CN215639858U - Thermocouple comparison device - Google Patents
Thermocouple comparison device Download PDFInfo
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- CN215639858U CN215639858U CN202122040396.0U CN202122040396U CN215639858U CN 215639858 U CN215639858 U CN 215639858U CN 202122040396 U CN202122040396 U CN 202122040396U CN 215639858 U CN215639858 U CN 215639858U
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Abstract
The application relates to a thermocouple comparison device, include: the constant temperature device comprises a constant temperature device and a heat conductor arranged in the constant temperature device; the bottom of the heat conductor is provided with a plurality of thermoelectric refrigerators which are circumferentially distributed along the axis of the heat conductor; the top center of the heat conductor is provided with a platinum resistor, the periphery of the platinum resistor is provided with a plurality of thermocouples, and the platinum resistor and the thermocouples measure the temperature of the heat conductor at the same time so as to compare and detect the plurality of thermocouples. By the thermocouple comparison device, a plurality of thermocouples meeting the requirements can be selected in one comparison under the same temperature measurement condition, the consistency of the thermocouples is effectively ensured, and the calibration comparison efficiency is greatly improved. The thermocouple comparison device has the characteristics of simple structure and high comparison precision, can effectively reduce the calibration times, and reduces the comparison and detection cost of the thermocouple on the premise of ensuring the comparison precision.
Description
Technical Field
The application relates to the technical field of thermocouples, in particular to a thermocouple comparison device.
Background
The heat conducting pad process identification test is carried out on the selected heat conducting pad according to the typical installation technical state of satellite single-machine equipment, and whether the heat conducting pad can realize the installation surface contact heat transfer coefficient of not less than 500W/(m) under certain installation technical conditions is verified2K) requirements.
In the existing verification process of the heat conduction pad installation surface contact heat transfer coefficient, the temperature control range of the simulation cabin plate is between minus 40 ℃ and 80 ℃, and a plurality of thermocouples are required to be adhered to different temperature measurement points of the heat conduction pad.
In the identification test of the heat conducting pad, the thermocouple for measuring the temperature needs to have higher measurement accuracy, and the temperature measurement accuracy is generally required to be controlled at 0.1 ℃, namely the temperature consistency of the thermocouple is less than 0.1 ℃. Only the thermocouples meeting the measurement precision requirement can be used for measurement, in the traditional thermocouple calibration, only a single thermocouple can be used for calibration, but a plurality of thermocouples cannot be simultaneously measured to display the measurement temperature, and the plurality of thermocouples meeting the requirement applied to the measurement process of the contact heat transfer coefficient of the same mounting surface are difficult to select.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the application is to provide a thermocouple comparison device for measuring and displaying a plurality of thermocouples simultaneously, so that a plurality of thermocouples with high consistency under the same temperature measurement condition are selected, and the requirement of a verification test of the contact heat transfer coefficient of the installation surface of a heat conduction pad is met.
The utility model provides a thermocouple comparison device, which comprises: the constant temperature device comprises a constant temperature device and a heat conductor arranged in the constant temperature device;
the bottom of the heat conductor is provided with a plurality of thermoelectric refrigerators which are circumferentially distributed along the axis of the heat conductor;
the top center of the heat conductor is provided with a platinum resistor, the periphery of the platinum resistor is provided with a plurality of thermocouples, and the platinum resistor and the thermocouples are connected with a temperature display.
The platinum resistor and the thermocouples transmit the measured temperature of the heat conductor to a temperature display at the same time, so that the temperature of the heat conductor measured by the thermocouples is compared and detected, and the thermocouple with high consistency is selected.
The thermoelectric refrigerators are arranged at the bottom of the heat conductor and are distributed along the axial center circumference of the heat conductor, so that heat or cold generated by the thermoelectric refrigerators can be uniformly transferred upwards, and the area at the top of the heat conductor is kept at the same temperature.
Combine the platinum resistance that sets up at the heat conductor top and carry out the thermocouple of comparing, make platinum resistance and thermocouple measure the temperature of heat conductor simultaneously, can use the temperature that platinum resistance measured to as the benchmark, compare the detection simultaneously to a plurality of thermocouples, can select the thermocouple of the coincidence requirement more directly perceivedly, greatly improved comparison efficiency.
