CN215678715U - Three-dimensional radio frequency testing mechanism - Google Patents
Three-dimensional radio frequency testing mechanism Download PDFInfo
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- CN215678715U CN215678715U CN202120600608.3U CN202120600608U CN215678715U CN 215678715 U CN215678715 U CN 215678715U CN 202120600608 U CN202120600608 U CN 202120600608U CN 215678715 U CN215678715 U CN 215678715U
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Abstract
The utility model provides a three-dimensional frequency-emission testing mechanism which is used for carrying out frequency-emission testing on a Flexible Printed Circuit (FPC) board and comprises a rack, an upper board, a carrier board and a vertical testing assembly, wherein the upper board is arranged on the rack, a positioning block for fixing a connector of the FPC board is arranged on the carrier board, and the vertical testing assembly comprises a vertically-arranged needle die assembly and a first driving assembly which is fixed on the upper board and drives the needle die assembly to horizontally move to the positioning block. The three-dimensional frequency-emission testing mechanism provided by the utility model can be directly used for frequency-emission testing of the FPC soft board with a three-dimensional structure, can effectively fix the connector which is vertically arranged on the FPC soft board on the carrier board by using the positioning block, and then performs radio frequency testing on the connector by using the vertical testing component, so that the frequency-emission testing requirement of the FPC soft board with the three-dimensional structure can be met, the connector with small area of a testing point and high requirement on positioning precision can be accurately aligned, and the accuracy and the stability of the testing can be ensured.
Description
Technical Field
The utility model relates to the technical field of test fixtures, in particular to a three-dimensional frequency-emission test mechanism.
Background
Most of the existing connectors for testing on the FPC soft board are of a planar structure, and all testing components on the FPC soft board are located on the same plane. Therefore, the existing plane type testing mechanism can be used for carrying out frequency transmission testing on the connector on the FPC soft board, and the pin module of the plane type testing mechanism and the connector of the FPC soft board are all positioned on the same horizontal plane. And along with the continuous development of science and technology, FPC soft board structure develops towards the direction that the space is compacter, the overall arrangement is more optimized, has just appeared the FPC soft board of spatial structure, and the connector of this spatial structure's FPC soft board is in vertical state under test status for traditional planar test mechanism can't satisfy the test demand of the connector under vertical state. Firstly, can't realize the test of penetrating frequently to the connector under the vertical state with traditional planar test mechanism, secondly, even change test direction with traditional planar test mechanism and set up to vertical test, also can't satisfy test point area little, the high demand of location requirement on the current connector.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects that the existing plane type testing mechanism cannot meet the requirements of frequency emission testing of an FPC (flexible printed circuit) soft board with a three-dimensional structure, cannot realize frequency emission testing of a connector in a vertical state, and cannot meet the requirements of small area and high positioning requirement of test points of the connector on the existing FPC soft board, and provides a three-dimensional frequency emission testing mechanism.
The technical scheme adopted by the utility model for solving the technical problems is as follows: the utility model provides a three-dimensional test mechanism that frequently penetrates for carry out the test of frequently penetrating to the FPC soft board, have the connector that is vertical setting on the FPC soft board, including the frame, set up in sky board, support plate and vertical test component in the frame, be provided with on the support plate and be used for fixing the locating piece of the connector of FPC soft board, vertical test component is including the needle mould subassembly that is vertical setting and being fixed in drive on the sky board needle mould subassembly horizontal migration extremely the first drive assembly of locating piece department.
Further, the first driving assembly comprises a base plate fixedly connecting the top plate with the rack, a driving cylinder fixed on the base plate and a moving block driven by the cylinder assembly, and the pin die assembly is fixed on the moving block.
Specifically, the moving block comprises a first connecting plate and a second connecting plate which are perpendicular to each other, the first connecting plate is horizontally fixed on the driving cylinder, the second connecting plate is vertically arranged on the side face of the top plate, and the needle die assembly is fixed on the second connecting plate.
