CN215644415U - Electroplating edge washing device and edge washing machine - Google Patents

Abstract

The application provides an electroplating edge washing device and an edge washing machine. The electroplating edge washing device is used for washing the edge of the wafer and comprises a bearing structure, a clamp and an edge washing nozzle. The bearing structure is used for bearing the wafer and enabling the wafer to be horizontally placed, and the bearing structure can drive the wafer to rotate around an axis vertical to the horizontal plane. The clamp is provided with a plurality of clamps, each clamp configured to: fixed in position for holding the edge of the wafer but not impeding the rotation of the wafer. The edge washing nozzle is arranged at a preset height above the edge of the bearing structure, is positioned between the adjacent clamping pieces and is used for spraying edge washing solution to the edge of the wafer between the adjacent clamping pieces. The technical scheme of this application effectively improves the wafer and washes limit width homogeneity, improves and washes limit efficiency.

Description

Electroplating edge washing device and edge washing machine

Technical Field

The application relates to the field of semiconductor manufacturing, in particular to an electroplating edge washing device and an edge washing machine.

Background

In the field of semiconductor manufacturing, the edge of a wafer is often a region with high defects, particularly after a chemical copper plating process, the edge of the wafer is covered by a copper film, the uniformity of a barrier layer and a copper seed layer deposited by physical vapor deposition at the edge of the wafer is poor, and copper is easy to diffuse into a dielectric material at a local weak position (the edge position of the wafer) of the barrier layer, so that the performance of a device is influenced. In addition, the uneven copper seed layer at the edge has adhesion problem with the subsequent film, which is easy to fall off to generate particle substances, and reduces the product yield. Therefore, the edge copper film needs to be removed in time after the copper electroplating process.

In the prior art, the wafer edge copper film edge washing device comprises a rotatable bearing table, wherein a fixing clamp which rotates concentrically along with the bearing table is arranged on the bearing table, and an edge washing nozzle with a fixed position is arranged at a preset position above the bearing table.

On one hand, referring to the prior art of fig. 1, when the edge-washing operation is performed, the susceptor bears the wafer and provides a rotational driving force for the wafer, at this time, the fixing clamp clamps the wafer and concentrically rotates along with the susceptor, and the susceptor, the wafer and the fixing clamp concentrically rotate together. And because the position of the edge washing nozzle is not changed, when the fixed clamp rotates to pass through the position below the edge washing nozzle in the edge washing process, the edge washing solution sprayed to the edge of the wafer by the edge washing nozzle flows to the fixed clamp under the action of centrifugal force, the edge washing solution generates backflow splash due to the blocking of the fixed clamp, the backflow splash may cause the cleaning width of the edge of the wafer at the fixed clamp to be too wide, the edge washing width of the edge of the whole wafer to be uneven, further the edge of the wafer may be cracked, and the yield is affected. On the other hand, the problem of backflow of the edge washing solution caused by the fixed clamp is limited, the rotating speed of the wafer is not too high, the edge washing efficiency is low, and if the rotating speed of the wafer is too high, the centrifugal force is increased, and the phenomenon of more serious backflow is caused when the edge washing solution touches the fixed clamp.

Therefore, how to design an electroplating edge washing device capable of effectively improving the uniformity of the edge washing width and improving the edge washing efficiency becomes a hotspot of research in the industry.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide an electroplating edge washing device, which can effectively improve the uniformity of the edge washing width of a wafer and improve the edge washing efficiency.

The second purpose of the embodiment of the application is also to provide an edge washing machine using the electroplating edge washing device.

In a first aspect, an electroplating edge-washing device is provided, which is used for washing an edge of a wafer, and comprises: bearing structure, anchor clamps and wash limit nozzle. The bearing structure is used for bearing the wafer and enabling the wafer to be horizontally placed, and the bearing structure can drive the wafer to rotate around an axis vertical to the horizontal plane. The clamp is provided with a plurality of clamps, each clamp configured to: fixed in position for holding the edge of the wafer but not impeding the rotation of the wafer. The edge washing nozzle is arranged at a preset height above the edge of the bearing structure, is positioned between the adjacent clamping pieces and is used for spraying edge washing solution to the edge of the wafer between the adjacent clamping pieces.

In an implementation scheme, the clamping members are rollers capable of rotating around the axis, a plurality of the clamping members are uniformly distributed around the periphery of the edge of the wafer, each roller is provided with a rotating surface which is in contact with the edge of the wafer, and the edge washing solution thrown from the edge of the wafer to the roller 41 is just received by the rotating surface of the roller 41.