In an alternative embodiment, a plurality of thermoelectric refrigerators are uniformly distributed on the heat conductor at intervals, and are attached to the bottom wall plane of the heat conductor.
Through the thermoelectric cooler evenly distributed on the heat conductor at intervals, heat or cold generated by the thermoelectric cooler to the heat conductor can be more uniformly transmitted in the heat conductor, and each heat conductor is guaranteed to heat or cool the heat conductor in a punctiform upward radiant heat mode.
Through all laminating thermoelectric cooler on the diapire plane of heat conductor, can heat or cool off the heat conductor more directly, make thermoelectric cooler can control the heat conductor temperature more directly.
In an alternative embodiment, the number of thermoelectric coolers is even, and the thermoelectric coolers are in central symmetry on the plane of the bottom wall of the heat conductor.
Through the thermoelectric refrigerator with central symmetrical distribution, the heat or cold of the thermoelectric refrigerator can be transferred to the heat conductor in a more uniform mode, and the top of the heat conductor is favorable for forming a temperature measurement area with consistent temperature.
In an alternative embodiment, the thermocouple is arranged on a circular line centered on the platinum resistor, the diameter of the circular line being 15-30 mm.
Based on the temperature of the thermal conductor top temperature measurement area keeps consistent, each part on the circular line can be kept at the same temperature by placing the thermocouple on the circular line with the platinum resistor as the center of a circle, and comparison between different thermocouples and the platinum resistor can be facilitated.
In an optional embodiment, the heat conductor is a solid cylinder, and the material of the heat conductor is red copper.
The solid cylinder is more favorable to the produced heat of thermoelectric cooler or the transmission of cold volume on the heat conductor, and through the heat conductor of red copper material, can improve heat transfer coefficient at the at utmost, and the heat conductor that combines solid cylinder can make heat or cold volume distribute more evenly on the heat conductor, improves temperature measurement and contrast precision.
In an alternative embodiment, the ratio between the diameter of the heat conductor and the diameter of the circular wire does not exceed 3: 1.
The ratio of the diameter of the heat conductor to the diameter of the thermocouple-arranged circular line is limited, so that all thermocouples can be placed on the effective temperature measurement circular line, and the temperature measurement point of the heat conductor can be measured more effectively.
In an optional embodiment, the platinum resistor and the thermocouple each include a temperature sensing chip for measuring a temperature of the heat conductor, and the temperature sensing chip is attached to a top wall plane of the heat conductor.
In an optional implementation manner, the temperature sensing chips are connected with data cables, and the data cables are externally connected with a temperature display.
In an alternative embodiment, a control system is further included, and a plurality of the thermoelectric coolers are each electrically connected to the control system.
Through control system, can be to a plurality of thermoelectric cooler simultaneous control, make it heat or refrigerate simultaneously, and can control the heat conductor and keep in different temperature points, realized comparing the detection to the alternating temperature of thermocouple, through the comparison detection to a plurality of different temperature points, effectively improved the degree of accuracy of thermocouple comparison result, and be close to the actual use operating mode of thermocouple under different temperature environment more, guaranteed that the thermocouple has good application property.
In an alternative embodiment, the temperature display is electrically connected to the control system, and the control system can compare the measured temperature of the platinum resistor with the reference point of the plurality of thermocouples.
The temperature display is electrically connected with the control system, so that the control system receives temperature signals of the platinum resistor and the thermocouples, and can compare the temperature measured by the platinum resistor with the temperature measured by the control system as a reference point among a plurality of thermocouples on a circular line with the same temperature, and select the thermocouple with higher consistency.
In an optional embodiment, the constant temperature device is an insulation box, and an insulation layer is lined inside the insulation box.
The insulation can play good heat preservation effect, makes the heat conductor keep apart with external environment, prevents to appear with external cold and hot exchange, guarantees the uniformity at the comparison in-process heat conductor top temperature of thermocouple from the at utmost.
By the thermocouple comparison device, a plurality of thermocouples meeting the requirements can be selected in one comparison under the same temperature measurement condition, the consistency of the thermocouples is effectively ensured, and the calibration comparison efficiency is greatly improved.
