CN215678969U - Display module - Google Patents
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- CN215678969U CN215678969U CN202121706063.0U CN202121706063U CN215678969U CN 215678969 U CN215678969 U CN 215678969U CN 202121706063 U CN202121706063 U CN 202121706063U CN 215678969 U CN215678969 U CN 215678969U
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Abstract
The utility model discloses a display module which comprises a first substrate, a second substrate, a driving chip and a flexible circuit board. The first part of the first substrate consists of a first area, a second area and a third area, and the second area and the third area are positioned at two sides of the first area; the first area has a first width, the second area and the third area have a second width, and the first width is larger than or equal to the second width; the driving chip is arranged on the first area, and a first distance is reserved between the first side edge of the driving chip and the second substrate; the flexible circuit board is provided with two binding parts, the two binding parts are respectively connected to the second area and the third area, and the binding parts are bent to the back of the first substrate and provided with bending ends; the starting end of the binding part has a second distance with the second substrate, and the second distance is smaller than the first distance; the starting end and the bending end have a third distance in the first direction, and the sum of the second distance and the third distance is less than or equal to the first width. The utility model can realize the effect of narrow frame.
Description
Technical Field
The utility model relates to the technical field of display, in particular to a display module.
Background
With the rapid development of portable electronic devices, users have increasingly high requirements for display modules, such as narrow frame and even no frame. At present, the technology for attaching a driving chip (IC) in an LTPS (Low Temperature polysilicon) display module mainly includes two technologies, namely COG (chip on glass) and cof (chip on fpc), and a COG scheme is the mainstream in the market in consideration of the technical maturity.
Referring to fig. 1 and 2, fig. 1 is a schematic cross-sectional view of a display module according to the prior art, and fig. 2 is a partial top view of the display module according to the prior art. The display module 10 includes a first substrate 11 'and a second substrate 12' disposed opposite to each other, the second substrate 12 'is stacked on the first substrate 11', the first substrate 11 'has a portion not covered by the second substrate 12', a driving chip (IC)13 'and a Flexible Printed Circuit (FPC) 14' are disposed on the portion, the driving chip 13 'is connected to a display region of the second substrate 12' through a trace (not shown), and the driving chip 13 'is connected to the FPC 14' through a trace (not shown). The flexible circuit board 14 'is bent and then placed under the backlight unit 15'. Therefore, the lower frame of the display module 10 can be at least composed of five parts, i.e., a dimension a, a dimension B, a dimension C, a dimension D, and a dimension E. Wherein, the dimension a represents a distance from the edge of the second substrate 12 'to the upper edge of the driving chip 13'. The size B represents the size of the driving chip 13'. The dimension C represents the distance from the lower edge of the driving chip 13 'to the upper edge of the flexible circuit board 14'. Dimension D represents the size of the bond pads of the flexible circuit board 14'. Dimension E represents the dimension of the flexible circuit board 14 'bent to protrude from the edge of the first substrate 11'. Currently, dimension a, dimension B, dimension C, dimension D, and dimension E all reach the process limit, so it is difficult to further reduce the lower frame.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a display module to solve the above problems.
In order to achieve the above object, the present invention provides a display module including a first substrate, a second substrate, a driving chip and a flexible circuit board. The second substrate is superposed on the first surface of the first substrate; in a first direction, the first surface of the first substrate includes a first portion not covered by the second substrate, the first direction is a length direction or a width direction of the first substrate, the first portion is composed of a first region, a second region and a third region, and the second region and the third region are located on two sides of the first region; in the first direction, the first region has a first width, the second region and the third region have a second width, and the first width is greater than or equal to the second width; the driving chip is arranged on the first area, the driving chip is provided with a first side edge adjacent to the second substrate in the first direction, and the first side edge and the second substrate are provided with a first distance in the first direction; the flexible circuit board is provided with two binding parts which are respectively connected to the second area and the third area, and the two binding parts are bent to the back of the first substrate and provided with bent ends; the starting ends of the two binding parts and the second substrate have a second distance in the first direction, and the second distance is smaller than the first distance; and the starting end and the bending end have a third distance in the first direction, and the sum of the second distance and the third distance is less than or equal to the first width.
As an optional technical solution, a ratio of a sum of the second distance and the third distance to the first width is between 90% and 100%.
