CN215675903U

CN215675903U - An ultra-thin semiconductor refrigeration device, a mobile phone refrigerator and a mobile phone

Info

Publication number: CN215675903U
Application number: CN202120894337.7U
Authority: CN
Inventors: 杨军辉
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-04-28
Filing date: 2021-04-28
Publication date: 2022-01-28
Anticipated expiration: 2031-04-28

Abstract

The utility model discloses an ultra-thin semiconductor refrigerating device, a mobile phone refrigerator and a mobile phone. The semiconductor refrigerating device is used for cooling electronic equipment and comprises a semiconductor refrigerating fin and a heat sink. The sheet-like thermally conductive material is attached to the hot end of the semiconductor refrigeration sheet, and the cold end of the semiconductor refrigeration sheet is attached to the electronic device. The utility model utilizes a large-area sheet-like heat-conducting material as a heat sink, which reduces the thickness of the device, makes the whole device light and simple, and expands the heat dissipation area, thereby improving the heat dissipation efficiency.

Description

Ultra-thin semiconductor refrigerating device, mobile phone refrigerator and mobile phone

Technical Field

The utility model relates to a heat dissipation and cooling device for electronic equipment such as a mobile phone, a tablet computer and the like, which can be used for most mobile phones and tablet computers in the market.

Background

Along with the development of science and technology, electronic equipment such as cell-phone and panel computer are more and more popularized, but after long-time operation, electronic equipment ubiquitous generates heat and scalds the phenomenon, and at this moment, need carry out quick cooling heat dissipation to electronic equipment, just can obtain better use and experience.

The existing cooling device has the defects of insufficient heat dissipation or heavy equipment and the like, for example, a heat dissipation mobile phone shell disclosed by the utility model patent with the application publication number of CN 110958342A dissipates heat and cools through a heat dissipation fan, so that the heat dissipation efficiency is low; also, for example, the utility model patent with application publication No. CN 110661318A discloses "a semiconductor refrigeration mobile phone cooling and charging device supporting wireless charging function", the whole device has a relatively high thickness and is bulky.

Disclosure of Invention

In order to solve the technical problems and enable the cooling device to be simple, convenient and efficient, the utility model provides an ultrathin semiconductor refrigerating device, a mobile phone refrigerator and a mobile phone.

The technical scheme adopted by the utility model is as follows: the ultrathin semiconductor refrigeration device comprises a semiconductor refrigeration piece and a radiating fin, wherein the radiating fin is a flaky heat conduction material with an area larger than that of the semiconductor refrigeration piece and is attached to the hot end of the semiconductor refrigeration piece, and the cold end of the semiconductor refrigeration piece is attached to the electronic equipment.

The utility model has the beneficial effects that: the utility model uses the sheet-shaped heat conduction material with larger area as the radiating fin, reduces the thickness of the device, leads the whole device to be light and simple, enlarges the radiating area and further improves the radiating efficiency.

Further, the area of the heat sink is adapted to the size of the housing of the electronic device.

Furthermore, the cold junction of semiconductor refrigeration piece is hugged closely and is had the cold conduction piece, cold conduction piece and fin thermal isolation, the semiconductor refrigeration piece is located between fin and the cold conduction piece, the cold conduction piece with the laminating of the position that generates heat of electronic equipment.

Furthermore, at least one of the radiating fins and the cold guide fins is provided with a groove at the overlapping position of the radiating fins and the cold guide fins, and the groove forms an accommodating cavity of the semiconductor refrigerating fin.

Furthermore, a heat radiation fan is arranged in the groove in a matched mode with the heat radiation fins, an air outlet of the heat radiation fan is parallel to the heat radiation fins and faces the direction of the semiconductor refrigeration fins, and air outlets are formed in the heat radiation fins and correspond to the air outlets.

Furthermore, a guide cover plate is arranged at the air outlet, and the direction of air flow in the air outlet is enabled to be towards the semiconductor refrigerating sheet by the guide cover plate.

Furthermore, the semiconductor refrigeration piece and the cooling fan are reversely powered by the electronic equipment through the wireless charging receiving module or the USB connecting line.

