CN215600093U

CN215600093U - Water cooling device of solid state disk

Info

Publication number: CN215600093U
Application number: CN202121723832.8U
Authority: CN
Inventors: 马迅嘉; 庄子贤; 陈冠廷
Original assignee: Team Group Co ltd
Current assignee: Team Group Co ltd
Priority date: 2021-07-28
Filing date: 2021-07-28
Publication date: 2022-01-21
Anticipated expiration: 2031-07-28

Abstract

The utility model relates to a water cooling device of a solid state disk, comprising: the water cooling component comprises a water cooling head and a water pump, the water pump is arranged in the water cooling head, and the water cooling head is provided with a heat conduction assembly used for forming heat conduction with the solid state disk; a first conduit; a second conduit; and the water cooling bar is provided with a radiator, the first pipeline and the second pipeline are connected between the water cooling bar and the water cooling component, the water pump drives the water cooling liquid to flow in a circulating mode sequentially through the water cooling component, the first pipeline, the water cooling bar, the second pipeline and the water cooling component, and the radiator in the water cooling bar transfers the heat of the water cooling liquid to the air.

Description

Water cooling device of solid state disk

Technical Field

The utility model relates to the technical field of solid state disks, in particular to a water cooling device for a solid state disk.

Background

With the rapid development of the solid state disk technology, the speed is gradually increased. For example, the read-write speed of the m.2 solid state disk based on the NVMe specification and using the PCIe bus is several times faster than before. However, the excellent performance also brings about a considerable problem of heat generation. A large amount of heat generated in the long-time large-amount reading and writing process is concentrated on the small-size master control chip and the NAND chip, so that overheating can be caused to trigger a protection mechanism, the performance is reduced, and even the service life is shortened.

In order to solve the overheating problem, some solid state disks in the prior art adopt a water cooling mode. The prior art water cooling device generally includes a water head (water block), a pump, a water cooling bank, and pipelines connecting the above components. However, the water cooling device in the prior art only uses the solid state disk as a component for dissipating heat when a CPU, a graphics card, and the like are dissipated, and only the solid state disk is provided with a water cooling head through which cold water passes. Compared with a CPU and a display card, the solid state disk has the advantage that the heat generated by the solid state disk reaches the level which is difficult to ignore. Therefore, it is necessary to design a water cooling device for dissipating heat of the solid state disk.

SUMMERY OF THE UTILITY MODEL

Therefore, an object of the present invention is to provide a water cooling apparatus for a solid state disk, which is used for dissipating heat from the solid state disk.

The technical means adopted by the utility model to solve the problems of the prior art is to provide a water cooling device for a solid state disk, comprising: the water cooling component comprises a water cooling head and a water pump, wherein the water cooling head is provided with a water pump accommodating space, the water pump is arranged in the water pump accommodating space, the water cooling head is provided with a liquid flow outlet, a liquid flow inlet and a heat conduction assembly, and the heat conduction assembly is used for forming heat conduction with the solid state disk so that the water cooling head receives heat from the solid state disk; a first pipe having one end connected to the liquid stream inlet; a second conduit having one end connected to the fluid outlet; and the water cooling row is provided with a water cooling outlet, a water cooling inlet and a radiator, the water cooling outlet is connected to the other end of the first pipeline, the water cooling inlet is connected to the other end of the second pipeline, the water pump drives the water cooling liquid to flow in a circulating mode sequentially through the water cooling component, the first pipeline, the water cooling row, the second pipeline and the water cooling component so that a circulating water path is formed among the water cooling component, the first pipeline, the water cooling row and the second pipeline, and the radiator in the water cooling row is used for conducting heat of the water cooling liquid to air.

In an embodiment of the utility model, the heat conduction member is a metal block and is configured to contact the solid state disk so that the solid state disk is conducted to the metal block.

In an embodiment of the utility model, to provide a water cooling device for a solid state disk, the heat conduction member further includes a fastener, the metal block has a fixing hole, and is fixed with the fastener, and the metal block and the fastener sandwich the solid state disk.

In an embodiment of the utility model, in order to provide a water cooling device for a solid state disk, the metal block has a groove, and the groove is formed as a part of the circulating water path.

In an embodiment of the utility model, a minimum distance between the liquid inlet and the heat conducting assembly is smaller than a minimum distance between the liquid outlet and the heat conducting assembly.

In an embodiment of the utility model, a water cooling apparatus for a solid state disk is provided, the water cooling bank includes a fan facing the heat sink.

