CN215620685U - Utilize apparatus for producing of liquid binder production bonding metal film board - Google Patents

Utilize apparatus for producing of liquid binder production bonding metal film board Download PDF

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Publication number
CN215620685U
CN215620685U CN202121338862.7U CN202121338862U CN215620685U CN 215620685 U CN215620685 U CN 215620685U CN 202121338862 U CN202121338862 U CN 202121338862U CN 215620685 U CN215620685 U CN 215620685U
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China
Prior art keywords
coating
roller
substrate
liquid
secondary coating
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Expired - Fee Related
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CN202121338862.7U
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Chinese (zh)
Inventor
白江虎
任娟红
李具仓
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Gansu Jiu Steel Group Hongxing Iron and Steel Co Ltd
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Gansu Jiu Steel Group Hongxing Iron and Steel Co Ltd
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Abstract

The utility model discloses a production device for producing a bonded metal film plate by using a liquid binder, which is provided with a primary coating area and a secondary coating area, wherein a heating furnace is arranged in the conveying direction between the primary coating area and the secondary coating area, the device is also provided with a multi-layer uncoiler, the multi-layer uncoiler is arranged at one side of the secondary coating area, an electric heating roller is arranged in the conveying direction of the multi-layer uncoiler, a multi-plate uncoiled by the multi-layer uncoiler is driven to be conveyed to the electric heating roller for heating, a compound machine is arranged in the conveying direction of the electric heating roller and the secondary coating area for compounding the multi-plate and a substrate subjected to secondary coating treatment, the device coats the substrate twice and compounds the multi-plate with the substrate after being directly heated, so that the technical problems that the traditional multi-layer metal film is thin, a decorative surface is easily polluted due to deviation in the production process, and the yield of a product is easily low are solved, the yield of the product is improved, and the safety risk and the labor intensity during production are reduced.