The thermocouple comparison device has the characteristics of simple structure and high comparison precision, can effectively reduce the calibration times, and reduces the comparison and detection cost of the thermocouple on the premise of ensuring the comparison precision.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a thermocouple comparison apparatus provided in an embodiment of the present application;
FIG. 2 is a diagram of a thermoelectric cooler disposed on the bottom of a thermal conductor according to one embodiment of the present application;
FIG. 3 is a diagram of a thermoelectric cooler disposed on the bottom of a thermal conductor according to another embodiment of the present application;
FIG. 4 is a diagram illustrating the distribution of platinum resistors and thermocouples on the top of a thermal conductor according to an embodiment of the present invention.
Icon:
10-an incubator; 11-a heat-insulating layer; 20-a heat conductor; 30-a thermoelectric refrigerator; 40-platinum resistance; 50-a thermocouple; 60-a temperature sensing chip; 70-data cable.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
In the description of the present application, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when using, and are only used for convenience in describing the present application and simplifying the description, but do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Fig. 1 is a schematic structural diagram of a thermocouple comparison apparatus provided in an embodiment of the present application, including: a thermostat and a heat conductor 20 arranged in the thermostat;
a plurality of thermoelectric refrigerators 30 are arranged at the bottom of the heat conductor 20, and the thermoelectric refrigerators 30 are circumferentially arranged along the axis of the heat conductor 20;
the top center of the heat conductor 20 is provided with a platinum resistor 40, the periphery of the platinum resistor 40 is provided with a plurality of thermocouples 50, and the platinum resistor 40 and the plurality of thermocouples 50 are both connected with a temperature display.
The temperature of the thermal conductor 20 measured by the platinum resistor 40 and the thermocouple 50 at the same time is compared to detect a plurality of thermocouples 50.
The thermocouple comparison device is mainly used for comparing the thermocouples 50 by taking the platinum resistor 40 as a temperature measuring base point when the platinum resistor 40 and the thermocouples 50 simultaneously measure the temperature of the heat conductor 20, so that a plurality of thermocouples 50 with high consistency are selected in one measurement process, and the thermocouples 50 with excellent temperature measuring performance are provided for the verification of the contact heat transfer coefficient of the mounting surface of the heat conducting pad.
The platinum resistor 40 and the thermocouple 50 specifically measure the temperature of the heat conductor 20 in the measurement process, and the temperature of the temperature measuring area at the top of the heat conductor 20 is kept consistent, so that the platinum resistor 40 and the thermocouple 50 can measure the temperature at the top of the heat conductor 20, and the temperature of the plurality of thermocouples 50 is simultaneously observed by taking the temperature measured by the platinum resistor 40 as a reference point, so that the thermocouples 50 with higher consistency can be more intuitively compared, and the comparison efficiency of the thermocouples 50 is effectively improved.
In order to reduce the dissipation of heat or cold from the thermal conductor 20 during the measurement process, the thermal conductor 20 is placed in a thermostat for comparison with the thermocouple 50, as well as the platinum resistor 40 and the thermocouple 50.
The temperature of the heat conductor 20 is specifically controlled by the plurality of thermoelectric refrigerators 30 arranged at the bottom of the heat conductor 20, the plurality of thermoelectric refrigerators 30 are arranged at the bottom of the heat conductor 20 and are circumferentially arranged along the axis of the heat conductor 20, each thermoelectric refrigerator 30 can be a heat supply point or a cold supply point, and when heat or cold is transferred on the heat conductor 20, the heat or cold is upwards conducted in a conical surface radiation manner by taking the heat supply point or the cold supply point as a base point, so that the heat or cold generated by the plurality of thermoelectric refrigerators 30 is crossly converged on the heat conductor 20, and the top area of the heat conductor 20 is kept at the same temperature.
The platinum resistor 40 and the thermocouple 50 are specifically disposed on the top of the thermal conductor 20 while temperature measurement is performed, based on the temperature uniformity at the top of the thermal conductor 20. The platinum resistor 40 is arranged at the center of the top of the heat conductor 20, and a plurality of thermocouples 50 to be compared are arranged at the periphery of the platinum resistor 40, so that the comparison precision of the thermocouples 50 is further improved.