Further, the pin die assembly comprises a vertically arranged base, a PCB arranged in the base and a test probe arranged on the PCB; when the needle die assembly moves to the positioning block, the test probe is in contact with the connector on the positioning block to form electric connection.
Specifically, the needle module assembly further comprises a floating plate which is arranged in the base and elastically connected with the base, and a pre-pressing block which can limit the connector of the FPC in the positioning block is arranged on the floating plate.
Specifically, the needle module assembly further comprises a cover plate which is arranged on one side of the base close to the positioning block and limits the floating plate on the base.
Specifically, the pin die assembly further comprises a radio frequency wire electrically connected with the PCB board on the base.
Specifically, the positioning block is provided with a positioning groove for placing the connector of the FPC soft board and a vacuum suction port for adsorbing the FPC soft board.
Specifically, a guide PIN aligned with the positioning block is arranged on a base of the needle module, a bushing into which the guide PIN can be inserted is arranged on the positioning block, and when the needle module moves to the positioning block, the guide PIN is inserted into the bushing.
Furthermore, a positioning pin matched with the carrier plate is arranged on the top plate, a positioning hole into which the positioning pin can be inserted is formed in the carrier plate, and a second driving assembly for driving the carrier plate to move upwards to the top plate is arranged in the rack.
The three-dimensional radio frequency testing mechanism provided by the utility model has the beneficial effects that: the frequency-emission testing device can be directly used for testing the FPC soft board with the three-dimensional structure, can utilize the positioning blocks to effectively fix the connector which is vertically arranged on the FPC soft board on the carrier board, and then utilizes the vertical testing assembly to carry out the radio frequency testing on the connector, can meet the frequency-emission testing requirement of the FPC soft board with the three-dimensional structure, can accurately align the connector which is small in testing point area and high in positioning precision requirement, and ensures the accuracy and stability of the testing.
Drawings
Fig. 1 is a schematic perspective view of a three-dimensional radio frequency testing mechanism according to the present invention;
FIG. 2 is a schematic perspective view of a vertical testing assembly of a three-dimensional RF testing mechanism according to the present invention;
FIG. 3 is a schematic perspective view of a needle module in a three-dimensional radio frequency testing mechanism according to the present invention;
FIG. 4 is a schematic diagram of an exploded view of a needle module in a three-dimensional RF testing mechanism according to the present invention;
fig. 5 is a schematic perspective view illustrating a positioning block on a carrier in a three-dimensional rf testing mechanism according to the present invention.
In the figure: 100-three-dimensional radio frequency testing mechanism, 10-frame, 20-antenna board, 21-positioning PIN, 30-carrier board, 31-positioning block, 311-positioning groove, 312-vacuum suction port, 313-bushing, 40-vertical testing component, 41-PIN module, 411-base, 4111-guide PIN, 412-PCB board, 413-testing probe, 414-floating board, 4141-prepressing block, 415-cover board, 42-first driving component, 421-backing plate, 422-driving cylinder, 423-moving block, 4231-first connecting board, 4232-second connecting board and 50-second driving component.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Referring to fig. 1 to 5, a three-dimensional radio frequency testing mechanism 100 provided by the present invention can be used for performing a radio frequency test on an FPC flexible printed circuit board, and is particularly suitable for being used on an FPC flexible printed circuit board having a connector 90 vertically disposed thereon, and can perform a radio frequency test on the FPC flexible printed circuit board after the connector 90 on the FPC flexible printed circuit board is accurately fixed.
Further, as shown in fig. 1, a three-dimensional radio frequency testing mechanism 100 provided by the present invention includes a rack 10, an upper plate 20 disposed on the rack 10, a carrier plate 30, and a vertical testing component 40. The top board 20 and the carrier board 30 are fixedly disposed in the chassis 10, and can relatively move in the chassis 10 for clamping the FPC flexible board to be tested. When the top board 20 and the carrier board 30 are pressed into a whole, the vertical testing component 40 moves towards the top board and the carrier board, and is precisely positioned on the connector 90 of the FPC soft board to realize electrical connection, and then the radio frequency test is performed.
