CN215588755U - Polishing device - Google Patents

Abstract

A polishing device is used for polishing the surface of a rubber thread and comprises a traction mechanism and a plurality of polishing mechanisms, wherein the traction mechanism comprises a thread feeding wheel and a thread take-up wheel which are arranged at intervals, the thread feeding wheel is used for winding the rubber thread to be polished, and the thread take-up wheel is used for drawing the rubber thread on the thread feeding wheel and winding the polished rubber thread; a plurality of grinding machanism arrange between wire feeding wheel and take-up pulley, and each grinding machanism includes the wheel of polishing that two intervals set up, is used for supplying the glue line to pass and polishes the glue line surface between two wheels of polishing, and wherein, the wheel of polishing that a plurality of grinding machanism correspond is from a plurality of angle centre grippings and polish the glue line. Among the above-mentioned grinding device, pull the gluey line through drive mechanism, the wheel of polishing that corresponds through a plurality of grinding machanism from a plurality of angle centre grippings and the gluey line of polishing to realize polishing the gluey line automatically and make gluey line surface polish evenly, promote grinding device's the effect of polishing, effectively reduce the waste of manpower, and effectively improve the efficiency of polishing.

Description

Polishing device

Technical Field

The application relates to the technical field of rubber processing, especially, relate to a grinding device.

Background

In the process of producing rubber products such as rubber hoses (rubber pipes), roughening treatment needs to be carried out on the surfaces of the rubber hoses. The existing processing method is to manually polish the surface of the rubber tube by using sand paper, so that the working efficiency is low, a large amount of manpower is wasted, and waste materials and dust generated in the polishing process are harmful to the health of a human body.

SUMMERY OF THE UTILITY MODEL

Accordingly, there is a need for a polishing device to solve the above problems.

The embodiment of the application provides a polishing device, which is used for polishing the surface of a rubber wire and comprises a traction mechanism and a plurality of polishing mechanisms, wherein the traction mechanism comprises a wire feeding wheel and a wire collecting wheel which are arranged at intervals, the wire feeding wheel is used for collecting the rubber wire to be polished, and the wire collecting wheel is used for drawing out the rubber wire on the wire feeding wheel and collecting the polished rubber wire; the plurality of grinding mechanisms are arranged between the wire feeding wheel and the wire collecting wheel, each grinding mechanism comprises two grinding wheels arranged at intervals, the two grinding wheels are used for allowing the glue line to pass through and grinding the surface of the glue line, and the grinding wheels corresponding to the plurality of grinding mechanisms clamp and grind the glue line from a plurality of angles.

Further, in some embodiments of this application, grinding device still includes bears the frame, bear the frame and be equipped with the loading surface of connecting a plurality of grinding machanism, glue the line with loading surface parallel arrangement, grinding machanism still includes the backup pad, the backup pad is equipped with the holding surface of connecting two grinding wheels, the holding surface that a plurality of grinding machanism correspond with contained angle between the loading surface is a plurality of angles.

Further, in some embodiments of the present application, the bearing surface is provided with a hollow portion, the polishing device is further provided with an accommodating groove, the accommodating groove is disposed on one side of the bearing surface deviating from the polishing mechanism, and the accommodating groove is communicated with the hollow portion and used for accommodating waste materials falling off from the polishing mechanism.

Further, in some embodiments of this application, each grinding machanism still includes driving piece, first band pulley, second band pulley, drive wheel, drive gear and hold-in range, the driving piece is fixed in the backup pad, the driving piece is equipped with rotatable transmission shaft, the drive wheel is equipped with gear portion and band pulley portion, the driving piece is connected first band pulley, the second band pulley reaches drive gear connects a dozen emery wheel respectively, first band pulley the second band pulley reaches connect the cover between the band pulley portion and establish the hold-in range, gear portion with drive gear meshing, the driving piece passes through the hold-in range reaches drive gear drives two grinding wheel synchronous rotation.

Further, in some embodiments of the present application, each of the grinding mechanisms further comprises a tension wheel movably connected to the support plate and abutting the timing belt.

Further, in some embodiments of the present application, the first pulley, the second pulley, and the drive wheel form a triangular drive structure.

Further, in some embodiments of the present application, each of the grinding mechanisms further includes a guide plate provided with a guide hole facing the gap between the two grinding wheels for passing through the glue line.