By the technical means adopted by the water cooling device of the solid state disk, the water cooling head and the water pump are combined into a whole. The heat conduction component of the water cooling head is used for forming heat conduction with the solid state disk, so that the water cooling head receives heat from the solid state disk. Preferably, the shape of the heat conduction assembly is matched with the chip arrangement of the solid state disk, so that the water cooling device of the solid state disk can radiate heat for the solid state disk.

Drawings

Fig. 1 is a schematic perspective view of a water cooling apparatus for a solid state disk according to an embodiment of the utility model.

Fig. 2 is an exploded schematic view of the water cooling apparatus for a solid state disk according to the embodiment of the utility model.

Fig. 3 is a partial side sectional view of the water cooling device of the solid state disk according to the embodiment of the utility model, which is disposed on the solid state disk.

Fig. 4 is a partial side sectional view of the water cooling device of the solid state disk according to the embodiment of the present invention.

Reference numerals

Water cooling device of 100 solid state disk

1 Water-cooled Member

11 water cooling head

111 liquid flow outlet

112 liquid stream inlet

113 heat conduction assembly

114 metal block

115 fastener

116 fixing hole

117 groove

12 water pump

2 first pipeline

3 second pipe line

4 Water-cooling row

41 radiator

411 Water-cooled discharge opening

412 water-cooled discharge inlet

42 Fan

D solid state disk

P heat conducting pad

S water pump accommodating space

Detailed Description

The following describes an embodiment of the present invention with reference to fig. 1 to 4. The description is not intended to limit the embodiments of the present invention, but is one example of the present invention.

As shown in fig. 1, a water cooling apparatus 100 for a solid state disk according to an embodiment of the present invention includes: water cooling member 1, first pipeline 2, second pipeline 3 and water cooling row 4.

As shown in fig. 1 to 3, according to a water cooling apparatus 100 for a solid state disk of an embodiment of the present invention, a water cooling member 1 includes a water cooling head 11 and a water pump 12. The water cooling head 11 has a water pump accommodating space S. The water pump 12 is disposed in the water pump accommodating space S, and the water cooling head 11 is combined with the water pump 12.

The water cooling head 11 has a liquid flow outlet 111, a liquid flow inlet 112 and a heat transfer member 113. The liquid outlet 111 and the liquid inlet 112 are used for respectively supplying water cooling liquid to flow out and flow into the water cooling head 11. The heat conduction assembly 113 is used for forming heat conduction with the solid state disk D, so that the heat conduction assembly 113 receives heat from the solid state disk D and transfers the heat to the water cooling head 11 through the heat conduction assembly 113.

At least a portion of water head 11 may be a light transmissive material to allow a user to view the water cooling fluid within water head 11.

The water cooling member 1 circulates so that the water cooling member 1, the second pipe 3, the water cooling bank 4, and the first pipe 2 form a circulation water path.

As shown in fig. 1 to 3, in the water cooling apparatus 100 for a solid state disk according to the embodiment of the present invention, the minimum distance between the liquid flow inlet 112 and the heat transfer member 113 is smaller than the minimum distance between the liquid flow outlet 111 and the heat transfer member 113, so that the influence of the water cooling liquid flowing into the water cooling head 11 from the liquid flow inlet 112 on the heat transfer member 113 is larger than the influence of the water cooling liquid flowing out of the water cooling head 11 from the liquid flow outlet 111 on the heat transfer member 113. Since the water coolant flowing out of the water head 11 from the liquid outlet 111 passes through the heat transfer member 113 and the water pump 12 and has a temperature higher than that of the water coolant flowing in from the liquid inlet 112, the temperature of the water coolant having a higher temperature affects the heat transfer member 113.

In detail, as shown in fig. 2 and 3, the heat conduction member 113 includes a metal block 114. A thermal pad P or thermal paste is disposed between the metal block 114 and the solid state disk D, so that heat of the solid state disk can be conducted to the metal block 114. The material of the metal block 114 is copper. In other embodiments, the metal block 114 may be made of other materials with high thermal conductivity. In the present embodiment, the bottom surface of the metal block 114 is a rectangular surface, and matches the arrangement of the chips of the solid state disk D.

As shown in fig. 2, in the water cooling apparatus 100 for a solid state disk according to the embodiment of the utility model, the heat conduction assembly 113 further includes a buckle 115. The metal block 114 has a fixing hole 116 to be fixed to the buckle 115. The metal block 114 and the fastener 115 clamp the solid state disk D, so that the water cooling device 100 of the solid state disk and the solid state disk D are fixed with each other.