Specifically, as shown in fig. 1, the carrier 30 is provided with a positioning block 31 for fixing the connector 90 of the FPC flexible printed circuit, and the connector 90 vertically disposed on the FPC flexible printed circuit can be well fixed by the positioning block 31, so that the vertical testing component 40 can be conveniently moved to the positioning block 31 to complete the testing of the connector 90.
As shown in fig. 1, the vertical testing assembly 40 includes a pin mold assembly 41 arranged vertically and a first driving assembly 42 fixed on the top plate 20 for driving the pin mold assembly 41 to move horizontally to the positioning block 31. The setting direction of the pin die assembly 41 is consistent with the setting direction of the connector 90 on the positioning block 31, and the pin die assembly and the connector 90 are both arranged in a vertical direction, so that the three-dimensional radio frequency testing mechanism 100 provided by the utility model can meet the requirement of automatic testing of the connector 90 on the FPC flexible printed circuit board. The pin die assembly 41 can also be matched with the first driving assembly 42 and the positioning block 31 to realize accurate alignment with the connector 90, so that a small test point on the connector 90 is ensured, and the frequency emission test can be smoothly completed.
Specifically, as shown in fig. 1, in the present embodiment, a second driving assembly 50 for driving the carrier plate 30 to move up to the top plate 20 is disposed in the rack 10. The second driving assembly 50 disposed below the carrier 30 can drive the carrier 30 to move up and down in the rack 10 during each test. When the rf test of the FPC flexible printed circuit board on the carrier 30 is required, the second driving assembly 50 drives the carrier 30 to drive the positioning block 31 disposed on the carrier 30 to vertically ascend in the machine frame 10 to abut against the top board 20. After the radio frequency test is finished, the second driving assembly 50 drives the carrier board 30 to vertically descend in the chassis 10, so that the carrier board 30 is continuously driven to vertically descend to the original position in the chassis after being separated from the top board 20, and the radio frequency test on the FPC flexible printed circuit board is completed.
In the radio frequency testing process of the three-dimensional radio frequency testing mechanism 100 provided by the utility model, after the top board 20 and the carrier board 30 are abutted, the vertical testing component 40 is used for testing the connector 90 on the carrier board 30. At this time, the first driving assembly 42 of the vertical testing assembly 40 drives the pin mold assembly 41 fixed on the top plate 20 to move horizontally to the positioning block 31 in the rack 10, and at this time, the pin mold assembly 41 and the connector 90 of the FPC flexible printed circuit board form an electrical connection for performing the rf test. After the test is completed, the first driving assembly 42 of the vertical testing assembly 40 drives the pin mold assembly 41 fixed on the top plate 20 to be separated from the positioning block 31 fixed with the FPC flexible printed circuit board and continuously retracts to the initial position, thereby completing the test operation. The three-dimensional radio frequency testing mechanism 100 provided by the utility model can be directly used for the radio frequency testing of the FPC flexible printed circuit board with a three-dimensional structure, the connector 90 vertically arranged on the FPC flexible printed circuit board can be effectively fixed on the carrier plate 30 by using the positioning block 31, and the connector 90 is subjected to radio frequency testing by using the vertical testing component, so that the radio frequency testing requirement of the FPC flexible printed circuit board with the three-dimensional structure can be met, the connector 90 with small area of a testing point and high requirement on positioning precision can be accurately aligned, and the testing accuracy and stability can be ensured.