Further, in some embodiments of this application, grinding device still includes inlet wire mechanism, inlet wire mechanism set up in go up the line wheel with be close to between the grinding machanism of going up the line wheel, inlet wire mechanism is including supporting holding board and first running roller, support holding board and first running roller is used for supporting holding the follow the gluey line that goes up the line wheel and pull out, in order to control the direction of traction of gluey line.

Further, in some embodiments of this application, grinding device still includes the admission machine, the admission machine set up in the admission wheel with be close to between the grinding machanism of admission wheel, the admission machine includes the second running roller and can follow and be on a parallel with admission wheel axis direction reciprocating motion's take-up pole, the second running roller be used for support hold in certainly grinding machanism pulls out gluey line, the tip of taking-up pole to the admission wheel extends, the tip is equipped with the through-hole and is used for supplying gluey line passes and make gluey line arrange in proper order and convolute in the admission wheel.

Further, in some embodiments of the present application, the take-up mechanism further includes a power component, and the power component is connected to the take-up pulley in a transmission manner and drives the take-up pulley to rotate, so as to draw and wind the glue line.

In the polishing device, the rubber wire is pulled by the traction mechanism, and is clamped and polished from a plurality of angles by the polishing wheels corresponding to the polishing mechanisms, so that the rubber wire is automatically polished and the surface of the rubber wire is uniformly polished, and the polishing effect of the polishing device is improved. Compare with the current artifical mode of polishing that uses abrasive paper, reduce the waste of manpower to effectively improve the efficiency of polishing.

Drawings

Fig. 1 is a schematic structural diagram of a polishing apparatus according to an embodiment of the present application.

Fig. 2 is a schematic front view of a polishing mechanism in a polishing apparatus according to an embodiment of the present application.

Fig. 3 is a schematic diagram illustrating a back side structure of a polishing mechanism in a polishing apparatus according to an embodiment of the present application.

Fig. 4 is a schematic front view of a polishing mechanism in a polishing apparatus according to an embodiment of the present application.

Fig. 5 is a schematic diagram illustrating a back side structure of a polishing mechanism in a polishing apparatus according to an embodiment of the present application.

Fig. 6 is a schematic front view of a polishing mechanism in a polishing apparatus according to an embodiment of the present application.

Fig. 7 is a schematic diagram illustrating a back side structure of a polishing mechanism in a polishing apparatus according to an embodiment of the present application.

Description of the main elements

Grinding device 100

Traction mechanism 10

Winding wheel 11

Take-up reel 12

Grinding mechanisms 20, 20a, 20b, 20c, 20d

Grinding wheel 21

Supporting plate 22

Supporting surface 221

Telescopic rod 222

Driving member 23

Drive shaft 231

First pulley 24

Second pulley 25

Drive wheel 26

Gear portion 261

Pulley portion 262

Drive gear 27

Synchronous belt 28

Tension wheel 29

The carrier 30

Carrying surface 31

Hollow part 32

Accommodating groove 35

Wire feeding mechanism 40

Abutting plate 41

First roller 42

First fixing plate 43

Take-up mechanism 50

Second roller 51

Take-up pole 52

End 521

Power part 53

Second fixing plate 54

Sliding rod 541

Guide plate 60

Guide hole 61

Glue line 90

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

It will be understood that when an element is referred to as being "mounted on" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

The embodiment of the application provides a polishing device, which is used for polishing the surface of a rubber thread and comprises a traction mechanism and a plurality of polishing mechanisms, wherein the traction mechanism comprises a thread feeding wheel and a thread take-up wheel which are arranged at intervals, the thread feeding wheel is used for winding the rubber thread to be polished, and the thread take-up wheel is used for drawing out the rubber thread on the thread feeding wheel and winding the polished rubber thread; a plurality of grinding machanism arrange between wire feeding wheel and take-up pulley, and each grinding machanism includes the wheel of polishing that two intervals set up, is used for supplying the glue line to pass and polishes the glue line surface between two wheels of polishing, and wherein, the wheel of polishing that a plurality of grinding machanism correspond is from a plurality of angle centre grippings and polish the glue line.

