CN215637381U - Cooking utensil - Google Patents

Abstract

The application provides a cooking utensil relates to household electrical appliances technical field to solve the technical problem that the high temperature component on the current circuit board easily contacts with the wire. The cooking utensil comprises a shell (1), wherein an accommodating cavity (2) is formed in the shell (1), a circuit board (3), a functional piece (4) and a supporting piece (6) are arranged in the accommodating cavity (2), the circuit board (3) and the functional piece (4) are electrically connected through a wire (5), and the supporting piece (6) is positioned on a wiring path of the wire (5); the circuit board (3) is provided with a high-temperature element (31), at least part of the support (6) is higher than the upper surface of the high-temperature element (31), at least part of the lead (5) is positioned on the support (6), and the lower surface of the at least part of the lead (5) is higher than the upper surface of the high-temperature element (31). This application can prevent high temperature component and wire contact on the circuit board, avoids the wire to damage, improves cooking utensil's life.

Description

Cooking utensil

Technical Field

The application relates to the technical field of household appliances, in particular to a cooking appliance.

Background

The induction cooker as a common electromagnetic cooking appliance has the advantages of rapid heating, no open fire, safety, convenience and the like, and is favored and approved by more and more consumers.

The induction cooker comprises a bottom shell and an upper cover, wherein the upper cover covers the bottom shell, the upper cover and the bottom shell jointly enclose a containing cavity, a circuit board, a control board, a heat dissipation fan and a coil panel are arranged in the containing cavity, the control board, the coil panel and the heat dissipation fan are all electrically connected with the circuit board through wires, and a user controls the working states of the coil panel and the heat dissipation fan through the control board.

However, high temperature components on the circuit board are easy to contact with the wires, so that the wires are easy to damage, and the service life of the induction cooker is influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve at least one of the problems mentioned in the background art, the present application provides a cooking appliance, which can prevent a high temperature component on a circuit board from contacting with a wire, avoid the wire from being damaged, and improve the service life of the cooking appliance.

In order to achieve the above object, the present application provides a cooking appliance, which includes a housing, wherein a housing cavity is provided in the housing, a circuit board, a functional component and a supporting component are provided in the housing cavity, the circuit board and the functional component are electrically connected through a wire, and the supporting component is located on a wiring path of the wire in the housing.

The circuit board is provided with a high-temperature element, at least part of the supporting piece is higher than the upper surface of the high-temperature element, at least part of the leads are positioned on the supporting piece, and the lower surface of the at least part of the leads is higher than the upper surface of the high-temperature element.

According to the cooking utensil provided by the embodiment of the application, the supporting piece is arranged in the accommodating cavity and used for supporting the conducting wire, so that part of the conducting wire is located above the high-temperature element and is higher than the upper surface of the high-temperature element. Therefore, on one hand, the high-temperature element is prevented from contacting the lead, the lead is prevented from being damaged by the high-temperature element, and the service life of the lead and the service life of the cooking utensil are prolonged. On the other hand, the lead can cross the high-temperature element to be wired, so that the wiring path of the lead is reduced, the length of the lead is reduced, and the manufacturing cost is reduced.

In an embodiment, the support has a support surface on which the conductor is located, the support surface being higher than the upper surface of the high-temperature component.

The height difference between the supporting surface and the upper surface of the high-temperature element is between 0.5 and 10 mm.

Thus, the supporting surface supports the lead, the supporting stability of the lead is improved, and the lead is prevented from contacting with a high-temperature element.

In one possible embodiment, the support is located on the bottom wall of the housing and is arranged close to the high-temperature element.

Like this, make support piece setting more convenient on the one hand, on the other hand makes support piece better to the supporting effect of wire, and furthest guarantees that the wire does not contact with high temperature component.

In one possible embodiment, the support comprises a support plate, the root of which is located on the bottom wall of the housing, the end of the support plate extending away from the bottom wall of the housing, and the support surface being located on the end of the support plate.

Therefore, the conducting wires are supported by the supporting plate, so that the supporting piece is simpler in structure and more convenient to manufacture.

In one possible embodiment, the support surface is planar; or the supporting surface is a curved surface.

Therefore, the structure of the supporting surface can be more diversified, and the processing and the manufacturing are convenient.

In an embodiment, the support plate is provided with a recess at its end, the wall of the recess forming the support surface.

