CN215627731U - UV visbreaking protective film without residual glue - Google Patents

UV visbreaking protective film without residual glue Download PDF

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Publication number
CN215627731U
CN215627731U CN202120957706.2U CN202120957706U CN215627731U CN 215627731 U CN215627731 U CN 215627731U CN 202120957706 U CN202120957706 U CN 202120957706U CN 215627731 U CN215627731 U CN 215627731U
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China
Prior art keywords
layer
protective film
fluorine
synthetic resin
containing synthetic
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CN202120957706.2U
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Chinese (zh)
Inventor
柯跃虎
诸葛锋
宋亦健
曾庆明
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Guangdong Shuocheng Technology Co ltd
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Guangdong Shuocheng Technology Co ltd
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Abstract

The utility model discloses a residual glue-free UV (ultraviolet) anti-sticking protective film which comprises a protective film base material layer, a sticking layer and a fluorine-containing synthetic resin layer, wherein the protective film base material layer is arranged at the bottommost part, the sticking layer is arranged on the protective film base material layer, and the fluorine-containing synthetic resin layer is arranged on the sticking layer. The utility model has excellent stability, heat resistance and retractility, can have larger adhesive force to well protect the semiconductor material from being damaged, and can greatly reduce the adhesive force after being irradiated by ultraviolet rays, be easily stripped without adhesive residue and avoid influencing subsequent procedures.