Further, a heat insulation layer is arranged between the radiating fins and the cold guide fins.

The utility model provides a cell-phone refrigerator, includes semiconductor refrigeration piece and fin, the fin is that the area is greater than the lamellar heat conduction material of semiconductor refrigeration piece, with the hot junction laminating of semiconductor refrigeration piece, the cold junction of semiconductor refrigeration piece laminates with the back of cell-phone, the fin is as the dorsal scale of cell-phone refrigerator.

The utility model provides a mobile phone, includes semiconductor refrigeration piece and fin, the fin is that the area is greater than the lamellar heat conduction material of semiconductor refrigeration piece, with the hot junction laminating of semiconductor refrigeration piece, the cold junction of semiconductor refrigeration piece laminates with the part that generates heat in the cell-phone, the fin is as the dorsal scale of cell-phone.

Drawings

FIG. 1 is a schematic diagram of a first embodiment of the present invention;

FIG. 2 is a disassembled schematic view of the first embodiment of the present invention;

FIG. 3 is a cross-sectional view taken along A-A of FIG. 1;

FIG. 4 is a schematic view of a second embodiment of the present invention;

fig. 5 is a disassembled schematic view of the second embodiment of the present invention.

The cooling structure comprises a semiconductor refrigerating sheet 1, a radiating fin 2, a protrusion 201, a guide cover plate 202, an air outlet 203, a cold guide sheet 3, a radiating fan 4, an air inlet 401, an air outlet 402, a heat insulation layer 5 and a groove 6.

Detailed Description

The utility model is further described with reference to the following figures and examples.

In an embodiment, as shown in fig. 1 and 2, an ultrathin semiconductor refrigeration device is used for cooling electronic equipment, and includes a semiconductor refrigeration sheet 1 and a heat dissipation sheet 2, where the heat dissipation sheet 2 is a sheet-shaped heat conduction material having an area larger than that of the semiconductor refrigeration sheet 1 and is attached to a hot end of the semiconductor refrigeration sheet 1, and a cold end of the semiconductor refrigeration sheet 1 is attached to the electronic equipment. In the embodiment, the sheet-shaped heat conduction material with a large area is used as the radiating fin 2, so that the thickness of the device is reduced, the whole device is light and simple, the radiating area is enlarged, and heat absorbed by the semiconductor refrigerating fin 1 can be dissipated out more quickly through the radiating fin 2, so that the radiating efficiency is improved. In the embodiment, when the device is used for electronic equipment such as a mobile phone and a tablet personal computer, the area of the heat sink 2 is generally set to be adapted to the size of the shell of the electronic equipment, so as to obtain a better heat dissipation effect on the premise of ensuring the beauty.

In an embodiment, as shown in fig. 1 and 2, a cold-conducting plate 3 is closely attached to a cold end of the semiconductor refrigeration plate 1, the cold-conducting plate 3 is thermally isolated from the heat sink 2, the semiconductor refrigeration plate 1 is located between the heat sink 2 and the cold-conducting plate 3, and the cold-conducting plate 3 is attached to a heating portion of the electronic device. In the embodiment, in order to dispel the heat in time effectively to electronic equipment, not only will dispel the heat that semiconductor refrigeration piece 1 absorbed fast, still should make semiconductor refrigeration piece 1 can absorb electronic equipment's heat fast, the setting up of cold conduction piece 3 has increased heat absorption area, makes electronic equipment's heat can be fast absorbed by semiconductor refrigeration piece 1 behind cold conduction piece 3 to improve this device radiating efficiency. In the embodiment, in order to avoid that the heat of the heat sink 2 is reversely transferred to the cold sink 3 when the heat sink 2 contacts the cold sink 3, which affects the heat dissipation effect, the cold sink 3 and the heat sink 2 should be thermally isolated, if they can be separated from each other without contacting, and further, as shown in fig. 1, a heat insulation layer 5 may be further filled in the gap between the cold sink 3 and the heat sink 2.