Therefore, the lead can be positioned in the groove and is not easy to be separated from the support.

In a practical embodiment, the end of the support plate is provided with an extension part, the root of the extension part is connected with the groove, the end of the extension part extends towards the direction close to the high-temperature element, the plate surface of the support plate is perpendicular to the bottom wall of the shell, and the extension part extends in a direction perpendicular to the plate surface of the support plate.

The shape of the extension part is matched with that of the groove, and the surface of the extension part and the wall surface of the groove form a supporting surface together.

Therefore, the contact surface between the supporting piece and the lead can be larger, and the supporting effect on the lead is better.

In one possible embodiment, the width of the groove is not less than the diameter of the wire and the depth of the groove is not less than the radius of the wire.

And/or the width of the groove is between 1.5 and 20 mm.

And/or the depth of the groove is between 1.5 and 15 mm.

Therefore, the groove can better fix the lead, and the lead is not easy to be separated from the support piece.

In an embodiment, the end of the supporting member is provided with a wire clamping portion, the wire clamping portion and the supporting surface together form a wire clamping area, and the conducting wire is located in the wire clamping area.

Therefore, the lead can be clamped on the supporting piece, the lead is prevented from being separated from the supporting piece, and the supporting stability of the supporting piece for the lead is improved.

In an implementation, the supporting member further includes a reinforcing rib disposed on the bottom wall of the housing and connected to the side wall surface of the supporting plate.

Thus, the structural strength of the support member can be improved, and the structural stability of the support member can be enhanced.

In one embodiment, the bottom wall of the housing is provided with support ribs, the support ribs and the reinforcing ribs are located on two opposite sides of the support plate, part of the support ribs are connected with the support plate, and the circuit board is located on the support ribs.

Therefore, the supporting ribs have double-layer functions, so that the circuit board can be supported on one hand, and the structural strength of the supporting piece can be improved on the other hand.

In an embodiment that can realize, the function piece includes radiator fan, lamp plate and heating plate, and the wire includes first wire, second wire and third wire, and heating plate and circuit board are connected to first wire, and radiator fan and circuit board are connected to the second wire, and lamp plate and circuit board are connected to the third wire.

The groove comprises a first groove and a second groove, the first groove and the second groove are arranged at the end part of the supporting plate at intervals, the first lead is positioned in the first groove, and the second lead and/or the third lead are/is positioned in the second groove.

Like this, can block high-voltage wire and low-voltage wire respectively and establish in the recess of difference, avoid high-voltage wire and low-voltage wire contact, improve cooking utensil's security.

In an implementation manner, the housing includes an upper cover, a middle frame and a lower cover, the middle frame connects the upper cover and the lower cover, the upper cover, the middle frame and the lower cover together enclose the accommodating cavity, and the support is located on a bottom wall of the lower cover.

The high-temperature element comprises a heat dissipation piece and an inductor which are arranged at intervals, and the heat dissipation piece and the inductor are both positioned on one side of the circuit board, which is far away from the lower cover.

Like this, can make the setting of support piece more convenient, reduce cooking utensil's the manufacturing degree of difficulty.

The construction of the present application and other objects and advantages thereof will be more apparent from the following description of the preferred embodiments taken in conjunction with the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of a cooking appliance provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a first cooking appliance (without an upper cover) provided in an embodiment of the present application;

FIG. 3 is an enlarged view of a portion I of FIG. 2;

fig. 4 is a top view of a first cooking appliance (without an upper cover) provided in an embodiment of the present application;

FIG. 5 is a schematic cross-sectional view taken along section A-A of FIG. 4;

FIG. 6 is an enlarged view of a portion II of FIG. 5;

fig. 7 is a partial structural schematic view of a lower cover in a first cooking appliance according to an embodiment of the present application;

fig. 8 is a partial structural schematic view of a lower cover in a second cooking appliance according to an embodiment of the present application;

fig. 9 is a partial structural schematic view of a lower cover in a third cooking appliance according to an embodiment of the present application;

fig. 10 is a partial structural schematic view of a lower cover in a fourth cooking appliance according to an embodiment of the present application;

fig. 11 is a top view of a lower cover of a fourth cooking appliance according to an embodiment of the present application;

FIG. 12 is a schematic cross-sectional view taken along section B-B of FIG. 11;

fig. 13 is a schematic cross-sectional view of section C-C of fig. 11.