In an embodiment, the supporting structure includes a circumferential groove disposed on the roller, the circumferential groove is tangent to the edge of the wafer for supporting the edge of the wafer, and the plurality of rollers actively rotate in the same direction to drive the circumferential groove to rotate the wafer in the direction opposite to the direction of the roller. The bearing structure also comprises a rotatable bearing platform which is arranged at the lower part of the wafer and is used for bearing the lower surface of the wafer and rotating along with the rotation of the wafer in the same direction.

In one embodiment, the supporting structure includes a rotatable supporting platform disposed at a lower portion of the wafer for supporting a lower surface of the wafer and driving the wafer to rotate, and the roller rotates in a reverse direction with the rotation of the wafer. The roller is provided with a circumferential groove, and the circumferential groove is tangent to the edge of the wafer and is used for supporting the edge of the wafer.

In an implementable scheme, the bearing structure comprises a rotatable bearing platform, the bearing platform is arranged at the lower part of the wafer and is used for bearing the lower surface of the wafer, and the bearing platform and the roller wheel both actively rotate to drive the wafer to rotate together. The bearing structure also comprises a circumferential groove arranged on the roller, and the circumferential groove is tangent to the edge of the wafer and is used for bearing the edge of the wafer.

In one embodiment, the number of rollers is at least three.

According to the second aspect of the application, the edge washing machine is further provided, and the electroplating edge washing module in the technical scheme is included.

Compared with the prior art, the beneficial effect of this application is:

1. in this application, bearing structure supports the wafer and drives the wafer rotation, and the centrifugal force that the wafer rotation produced will wash the limit solution and get rid of the outside along the wafer edge. The anchor clamps in this application do not rotate along with the wafer axle center, wash limit nozzle and arrange between adjacent holder, form with the dislocation arrangement form of holder. So the holder in this application can not be through the below of washing the limit nozzle all the time, and the limit solution of washing the limit nozzle spun just can not directly spout the position to the holder yet, and the minimize eliminates even and washes the backward flow backsplash phenomenon of limit solution in holder department to guarantee that the washing width at wafer edge keeps unanimous, improve the wafer and wash the homogeneity of limit width.

2. In this application, owing to change structure, overall arrangement etc. of anchor clamps for wash the backward flow phenomenon of limit solution and reduce or even eliminate, consequently, can control the corresponding rotational speed that improves the wafer of bearing structure, and the corresponding solution outflow speed that improves the limit nozzle of washing, and then improve the limit efficiency of washing of wafer.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

FIG. 1 is a schematic view of a wafer edge cleaning in the prior art;

FIG. 2 is a block diagram of an apparatus for edge-washing in wafer electroplating according to an embodiment of the present disclosure;

FIG. 3 is a block diagram of another wafer edge electroplating apparatus according to an embodiment of the present disclosure;

FIG. 4 is a schematic view of the wafer of FIG. 3 without the wafer placed thereon;

FIG. 5 is a top view structural diagram of the electroplating edge-washing device shown in FIG. 2 or FIG. 3;

FIG. 6 is a top view of the electroplating edge-washing device with the number of rollers changed in FIG. 5.

In the figure: 10. a wafer; 20. a load bearing structure; 21. a circumferential groove; 22. a bearing table; 30. an edge washing nozzle; 40. a clamp; 41. and a roller.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The inventor finds that in the actual wafer electroplating edge-washing processing process, after the wafer is subjected to the edge-washing process, cracking phenomena may occur at certain positions of the edge of the wafer, so that the yield of the wafer is reduced. After multiple observations and experiments, the inventor finds that when the fixing clamp rotates together with the wafer and passes below the edge washing nozzle, the edge washing solution at the position where the edge of the wafer is clamped by the fixing clamp is blocked to generate a backflow phenomenon (as shown in fig. 1), so that the edge washing width of the edge of the wafer at the fixing clamp is too wide, the edge washing width is not uniform, and the problem of cracking of the edge of the wafer is further caused. Therefore, the structure and arrangement of the fixing clamp are creatively changed by the inventor to reduce or eliminate the backflow phenomenon at the clamp as much as possible and improve the uniformity of the edge washing width.

According to a first aspect of the present application, there is first provided an electroplating edge washing apparatus for edge washing of a wafer, see fig. 2-6, comprising a carrying structure 20, a clamp 40 and an edge washing nozzle 30. The supporting structure 20 is used for supporting the wafer 10 and horizontally placing the wafer 10, and the supporting structure 20 can drive the wafer 10 to rotate around an axis perpendicular to the horizontal plane. The clamp 40 is provided with a plurality of clamps, each clamp being configured to: stationary for holding the edge of the wafer 10 but not impeding the rotation of the wafer 10. The edge-washing nozzle 30 is disposed at a predetermined height above the edge of the carrier structure 20, and the edge-washing nozzle 30 is located between adjacent clamps for spraying an edge-washing solution toward the edge of the wafer 10 between the adjacent clamps.