As an optional technical solution, the first substrate has a first length in the second direction; the first region has a second length in a second direction, the second region and the third region have a third length in the second direction, the first length is equal to the sum of the second length and the two third lengths, and the first direction is perpendicular to the second direction.
As an optional technical solution, the flexible circuit board has a body, the body is connected to the two binding portions, and the body is located on the back side of the first substrate after the flexible circuit board is bent.
As an optional technical solution, the display module further includes a cover plate disposed on the second substrate, and a projection of the cover plate on the first substrate covers the driving chip and the two binding portions.
As an optional technical solution, the display module further includes a backlight unit disposed below the first substrate, and the flexible circuit board is bent to a back surface of the backlight unit.
As an optional technical solution, the driving chip has a second side edge far from the second substrate in the first direction, the second side edge has a fourth distance from an edge of the first region in the first direction, the driving chip has a third width in the first direction, and the fourth distance is smaller than the third width; alternatively, the fourth distance is less than the first distance.
As an optional technical solution, the display module further has a protective adhesive disposed adjacent to the bending end.
As an optional technical solution, the first substrate further has a second surface opposite to the first surface, the driving chip is disposed on the first surface, the first surface of the first substrate is disposed with a plurality of first pads corresponding to the driving chip, the first substrate is disposed with a plurality of first conductive through holes corresponding to the plurality of first pads, the first surface of the first substrate is disposed with a plurality of second pads corresponding to the two bonding portions, the first substrate is disposed with a plurality of second conductive through holes corresponding to the plurality of second pads, the plurality of first pads are connected to a circuit on the second surface through the plurality of first conductive through holes, and then connected to the plurality of second pads through the plurality of second conductive through holes.
As an optional technical solution, the driving chip has a second side edge far from the second substrate in the first direction, the second side edge is provided with a plurality of pins, and the plurality of first pads are used for connecting the plurality of pins.
In the utility model, the binding region of the flexible circuit board is moved from the middle region of the first substrate to two sides of the driving chip in the prior art, and the bending end of the flexible circuit board is also moved from the middle region of the first substrate in the second direction to two sides of the driving chip. In the width direction of lower frame, two binding portions of flexible circuit board are closer to the edge of second base plate than the distance of the edge of driver chip with the second base plate to be convenient for first base plate provide sufficient binding space for two binding portions when catering to narrow frame trend. Furthermore, in the width direction of the lower frame, the bending ends of the two binding portions on the flexible circuit board are slightly retracted or flush with the edge of the area where the driving chip is located. Therefore, through the structural improvement of the utility model, the size of the lower frame can be reduced to the width of the area where the driving chip is positioned in the frame direction, the processing capability of the current materials is not required to be improved, and the size of the frame is reduced through the structural change.
The utility model is described in detail below with reference to the drawings and specific examples, but the utility model is not limited thereto.
Drawings
FIG. 1 is a schematic cross-sectional view of a display module of the prior art;
FIG. 2 is a partial top view of a display module according to the prior art;
FIG. 3 is a schematic cross-sectional view of a display module according to the present invention;
FIG. 4 is a partial top view of the display module according to the present invention when the flexible printed circuit board is not bent;
fig. 5 is a partial top view of the flexible circuit board of the display module according to the present invention when being bent.
Detailed Description
In order to further understand the objects, structures, features and functions of the present invention, the following embodiments are described in detail.
Please refer to fig. 3 to 5. FIG. 3 is a schematic cross-sectional view of a display module according to the present invention; FIG. 4 is a partial top view of the display module according to the present invention when the flexible printed circuit board is not bent; fig. 5 is a partial top view of the display module according to the present invention after the flexible circuit board is bent.
The display module 100 of the present invention includes a first substrate 11, a second substrate 12, a driving chip 13 and a flexible circuit board 14. As shown in fig. 3, the second substrate 12 is stacked on the first surface 11A of the first substrate 11, and in the first direction F1, the first surface 11A of the first substrate 11 has a first portion not covered by the second substrate 12. The first direction F1 is a longitudinal direction or a width direction of the first substrate 11, and in the present embodiment, the first direction F1 is a longitudinal direction of the first substrate 11. The first portion is composed of a first region 111, a second region 112 and a third region 113, and the second region 112 and the third region 113 are located on two sides of the first region 111. In the first direction F1, the first region 111 has a first width W1, the second region 112 and the third region 113 have a second width W2, and the first width W1 is greater than or equal to the second width W2. In practice, the widths of the second region 113 and the third region 113 may also be different.