Description of reference numerals:

100-a cooking appliance;

1-a shell;

11-a lower cover;

111-support ribs;

12-middle frame;

13-upper cover;

2-an accommodating cavity;

3-a circuit board;

31-a high temperature element;

311-a heat sink;

312-an inductor;

4-a functional element;

41-a heat dissipation fan;

42-a lamp panel;

43-heating plate;

5-a wire;

6-a support member;

61-a support plate;

611-a support surface;

612-grooves;

613-separating part;

62-an extension;

63-a wire clamping part;

64-wire clamping area;

65-reinforcing ribs;

7-knob.

Detailed Description

In the related art, the size of the induction cooker is small, the coil panel is usually stacked above the heat dissipation fan and the circuit board, and different wires inside the accommodating cavity need to be connected with the circuit board. The circuit board is provided with high temperature elements such as an inductor and a heat dissipation piece, wherein the heat dissipation piece is provided with sharp corners. Because the lead is relatively poor in fixation, the lead is easy to contact with the heat dissipation part, so that the lead is easy to damage at high temperature, the sharp corner of the lead is easy to scratch, and the service life of the lead is relatively short.

In view of the above technical problem, the present application provides a cooking appliance, in which a support is disposed in the accommodating chamber, and the support is used for supporting the wires, so that a portion of the wires is located above the high temperature element and is higher than the upper surface of the high temperature element. Therefore, on one hand, the high-temperature element is prevented from contacting the lead, the lead is prevented from being damaged by the high-temperature element, and the service life of the lead and the service life of the cooking utensil are prolonged. On the other hand, the lead can cross the high-temperature element to be wired, so that the wiring path of the lead is reduced, the length of the lead is reduced, and the manufacturing cost is reduced.

In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the accompanying drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are a subset of the embodiments in the present application and not all embodiments in the present application. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Embodiments of the present application will be described in detail below with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a cooking appliance provided in an embodiment of the present application. Fig. 2 is a schematic structural diagram of a first cooking appliance (without an upper cover) provided in an embodiment of the present application. Fig. 3 is a partially enlarged view of portion i in fig. 2. Fig. 4 is a top view of a first cooking appliance (without an upper cover) provided in an embodiment of the present application. Fig. 5 is a schematic cross-sectional view of the section a-a in fig. 4. Fig. 6 is a partial enlarged view of a portion ii in fig. 5. Fig. 7 is a partial structural schematic view of a lower cover in a first cooking appliance according to an embodiment of the present application. Fig. 8 is a partial structural schematic view of a lower cover in a second cooking appliance according to an embodiment of the present application.

Fig. 9 is a partial structural schematic view of a lower cover in a third cooking appliance according to an embodiment of the present application. Fig. 10 is a partial structural schematic view of a lower cover in a fourth cooking appliance according to an embodiment of the present application. Fig. 11 is a top view of a lower cover in a fourth cooking appliance according to an embodiment of the present application. Fig. 12 is a schematic cross-sectional view of section B-B in fig. 11. Fig. 13 is a schematic cross-sectional view of section C-C of fig. 11. Referring to fig. 1 to 13, an embodiment of the present application provides a cooking appliance.

Referring to fig. 1, 2 and 3, the cooking appliance 100 includes a housing 1, a housing cavity 2 is provided in the housing 1, a circuit board 3, a functional component 4 and a supporting component 6 are provided in the housing cavity 2, the circuit board 3 and the functional component 4 are electrically connected through a wire 5, and the supporting component 6 is located on a routing path of the wire 5. The circuit board 3 is provided with a high temperature component 31, a part of the supporting member 6 is higher than the upper surface of the high temperature component 31, the supporting member 6 supports the lead 5, so that at least a part of the lead 5 is positioned above the high temperature component 31, and the lower surface of the at least a part of the lead 5 is higher than the upper surface of the high temperature component 31, thus, the lead 5 is not only positioned above the high temperature component 31, but also has a distance with the high temperature component 31, so that the lead 5 is not in contact with the high temperature component 31.