In the above implementation process, the carrying structure 20 supports the wafer 10 and drives the wafer 10 to rotate, and the centrifugal force generated by the rotation of the wafer 10 throws the edge-washing solution along the edge of the wafer 10 to the outside. Anchor clamps 40 in this application do not rotate along with wafer 10 is concentric, wash limit nozzle 30 and arrange between adjacent holder, form the form of dislocation arrangement, so holder in this application can not be through the below of washing limit nozzle 30 all the time, wash limit nozzle 30 spun and wash limit solution can not direct spout to the position of holder, minimize or even eliminate the backward flow backsplash phenomenon of washing limit solution, thereby guarantee that the washing width at wafer 10 edge keeps unanimous, improve the homogeneity that wafer 10 washed the limit width. In addition, the structure and layout of the fixture 40 are changed, so that the backflow phenomenon of the edge washing solution is reduced or even eliminated, the bearing structure 20 can be controlled to correspondingly increase the rotation speed of the wafer 10, the solution outflow speed of the edge washing nozzle 30 is correspondingly increased, and the edge washing efficiency of the wafer 10 is further improved.

In the prior art, when the fixing clamp is not arranged below the edge washing nozzle 30, the centrifugal force generated by the rotation of the wafer 10 can throw part of the edge washing solution to the fixing clamp, and the back flow and the back splash can be generated when the edge washing solution is blocked by the fixing clamp. In order to make the solution of the present application also well cope with such a situation, the specific structure, clamping manner and layout of the clamp 40 are further supplemented below.

In one embodiment, referring to fig. 2 and 3, the clamping members are rollers 41 rotatable about an axis, and a plurality of clamping members are evenly distributed around the periphery of the edge of the wafer 10, each roller 41 is configured with a rotating surface that contacts the edge of the wafer 10, and the edge bead solution thrown from the edge of the wafer 10 toward the roller 41 is just received by the rotating surface of the roller 41. In the prior art (see fig. 1), the fixing clamp rotates along with the susceptor, and the position of the roller 41 in this embodiment is fixed, and only rotates around its own rotation axis, and does not rotate coaxially with the wafer 10. The edge-washing solution contacts the rotating surface on the surface of the rotating roller 41 and is guided out by the rotating roller 41 along the rotating surface, the rotating surface plays a role in drainage, the back splash generated by blocking is basically eliminated, the consistency of the edge-washing width of the wafer 10 at the position where the roller 41 is positioned with other positions is ensured, and the uniformity of the edge-washing width of the wafer 10 is improved.

In one embodiment, the edge-washing nozzle 30 is located between two adjacent rollers 41, and the edge-washing solution sprayed from the edge-washing nozzle 30 is sprayed toward the edge of the wafer 10 between two adjacent rollers 41. The arrangement can be further expressed as that the edge-washing nozzle 30 can be arranged between the adjacent rollers 41, the rollers 41 can avoid the position of the edge-washing nozzle 30, and the rotating surface of the rotating roller 41 meets the edge-washing solution and guides the edge-washing solution out, so that the backflow and the splashing are eliminated as much as possible, and the rollers 41 can also perform the functions of dynamically clamping and positioning the wafer 10.

Referring to fig. 2-4, a roller 41 may be provided with a circumferential groove 21, a susceptor 22 may be provided on a lower portion of the wafer 10, and one or both of the circumferential groove 21 and the susceptor 22 may be a component of the supporting structure 20 for supporting the wafer 10 and driving the wafer 10 to rotate. The specific embodiment of the load bearing structure 20 is as follows:

in the first embodiment of the carrier structure 20, see fig. 2, the carrier structure 20 may comprise only the circumferential groove 21 and no carrier table 22. During edge washing, the edge of the wafer 10 is embedded into the circumferential groove 21, the circumferential groove 21 is tangent to the edge of the wafer 10, and the plurality of circumferential grooves 21 are used for supporting the edge of the wafer 10. The rollers 41 can be driven by a driving device or a plurality of driving devices to rotate in the same direction, and the rollers 41 actively rotate in the same direction to rub the circumferential groove 21 to drive the wafer 10 to rotate in the opposite direction of the rollers 41. At this moment, the circumferential groove 21 plays roles of supporting, positioning and dynamic clamping, and also plays a role of driving the wafer 10 to rotate, a rotating surface is also arranged in the rotating circumferential groove 21 and is also a part of the rotating surface of the roller 41, and the rotating surface of the rotating circumferential groove 21 is also beneficial to reducing splashing of the edge washing solution, so that better drainage is realized. In addition, referring to fig. 3, a susceptor 22 may be added while the circumferential groove 21 is used to support and drive the wafer 10 to rotate. In this case, the susceptor 22 is disposed below the wafer 10, and serves only to assist in supporting the lower surface of the wafer 10, and rotates in the same direction as the wafer 10 rotates. The addition of the auxiliary support and follow-up susceptor 22 allows the wafer 10 to rotate more smoothly.