The driving chip 13 is disposed on the first region 111, the driving chip 13 has a first side 131 (upper edge) adjacent to the second substrate 12 in the first direction F1, and the first side 131 and the second substrate 12 have a first distance D1 in the first direction F1. The flexible circuit board 14 has two binding portions 141, and the two binding portions 141 are bound and connected to the second region 112 and the third region 113, respectively. One of the binding portions 141 is connected to the second region 112, and the other binding portion 141 is connected to the third region 113. And the two binding portions 141 are bent to the back surface of the first substrate 11 and have bent ends 142 (as shown in fig. 3 and 5); the starting ends 143 of the two binding portions 141 and the second substrate 12 have a second distance D2 in the first direction F1, and the second distance D2 is smaller than the first distance D1, i.e., the two binding portions 141 and the first substrate 11 are bound at a position closer to the second substrate 12 than the driving chip 13; the starting end 143 and the bending end 142 have a third distance D3 in the first direction F1, and a sum of the second distance D2 and the third distance D3 is smaller than or equal to the first width W1. In practical operation, the first substrate 11 may be an array substrate, and the second substrate 12 may be a color filter substrate. A liquid crystal layer (not shown) may be disposed between the first substrate 11 and the second substrate 12.
As shown in fig. 4, the first portion is composed of a first region 111, a second region 112, and a third region 113, and has no other region, so that the first portion has a shape of a letter "convex". The first substrate 11 has a first length L1 in the second direction F2; the first region 111 has a second length L2 in the second direction F2, the second region 112 and the third region 113 have a third length L3 in the second direction F2, the first length L1 is equal to the sum of the second length L2 and two third lengths L3, and the first direction F1 is perpendicular to the second direction F2. In this embodiment, the lengths of the second region 112 and the third region 113 in the second direction F2 are equal, and in practice, the lengths of the second region 112 and the third region 113 in the second direction F2 may also be different.
As shown in fig. 4 and 5, the driving chip 13 has a second side 132 (lower edge) away from the second substrate 12 in the first direction F1, the second side 132 and the edge of the first region 111 in the first direction F1 have a fourth distance D4, the driving chip 13 has a third width W3 in the first direction F1, and the fourth distance D4 is smaller than the third width W3. In practice, the fourth distance D4 is determined by the binding tolerance of the driver chip 13, so that the size of the fourth distance D4 can be effectively limited while ensuring that the driver chip 13 can be bound smoothly. In this embodiment, the fourth distance D4 is also smaller than the first distance D1 between the driving chip 13 and the second substrate 12.
In the present invention, the sum of the second distance D2 in the first direction F1 between the starting ends 143 of the two binding portions 141 and the second substrate 12 and the third distance D3 in the first direction F1 between the starting ends 143 and the bending end 142 is less than or equal to the first width W1. In practice, the ratio of the sum of the second distance D2 and the third distance D3 to the first width W1 may be between 90% and 100%. So that the bent ends 142 are only slightly retracted compared to the edges of the first region 111 in the first direction F1 after the two binding portions 141 are bent. Preferably, the sum of the second distance D2 and the third distance D3 is equal to the first width W1, so that the bent end 142 is flush with the edge of the first region 111. In this way, the width difference in the first direction F1 between the first region 111 and the second region 112/third region 113 can be reduced while the lower bezel width is reduced, and the influence on the strength of the first substrate 11 (particularly the first portion) can be reduced.
In the present invention, the bonding region of the flexible circuit board 14 is moved from the middle region of the first substrate 11 to two sides of the driving chip 13 in the prior art, and the bending end of the flexible circuit board 14 is also moved from the middle region of the first substrate 11 in the second direction F2 to two sides of the driving chip 13. Thus, the size D of the bonding pad of the flexible circuit board 14' in the prior art can be saved. As shown in fig. 4, in the first direction F1, i.e., the width direction of the lower frame, the two binding portions 141 of the flexible circuit board 14 are closer to the edge of the second substrate 12 than the driving chip 13 is to the edge of the second substrate 12, so that the first substrate 11 provides enough binding space for the two binding portions 141 while meeting the trend of narrow frames. Further, in the first direction F1, the bent ends 142 of the two binding portions 141 on the flexible circuit board 14 are slightly recessed or flush with the edge of the first region 111 where the driving chip 13 is located. Therefore, the dimension E of the flexible circuit board 14 'bending to protrude the edge of the first substrate 11' in the prior art can be saved. Therefore, through the structural improvement of the present invention, the size of the lower frame can be reduced to the first width W1 in the first direction F1 of the first region 111 where the driving chip 13 is located, without improving the current process capability of each material, and the size of the frame is reduced through structural change.