In an embodiment, as shown in fig. 1 and 4, at least one of the heat sink 2 and the cold-conducting fin 3 is provided with a groove 6 at the overlapping position of the two, and the groove 6 forms an accommodating cavity of the semiconductor chilling plate 1; in the embodiment, as shown in fig. 1, the groove 6 is arranged on the heat sink 2, and the structure reduces the space occupied by the whole device; in the second embodiment, as shown in fig. 4, the groove 6 is disposed on the cold conducting strip 3, when the device is used, the cold conducting strip 3 contacts with the electronic device, and the second embodiment has such a structure that the accommodating space inside the device is increased without increasing the height of the device, and a part of the components can be placed between the cold conducting strip 3 and the electronic device. In an embodiment, as shown in fig. 1 to 3, a heat dissipation fan 4 is disposed in the groove 6 and is matched with the heat dissipation plate 2, an air outlet 402 of the heat dissipation fan 4 is parallel to the heat dissipation plate 2 and faces the semiconductor chilling plate 1, and an air outlet 203 is disposed on the heat dissipation plate 2 corresponding to the air outlet 402. The structure can hide the semiconductor refrigeration piece 1 and the cooling fan 4 in the groove 6, so that the occupied space of the device is saved, when the cooling fan 4 is opened, an air channel is formed in the groove 6, and heat is discharged from the air outlet 203 along with air flow, so that the heat can be quickly dissipated and cooled. In the embodiment, the heat dissipation area of the sheet-shaped heat dissipation sheet 2 is large, and the sheet-shaped heat dissipation sheet has a good heat dissipation effect, so that the power of the heat dissipation fan 4 does not need to be too large, and the heat dissipation fan 4 can have a smaller size and be arranged in the groove 6, and finally, the whole device is enabled to ensure the heat dissipation effect and save the space. In an embodiment, as shown in fig. 3, a guiding cover plate 202 is further disposed at the air outlet 203, the guiding cover plate 202 enables the direction of the air flow in the air outlet 203 to be the direction toward the semiconductor chilling plate 1, and after the air flow comes out from the air outlet 203, the air flow is affected by the guiding cover plate 202 and is close to the outer surface of the heat sink 2 above the hot end of the semiconductor chilling plate 1. In the embodiment, as shown in fig. 3, the exhaust outlet 203 may be a slanted through hole to provide a better guiding function for the wind flow. In the embodiment, the heat dissipation fan 4 may be disposed on the upper surface of the heat dissipation plate 2 as needed.

In an embodiment, as shown in fig. 1, a protrusion 201 may be further disposed on the surface of the heat sink 2, and the protrusion 201 may increase the heat dissipation area of the heat sink 2, so as to improve the heat dissipation efficiency. In the embodiment, in order not to increase the thickness of the device, the height of the protrusion 201 is lower than the depth of the groove 201.

In the embodiment, the semiconductor refrigeration piece 1 is reversely powered by the electronic equipment through the wireless charging receiving module and the USB connecting line, and the wireless charging receiving module is respectively matched with the wireless charging transmitting module and the USB interface on the electronic equipment, so that two charging modes of wireless charging and mobile phone USB reverse charging can be adopted, and the device is convenient and simple.

In the embodiment, a cell-phone refrigerator, includes semiconductor refrigeration piece 1 and fin 2, fin 2 is the area and is greater than semiconductor refrigeration piece 1's lamellar heat conduction material, with the hot junction laminating of semiconductor refrigeration piece 1, the cold junction of semiconductor refrigeration piece 1 and the back laminating of cell-phone, fin 2 is as the dorsal scale of cell-phone refrigerator. The mobile phone refrigerator with the structure is hung outside the mobile phone and is used in combination with the back of the mobile phone, so that the mobile phone refrigerator is convenient to replace.