It should be noted that, by providing the support 6 in the accommodating chamber 2, the support 6 can support the lead 5, and part of the lead 5 is located above the high-temperature element 31 and is higher than the upper surface of the high-temperature element 31. Thus, on the one hand, the high temperature element 31 is prevented from contacting the lead 5, thereby not only preventing the lead 5 from being damaged by high temperature, but also preventing sharp corners of the high temperature element 31 from scratching the lead 5, and prolonging the service life of the lead 5 and the cooking utensil 100. On the other hand, the lead 5 can cross the high-temperature element 31 for wiring, so that the wiring path of the lead 5 is reduced, the length of the lead 5 is reduced, and the manufacturing cost is reduced.

In this application embodiment, the function part 4 includes cooling fan 41, lamp plate 42 and heating plate 43, and casing 1 outside is provided with knob 7, and the pivot on knob 7 and the lamp plate 42 is connected, and the user passes through the work of knob 7 control heating plate 43. High temperature component 31 includes a heat sink 311 and an inductor 312, where heat sink 311 is disposed on an Insulated Gate Bipolar Transistor (IGBT) for dissipating heat from the IGBT. The heat sink 311 has heat dissipation fins with sharp edges and corners. The shell 1 comprises an upper cover 13, a middle frame 12 and a lower cover 11, wherein the middle frame 12 is connected with the upper cover 13 and the lower cover 11, and the upper cover 13, the middle frame 12 and the lower cover 11 jointly enclose the accommodating cavity 2. The embodiment of the present application is described by taking an example in which the supporting member 6 is disposed on the lower cover 11, and the conductive wire 5 is located above the heat sink 311.

Specifically, as shown in fig. 6 and 8, the support 6 has a support surface 611 thereon, and the wire 5 is positioned on the support surface 611, and the support surface 611 is higher than the upper surface of the high-temperature component 31. By providing the support surface 611, the contact surface between the support 6 and the wire 5 can be made as large as possible, and the support stability of the wire 5 can be improved. By making the support surface 611 higher than the high temperature element 31, it can be ensured that the wire 5 does not contact the support 6 after being placed on the support surface 611.

The supporting surface 611 may be a large plane, or may be a small end surface, for example, an end surface of the supporting plate 61.

In particular, the height difference between the support surface 611 and the upper surface of the high temperature element 31 is between 0.5 and 10mm, wherein the height difference may be 0.5mm, 5mm or 10 mm. When the height difference is smaller than 0.5mm, the wire 5 in the suspended state is easy to contact with the high-temperature element 31 after being deformed slightly due to the flexibility of the wire 5. When the height difference is greater than 10mm, the height of the supporting member 6 is high, which easily affects the arrangement of other components, and is not favorable for thinning the cooking utensil 100.

In a possible embodiment, the support 6 is located on the bottom wall of the lower cover 11 and is arranged close to the high temperature element 31. Thus, the support member 6 is disposed on the bottom wall of the lower cover 11, making the support member 6 more convenient to dispose. When the support member 6 and the lower cover 11 are separately arranged, the assembly of the support member 6 is facilitated; when the support member 6 and the lower cover 11 are integrally provided, the integral molding of the support member 6 is facilitated. The support 6 is close to the high-temperature element 31, so that the support effect of the support 6 on the lead 5 can be better, and the lead 5 is ensured not to be contacted with the high-temperature element 31 to the maximum extent. It can be understood that, since the wire 5 has a certain flexibility and the wire 5 farther from the support 6 sags by a larger extent under the action of gravity, by making the support 6 close to the high temperature element 31, the wire 5 above the high temperature element 31 can be prevented from sagging to the greatest extent, preventing the wire 5 from contacting the high temperature element 31.

It should be noted that the supporting member 6 may also be disposed on the side wall of the middle frame 12 or on the inner wall of the upper cover 13, and the position where the supporting member 6 is disposed is not limited in this embodiment, and the user may select the position as needed.

In one possible embodiment, as shown in fig. 3 and 7, the support 6 includes a support plate 61, a root portion of the support plate 61 is located on the bottom wall of the lower cover 11, an end portion of the support plate 61 extends in a direction away from the bottom wall of the lower cover 11, and a support surface 611 is located on the end portion of the support plate 61. Thus, the supporting plate 61 supports the lead 5, the structural complexity of the supporting piece 6 is reduced to the maximum extent, the whole structure of the supporting piece 6 is simpler, the manufacturing is more convenient, and the cost is lower.