Description

Utilize apparatus for producing of liquid binder production bonding metal film board
Technical Field
The utility model relates to the technical field of composite material production, in particular to a production device for producing a bonded metal film plate by using a liquid binder.
Background
The metal film plate is a layered composite material formed by coating a binder on a metal substrate and a composite plate by using a coating machine and binding the metal substrate and the composite plate after being compounded by a compounding roller.
The production process of the colloid film comprises the following steps: the passivated substrate enters a heating furnace to be directly heated, the metal film composite plate is directly heated and then is adhered with a colloid film, the laminated composite plate and the substrate synchronously enter a laminating roller to be rolled and laminated, the colloid film production process leads the produced metal film composite plate to have poor temperature resistance due to the fact that the colloid film is conventionally a hot-melt adhesive, functional vibration-damping composite plates are not easy to produce, only metal film plates with the thickness of 0.2mm or above can be produced, when the metal film plates with the thickness of 0.15mm are printed with wrinkle marks such as colloid films due to uneven stress in the compounding process due to the fact that the composite plates are thin and low in rigidity, and therefore continuous production cannot be achieved by utilizing the colloid film for the metal film plates with the thickness of 0.15mm or below.
The production process of the liquid adhesive comprises the following steps: the method comprises the following steps that a substrate coiled material is uncoiled, the surface is passivated, a passivated base material is laid on the upper surface of the base material and is coated with a liquid binder, a metal film clad plate is also produced by the same process as the substrate, after the liquid binder is coated, the substrate and the metal film clad plate are respectively heated and synchronously enter a compound machine for rolling and compounding, the liquid binder used in the production process of the liquid binder is divided into a single-component binder and a multi-component mixed binder, wherein the multi-component binder needs to be mixed during regeneration, and the production process is difficult to control; the single-component binder is convenient to produce, has low cost compared with a colloid film, and is often used for producing metal film plates.
However, the existing liquid binder production process can only be used for producing metal film plates with the metal composite plate thickness of 0.3mm or more, this is because the existing coating machine can coat the liquid binder on the supporting roller supporting the strip steel or the both side edge portions of the supporting roller not contacting the strip steel when the coating roller coats the strip steel when coating the thin plate, along with the continuous production, the deviation and the continuous deviation rectification of the base plate and the metal film plate cause that the adhesive coated on the supporting roller or the edges of the two sides of the supporting roller which are not contacted with the strip steel is coated on the surface of the decorative surface of the metal film compound plate and finally is brought to the supporting roller in each area of the production line, each supporting roller in the production line pollutes the decorative surface again, so that the product yield is low, the shutdown treatment is caused in serious cases, the whole polluted roll surface of the whole modified production line is completely cleaned, and the safety risk and the labor intensity are greatly increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims to: the utility model provides a production device for producing a bonded metal film plate by using a liquid binder, aiming at the technical problems that the surface of the metal film plate is easy to be polluted due to easy adhesion of the surface when the existing coating machine produces the metal film plate with the thickness less than 0.3mm, the product yield is low, and the safety risk and the cleaning difficulty are high when the roller surface is cleaned by stopping the machine, the device coats a substrate twice, and the composite plate is directly heated and then is compounded with the substrate, so that the technical problems that the product yield is low due to the fact that the traditional composite metal film is thin and the decorative surface is easy to be polluted due to deviation in the production process are solved, the product yield is improved, the safety risk and the labor intensity during production are reduced, and the stable and smooth production when the composite metal film with the thickness less than 0.3mm is used is further ensured.
The technical scheme adopted by the utility model is as follows: a production device for producing bonded metal film plates by using a liquid binder is provided with a primary coating area and a secondary coating area, wherein a heating furnace is arranged in the conveying direction between the primary coating area and the secondary coating area, the heating furnace heats a substrate subjected to primary coating treatment in the primary coating area, the substrate is subjected to primary coating treatment in the primary coating area, then conveyed to the heating furnace for heating treatment, and finally reaches the secondary coating area for secondary coating. The device still is provided with compounding machine, multiple-layer decoiler and electric heat roller, multiple-layer decoiler sets up the one side in secondary coating district, the electric heat roller sets up in the direction of delivery of multiple-layer decoiler, multiple-layer decoiler is used for opening a book the compound board, the warp compound board after multiple-layer decoiler opens a book conveys to the electric heat roller through the drive and heats, the compounding machine sets up in the direction of delivery in electric heat roller and secondary coating district, and compound board after the electric heat roller heating conveys to the compounding machine position with the base plate after secondary coating treatment in secondary coating district and compounds.