Further, as shown in fig. 2, the first driving assembly 42 in the vertical testing assembly 40 of the three-dimensional radio frequency testing mechanism 100 provided by the present invention includes a backing plate 421 for fixedly connecting the top plate 20 and the frame 10, a driving cylinder 422 fixed on the backing plate 421, and a moving block 423 driven by the cylinder assembly 42, wherein the pin mold assembly 41 is fixed on the moving block 423. The driving cylinder 422 in the first driving assembly 42 can drive the moving block 423 to drive the needle mold assembly 41 fixed on the moving block 423 to horizontally move to the positioning block 31 when a test is needed; meanwhile, after the test is completed, the moving block 423 can be driven to drive the pin die assembly 41 fixed on the moving block 423 to retract to the initial position in the rack 10, so that the pin die assembly 41 fixed on the moving block 423 and the FPC flexible printed circuit board fixed on the positioning block 31 are in mutual contact or separated, and the radio frequency test of the FPC flexible printed circuit board is completed.
Specifically, as shown in fig. 3, the moving block 423 of the first driving assembly 42 includes a first connection plate 4231 and a second connection plate 4232 which are perpendicular to each other, the first connection plate 4231 is horizontally fixed to the driving cylinder 422, the second connection plate 4232 is vertically arranged on the side surface of the top plate 20, and the pin mold assembly 41 is fixed to the second connection plate 4232. The driving rod of the driving cylinder 422 is fixedly connected with the first connecting plate 4231 on the moving block 423. The driving cylinder 422 in the first driving assembly 42 drives the first connecting plate 4231 horizontally arranged on the moving block 423 to horizontally move to drive the needle mold assembly 41 fixed on the second connecting plate 4232 vertically arranged in the moving block 423 to horizontally move to the positioning block 31, or drives the needle mold assembly 41 on the moving block 423 to retreat to the initial position in the rack 10, the second connecting plate 4232 of the moving block 423 provides a mounting plane and driving force for the needle mold assembly 41 vertically arranged, and the horizontal driving of the driving cylinder 422 can be converted into the horizontal movement of the needle mold assembly 41.
Further, as shown in fig. 3 and 4, the pin die assembly 41 includes a base 411 arranged vertically, a PCB 412 arranged in the base 411, and a test probe 413 arranged on the PCB 412; when the pin die assembly 41 moves to the positioning block 31, the test probes 412 contact the connectors 90 on the positioning block 31 to form an electrical connection. The base 411 of the pin mold assembly 41 is vertically arranged and fixedly connected to the second connecting plate 4232, in which the moving block 423 is vertically arranged, so that the whole pin mold assembly 41 and the connector 90 to be tested can be located on the same plane. The testing probes 413 disposed on the PCB 412 in the base 411 are perpendicular to the PCB 412, and when the driving cylinder 422 drives the moving block 423 to move horizontally to drive the pin mold assembly 41 fixed in the moving block 423 to move horizontally to the positioning block 31, the testing probes 413 contact the testing points on the connector 90 of the FPC flexible printed circuit board fixed on the positioning block 31, so as to achieve electrical connection between the testing points and the PCB 412.