The plurality of thermoelectric refrigerators 30 are uniformly distributed at the bottom of the heat conductor 20 at intervals, and all the thermoelectric refrigerators 30 are attached to the bottom wall plane of the heat conductor 20, so that the generated heat or cold can be directly transferred to the heat conductor 20.
Referring to fig. 2 to 3, in order to maintain uniformity of the plurality of thermoelectric coolers 30 in upward heat conduction, the number of thermoelectric coolers 30 is preferably an even number of not less than two, and may be, for example, four, six or eight, and the plurality of thermoelectric coolers 30 are arranged on the bottom wall of the heat conductor 20 in a central symmetrical manner. Based on the above description of the heat transfer form angles of the plurality of thermoelectric coolers 30, the thermoelectric coolers 30 distributed in a central symmetry manner can make the heat or the cold more uniformly meet and merge in the transfer of the heat conductor 20, so that the heat or the cold transferred to the top of the heat conductor 20 can be kept consistent to the maximum extent, and the temperature at the top of the heat conductor 20 can be kept consistent.
Based on the divergent form of the cone on the heat conductor 20 of the heat or cold, when the number of the thermoelectric coolers 30 is large enough, the temperature of all the areas on the top of the heat conductor 20 can be made the same; when the number of thermoelectric coolers 30 is not so large as to cover the entire top of thermal conductor 20, the temperature distribution at the top of thermal conductor 20 is such that the temperature remains the same over a plurality of intersecting circular areas.
Therefore, in the present embodiment, when measuring temperature, the thermocouples 50 are arranged on a circular line with the platinum resistor 40 as a center, and the platinum resistor 40 arranged at the center of the top of the heat conductor 20 is used as a reference point for measuring temperature, and the thermocouples 50 arranged at a plurality of temperature measuring points on the circular line with the same temperature distribution are compared, and the thermocouples 50 with lower consistency and larger temperature difference with other thermocouples 50 can be visually distinguished in the comparison process, so that the thermocouples 50 with higher consistency are selected.
The diameter of the circular wire is 15-30mm, and the diameter of the circular wire is preferably 20mm in the embodiment, so that the arrangement mode can be used for facilitating the arrangement of the thermocouples 50 under the working condition that the temperature of all areas on the top of the heat conductor 20 is the same.
In order to ensure the smoothness of the heat transfer process of the heat conductor 20, the heat conductor 20 is made of a solid cylindrical red copper block. The heat conduction of heat or cold on the heat conductor 20 is facilitated through the form of the cylinder, and the red copper block has a good heat transfer coefficient, so that the thermoelectric refrigerator 30 can conveniently control the temperature of the heat conductor 20.
Referring to fig. 4, from the perspective of heat conduction in the form of a tapered surface, in order to make the temperature collected by the thermocouple 50 more effective, it is necessary to consider the installation position of the thermocouple 50, and in this embodiment, the ratio between the diameter of the heat conductor 20 and the diameter of the circular wire is not more than 3:1, and it is more preferable that the diameter of the circular wire is made to be the same as the length of the annular gap outside the circular wire in the radial direction of the circular wire, and the cylindrical body is equally divided into three equal lengths in the radial direction by the circular wire.
The same temperature distribution on the circular line can be formed to the maximum extent, and the accuracy of the comparison result of the thermocouple 50 is improved.
The temperature sensing chips 60 are all connected with data cables 70, and the data cables 70 are externally connected with a temperature display. The data cable 70 transmits the temperature signal to the temperature display, so that the temperature signal can be observed more visually in the comparison process, and the comparison efficiency is improved.
In a specific comparison process, the comparison between the thermocouples 50 may be performed by electrically connecting the temperature display with the control system through a temperature signal received by the control system.
In a specific example, if the temperature of all areas on the top of the thermal conductor 20 is the same, the thermocouple 50 with higher consistency is selected by the control system by detecting that the temperature measured by the thermocouple 50 is the same as the temperature measured by the platinum resistor 40; when the temperature at the top of the thermal conductor 20 conforms to the same working condition of temperature on the circular line, the thermocouples 50 with higher temperature consistency among the thermocouples 50 are detected by the control system to be selected, for example, when 8 thermocouples 50 are simultaneously compared, one of the thermocouples with different temperature from the displayed temperature of the other 7 thermocouples 50 is picked to remove the thermocouple 50 with higher consistency. A plurality of indication positions may be provided on a controller of the control system, each indication position corresponds to the thermocouple 50, and an indication lamp may be provided on the indication position to indicate the comparison result.