The metal block 114 is capable of directly contacting the water-cooling fluid. In the present embodiment, as shown in fig. 3 and 4, the metal block 114 has an elongated groove 117. The middle section of the groove 117 is covered and an opening for the inlet and outlet of the water cooling liquid is formed at the two ends. Arrows indicate the flow direction of the water-cooling liquid when driven by the water pump 12. The water-cooling fluid flows into the groove 117 from one end of the groove 117 and flows out of the groove 117 from the other end of the groove 117. That is, the groove 117 is formed as a part of the circulating water path, and raises the surface area of the metal block 114 contacting the water-cooling liquid. In other embodiments, the metal block 114 may be replaced by a rectangular plate of metal.

As shown in fig. 1 and 2, one end of the first pipe 2 is connected to the liquid inlet 112 of the water cooling head 11, and the other end of the first pipe 2 is connected to the water cooling outlet 411 of the radiator 41 of the water cooling bank 4. The water-cooled liquid flows from the water-cooled discharge port 411 to the liquid inlet 112 in the first pipe 2 by being driven by the water pump 12. The first pipe 2 may be a hard material such as metal or a soft material such as plastic. On the other hand, the first pipe 2 may be a light-transmitting material so that a user can observe the water-cooled liquid inside the first pipe 2.

As shown in fig. 1 and 2, one end of the second pipe 3 is connected to the liquid outlet 111 of the water cooling head 11, and the other end of the second pipe 3 is connected to the water cooling discharge inlet 412 of the radiator 41 of the water cooling bank 4. The water-cooling liquid is driven by the water pump 12 to flow from the liquid outlet 111 to the water-cooling discharge inlet 412 in the second pipe 3. The second conduit 3 may be a hard material such as metal or a soft material such as plastic. On the other hand, the second conduit 3 may be of a light-transmissive material so that the user can observe the water-cooled liquid inside the second conduit 3. The material of the second conduit 3 may be the same as or different from the first conduit 2.

The water cooling bank 4 has a radiator 41 and a fan 42. The radiator 41 is in fluid communication with water cooling liquid for transferring heat of the water cooling liquid to air. The fan 42 is directed toward the radiator 41 to improve the effect of the radiator 41 in transferring the heat of the water-cooling liquid to the air.

The radiator 41 has a water-cooled discharge port 411 and a water-cooled discharge port 412, and the water-cooled liquid is supplied to flow out of and into the radiator 41, respectively. A water-cooled discharge port 411 is connected to the other end of the first pipe 2, and a water-cooled discharge port 412 is connected to the other end of the second pipe 3.

While the foregoing description and description are of the preferred embodiment of the present invention, other modifications will be apparent to those skilled in the art from this disclosure and it is intended that all such modifications fall within the spirit and scope of the present invention.

Claims

1. The utility model provides a water cooling plant of solid state hard drives which characterized in that, water cooling plant contain:

the water cooling component comprises a water cooling head and a water pump, wherein the water cooling head is provided with a water pump accommodating space, the water pump is arranged in the water pump accommodating space, the water cooling head is provided with a liquid flow outlet, a liquid flow inlet and a heat conduction assembly, and the heat conduction assembly is used for forming heat conduction with the solid state disk so that the water cooling head receives heat from the solid state disk;

a first conduit, one end of said first conduit being connected to said fluid stream inlet;

a second conduit, one end of said second conduit being connected to said fluid outlet; and

the water-cooling is arranged and has a water-cooling outlet, a water-cooling inlet and a radiator, the water-cooling outlet is connected with the other end of the first pipeline, the water-cooling inlet is connected with the other end of the second pipeline, the water pump drives water-cooling liquid to flow in sequence in the water-cooling component, the first pipeline, the water-cooling outlet, the second pipeline and the water-cooling component in a circulating way, so that the water-cooling component, the first pipeline, the water-cooling outlet and the second pipeline form a circulating water channel, and the radiator in the water-cooling outlet is used for transferring the heat of the water-cooling liquid to the air.

2. The solid state disk water cooling device as claimed in claim 1, wherein the heat conducting member is a metal block for contacting the solid state disk, so that the water cooling head receives heat from the solid state disk through the metal block.

3. The solid state disk water cooling device as claimed in claim 2, wherein the heat conduction member further comprises a clip, the metal block has a fixing hole to be fixed with the clip, and the metal block and the clip sandwich the solid state disk.

4. The solid state disk water cooling device as claimed in claim 2, wherein the metal block has a groove formed as a part of the circulating water path.

5. The apparatus of claim 1, wherein a minimum distance between the fluid inlet and the heat conducting member is smaller than a minimum distance between the fluid outlet and the heat conducting member.

6. The solid state disk water cooling device as claimed in claim 1, wherein the water cooling bank comprises a fan facing the heat sink.