In the present invention, the first width W1 is composed of three dimensions, a first distance D1 between the first side 131 of the driving chip 13 and the second substrate 12 in the first direction F1, a dimension of the driving chip 13 in the first direction F1, and a fourth distance D4 between the second side 132 of the driving chip 12 and the edge of the first region 111. In practical applications, the first distance D1 can be minimized in the first direction F1 by the most reasonable and effective fan-out (fan-out) design, the size of the driving chip 13 can be minimized in the first direction F2 by the internal functional design of the driving chip 13, and the fourth distance D4 can be minimized in the first direction F1 by the process precision, so that the first width W1 formed by the sum of the three is the minimum, and at this time, the size of the bottom frame of the display module 100 can be minimized.
As shown in fig. 3 and 4, the flexible circuit board 14 has a body 144, the body 144 is electrically connected to the two binding portions 141, and the body 144 is located on the back surface of the first substrate 11 after the flexible circuit board 14 is bent. Further, the body 144 has a corresponding structure corresponding to the two binding portions 141, so that after the flexible circuit board 14 is bent, the body 144 can provide a certain support corresponding to the two binding portions 141 to increase the strength thereof.
As shown in fig. 3, the display module 100 further includes a cover plate 15, the cover plate 15 is disposed on the second substrate 11, and a projection of the cover plate 15 on the first substrate 11 covers the driving chip 13 and the two binding portions 141. In this way, the cover plate 15 can protect the first substrate 11, the second substrate 12, the driving chip 13 disposed on the first substrate 11, the flexible circuit board 14, and the like. In practical operation, the cover plate 15 may be a common transparent plate or a plate with a touch function. The user can design according to actual conditions.
As shown in fig. 3, the display module 100 further includes a backlight unit 16, the backlight unit 16 is disposed under the first substrate 11, and the flexible circuit board 14 is bent to a back surface of the backlight unit 16. The backlight unit 16 is used for providing a backlight source for the display module 100. The backlight unit 16 may include a light bar, a light guide plate, an optical film, and the like.
As shown in fig. 3, the display module 100 further has a protection paste 17, and the protection paste 17 is disposed adjacent to the bent ends 142 of the two binding portions 141. By the provision of the protective adhesive 17, the two binding portions 141 of the flexible circuit board 14 can be protected from peeling (peeling) or breaking.
As shown in fig. 3 and 4, the first substrate 11 further has a second surface 11B opposite to the first surface 11A, the driving chip 13 is disposed on the first surface 11A, the first surface 11A of the first substrate 11 may be disposed with a plurality of first pads 21 corresponding to the driving chip 13, the first surface 11A of the first substrate 11 is disposed with a plurality of second pads 22 corresponding to the two bonding portions 141, the first substrate 11 is disposed with a plurality of first vias (not shown) electrically connected to the plurality of first pads 21, the first substrate 11 is disposed with a plurality of second vias (not shown) electrically connected to the plurality of second pads 22, the plurality of first pads 21 are connected to the circuit (not shown) on the second surface 11B through the plurality of first vias, and then are connected to the plurality of second pads 22 through the plurality of second vias. The first pads are disposed corresponding to the second side 132 of the driving chip 13 away from the second substrate 12, so as to be connected to corresponding pins on the driving chip 13. In this way, the driving chip 13 can follow the architecture of the prior art without changing.
According to the display module, the binding areas of the flexible circuit board are arranged on the left side and the right side of the lower frame, the lower frame area of the first substrate is designed to be in a convex shape so as to reserve the bending size of the flexible circuit board, and when the flexible circuit board is bent to the back of the first substrate, the bending end is flush with or slightly retracted to the edge of the first substrate. Therefore, the limitation of the bonding welding pads and the bending areas of the flexible circuit board on the size of the lower frame is eliminated, and the trend of narrow frames is met.