In the second embodiment of the bearing structure 20, see fig. 3 and 4, the bearing structure 20 may comprise only the rotatable bearing table 22, but not the circumferential grooves 21 (the circumferential grooves 21 are not provided on the rollers 41). The susceptor 22 is disposed below the wafer 10 for supporting a lower surface of the wafer 10, the susceptor 22 can be driven by a driving device to rotate, the wafer 10 is driven by the rotating susceptor 22, and the roller 41 rotates in a reverse direction with the rotation of the wafer 10. At this time, the susceptor 22 actively rotates to drive the wafer 10 to rotate, the roller 41 follows up the wafer 10 under the rotating friction effect, the roller 41 plays a role in clamping and positioning, and the following rotation of the roller 41 can also drain the edge-washing solution. In addition, the roller 41 may also be provided with a circumferential groove 21, and the circumferential groove 21 may also serve as a part of the supporting structure 20 for supporting, specifically, the circumferential groove 21 is tangential to the edge of the wafer 10 and is used for supporting the edge of the wafer 10.

In a third embodiment of the carrier structure 20, referring to fig. 3 and 4, the carrier structure 20 includes a rotatable susceptor 22 and a circumferential groove 21, wherein the susceptor 22 and the circumferential groove 21 can both support and position the wafer 10, and the circumferential groove 21 can also dynamically clamp and guide the wafer 10. The bearing table 22 and the roller 41 with the circumferential groove 21 can both actively rotate, the rotation of the bearing table 22 and the roller 41 can be realized by a driving device matched with a transmission structure, or a plurality of driving devices are used for respectively driving the bearing table 22 and the roller 41, the rotation direction of the roller 41 is opposite to that of the wafer 10, and the rotation direction of the bearing table 22 is the same as that of the wafer 10. The rotation speeds of the susceptor 22 and the rollers 41 are matched to generate a common stable driving force for the wafer 10.

The three embodiments of the supporting structure 20 have the roller 41, so that the roller 41 does not rotate with the wafer 10 and does not pass through the position below the edge-washing nozzle 30, and thus, the backflow and splashing can be reduced or eliminated well, and the roller 41 can also play a good role in draining the flow due to the rotation thereof. The bearing structure 20 can be reasonably selected according to the requirements of bearing mode, precision, cost and the like.

In one embodiment, the surface of rotation of roller 41 includes, but is not limited to, a cylindrical surface, a curved surface of rotation, and a conical surface, and the surface of rotation of circumferential groove 21 includes, but is not limited to, an inwardly concave curved surface of rotation, an inwardly concave cylindrical surface, an inwardly concave stepped cylindrical surface, or an inwardly concave conical surface, and the like.

In one embodiment, referring to fig. 5 and 6, the number of rollers 41 is at least three, and three, four, etc. may be used. The use of at least three rollers 41 ensures a good hold-positioning effect. And when the plurality of rollers 41 actively rotate, the rotational driving frictional force generated to the wafer 10 is more uniform.

It should be noted that, the clamping part of the fixture 40 may be configured by adding (as shown in fig. 1) a steel ball, a micro-fluency strip, and other structures that are in rolling contact with the wafer 10 on the basis of the original structure of the fixture, so that the fixture 40 is changed to a fixture 40 that does not rotate coaxially with the wafer 10, and the steel ball, the micro-fluency strip, and other structures may also realize dynamic holding of the wafer 10 by the fixture 40. The fixture 40 may further adopt a structure that a sliding groove matched with the edge of the wafer 10 is additionally arranged on the basis of the original fixed fixture, and a lubricant which has no influence on the wafer 10 is added in the sliding groove, so as to realize the contact sliding of the flow field. The structure of the jig 40 is not limited to the above-mentioned structure.

In one embodiment, the edge wash nozzles 30 are disposed in the area between adjacent rollers 41. According to the requirement of the edge washing efficiency, one edge washing nozzle 30 can be arranged, and a plurality of edge washing nozzles 30 can also be arranged. When a plurality of edge washing nozzles 30 are arranged, the edge washing nozzles 30 can be arranged between any two adjacent rollers 41, so that the faster edge washing speed is realized, and the edge washing nozzles and the rollers 41 are arranged in a staggered manner, and interference influence is eliminated.