In particular, the height of the support plate 61 ranges from 4 to 60mm, wherein the height may be 4mm, 20mm, 40mm or 60 mm. The height of the supporting plate 61 is within the above range, so that the supporting wire 5 can be supported to avoid contact with the high-temperature element 31, and the influence on the arrangement of other components can be avoided, thereby being beneficial to thinning the cooking utensil 100.

In one possible implementation, as shown in FIG. 8, the support surface 611 is planar. The end of the support plate 61 is straight, and the end surface of the support plate 61 forms the support surface 611. Thus, the structural complexity of the support plate 61 is reduced to the maximum extent, the overall structure of the support plate 61 is simpler, the manufacture is more convenient, and the cost is lower.

In one possible implementation, as shown in FIG. 6, the support surface 611 is curved. Wherein the end surface of the support plate 61 has a curved surface thereon, which forms a support surface 611. Thus, the lead 5 can be positioned in the curved surface and is not easy to be separated from the supporting surface 611 of the supporting piece 6, and the supporting stability of the supporting piece 6 is improved.

Specifically, as shown in fig. 3, 6 and 7, the end of the support plate 61 is provided with a groove 612, and the wall surface of the groove 612 forms a support surface 611. In this way, the groove 612 is formed in the end face of the end portion of the support plate 61, so that the lead 5 is positioned in the groove 612, and is not easy to be separated from the support member 6, thereby improving the support stability of the support member 6.

It should be noted that the cross-sectional shape of the groove 612 may be a rectangle, a semicircle, an arc, or the like, and the specific shape of the groove 612 is not limited in the embodiment of the present application, and a user may select the shape according to the actual situation.

In one possible embodiment, as shown in fig. 6, the width W of the groove 612 is not less than the diameter of the wire 5 and the depth H of the groove 612 is not less than the radius of the wire 5. In this way, at least half of the volume of the cylindrical wire 5 can be located in the groove 612, so that the wire 5 is not easy to fall out of the groove 612, and the support stability of the support 6 is improved.

In one possible embodiment, the width W of the groove 612 is between 1.5 and 20mm, wherein the width W may be 1.5mm, 7mm, 15mm, or 20 mm. When the width W is less than 1.5mm, the smallest wire 5 cannot be caught in the groove 612. When the width W is greater than 20mm, the width of the groove 612 is much greater than the diameter of the wire 5, the space in which the wire 5 can move in the groove 612 is large, and the groove 612 has a poor fixing effect on the wire 5.

In one possible embodiment, the depth H of the groove 612 is between 1.5 and 15mm, wherein the depth H may be 1.5mm, 8mm, 12mm or 15 mm. When the depth H is less than 1.5mm, the depth at which the wire 5 is caught in the groove 612 is insufficient, and the wire 5 is easily pulled out from the groove 612. When the depth H is larger than 15mm, in order to avoid the height of the lead 5 from being higher than the high-temperature element 31, the height of the support plate 61 needs to be set higher, which is liable to affect the assembly of other parts.

In one possible embodiment, as shown in fig. 9, the end of the support plate 61 is provided with an extension 62, the root of the extension 62 is connected with the groove 612, the end of the extension 62 extends toward the high-temperature component 31, the shape of the extension 62 is matched with the shape of the groove 612, and the surface of the extension 62 and the wall surface of the groove 612 together form a support surface 611. Thus, the contact area between the support member 6 and the lead 5 can be increased by the extension portion 62, and the support effect of the support member 6 can be improved.

Further, the plate surface of the support plate 61 is perpendicular to the bottom wall of the lower cover 11, and the extending direction of the extending portion 62 is perpendicular to the plate surface of the support plate 61. Thus, the extension parts 62 can be in a horizontal state, and the wires 5 can be arranged at the same height as much as possible in the horizontal direction, so that the arrangement of the wires 5 is regular.

In one possible embodiment, as shown in fig. 10, the end of the supporting member 6 is provided with a wire clamping portion 63, the wire clamping portion 63 and the supporting surface 611 together form a wire clamping area 64, and the conducting wire 5 is located in the wire clamping area 64. By arranging the clamping line part 63, the lead 5 can be clamped on the supporting part 6, the lead 5 is prevented from being separated from the supporting part 6, and the supporting stability of the supporting part 6 for the lead 5 is improved.