Specifically, the district is provided with first coating roller once coats, first coating roller is used for carrying out a coating of liquid binder to the base plate, the both sides of first coating roller are provided with first dip roller and first coating backing roll, first coating backing roll is arranged in the support of base plate coating in-process, the below of first dip roller is provided with first adhesive charging tray, first adhesive charging tray is used for splendid attire liquid binder, first dip roller is arranged in dipping in the liquid binder in the first adhesive charging tray, be provided with first backup roll on the direction of delivery of first coating backing roll, first backup roll is used for the support and the transmission of base plate after once coating, conveys the base plate to the heating furnace from first coating backing roll, has tensile base plate to wind to the upper roll from the downside roller round first coating backing roll, and liquid binder is put into to first adhesive charging tray, the liquid adhesive in the first adhesive tray is dipped by the first dipping roller, the liquid adhesive is transferred to the first coating roller from the first dipping roller, the liquid adhesive is coated on the substrate by the first coating roller, and the substrate coated with the liquid adhesive by the first coating roller is transferred to the heating furnace for heating through the first supporting roller.
Preferably, the first dip roll used in the primary coating zone is a steel roll.
Preferably, the first coating roller used in the primary coating zone is a glue roller.
Specifically, the secondary coating district is provided with the second coating roller, the second coating roller is used for the secondary coating to the base plate, and the base plate after the heating furnace heating gets into the secondary coating district through the second coating backing roll and carries out the secondary coating, the both sides of second coating roller are provided with second coating backing roll and second dip in the material roller respectively, the second coating backing roll sets up the below at the conveying base plate, the second coating backing roll is used for the support to the base plate secondary coating in-process, the below of second dip in the material roller is provided with the second adhesive material charging tray, the second adhesive material charging tray is used for the liquid binder that splendid attire secondary coating was used, the second dip in the material roller is used for dipping in the liquid binder in the second adhesive material charging tray, dips in the liquid binder in the second adhesive material charging tray through the second coating roller, transmits the liquid binder to the second coating roller from the second dip in the material roller, and coating the liquid adhesive on the substrate by the second coating roller to realize secondary coating on the substrate.
Preferably, the second coating roll used in the secondary coating zone is a steel roll.
Preferably, the second coating backup roll used in the secondary coating zone is a high temperature resistant gum roll.
The principle of a production device for producing bonded metal film plates by using liquid adhesives is as follows: the method comprises the steps that a tensioned substrate is wound around a first coating support roller from a lower side roller to an upper side roller, a liquid adhesive is filled in a first adhesive material tray, the first adhesive material tray is dipped with the liquid adhesive in a first adhesive material tray through the first dipping roller, the liquid adhesive is transferred to the first coating roller from the first dipping roller, the liquid adhesive is coated on the substrate through the first coating roller, the substrate coated with the liquid adhesive through the first coating roller is transferred to a heating furnace through the first support roller to be heated, the substrate heated through the heating furnace enters a secondary coating area through a second coating support roller to be coated for the second time, the liquid adhesive in a second adhesive material tray is dipped with the second dipping roller, the liquid adhesive is transferred to the second coating roller from the second coating roller, the liquid adhesive is coated on the substrate through the second coating roller to realize the secondary coating of the substrate, a compound layer uncoiler uncoils a compound plate, and the hot roller heats the uncoiled compound plate, the compound plate heated by the hot roller and the substrate subjected to secondary coating treatment in the secondary coating area are compounded through a compounding machine, and finally the metal thin film plate is formed after compounding.
Compared with the prior art, the utility model has the beneficial effects that:
(1) the traditional production device for producing the metal film plate by the liquid binder is characterized in that a base plate is coated with the liquid binder through a primary coating area, a composite plate is coated with the liquid binder through another group of primary coating areas, then the composite plate respectively enters heating furnaces with different lengths, and after the composite plate is heated, a composite machine is utilized to carry out composite to form the metal film plate; the utility model has the principle that a substrate is coated with a binder through a primary coating area and then enters a secondary coating area for coating the liquid binder after being heated in a heating furnace, a multilayer metal is directly uncoiled through an uncoiler and is directly compounded with the substrate coated with the liquid binder through the secondary coating area by a compound machine after being heated by an electric heating roller to form a metal film plate after being compounded, and the production device for producing the bonded metal film plate by using the liquid binder provided by the utility model coats the substrate twice and compounds the directly heated multilayer plate with the substrate, thereby overcoming the technical problem that the product yield is low due to the fact that a decorative surface is easily polluted due to deviation in the production process, improving the product yield, reducing the safety risk and labor intensity during production, and further ensuring the stable and smooth operation when the multilayer metal film below 0.3mm is used for production;
(2) according to the production device for producing the bonded metal film plate by using the liquid binder, the steel roller is used as the first dipping roller in the primary coating area, the colloid roller is used as the first coating roller to ensure that the coating thickness of the binder layer on the normal-temperature steel strip is mainly controlled in the primary coating area, the steel roller is used as the second coating roller in the secondary coating area, and the high-temperature-resistant colloid roller is used as the second coating support roller, so that the thickness of the binder wet film on the high-temperature steel strip at 120-280 ℃ in the secondary coating area can be effectively controlled, the binder thickness of the final composite product is further ensured, the binder thickness of the final composite product is ensured, and the qualified product is ensured to be produced;
(3) the production device for producing the bonded metal film plate by using the liquid binder, provided by the utility model, overcomes the problem that each supporting roller of a production line is polluted when a multi-layer metal is coated, and reduces the safety risk and the labor intensity brought by the pollution.
Drawings
FIG. 1 is a structural view of a manufacturing apparatus for manufacturing a bonded metal film plate using a liquid adhesive according to the present invention;
labeled as: 1-a first dipping roller, 2-a first adhesive material tray, 3-a first coating roller, 4-a first coating support roller, 5-a first support roller, 6-a heating furnace, 7-a multilayer uncoiler, 8-a second coating support roller, 9-a second coating roller, 10-a second dipping roller, 11-a second adhesive material tray, 12-an electric heating roller, 13-a compound machine, an A-primary coating area and a B-secondary coating area.
Detailed Description
The present invention will be described in further detail in order to make the objects, technical solutions and advantages of the present invention more apparent.
A production device for producing a bonded metal thin film plate by using a liquid adhesive is provided with a primary coating area A and a secondary coating area B, a heating furnace 6 is arranged in the conveying direction of the primary coating area A and the secondary coating area B, the heating furnace 6 heats a substrate subjected to coating treatment of the primary coating area A, the substrate is conveyed into the heating furnace 6 for heating treatment after being subjected to primary coating treatment of the primary coating area A, and then reaches the secondary coating area B for secondary coating, the device is further provided with a compound machine 13, a compound layer uncoiler 7 and an electric heating roller 12, the compound layer uncoiler 7 is arranged on one side of the secondary coating area B, the electric heating roller 12 is arranged in the conveying direction of the compound layer uncoiler 7, the compound plate uncoiled by the compound layer uncoiler 7 is driven to be conveyed to the electric heating roller 12 for heating, the compound machine 13 is arranged in the conveying direction of the electric heating roller 12 and the secondary coating area B, the composite board heated by the electric heating roller 12 and the substrate subjected to the secondary coating treatment in the secondary coating area B are conveyed to a compounding machine 13 for compounding.
The primary coating area A is provided with a first coating roller 3, the first coating roller 3 is used for coating a substrate once with a liquid adhesive, two sides of the first coating roller 3 are provided with a first dipping roller 1 and a first coating support roller 4, the first coating support roller 4 is used for supporting the substrate in the coating process, a first adhesive material tray 2 is arranged below the first dipping roller 1, the first adhesive material tray 2 is used for containing the liquid adhesive, the first dipping roller 1 is used for dipping the liquid adhesive in the first adhesive material tray 2, a first support roller 5 is arranged in the conveying direction of the first coating support roller 4, the first support roller 5 is used for supporting and transmitting the substrate after primary coating, the substrate is conveyed from the first coating support roller 4 to a heating furnace 6, the substrate with tension winds from a lower side roller to an upper side roller around the first coating support roller 4, the first adhesive material tray 2 is filled with the liquid adhesive, dip in the liquid binder in the first adhesive charging tray 2 through first dip roller 1, transmit liquid binder to first coating roller 3 from first dip roller 1, on coating the base plate with liquid binder by first coating roller 3, the base plate that has liquid binder through first coating roller 3 coating is heated in transmitting to heating furnace 6 through first backing roll 5, and first dip roller 1 in the primary coating district A is the steel roller, and first coating roller 3 in the primary coating district A is the colloid roller.