Description

UV visbreaking protective film without residual glue
Technical Field
The utility model relates to a residual glue-free UV (ultraviolet) anti-sticking protective film, which is mainly applied to the field of semiconductor materials.
Background
In recent years, semiconductor materials are more and more widely applied, and miniaturized and lightweight semiconductor materials are more and more developed, but in the production and use process of semiconductor materials, because the internal structure of the semiconductor materials is more complicated, slight deviation in the cutting process may cause damage to the semiconductor materials, so that a thin film needs to be coated outside the semiconductor materials to reduce damage to the semiconductor, but in the picking process, the existence of the protective film may affect the picking sensitivity, prolong the picking time and reduce the working efficiency. Therefore, the UV anti-sticking protective film without the adhesive residue is designed, when a semiconductor is cut, the protective film can effectively protect the semiconductor material, the cutting damage is reduced, the viscosity of the protective film is greatly reduced after ultraviolet irradiation, peeling can be easily performed, the adhesive residue is not generated, the influence on a picking process is avoided, and the semiconductor material is greatly protected.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a UV (ultraviolet) anti-sticking protective film without adhesive residue, which has larger adhesive force and can well protect a semiconductor material from being damaged on one hand, and on the other hand, the adhesive force is greatly reduced after the UV anti-sticking protective film is irradiated by ultraviolet rays, so that the UV anti-sticking protective film can be easily peeled without adhesive residue, and the influence on the subsequent processes is avoided.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a UV visbreaking protection film of no cull, includes protection film substrate layer, gluing layer and fluorine-containing synthetic resin layer, the protection film substrate layer is at the bottommost, and gluing layer is on the protection film substrate layer, and fluorine-containing synthetic resin layer is on gluing layer.
In a preferred embodiment, the thickness of the protective film substrate layer is 10 to 200 μm.
In a preferred embodiment, the adhesive layer is applied to a thickness of 3 to 28 μm.
In a preferred embodiment, the thickness of the layer of the fluorine-containing synthetic resin is 15 to 50 μm.
In a preferred embodiment, the protective film base material layer and the fluorine-containing synthetic resin layer are bonded to each other through an adhesive layer.
In a preferred embodiment, the material of the protective film substrate layer is selected from one of polyethylene, polypropylene, polyvinyl chloride, polyethylene terephthalate, and propylene oxide.
As a preferred embodiment, the adhesive layer is acrylate pressure sensitive adhesive.
In a preferred embodiment, the fluorine-containing synthetic resin layer is provided with an easy-tear tape.
As a preferred embodiment, the area of the easy-tear strip is 10-20mm2
In a preferred embodiment, the easy-tear tape is provided on the outer edge of the layer of the fluorine-containing synthetic resin.
Compared with the prior art, the utility model has the beneficial effects that:
(1) the UV anti-sticking protective film without adhesive residue provided by the utility model has excellent stability, heat resistance and retractility.
(2) The UV anti-sticking protective film without residual glue provided by the utility model uses the specific pressure-sensitive adhesive, and has excellent cohesive strength, adhesion performance and acid and alkali resistance.
(3) The UV anti-sticking protective film without adhesive residue provided by the utility model has high cohesiveness in the cutting process of semiconductor materials, and can well protect the materials and avoid the damage of the materials.
(4) The UV anti-sticking protective film without adhesive residue provided by the utility model has the advantages that the adhesive force is greatly reduced through ultraviolet treatment in the picking process of semiconductor materials, the UV anti-sticking protective film is easy to peel and has no adhesive residue, and the influence on the subsequent steps is avoided.
Drawings
FIG. 1 is a schematic view of the structure of the present invention.
In the figure: 1 protective film substrate layer, 2 gluing layers, 3 synthetic resin layers containing fluorine, 4 easy tear strips.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: the utility model provides a UV visbreaking protection film of no cull, includes protection film substrate layer, gluing layer and fluorine-containing synthetic resin layer, the protection film substrate layer is at the bottommost, and gluing layer is on the protection film substrate layer, and fluorine-containing synthetic resin layer is on gluing layer.
In a preferred embodiment, the thickness of the protective film substrate layer is 10 to 200 μm.
In a preferred embodiment, the adhesive layer is applied to a thickness of 3 to 28 μm.
Further preferably, the coating thickness of the adhesive layer is 5 to 25 μm.
The applicant has found that the choice of the thickness of the adhesive layer has a great influence on the performance of the protective film, and particularly when the adhesive layer is applied in a thickness of 5 to 25 μm, the test performance is best. When the thickness of the bonding layer is too large, the ultraviolet treatment cannot be completed in a short time, the bonding strength is still high in a short time, and residue-free stripping cannot be realized; when the thickness of the bonding layer is smaller, the bonding force of the protective film is weaker, the bonding strength of the bonding layer and the protective film base material layer is smaller, and the semiconductor material cannot be well protected.
In a preferred embodiment, the thickness of the layer of the fluorine-containing synthetic resin is 15 to 50 μm.
In a preferred embodiment, the fluorine-containing synthetic resin layer is a PET release film.
In a preferred embodiment, the protective film base material layer and the fluorine-containing synthetic resin layer are bonded to each other through an adhesive layer.
In a preferred embodiment, the material of the protective film substrate layer is selected from one of polyethylene, polypropylene, polyvinyl chloride, polyethylene terephthalate, and propylene oxide.
As a preferred embodiment, the adhesive layer is acrylate pressure sensitive adhesive.
In a preferred embodiment, the fluorine-containing synthetic resin layer is provided with an easy-tear tape.
The applicant finds that the easy-to-tear strip is arranged on the fluorine-containing synthetic resin layer, the protective film can be torn off more conveniently without contacting with semiconductor materials after ultraviolet treatment, even without manual participation, batch operation can be realized, and the use is more convenient.
As a preferred embodiment, the area of the easy-tear strip is 10-20mm2
Further preferably, the shape of the tear strip is selected from the group consisting of rectangular, circular, triangular, pentagonal, hexagonal, and the like.
In a preferred embodiment, the easy-tear tape is provided on the outer edge of the layer of the fluorine-containing synthetic resin.
Further preferably, the tear tape is provided at a vertex angle or edge of the fluorine-containing synthetic resin layer.
The present invention will be specifically described below by way of examples. It should be noted that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and that the insubstantial modifications and adaptations of the present invention by those skilled in the art based on the above disclosure are still within the scope of the present invention.
In addition, the starting materials used are all commercially available, unless otherwise specified.
Example 1
The utility model provides a UV visbreaking protection film of no cull, includes protection film substrate layer 1, gluing layer 2 and fluorine-containing synthetic resin layer 3, protection film substrate layer 1 is at the bottommost, and gluing layer 2 is on protection film substrate layer 1, and fluorine-containing synthetic resin layer 3 is on gluing layer 2.
The material of the protective film substrate layer 1 is polyethyleneAnd the thickness of the protective film base material layer 1 is 35 mu m. The adhesive layer 2 is acrylate pressure-sensitive adhesive, and the coating thickness of the adhesive layer 2 is 15 micrometers. The fluorine-containing synthetic resin layer is a fluorine PET release film which is purchased from Youlen electronic material science and technology limited of Dongguan city, and the thickness of the fluorine-containing synthetic resin layer 3 is 30 μm. The fluorine-containing synthetic resin layer 3 is provided with an easy-tearing strip 4 of 15mm2At the top corners of the fluorine-containing synthetic resin layer 3.
Example 2
The utility model provides a UV visbreaking protection film of no cull, includes protection film substrate layer 1, gluing layer 2 and fluorine-containing synthetic resin layer 3, protection film substrate layer 1 is at the bottommost, and gluing layer 2 is on protection film substrate layer 1, and fluorine-containing synthetic resin layer 3 is on gluing layer 2.
The material of protection film substrate layer 1 is propylene oxide, the thickness of protection film substrate layer 1 is 150 mu m. The adhesive layer 2 is acrylate pressure-sensitive adhesive, and the coating thickness of the adhesive layer 2 is 25 micrometers. The fluorine-containing synthetic resin layer is a fluorine PET release film which is purchased from Youlen electronic material science and technology limited of Dongguan city, and the thickness of the fluorine-containing synthetic resin layer 3 is 20 μm. The fluorine-containing synthetic resin layer 3 is provided with an easy-tearing strip 4, and the easy-tearing strip 4 is 10mm2On the edge of the fluorine-containing synthetic resin layer 3.