The thermocouple comparison device in this embodiment requires that the heat conductor 20 performs comparison for multiple times at different temperatures, and by electrically connecting the thermoelectric refrigerators 30 to the control system, the control system can control the plurality of thermoelectric refrigerators 30 to heat or refrigerate simultaneously, so that the heat conductor 20 can perform measurement at different temperatures.
The thermostat is specifically an incubator 10 with a detachable cover body, which can facilitate the disassembly and assembly of the thermocouple 50 at the top of the heat conductor 20, and the inner side of the incubator 10 is lined with the heat insulation layer 11, so that the heat conductor 20 is isolated from the outside in the comparison process, and the heat exchange with the outside is reduced.
What need point out is that through regard as platinum resistance 40 as the temperature measurement benchmark to through cylindric red copper piece as heat conductor 20, have good heat-conduction effect, through enclosing the thermocouple 50 that needs the comparison in platinum resistance 40's circumference ring region, can effectively guarantee the accuracy of the comparison result based on the same temperature measurement benchmark, improve the accuracy of heat conduction pad installation face contact heat transfer coefficient verification process.
It should be noted that the features of the embodiments in the present application may be combined with each other without conflict.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A thermocouple comparison device, comprising: the constant temperature device comprises a constant temperature device and a heat conductor arranged in the constant temperature device;
the bottom of the heat conductor is provided with a plurality of thermoelectric refrigerators which are circumferentially distributed along the axis of the heat conductor;
the top center of the heat conductor is provided with a platinum resistor, the periphery of the platinum resistor is provided with a plurality of thermocouples, and the platinum resistor and the thermocouples are connected with a temperature display.
2. The thermocouple comparison device according to claim 1, wherein a plurality of thermoelectric coolers are uniformly spaced on the heat conductor and are attached to the bottom wall plane of the heat conductor.
3. A thermocouple comparison device as claimed in claim 1 wherein the number of thermoelectric coolers is even and is centrally symmetrical in the plane of the bottom wall of the heat conductor.
4. The thermocouple comparison device according to claim 1, wherein the thermocouple is disposed on a circular line centered on the platinum resistor, the diameter of the circular line being 15-30 mm.
5. The thermocouple comparison device according to claim 4, wherein the heat conductor is a solid cylinder and is made of red copper.
6. Thermocouple alignment apparatus according to claim 5, wherein the ratio between the diameter of the thermal conductor and the diameter of the circular wire is no more than 3: 1.
7. The thermocouple comparison device according to claim 5, wherein the platinum resistor and the thermocouple each include a temperature sensing chip for measuring the temperature of the heat conductor, and the temperature sensing chip is attached to a top wall plane of the heat conductor.
8. The thermocouple comparison device according to claim 7, further comprising a control system, wherein a plurality of said thermoelectric coolers are electrically connected to said control system.
9. The thermocouple comparison device according to claim 8, wherein the temperature display is electrically connected to the control system, and the control system is capable of performing comparison between a plurality of the thermocouples using the temperature measured by the platinum resistor as a reference point.
10. The thermocouple comparison device according to any one of claims 1 to 9, wherein the thermostatic device is an incubator, and an inner side of the incubator is lined with a heat insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122040396.0U CN215639858U (en) | 2021-08-26 | 2021-08-26 | Thermocouple comparison device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122040396.0U CN215639858U (en) | 2021-08-26 | 2021-08-26 | Thermocouple comparison device |
Publications (1)
| Publication Number | Publication Date |
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| CN215639858U true CN215639858U (en) | 2022-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122040396.0U Active CN215639858U (en) | 2021-08-26 | 2021-08-26 | Thermocouple comparison device |
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| CN (1) | CN215639858U (en) |
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2021
- 2021-08-26 CN CN202122040396.0U patent/CN215639858U/en active Active
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