The secondary coating area B is provided with a second coating roller 9, the second coating roller 9 is used for secondary coating of the substrate, the substrate heated by the heating furnace 6 enters the secondary coating area B through a second coating support roller 8 for secondary coating, two sides of the second coating roller 9 are respectively provided with a second coating support roller 8 and a second dipping roller 10, the second coating support roller 8 is arranged below the conveyed substrate, the second coating support roller 8 is used for supporting the substrate in the secondary coating process, a second adhesive material tray 11 is arranged below the second dipping roller 10, the second adhesive material tray 11 is used for containing liquid adhesive for secondary coating, the second dipping roller 10 is used for taking the liquid adhesive in the second adhesive material tray 11, the liquid adhesive in the second adhesive material tray 11 is dipped by the second dipping roller 10, and the liquid adhesive is transmitted to the second coating roller 9 from the second dipping roller 10, and coating the liquid adhesive on the substrate by using a second coating roller 9 to realize secondary coating on the substrate, wherein the second coating roller 9 used in the secondary coating area B is a steel roller, and a second coating support roller 8 used in the secondary coating area B is a high-temperature-resistant colloid roller.
The principle of a production device for producing bonded metal film plates by using liquid adhesives is as follows: the method comprises the steps that a tensioned substrate is wound around a first coating support roller 4 from a lower side roller to an upper side roller, liquid adhesive is filled in a first adhesive material tray 2, the first adhesive material tray 1 is dipped with the liquid adhesive in the first adhesive material tray 2, the liquid adhesive is transferred from the first dipping roller 1 to a first coating roller 3, the liquid adhesive is coated on the substrate through the first coating roller 3, the substrate coated with the liquid adhesive through the first coating roller 3 is transferred to a heating furnace 6 through a first support roller 5 to be heated, the substrate heated through the heating furnace 6 enters a secondary coating area B through a second coating support roller 8 to be coated for the second time, the liquid adhesive in a second adhesive material tray 11 is dipped on a second dipping roller 10, the liquid adhesive is transferred from the second dipping roller 10 to a second coating roller 9, the liquid adhesive is coated on the substrate through the second coating roller 9, and secondary coating on the substrate is realized, the multi-layer uncoiler 7 uncoils the multi-layer plate, the electric heating roller 12 heats the uncoiled multi-layer plate, the multi-layer plate heated by the electric heating roller 12 and the substrate subjected to the secondary coating treatment in the secondary coating area B are compounded through the compounding machine 13, and finally the metal thin film plate is formed after compounding.
Example 1
In the embodiment, a galvanized sheet with the thickness of 0.3mm multiplied by 1250mm is adopted as the galvanized sheet, a stainless steel film sheet with the thickness of 0.1mm multiplied by 1250mm is adopted as the composite metal film, during coating operation, the galvanized sheet with tension is wound from a lower side roller to an upper side roller around a first coating support roller 4, liquid adhesive is filled in a first adhesive material tray 2, the liquid adhesive in the first adhesive material tray 2 is dipped by the first dipping roller 1, the liquid adhesive is transferred from the first dipping roller 1 to a first coating roller 3, the liquid adhesive is coated on the galvanized sheet by the first coating roller 3, the galvanized sheet coated with the liquid adhesive by the first coating roller 3 is transferred to a heating furnace 6 for heating through a first support roller 5, the galvanized sheet heated by the heating furnace 6 enters a secondary coating area B for secondary coating through a second coating support roller 8, the liquid adhesive in a second adhesive material tray 11 is dipped by a second dipping roller 10, the liquid binder is transferred from the second dipping roll 10 to the second coating roll 9, the liquid binder is coated on the galvanized sheet by the second coating roll 9, the secondary coating of the galvanized sheet of strip steel with the temperature of 200 ℃ is realized, the uncoiling treatment is carried out on the stainless steel thin film sheet by the multi-layer uncoiler 7, the uncoiled stainless steel thin film sheet is heated by the electric heating roll 12, the stainless steel thin film sheet heated by the electric heating roll 12 and the galvanized sheet subjected to the secondary coating treatment in the secondary coating area B are compounded by the compounding machine 13, and finally, the metal thin film sheet is formed after compounding.
The above-mentioned embodiments only express the specific embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for those skilled in the art, without departing from the technical idea of the present application, several changes and modifications can be made, which are all within the protection scope of the present application.