The present invention is capable of other embodiments, and various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the utility model.
Claims (10)
1. A display module is characterized in that it comprises,
the display device comprises a first substrate and a second substrate, wherein the second substrate is superposed on the first surface of the first substrate; in a first direction, the first surface of the first substrate includes a first portion not covered by the second substrate, the first direction is a length direction or a width direction of the first substrate, the first portion is composed of a first region, a second region and a third region, and the second region and the third region are located on two sides of the first region; in the first direction, the first region has a first width, the second region and the third region have a second width, and the first width is greater than or equal to the second width;
the driving chip is arranged on the first area, the driving chip is provided with a first side edge adjacent to the second substrate in the first direction, and the first side edge and the second substrate are provided with a first distance in the first direction; and
the flexible circuit board is provided with two binding parts, the two binding parts are respectively connected to the second area and the third area, and the two binding parts are bent to the back of the first substrate and provided with bent ends; the starting ends of the two binding parts and the second substrate have a second distance in the first direction, and the second distance is smaller than the first distance; and the starting end and the bending end have a third distance in the first direction, and the sum of the second distance and the third distance is less than or equal to the first width.
2. The display module of claim 1, wherein a ratio of a sum of the second distance and the third distance to the first width is between 90% and 100%.
3. The display module of claim 1, wherein the first substrate has a first length in the second direction; the first region has a second length in a second direction, the second region and the third region have a third length in the second direction, the first length is equal to the sum of the second length and the two third lengths, and the first direction is perpendicular to the second direction.
4. The display module as claimed in claim 1, wherein the flexible circuit board has a body, the body is connected to the two binding portions, and the body is located on the back surface of the first substrate after the flexible circuit board is bent.
5. The display module of claim 1, further comprising a cover plate disposed on the second substrate, wherein a projection of the cover plate on the first substrate covers the driving chip and the two binding portions.
6. The display module according to claim 1, further comprising a backlight unit disposed under the first substrate, wherein the flexible circuit board is bent to a back surface of the backlight unit.
7. The display module of claim 1, wherein the driving chip has a second side away from the second substrate in the first direction, the second side has a fourth distance from an edge of the first region in the first direction, the driving chip has a third width in the first direction, and the fourth distance is smaller than the third width; alternatively, the fourth distance is less than the first distance.
8. The display module of claim 1, further comprising a protective adhesive disposed adjacent to the bent end.
9. The display module as claimed in claim 1, wherein the first substrate further has a second surface opposite to the first surface, the driving chip is disposed on the first surface, the first surface of the first substrate is disposed with a plurality of first pads corresponding to the driving chip, the first substrate is disposed with a plurality of first vias corresponding to the plurality of first pads and electrically connected thereto, the first surface of the first substrate is disposed with a plurality of second pads corresponding to the two bonding portions, the first substrate is disposed with a plurality of second vias corresponding to the plurality of second pads and electrically connected thereto, the plurality of first pads are connected to the circuit on the second surface through the plurality of first vias and then connected to the plurality of second pads through the plurality of second vias.
10. The display module as claimed in claim 9, wherein the driving chip has a second side away from the second substrate in the first direction, the second side has a plurality of pins, and the plurality of first pads are used to connect the plurality of pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121706063.0U CN215678969U (en) | 2021-07-26 | 2021-07-26 | Display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121706063.0U CN215678969U (en) | 2021-07-26 | 2021-07-26 | Display module |
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| Publication Number | Publication Date |
|---|---|
| CN215678969U true CN215678969U (en) | 2022-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121706063.0U Active CN215678969U (en) | 2021-07-26 | 2021-07-26 | Display module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023109237A1 (en) * | 2021-12-14 | 2023-06-22 | 深圳Tcl新技术有限公司 | Display module and display device |
| WO2024011671A1 (en) * | 2022-07-11 | 2024-01-18 | 武汉华星光电技术有限公司 | Display panel, binding apparatus therefor and display apparatus |
-
2021
- 2021-07-26 CN CN202121706063.0U patent/CN215678969U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023109237A1 (en) * | 2021-12-14 | 2023-06-22 | 深圳Tcl新技术有限公司 | Display module and display device |
| WO2024011671A1 (en) * | 2022-07-11 | 2024-01-18 | 武汉华星光电技术有限公司 | Display panel, binding apparatus therefor and display apparatus |
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