold 10, the first groove 14 is structurally matched with the boss 22, and the plurality of ball-planting holes 11 are provided at the bottom wall of the first groove 14. That is to say, plant ball mould 10 and be close to the back of the motion of die block 20, boss 22 can stretch into first recess 14 in, prevent that die block 20 from planting ball mould 10 motion mutually, and boss 22 stretches into in first recess 14, can be that the work piece groove 21 on boss 22 top corresponds with the better laminating in a plurality of ball planting holes 11 in the first recess 14, and the ball planting effect is better.
More specifically, a second groove 12 may be further disposed at the top end of the ball-planting mold 10, and the plurality of ball-planting holes 11 are communicated into the second groove 12, so that when placing the soldering paste steel sheet and the ball-embedding steel sheet, the soldering paste steel sheet or the second groove 12 may be placed, and the assembly structure of the corresponding steel sheet is stable.
At this time, due to the limitation of the second groove 12, the excessive solder balls can be prevented from rolling out of the ball implanting die 10 during the ball implanting process, which is convenient for the next use.
Furthermore, a notch can be formed in the side edge of the second groove 12, and the notch can be used for being embedded by a hand, so that the soldering paste steel sheet and the ball embedding steel sheet can be conveniently taken out or put in, and the operation is more convenient.
Further, in this embodiment, a plurality of positioning holes 13 may be further disposed on the bottom die 20, the plurality of positioning holes 13 are surrounded on the periphery of the boss 22, a plurality of positioning pillars 24 are correspondingly disposed on the ball-planting die 10, the plurality of positioning pillars 24 may be inserted into the plurality of positioning holes 13 in a one-to-one manner, so when the ball-planting die 10 moves downward relative to the bottom die 20, each positioning pillar 24 may be inserted into each positioning hole 13 in a one-to-one manner, the positioning pillars 24 are gradually inserted into the process, so as to guide the ball-planting die 10 to stably move close to the bottom die 20, after the positioning pillars 24 are inserted in place, the plurality of ball-planting holes 11 on the ball-planting die 10 may be accurately located above the circuit board in the workpiece slot 21, the post ball-planting positioning is more accurate, and the ball-planting effect is better.
Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes should fall within the scope of the claims of the present invention.
Claims (6)
1. The combined ball planting fixture is characterized by comprising a bottom die and a ball planting die, wherein a workpiece groove for placing a workpiece is formed in the bottom die, and the ball planting die is arranged above the bottom die and can move close to or far away from the bottom die; the bottom end of the ball planting die is provided with a plurality of ball planting holes, and the ball planting holes penetrate through to the top end surface of the ball planting die; and the ball planting holes are used for corresponding to the workpiece grooves after the ball planting mold moves close to the bottom mold.
2. The assembled ball-planting jig of claim 1, wherein a plurality of positioning grooves are formed on both sides of the workpiece groove, the plurality of positioning grooves are spaced apart in a longitudinal direction of the workpiece groove, and the positioning grooves penetrate into the workpiece groove.
3. The combined ball-planting jig of claim 1, wherein a boss is provided on a top end surface of the bottom die, and the workpiece groove is provided on the boss; the bottom end of the ball planting mold is provided with a first groove, and the first groove is matched with the boss structure; the ball planting holes are formed in the bottom wall of the first groove.
4. The combined ball-planting jig of claim 3, wherein a second groove is formed at the top end of the ball-planting mold, and the plurality of ball-planting holes penetrate into the second groove.
5. The assembled ball-planting jig of claim 4, wherein the second groove has a notch formed at a side thereof.
6. The assembled ball-planting jig of claim 3, wherein the bottom die is provided with a plurality of positioning holes; the positioning holes are arranged around the periphery of the boss; the ball planting die is provided with a plurality of positioning columns, and the positioning columns are used for being inserted into the positioning holes in a one-to-one correspondence mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122308106.6U CN215682782U (en) | 2021-09-23 | 2021-09-23 | Combined ball-planting clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122308106.6U CN215682782U (en) | 2021-09-23 | 2021-09-23 | Combined ball-planting clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215682782U true CN215682782U (en) | 2022-01-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122308106.6U Active CN215682782U (en) | 2021-09-23 | 2021-09-23 | Combined ball-planting clamp |
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| Country | Link |
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| CN (1) | CN215682782U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114535743A (en) * | 2022-02-21 | 2022-05-27 | 上海世禹精密机械有限公司 | Drum-type brush ball laying equipment |
| CN115229295A (en) * | 2022-06-09 | 2022-10-25 | 上海移远通信技术股份有限公司 | Positioner and manual brush tin subassembly |
-
2021
- 2021-09-23 CN CN202122308106.6U patent/CN215682782U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114535743A (en) * | 2022-02-21 | 2022-05-27 | 上海世禹精密机械有限公司 | Drum-type brush ball laying equipment |
| CN115229295A (en) * | 2022-06-09 | 2022-10-25 | 上海移远通信技术股份有限公司 | Positioner and manual brush tin subassembly |
| CN115229295B (en) * | 2022-06-09 | 2024-07-02 | 上海移远通信技术股份有限公司 | Positioning device and manual tin brushing assembly |
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