In the embodiment, the mobile phone comprises a semiconductor refrigeration piece 1 and a radiating fin 2, wherein the radiating fin 2 is a flaky heat conduction material with an area larger than that of the semiconductor refrigeration piece 1 and is attached to the hot end of the semiconductor refrigeration piece 1, the cold end of the semiconductor refrigeration piece 1 is attached to a heating part in the mobile phone, and the radiating fin 2 serves as a back shell of the mobile phone. The refrigerator with the structure is arranged in the mobile phone, so that the refrigerator is more invisible and attractive, and the radiating fin 2 is used as a back shell of the mobile phone, so that the whole thickness is thinner, and the hand feeling is better.

It should be understood that the above-described embodiments of the present invention are merely examples for illustrating the present invention, and are not intended to limit the embodiments of the present invention. Obvious variations or modifications of the present invention are possible within the spirit of the present invention.

Claims

1. An ultra-thin semiconductor refrigeration device for cooling electronic equipment, characterized in that it comprises a semiconductor refrigeration sheet (1) and a heat sink (2), and the heat sink (2) is larger in area than the semiconductor refrigeration sheet The sheet-like thermally conductive material of (1) is attached to the hot end of the semiconductor refrigeration sheet (1), and the cold end of the semiconductor refrigeration sheet (1) is attached to the electronic device.

2 . The ultra-thin semiconductor refrigeration device according to claim 1 , wherein the area of the heat sink ( 2 ) is adapted to the size of the casing of the electronic device. 3 .

3 . The ultra-thin semiconductor refrigeration device according to claim 1 , wherein the cold end of the semiconductor refrigeration sheet ( 1 ) is closely attached to a cooling fin ( 3 ), and the cooling fin ( 3 ) is connected to a heat sink. 4 . The sheet (2) is thermally isolated, and the semiconductor cooling sheet (1) is located between the heat sink (2) and the cooling fin (3), and the cooling fin (3) is attached to the heat generating part of the electronic device. combine.

4. The ultra-thin semiconductor refrigeration device according to claim 3, characterized in that: at least one of the cooling fins (2) and the cooling fins (3) is provided with a groove (6) at the overlap of the two. ), and the groove (6) constitutes the accommodating cavity of the semiconductor refrigeration chip (1).

5. The ultra-thin semiconductor refrigeration device according to claim 4, characterized in that: in the groove (6), a cooling fan (4) is arranged in cooperation with the cooling fin (2), and the cooling fan (4) The air outlet (402) of the cooling fin (2) is parallel to the heat sink (2) and faces the semiconductor refrigeration sheet (1), and the heat sink (2) is provided with an air outlet ( 203).

6 . The ultra-thin semiconductor refrigeration device according to claim 5 , wherein a guide cover plate ( 202 ) is provided at the air outlet ( 203 ), and the guide cover plate ( 202 ) makes the air outlet ( The direction of the airflow in 203) is the direction toward the semiconductor refrigeration sheet (1).

7. The ultra-thin semiconductor refrigeration device according to claim 5 or 6, characterized in that: the semiconductor refrigeration sheet (1) and the cooling fan (4) are reversed by the electronic device through a wireless charging receiving module or a USB cable. to supply power.

8 . The ultra-thin semiconductor refrigeration device according to claim 3 , characterized in that: an insulating layer ( 5 ) is provided between the heat sink ( 2 ) and the cooling fin ( 3 ). 9 .

9. A cell phone refrigerator, characterized in that it comprises a semiconductor refrigeration sheet (1) and a heat sink (2), wherein the heat sink (2) is a sheet-like thermally conductive material with an area larger than the semiconductor refrigeration sheet (1), It is attached to the hot end of the semiconductor refrigeration sheet (1), the cold end of the semiconductor refrigeration sheet (1) is attached to the back of the mobile phone, and the heat sink (2) is used as the back shell of the mobile phone refrigerator.

10. A mobile phone, characterized in that it comprises a semiconductor refrigeration sheet (1) and a heat sink (2), wherein the heat sink (2) is a sheet-shaped thermally conductive material with an area larger than the semiconductor refrigeration sheet (1), The hot end of the semiconductor refrigeration sheet (1) is attached, the cold end of the semiconductor refrigeration sheet (1) is attached to the heating parts in the mobile phone, and the heat sink (2) is used as the back shell of the mobile phone.