In one embodiment, the supporting structure 20 is further provided with a positioning member for positioning the wafer 10 mounted on the supporting structure 20 and an adsorbing member contacting and adsorbing the lower surface of the wafer 10.

In one embodiment, the edge-washing nozzle 30 supplies the edge-washing solution from a supply device, which includes a supply line for delivering the edge-washing solution, and the supply device may have a flow-adjustable speed-adjusting function to ensure that the edge-washing solution matches the rotation speed of the wafer 10.

The surface of rotation of the rotating roller 41 performs a drainage function, and in one embodiment, a drainage structure may be further disposed to perform a drainage function, and the drainage structure may be proximate to the edge of the wafer 10 for leading out the edge-washing solution at the edge of the wafer 10. The flow directing structure may be a surface of revolution of the roller 41 to effect flow directing. The drainage structure can also adopt the suction nozzle to set up the mode at wafer 10 edge and carry out the drainage, perhaps changes mounting fixture's structure, sets up the through-hole so that the drainage with the position that mounting fixture and wafer 10 contacted in FIG. 1, perhaps sets up solution absorption piece again on mounting fixture, will touch mounting fixture's the solution of washing the limit in time to absorb. The form of the flow guide structure is not limited to the above structure.

According to the second aspect of the application, the edge washing machine is further provided, the electroplating edge washing device in the technical scheme has the advantages of the electroplating edge washing device.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. An electroplating edge-washing device for washing the edge of a wafer (10), which is characterized by comprising:

the bearing structure (20) is used for bearing the wafer (10) and enabling the wafer (10) to be horizontally placed, and the bearing structure (20) can drive the wafer (10) to rotate around an axis vertical to the horizontal plane;

a clamp (40) provided with a plurality of clamps, each clamp configured to: a stationary position for holding an edge of the wafer (10) without impeding rotation of the wafer (10);

the edge washing nozzle (30) is arranged at a preset height above the edge of the bearing structure (20), and the edge washing nozzle (30) is positioned between the adjacent clamping pieces and used for spraying edge washing solution to the edge of the wafer (10) between the adjacent clamping pieces.

2. The apparatus according to claim 1, wherein the clamping members are rollers (41) rotatable about an axis, a plurality of the clamping members being evenly distributed around the periphery of the edge of the wafer (10), each of the rollers (41) being provided with a surface of rotation in contact with the edge of the wafer (10);

the edge washing solution thrown to the roller (41) from the edge of the wafer (10) is just received by the rotating surface of the roller (41).

3. The electroplating edge-washing device according to claim 2, characterized in that the carrying structure (20) comprises a circumferential groove (21) disposed on the roller (41), the circumferential groove (21) is tangential to the edge of the wafer (10) for supporting the edge of the wafer (10), and the plurality of rollers (41) actively rotate in the same direction to make the circumferential groove (21) drive the wafer (10) to rotate in the opposite direction of the roller (41).

4. The apparatus according to claim 3, wherein the carrier structure (20) further comprises a rotatable susceptor (22), the susceptor (22) being disposed at a lower portion of the wafer (10) for supporting a lower surface of the wafer (10) and rotating in the same direction as the wafer (10).

5. The apparatus according to claim 2, wherein the supporting structure (20) comprises a rotatable supporting platform (22) disposed at a lower portion of the wafer (10) for supporting a lower surface of the wafer (10) and rotating the wafer (10), and the roller (41) rotates in a direction opposite to the rotation of the wafer (10).

6. The electroplating edge-washing device according to claim 5, characterized in that the roller (41) is provided with a circumferential groove (21), and the circumferential groove (21) is tangential to the edge of the wafer (10) and is used for supporting the edge of the wafer (10).

7. The apparatus according to claim 2, wherein the supporting structure (20) comprises a rotatable supporting platform (22), the supporting platform (22) is disposed at a lower portion of the wafer (10) and is configured to support a lower surface of the wafer (10), and the supporting platform (22) and the roller (41) are both actively rotated to jointly rotate the wafer (10).

8. The apparatus according to claim 7, wherein the carrier structure (20) further comprises a circumferential groove (21) provided on the roller (41), the circumferential groove (21) being tangential to the edge of the wafer (10) and adapted to hold the edge of the wafer (10).

9. The edge washing apparatus according to any one of claims 2 to 8, wherein the number of the rollers (41) is at least three.

10. An edge washing machine comprising the electrolytic edge washing device according to any one of claims 1 to 9.

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