Claims (10)

1. The UV anti-sticking protective film without adhesive residue is characterized by comprising a protective film base material layer, a sticking layer and a fluorine-containing synthetic resin layer, wherein the protective film base material layer is arranged at the bottommost part, the sticking layer is arranged on the protective film base material layer, and the fluorine-containing synthetic resin layer is arranged on the sticking layer; the fluorine-containing synthetic resin layer is a fluorine PET release film.
2. The UV detackifying protective film of claim 1 wherein the protective film substrate layer has a thickness of 10-200 μm.
3. The UV detackifying protective film according to claim 1, wherein the adhesive layer is applied to a thickness of 3-28 μm.
4. The UV detackifying protective film without adhesive residue of claim 1, wherein the thickness of the fluorine-containing synthetic resin layer is 15-50 μm.
5. The UV detackifying protective film according to claim 1, wherein the protective film substrate layer and the fluorine-containing synthetic resin layer are bonded by an adhesive layer.
6. The UV anti-adhesive protection film without adhesive residue of claim 1, wherein the material of the protection film substrate layer is selected from one of polyethylene, polypropylene, polyvinyl chloride, polyethylene terephthalate and propylene oxide.
7. The UV detackifying protective film without adhesive residue of claim 1, wherein the adhesive layer is acrylate pressure sensitive adhesive.
8. The UV detackifying film as claimed in claim 1, wherein the fluorine-containing synthetic resin layer is provided with an easy-to-tear tape.
9. The UV detackifying film of claim 8, wherein the area of the easy-tear strip is 10-20mm2
10. The UV detackifying film as claimed in claim 8, wherein the easy-tear strip is at the outer edge of the layer of fluoropolymer resin.
CN202120957706.2U 2021-05-06 2021-05-06 UV visbreaking protective film without residual glue Active CN215627731U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120957706.2U CN215627731U (en) 2021-05-06 2021-05-06 UV visbreaking protective film without residual glue

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120957706.2U CN215627731U (en) 2021-05-06 2021-05-06 UV visbreaking protective film without residual glue

Publications (1)

Publication Number Publication Date
CN215627731U true CN215627731U (en) 2022-01-25

Family

ID=79937594

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120957706.2U Active CN215627731U (en) 2021-05-06 2021-05-06 UV visbreaking protective film without residual glue

Country Status (1)

Country Link
CN (1) CN215627731U (en)

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Address after: 512000 chlor alkali characteristic industrial base of hougongdu Economic Development Zone, Rucheng Town, Ruyuan County, Shaoguan City, Guangdong Province

Patentee after: Guangdong Shuocheng Technology Co.,Ltd.

Address before: 512000 chlor alkali characteristic industrial base of hougongdu Economic Development Zone, Rucheng Town, Ruyuan County, Shaoguan City, Guangdong Province

Patentee before: GUANGDONG SHUOCHENG TECHNOLOGY Co.,Ltd.