CN215613558U - Wafer surface cleaning device - Google Patents
Wafer surface cleaning device Download PDFInfo
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- CN215613558U CN215613558U CN202121992393.0U CN202121992393U CN215613558U CN 215613558 U CN215613558 U CN 215613558U CN 202121992393 U CN202121992393 U CN 202121992393U CN 215613558 U CN215613558 U CN 215613558U
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- cleaning
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- spray head
- wafer surface
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Abstract
The utility model relates to the field of wafer production, in particular to a wafer surface cleaning device. The device comprises a lifting mechanism, a spray head adjusting mechanism, a cleaning spray head, a height adjusting rod and a supporting rod, wherein one end of the height adjusting rod is fixedly connected, the other end of the height adjusting rod is connected with the lifting mechanism, the lifting mechanism adjusts the height of the height adjusting rod through rotation, the supporting rod is transversely connected onto the lifting mechanism, the spray head adjusting mechanism is arranged on the supporting rod, the cleaning spray head is connected onto the spray head adjusting mechanism, and the orientation of the cleaning spray head is adjusted to be aligned to the surface of a wafer according to the position spray head adjusting mechanism of the wafer. The device adopts the megasonic generator to enable the liquid to generate high-frequency oscillation to clean the surface of the wafer, and has stronger cleaning effect on residues; the relative height between the lifting mechanism and the wafer is adjusted, and the nozzle adjusting mechanism is used to make the cleaning nozzle align with the surface of the wafer, so that the liquid sprayed by the cleaning nozzle has the best cleaning angle relative to the surface of the wafer.
Description
Technical Field
The utility model relates to the field of wafer production, in particular to a wafer surface cleaning device.
Background
The utility model relates to the field of wafer production, in particular to a wafer surface cleaning device.
SUMMERY OF THE UTILITY MODEL
The utility model provides a wafer surface cleaning device, and aims to solve the problems that an existing cleaning mechanism is poor in cleaning effect and cannot adapt to various angle structures of a wafer.
The utility model provides a wafer surface cleaning device which comprises a lifting mechanism, a spray head adjusting mechanism, a cleaning spray head, a height adjusting rod and a supporting rod, wherein one end of the height adjusting rod is fixedly connected, the other end of the height adjusting rod is connected with the lifting mechanism, the lifting mechanism adjusts the height of the height adjusting rod through rotation, the supporting rod is transversely connected onto the lifting mechanism, the spray head adjusting mechanism is arranged on the supporting rod, the cleaning spray head is connected onto the spray head adjusting mechanism, and the spray head adjusting mechanism adjusts the orientation of the cleaning spray head to be aligned with the surface of a wafer according to the position of the wafer.
As a further improvement of the utility model, the spray head adjusting mechanism comprises a transverse bracket and an angle bracket, the upper end of the transverse bracket moves on the supporting rod and is fixed at any position on the supporting rod through a fastening piece, the lower end of the transverse bracket is connected with the angle bracket, and the cleaning spray head is connected with the angle bracket.
As a further improvement of the utility model, the top end of the angle bracket is hinged with the lower end of the transverse bracket and is fixed at any angle through a fastener, and the cleaning spray head is connected to the bottom end of the angle bracket.
As a further improvement of the utility model, the mechanism comprises a pipeline bracket, one or more pipeline brackets are connected on the support rod, the cleaning spray head is externally connected with cleaning liquid supply equipment through a pipeline, a pipeline through hole is arranged on the pipeline bracket, and the pipeline penetrates through the pipeline through holes on the one or more pipeline brackets.
As a further improvement of the utility model, the wafer surface cleaning device comprises a megasonic generator which is connected to the cleaning spray head.
As a further improvement of the utility model, the lifting mechanism comprises a rotary driving cylinder and a lifting platform, the height adjusting rod is provided with threads, the support rod is connected to the lifting platform, the lifting platform is connected to the rotary driving cylinder, and the rotary driving cylinder is connected with the height adjusting rod through the threads.
The utility model has the beneficial effects that: the device adopts the megasonic generator to enable the liquid to generate high-frequency oscillation to clean the surface of the wafer, and has stronger cleaning effect on residues; the relative height between the lifting mechanism and the wafer is adjusted, and the nozzle adjusting mechanism is used to make the cleaning nozzle align with the surface of the wafer, so that the liquid sprayed by the cleaning nozzle has the best cleaning angle relative to the surface of the wafer.
Drawings
FIG. 1 is a schematic diagram of an apparatus for cleaning a wafer surface according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.
As shown in fig. 1, the wafer surface cleaning apparatus of the present invention includes a lifting mechanism 1, a nozzle adjusting mechanism, a cleaning nozzle 6, a height adjusting rod 2, and a support rod 3, wherein one end of the height adjusting rod 2 is fixedly connected, and the other end thereof is connected to the lifting mechanism 1, the lifting mechanism 1 adjusts the height of the height adjusting rod 2 by rotation, the support rod 3 is transversely connected to the lifting mechanism 1, the nozzle adjusting mechanism is disposed on the support rod 3, the cleaning nozzle 6 is connected to the nozzle adjusting mechanism, and the nozzle adjusting mechanism adjusts the orientation of the cleaning nozzle 6 to be aligned with the wafer surface according to the position of the wafer.
The lifting mechanism 1 is matched with the height adjusting rod 2, the height of the cleaning spray head 6 relative to the surface of the wafer is adjusted through the connection of the supporting rod 3, and the spray head adjusting mechanism controls the sprayed cleaning liquid to clean the surface of the wafer at the optimal angle through adjusting the alignment angle of the cleaning spray head 6.