Specifically, as shown in fig. 4, the pin module 41 further includes a floating plate 414 disposed in the base 411 and elastically connected to the base 411, and the floating plate 414 is provided with a pre-pressing block 4141 for confining the connector 90 of the FPC within the positioning block. When the driving cylinder 422 drives the moving block 423 to move horizontally to drive the pin mold assembly 41 fixed in the moving block 423 to move horizontally to the positioning block 31, the pre-pressing block 4141 disposed on the floating plate 414 elastically connected to the base 411 abuts against the surface of the positioning block 31 before the testing probe 413. At this time, the driving cylinder 422 continuously drives the moving block 423 to move forward, the pre-pressing block 4141 can be used to push the connector 90 on the FPC flexible printed circuit board in contact therewith to abut against the positioning block 31, so as to facilitate the fixing of the connector 90 in the positioning block 31, at the same time, the pre-pressing block 4141 is continuously pressed, as the floating plate 414 moves backward in the base 411 relative to the base 411, and as the driving cylinder 422 is continuously driven, the testing probe 413 on the PCB 412 disposed in the base 411 is exposed and abuts against the FPC flexible printed circuit board fixed on the positioning block 31, at this time, the connector 90 on the positioning block 31 forms a passage with the PCB 412 through the testing probe 413 disposed on the PCB 412, thereby achieving electrical connection and performing an rf test on the PCB flexible printed circuit board fixed on the positioning block 31. After the test is completed, the driving cylinder 422 drives the moving block 423 to move horizontally to drive the needle mold assembly 41 fixed in the moving block 423 to be separated from the positioning block 31 after being horizontal, at this time, the pre-pressing block 4141 arranged on the floating plate 414 elastically connected with the base 411 is still continuously abutted against the surface of the positioning block 31, the driving cylinder 422 continuously drives the moving block 423 to move backwards, after the floating plate 414 elastically connected with the base 411 moves forwards in the base 411 to an original position relative to the base 411, the pre-pressing block 4141 is separated from the test probe 413 synchronously with the connector 90, and therefore the radio frequency test on the FPC soft board is completed.
Specifically, as shown in fig. 3, the pin die assembly 41 of the vertical testing assembly 40 further includes a cover 415 disposed on a side of the base 411 adjacent to the positioning block 31 to define the floating plate 414 on the base 411. When the floating plate 414 is at the original position, the upper surface of the floating plate 414 continuously abuts against the inner surface of the cover plate 415, when the driving cylinder 422 drives the moving block 423 to horizontally move to drive the pin die assembly 41 fixed in the moving block 423 to horizontally move to the positioning block 31, the pre-pressing block 4141 arranged on the floating plate 414 elastically connected with the base 411 abuts against the surface of the positioning block 31, at this time, the driving cylinder 422 continuously drives the moving block 423 to move forward, the pre-pressing block 4141 is continuously pressed and pushes the floating plate 414 elastically connected with the base 411 to move backward in the base 411 relative to the base 411, and at this time, the upper surface of the floating plate 414 is separated from the inner surface of the cover plate 415. When the radio frequency test of the FPC flexible printed circuit board on the positioning block 31 is completed, at this time, the driving cylinder 422 drives the moving block 423 to move horizontally to drive the pin mold assembly 41 fixed in the moving block 423 to move horizontally and then to be separated from the positioning block 31, the driving cylinder 422 continuously drives the moving block 423 to move backwards, the floating plate 414 elastically connected to the base 411 moves forwards in the base 411 to an original position relative to the base 411, at this time, the upper surface of the floating plate 414 abuts against the inner surface of the cover plate 415, and since the cover plate 415 is fixedly connected to the base 411, at this time, the floating plate 414 cannot continuously move forwards in the base 411 relative to the base 411, and thus the floating plate 414 is limited in the base 411 by the cover plate 415.
Specifically, as shown in fig. 4, the pin die assembly 41 further includes a radio frequency line 416 electrically connected to the PCB board 412 on the base 411. During testing, the rf line 416 disposed on the PCB 412 is electrically connected to the connector 90 through the test probe 413 disposed on the PCB 412, and the rf testing of the FPC flexible printed circuit board is achieved through the rf line 416.