In one possible implementation, the catching portion 63 may be provided in combination with the groove 612. Specifically, each groove 612 corresponds to two wire clamping portions 63, the two wire clamping portions 63 are respectively located at two sides of the groove 612, a gap is formed between the two wire clamping portions 63, and the lead 5 enters the wire clamping area 64 from the gap. The gap may be made slightly smaller than the diameter of the wire 5 so that the wire 5 is not easily pulled out from between the two seizing portions 63. The wire clamping part 63 can also have certain elasticity, so that the wire clamping part 63 deforms when the wire 5 is clamped, and the wire 5 can be conveniently clamped into the wire clamping area 64.

In another possible embodiment, the wire clamping portion 63 can be clamped with the supporting plate 61 by a snap, when the wire 5 is assembled, the wire clamping portion 63 is detached from the end of the supporting plate 61, the wire 5 is placed in the groove 612, and then the wire clamping portion 63 is clamped with the supporting plate 61, thereby completing the assembly. The embodiment of the present application does not limit the specific structure of the wire clamping portion 63, and a user can select the wire clamping portion as needed.

In one possible embodiment, as shown in fig. 7 to 10, the supporting member 6 further includes a reinforcing rib 65, the reinforcing rib 65 is provided on the bottom wall of the lower cover 11 and is connected to the side wall surface of the supporting plate 61, and the number of the reinforcing ribs 65 may be one or more. Thus, the structural strength of the support plate 61 can be improved, and the structural stability of the support 6 can be enhanced.

In addition, the bottom wall of the lower cover 11 is further provided with support ribs 111, the support ribs 111 and the reinforcing ribs 65 are located on two opposite sides of the support plate 61, a part of the support ribs 111 is connected with the support plate 61, and the circuit board 3 is located on the support ribs 111. Thus, the support rib 111 has a double-layer function, and can support the circuit board 3 on one hand and improve the structural strength of the support member 6 on the other hand.

It should be noted that the wires 5 may include a first wire (not shown), a second wire (not shown), and a third wire (not shown), the first wire connects the heating plate 43 and the circuit board 3, the second wire connects the cooling fan 41 and the circuit board 3, and the third wire connects the lamp panel 42 and the circuit board 3. The first conducting wire is a high-voltage conducting wire, and the second conducting wire and the third conducting wire are low-voltage conducting wires. The grooves 612 include a first groove (not shown) and a second groove (not shown), the first groove and the second groove being spaced apart at an end of the support plate 61, the first conductive line being located in the first groove, and the second conductive line and/or the third conductive line being located in the second groove. Therefore, the high-voltage wire and the low-voltage wire can be respectively clamped in different grooves 612, so that the high-voltage wire and the low-voltage wire are prevented from contacting, and the safety of the cooking appliance 100 is improved. It is understood that the shape and size of the first groove and the second groove may be the same or different, and the embodiment of the present application does not limit this.

Specifically, as shown in fig. 6, when there are a plurality of grooves 612, a separating portion 613 may be disposed between adjacent grooves 612, and the separating portion 613 separates adjacent grooves 612, so that the wires 5 in different grooves 612 have a space therebetween. The width L of the divider 613 ranges from 0.5 to 10mm, wherein the width L may be 0.5mm, 3mm, 5mm or 10 mm. When the width L is less than 0.5mm, the wires 5 in the adjacent grooves 612 are too close to each other, and the wires 5 are liable to affect each other. When the width L is greater than 10mm, the distance between the adjacent grooves 612 is too long, and this results in increasing the width of the support plate 61, which is liable to affect the arrangement of other components.

It should be noted that the numerical values and numerical ranges related to the embodiments of the present application are approximate values, and there may be a certain range of errors depending on the manufacturing process, and those skilled in the art may consider these errors to be negligible.

In the description of the embodiments of the present application, it should be understood that the terms "mounted," "connected," and "connected" are used broadly and can refer to a fixed connection, an indirect connection through intermediary media, communication between two elements, or an interaction between two elements, for example, unless explicitly stated or limited otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate. The terms "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like refer to an orientation or positional relationship indicated in the drawings for convenience in describing the present application and to simplify description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application. In the description of the present application, "a plurality" means two or more unless specifically stated otherwise.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the above-described drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (13)

1. The cooking utensil is characterized by comprising a shell (1), wherein an accommodating cavity (2) is formed in the shell (1), a circuit board (3), a functional piece (4) and a supporting piece (6) are arranged in the accommodating cavity (2), the circuit board (3) and the functional piece (4) are electrically connected through a wire (5), and the supporting piece (6) is positioned on a wiring path of the wire (5) in the shell (1);

the circuit board (3) is provided with a high-temperature element (31), at least part of the support (6) is higher than the upper surface of the high-temperature element (31), at least part of the lead (5) is positioned on the support (6), and the lower surface of the at least part of the lead (5) is higher than the upper surface of the high-temperature element (31).