Claims (10)

1. The utility model provides an utilize liquid binder production bonding metal film plate's apparatus for producing, its characterized in that, the device is provided with once coats district A, secondary and coats district B, be provided with heating furnace (6) on the direction of transfer between once coating district A and the secondary and coat the district B, the device still is provided with multiple layer decoiler (7), multiple layer decoiler (7) set up one side at secondary coating district B, set up electric heat roller (12) on multiple layer decoiler 7's the direction of transfer, the multiple plate after multiple layer decoiler (7) are decoiled conveys electric heat roller (12) through the drive and heats, be provided with compounding machine (13) on electric heat roller (12) and the direction of transfer of secondary coating district B for compound board and the base plate after the secondary coating is handled.
2. A device for producing bonded metal film sheets using a liquid adhesive according to claim 1, wherein the primary coating area a is provided with a first coating roller (3), the first coating roller (3) is used for primary coating of the substrate, a first dipping roller (1) and a first coating backup roller (4) are provided on both sides of the first coating roller (3), and the first coating backup roller (4) is located below the conveyed substrate and is used for supporting the substrate during the primary coating process.
3. A device for producing bonded metallic film sheets using liquid adhesives according to claim 2, wherein a first adhesive pan (2) is provided under the first dip roller (1), the first adhesive pan (2) being adapted to contain liquid adhesive.
4. The apparatus for manufacturing bonded metallic film plates using liquid adhesives as claimed in claim 2, wherein the first coating backup roll (4) is provided with a first backup roll (5) in a transport direction, and the first backup roll (5) is used for supporting and transporting the substrate after the first coating, and transporting the substrate from the first coating backup roll (4) to the heating furnace (6).
5. A device for producing bonded metallic film sheets using a liquid binder as claimed in claim 2, wherein the first dip roll (1) in the primary coating zone a is a steel roll.
6. A device for producing bonded metallic film sheets using a liquid adhesive according to claim 2, wherein the first coating roll (3) in the primary coating zone a is a glue roll.
7. A device for producing bonded metallic film sheets using a liquid adhesive according to claim 1, wherein the secondary coating zone B is provided with a second coating roller (9), the second coating roller (9) is used for secondary coating of the substrate, a second coating backup roller (8) and a second dip roller (10) are respectively provided on both sides of the second coating roller (9), the second coating backup roller (8) is provided under the transferred substrate, and the second coating backup roller (8) is used for support in the secondary coating of the substrate.
8. A device for producing bonded metallic film sheets using liquid adhesives according to claim 7, wherein a second adhesive pan (11) is provided under the second dipping roller (10), and the second adhesive pan (11) is used for containing liquid adhesives for secondary coating.
9. A device for producing bonded metallic film sheets using a liquid adhesive as claimed in claim 7, wherein the second coating roller (9) used in said secondary coating zone B is a steel roller.
10. The apparatus for manufacturing bonded metallic film sheets using liquid adhesives as claimed in claim 7, wherein the second coating backup roll (8) used in the secondary coating zone B is a high temperature resistant glue roll.
CN202121338862.7U 2021-06-16 2021-06-16 Utilize apparatus for producing of liquid binder production bonding metal film board Expired - Fee Related CN215620685U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121338862.7U CN215620685U (en) 2021-06-16 2021-06-16 Utilize apparatus for producing of liquid binder production bonding metal film board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121338862.7U CN215620685U (en) 2021-06-16 2021-06-16 Utilize apparatus for producing of liquid binder production bonding metal film board

Publications (1)

Publication Number Publication Date
CN215620685U true CN215620685U (en) 2022-01-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121338862.7U Expired - Fee Related CN215620685U (en) 2021-06-16 2021-06-16 Utilize apparatus for producing of liquid binder production bonding metal film board

Country Status (1)

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CN (1) CN215620685U (en)

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