Further, as shown in fig. 5, a schematic perspective view of a positioning block 31 in a three-dimensional rf testing mechanism 100 according to the present invention is shown. The positioning block 31 disposed on the carrier 30 is provided with a positioning slot 311 for placing the connector 90 of the FPC flexible printed circuit and a vacuum suction port 312 for absorbing the FPC flexible printed circuit. When the radio frequency test is needed to be carried out on the FPC soft board, firstly, the connector 90 of the FPC soft board is placed into the positioning groove 311, and at the moment, the positioning groove 311 in the positioning block 31 is always abutted to the connector 90 on the FPC soft board, so that the FPC soft board is always clamped in the positioning groove 311 and keeps a vertical state, and the radio frequency test is carried out on the FPC soft board by the subsequent vertical test component 40. Meanwhile, the vacuum suction port 312 arranged on the positioning block 31 is used for further fixing the FPC flexible printed circuit board on the positioning block 31 through negative pressure adsorption, so as to prevent the instant impact force generated when the second driving assembly 50 drives the carrier plate 30 to drive the positioning block 31 arranged on the carrier plate 30 to vertically ascend in the rack 10 to abut against the top plate 20 and the instant impact force generated when the driving cylinder 422 drives the moving block 423 to horizontally move to drive the needle mold assembly 41 fixed in the moving block 423 to horizontally move to the positioning block 31 to abut against the positioning block 31, so that the relative displacement between the connector 90 of the FPC flexible printed circuit board and the positioning block 31 is caused, and the radio frequency test result of the FPC flexible printed circuit board is influenced. After the test is finished, the second driving assembly 50 drives the carrier board 30 to drive the positioning block 31 disposed on the carrier board 30 to vertically descend in the rack to be separated from the top board 20, and continuously drives the carrier board 30 to the original position, and then the vacuum suction port 312 is closed, so that the flexible FPC board for completing the radio frequency test can be conveniently detached.
Further, to ensure that the test probes 413 of the vertical test assembly 40 can be accurately mated with the test points provided on the connectors 90 of the positioning block 31. A positioning assembly is also provided between the needle die assembly 41 and the positioning block 31. Specifically, as shown in fig. 3, the base 411 of the PIN module 41 is provided with a guide PIN4111 aligned with the positioning block 31, as shown in fig. 5, the positioning block 31 is provided with a bushing 313 into which the guide PIN4111 can be inserted, and when the PIN module 41 moves to the positioning block 31, the guide PIN4111 is inserted into the bushing 313. After the second driving assembly 50 drives the carrier 30 to drive the positioning block 31 disposed on the carrier 30 to vertically ascend in the rack 10 and abut against the top plate 20, the driving cylinder 422 drives the moving block 423 to horizontally move to drive the PIN mold assembly 41 to horizontally move to the positioning block 31, at this time, the guide PIN4111 disposed on the base 411 is inserted into the bushing 313 disposed on the positioning block 31 and capable of being inserted by the guide PIN4111, and the moving block 423 is continuously driven along with the driving cylinder 422 to horizontally move, so as to ensure that the base 411 in the PIN mold assembly 41 can be accurately abutted against the positioning block 31, and prevent the positioning block 31 and the base 411 from generating relative displacement in the process that the driving cylinder 422 continuously drives the moving block 423 to horizontally move, thereby affecting the abutment of the testing probe 413 and the connector 90.
Further, as shown in fig. 1, in the three-dimensional radio frequency testing mechanism 100 provided by the present invention, the top plate 20 is provided with a positioning pin 21 matched with the carrier plate 30, the carrier plate 30 is provided with a positioning hole (not shown) for inserting the positioning pin 21, and the rack 10 is provided with a second driving assembly 50 for driving the carrier plate 30 to move upward to the top plate 20. When the FPC flexible printed circuit is subjected to a radio frequency test, the second driving assembly 50 drives the carrier 30 to drive the positioning block 31 disposed on the carrier 30 to vertically ascend in the rack to abut against the top board 20, and at this time, the positioning pin 21 disposed on the top board 20 and engaged with the carrier 30 is inserted into a positioning hole (not shown in the figure) disposed on the carrier 30 and into which the positioning pin 21 is inserted, so as to ensure accurate abutting joint of the top board 20 and the carrier 30 in the vertical direction during relative movement, and prevent the carrier 30 and the top board 20 from generating relative displacement, thereby causing the positioning block 31 and the pin mold assembly 41 to generate relative displacement and affecting the test of the radio frequency test.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a three-dimensional test mechanism that frequently penetrates for carry out the test of frequently penetrating to the FPC soft board, the last connector that is vertical setting that has of FPC soft board, a serial communication port, including the frame, set up in sky board, support plate and vertical test component in the frame, be provided with on the support plate and be used for fixing the locating piece of the connector of FPC soft board, vertical test component is including being the needle mould subassembly of vertical setting and being fixed in drive on the sky board needle mould subassembly horizontal migration extremely the first drive assembly of locating piece department.