2. The cooking appliance according to claim 1, wherein the support (6) has a support surface (611), the wire (5) being located on the support surface (611), the support surface (611) being higher than an upper surface of the high temperature element (31); the height difference between the support surface (611) and the upper surface of the high temperature element (31) is between 0.5 and 10 mm.

3. The cooking appliance according to claim 2, wherein the support (6) is located on the bottom wall of the casing (1) and is arranged close to the high temperature element (31).

4. The cooking appliance according to claim 3, wherein the support (6) comprises a support plate (61), a root of the support plate (61) being located on the bottom wall of the housing (1), an end of the support plate (61) extending away from the bottom wall of the housing (1), the support surface (611) being located on the end of the support plate (61).

5. The cooking appliance according to claim 4, wherein the support surface (611) is planar; or, the supporting surface (611) is a curved surface.

6. Cooking appliance according to claim 4, characterized in that the end of the support plate (61) is provided with a groove (612), the wall surface of the groove (612) forming the support surface (611).

7. The cooking appliance according to claim 6, wherein the end of the support plate (61) is provided with an extension (62), the root of the extension (62) is connected with the groove (612), the end of the extension (62) extends towards the direction close to the high temperature element (31), the shape of the extension (62) is matched with the shape of the groove (612), and the surface of the extension (62) and the wall surface of the groove (612) together form the support surface (611);

the plate surface of the supporting plate (61) is perpendicular to the bottom wall of the shell (1), and the extending direction of the extending part (62) is perpendicular to the plate surface of the supporting plate (61).

8. The cooking appliance according to any of the claims 4 to 7, wherein the end of the support (6) is provided with a wire catching portion (63), the wire catching portion (63) and the support surface (611) together forming a wire catching area (64), the wire (5) being located in the wire catching area (64).

9. The cooking appliance according to any one of claims 4 to 7, wherein the support (6) further comprises a reinforcing rib (65), the reinforcing rib (65) being provided on the bottom wall of the housing (1) and being connected to the side wall surface of the support plate (61).

10. The cooking appliance according to claim 9, wherein a support rib (111) is provided on the bottom wall of the housing (1), the support rib (111) and the reinforcement rib (65) are located on opposite sides of the support plate (61), and a part of the support rib (111) is connected to the support plate (61), and the circuit board (3) is located on the support rib (111).

11. The cooking appliance according to claim 6 or 7, wherein the width of the groove (612) is not less than the diameter of the wire (5) and the depth of the groove (612) is not less than the radius of the wire (5);

and/or the width of the groove (612) is between 1.5 and 20 mm;

and/or the depth of the groove (612) is between 1.5 and 15 mm.

12. The cooking appliance according to claim 6 or 7, wherein the functional element (4) comprises a heat dissipation fan (41), a lamp panel (42) and a heating plate (43), the wires (5) comprise a first wire, a second wire and a third wire, the first wire connects the heating plate (43) and the circuit board (3), the second wire connects the heat dissipation fan (41) and the circuit board (3), and the third wire connects the lamp panel (42) and the circuit board (3);

the groove (612) comprises a first groove and a second groove, the first groove and the second groove are arranged at the end part of the supporting plate (61) at intervals, the first conducting wire is positioned in the first groove, and the second conducting wire and/or the third conducting wire is/are positioned in the second groove.

13. The cooking appliance according to any one of the claims 1 to 7, wherein the casing (1) comprises an upper cover (13), a middle frame (12) and a lower cover (11), the middle frame (12) connects the upper cover (13) and the lower cover (11), the upper cover (13), the middle frame (12) and the lower cover (11) jointly enclose the accommodating cavity (2), and the support (6) is located on the bottom wall of the lower cover (11); the high-temperature element (31) comprises a heat dissipation piece (311) and an inductor (312) which are arranged at intervals, wherein the heat dissipation piece (311) and the inductor (312) are both positioned on one side, far away from the lower cover (11), of the circuit board (3).

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