The device also comprises a megasonic generator 7, the megasonic generator 7 is connected on the cleaning spray head 6, bubbles which can not be cleaned by ultrasonic waves are formed after the cleaning liquid is subjected to high-frequency vibration of the megasonic generator 7, and the bubbles continuously impact the surface of the wafer by high-speed fluid waves, so that fine particles of pollutants attached to the surface of the wafer are forcibly removed and enter the cleaning liquid.
The spray head adjusting mechanism comprises a transverse support 4 and an angle support 5, the upper end of the transverse support 4 moves on the support rod 3 and is fixed at any position on the support rod 3 through a fastener, the lower end of the transverse support 4 is connected with the angle support 5, and the cleaning spray head 6 is connected onto the angle support 6. The transverse bracket 4 is responsible for adjusting the position of the cleaning spray head 6 on the support rod 3, namely adjusting the cleaning radius, and after the transverse bracket 4 is moved to a required position, the transverse bracket 4 is fixed by tightening a fastener.
The top end of the angle bracket 5 is hinged with the lower end of the transverse bracket 4 and fixed at any angle through a fastener, and the cleaning spray head 6 is connected at the bottom end of the angle bracket 5. The angle bracket 5 is responsible for adjusting the inclination angle of the cleaning spray head 6 relative to the transverse bracket 4, one end of the angle bracket 5 can rotate around the lower end of the transverse bracket 4, and after the angle bracket is rotated to a required angle, the angle bracket 5 is fixed by screwing a fastener, so that the cleaning spray head 6 is aligned to the surface of the wafer. The liquid is used to clean the wafer at an optimal position and angle relative to the wafer by using the front-back and angle adjustment mechanism.
The wafer surface cleaning device comprises a pipeline support 8, one or more pipeline supports 8 are connected to a support rod 3, a cleaning spray head 6 is externally connected with cleaning liquid supply equipment through a pipeline, a pipeline through hole 81 is formed in the pipeline support 8, and the pipeline penetrates through the pipeline through holes 81 in one or more pipeline supports 8. The pipeline includes spool and trachea that control washing shower nozzle 6 and megasonic generator 7 needs, and spool and tracheal line length all pass pipeline through-hole 81 and fix, makes spool and trachea can not scatter on bracing piece 3, influences the position control of device in the cleaning process, has also avoided hindering the hydrojet that washs shower nozzle 6.
The wafer surface cleaning device adopts a multi-freedom-degree adjusting mechanism for the megasonic generator 7, so that the liquid has the optimal cleaning angle relative to the wafer surface. And the cleaning liquid of the cleaning spray head 6 is matched with the megasonic generator 7, so that the liquid generates high-frequency oscillation to efficiently clean the residues on the surface of the wafer.
The foregoing is a more detailed description of the utility model in connection with specific preferred embodiments and it is not intended that the utility model be limited to these specific details. For those skilled in the art to which the utility model pertains, several simple deductions or substitutions can be made without departing from the spirit of the utility model, and all shall be considered as belonging to the protection scope of the utility model.
Claims (6)
1. The utility model provides a wafer surface cleaning device, its characterized in that includes elevating system, shower nozzle adjustment mechanism, washs the shower nozzle, altitude mixture control pole, bracing piece, elevating system is connected to altitude mixture control pole one end fixed connection, its other end, elevating system adjusts the height on altitude mixture control pole through the rotation, bracing piece transverse connection is on elevating system, shower nozzle adjustment mechanism sets up on the bracing piece, it connects on shower nozzle adjustment mechanism to wash the shower nozzle, according to the position of wafer the orientation alignment wafer surface of shower nozzle is washd in shower nozzle adjustment mechanism adjustment.
2. The wafer surface cleaning apparatus according to claim 1, wherein the nozzle adjusting mechanism comprises a lateral bracket and an angle bracket, an upper end of the lateral bracket moves on the support rod and is fixed at any position on the support rod through a fastener, a lower end of the lateral bracket is connected with the angle bracket, and the cleaning nozzle is connected with the angle bracket.
3. The wafer surface cleaning device as claimed in claim 2, wherein the top end of the angle bracket is hinged with the lower end of the transverse bracket and is fixed at any angle through a fastener, and the cleaning spray head is connected with the bottom end of the angle bracket.
4. The wafer surface cleaning device of claim 1, comprising a pipeline support, wherein one or more pipeline supports are connected to the support rod, the cleaning nozzle is externally connected with a cleaning liquid supply device through a pipeline, a pipeline through hole is formed in the pipeline support, and the pipeline penetrates through the pipeline through holes in the one or more pipeline supports.
5. The wafer surface cleaning apparatus of claim 1, comprising a megasonic generator coupled to the cleaning showerhead.
6. The wafer surface cleaning device as claimed in claim 1, wherein the lifting mechanism comprises a rotary driving cylinder and a lifting table, the height adjusting rod is provided with a thread, the support rod is connected to the lifting table, the lifting table is connected to the rotary driving cylinder, and the rotary driving cylinder is connected with the height adjusting rod through a thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121992393.0U CN215613558U (en) | 2021-08-23 | 2021-08-23 | Wafer surface cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121992393.0U CN215613558U (en) | 2021-08-23 | 2021-08-23 | Wafer surface cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215613558U true CN215613558U (en) | 2022-01-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121992393.0U Active CN215613558U (en) | 2021-08-23 | 2021-08-23 | Wafer surface cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215613558U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114308424A (en) * | 2022-03-08 | 2022-04-12 | 宁波润华全芯微电子设备有限公司 | High pressure nozzle assembly, high pressure nozzle moving part, degumming cavity and degumming machine |
-
2021
- 2021-08-23 CN CN202121992393.0U patent/CN215613558U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114308424A (en) * | 2022-03-08 | 2022-04-12 | 宁波润华全芯微电子设备有限公司 | High pressure nozzle assembly, high pressure nozzle moving part, degumming cavity and degumming machine |
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