2. A three-dimensional radio frequency testing mechanism as claimed in claim 1, wherein said first driving assembly comprises a backing plate fixedly connecting said top plate with said frame, a driving cylinder fixed on said backing plate and a moving block driven by said cylinder assembly, said pin module being fixed on said moving block.
3. A three-dimensional radio frequency testing mechanism as claimed in claim 2, wherein said moving block comprises a first connecting plate and a second connecting plate which are vertically arranged, said first connecting plate is horizontally fixed on said driving cylinder, said second connecting plate is vertically arranged on the side of said top plate, and said needle module is fixed on said second connecting plate.
4. A three-dimensional radio frequency testing mechanism according to any one of claims 1-3, wherein said pin die assembly comprises a vertically arranged base, a PCB board arranged in said base, and a testing probe arranged on said PCB board; when the needle die assembly moves to the positioning block, the test probe is in contact with the connector on the positioning block to form electric connection.
5. A three dimensional radio frequency testing mechanism according to claim 4, wherein said pin module further comprises a floating plate disposed within and resiliently coupled to said base, said floating plate having a pre-press block disposed thereon for confining said FPC connector within said positioning block.
6. A radio frequency testing mechanism according to claim 5, wherein said pin module further comprises a cover plate disposed on a side of said base adjacent to said positioning block for limiting said floating plate to said base.
7. A stereoscopic rf testing mechanism as in claim 4, wherein the pin die assembly further comprises rf wires electrically connected to the PCB board on the base.
8. A three-dimensional radio frequency testing mechanism as claimed in claim 4, wherein said positioning block is provided with a positioning slot for placing a connector of said FPC and a vacuum suction port for sucking said FPC.
9. A three-dimensional radio frequency testing mechanism according to claim 8, wherein the base of the PIN module is provided with a guide PIN aligned with the positioning block, the positioning block is provided with a bushing into which the guide PIN can be inserted, and when the PIN module moves to the positioning block, the guide PIN is inserted into the bushing.
10. A three-dimensional radio frequency testing mechanism as claimed in claim 1, wherein said top plate has a positioning pin engaged with said carrier plate, said carrier plate has a positioning hole for inserting said positioning pin, and said frame has a second driving assembly for driving said carrier plate to move upward to said top plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120600608.3U CN215678715U (en) | 2021-03-24 | 2021-03-24 | Three-dimensional radio frequency testing mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120600608.3U CN215678715U (en) | 2021-03-24 | 2021-03-24 | Three-dimensional radio frequency testing mechanism |
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| CN215678715U true CN215678715U (en) | 2022-01-28 |
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| CN202120600608.3U Active CN215678715U (en) | 2021-03-24 | 2021-03-24 | Three-dimensional radio frequency testing mechanism |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115616382A (en) * | 2022-10-31 | 2023-01-17 | 燕麦(杭州)智能制造有限公司 | Automatic test equipment and test method |
| CN115754676A (en) * | 2022-11-18 | 2023-03-07 | 燕麦(杭州)智能制造有限公司 | Test equipment and test method for electrical property test of flexible circuit board |
-
2021
- 2021-03-24 CN CN202120600608.3U patent/CN215678715U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115616382A (en) * | 2022-10-31 | 2023-01-17 | 燕麦(杭州)智能制造有限公司 | Automatic test equipment and test method |
| CN115754676A (en) * | 2022-11-18 | 2023-03-07 | 燕麦(杭州)智能制造有限公司 | Test equipment and test method for electrical property test of flexible circuit board |
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