Among the above-mentioned grinding device, pull the gluey line through drive mechanism, the wheel of polishing that corresponds through a plurality of grinding machanism from a plurality of angle centre grippings and the gluey line of polishing to realize polishing the gluey line automatically and make gluey line surface polish evenly, promote grinding device's the effect of polishing. Compare with the current artifical mode of polishing that uses abrasive paper, reduce the waste of manpower to effectively improve the efficiency of polishing.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings.

Referring to fig. 1, the polishing apparatus 100 of the present embodiment is used for polishing the surface of the glue line 90 to perform a roughening process on the surface of the glue line 90. It is understood that the polishing device 100 can be used for polishing the rubber wire 90, and can also be used for polishing other wires or pipes such as cables or pipes.

The grinding apparatus 100 of the present embodiment includes a traction mechanism 10 and a plurality of grinding mechanisms 20. The traction mechanism 10 comprises a wire feeding wheel 11 and a wire collecting wheel 12 which are arranged at intervals, wherein the wire feeding wheel 11 is used for winding a rubber wire 90 to be polished, and the wire collecting wheel 12 is used for drawing the rubber wire 90 on the wire feeding wheel 11 and winding the polished rubber wire 90. The plurality of grinding mechanisms 20 are arranged between the winding wheel 11 and the winding wheel 12, each grinding mechanism 20 comprises two grinding wheels 21 arranged at intervals, and the two grinding wheels 21 are used for allowing the glue line 90 to pass through and grinding the surface of the glue line 90. Wherein, the grinding wheel 21 that a plurality of grinding machanism 20 correspond is from a plurality of angle centre grippings and the rubber thread 90 of polishing, promptly, each grinding machanism 20 polishes the different position of rubber thread 90 respectively, and a plurality of grinding machanism 20 cooperations can be polished a plurality of different positions of rubber thread 90 or even all peripheral surfaces of rubber thread 90.

In some embodiments, the abrading device 100 includes four abrading mechanisms 20, referenced to a cross-section of the glue line 90 along a direction perpendicular to its axis, the cross-section being a 360 ° circle. The four grinding mechanisms 20 are defined as a grinding mechanism 20a, a grinding mechanism 20b, a grinding mechanism 20c, and a grinding mechanism 20d, respectively.

The contact points of the two grinding wheels 21 corresponding to the grinding mechanism 20a and the glue line 90 are located at 0-degree and 180-degree positions of the circular section; the contact points of the two grinding wheels 21 corresponding to the grinding mechanism 20b and the glue line 90 are located at 90 degrees and 270 degrees of the circular section; the contact points of the two grinding wheels 21 corresponding to the grinding mechanism 20c and the glue line 90 are positioned at 45 degrees and 225 degrees of the circular section; the contact points of the two grinding wheels 21 of the grinding mechanism 20d with the glue line 90 are located at 135 ° and 315 ° of the circular cross section. The surfaces of the peripheral sides of the rubber threads 90 are polished by the four polishing mechanisms 20, so that the surfaces of the rubber threads 90 are uniformly polished, and the polishing effect of the polishing device 100 is improved.

In the use process of the polishing device 100, the glue line 90 to be polished is wound on the winding wheel 11, and then the glue line 90 sequentially passes through two polishing wheels 21 corresponding to the polishing mechanisms 20, and the end part of the glue line 90 is fixed on the winding wheel 12. The plurality of grinding mechanisms 20 are started to enable the corresponding grinding wheels 21 to clamp and grind the glue lines 90 from multiple angles, and meanwhile, the take-up pulley 12 is rotated to pull the glue lines 90 to move so as to wind the ground glue lines 90 on the take-up pulley 12.

Among the above-mentioned grinding device 100, pull gluey line 90 through drive mechanism 10, polish wheel 21 through a plurality of grinding machanism 20 correspondences from a plurality of angle centre grippings and polish gluey line 90 to realize polishing gluey line 90 automatically and make gluey line 90 surface polish evenly, promote grinding device 100's the effect of polishing. Compare with the current artifical mode of polishing that uses abrasive paper, reduce the waste of manpower to effectively improve the efficiency of polishing.

Referring to fig. 1, the polishing apparatus 100 further includes a carrier 30, and the carrier 30 is provided with a carrying surface 31 connected to the polishing mechanisms 20. The glue line 90 is disposed parallel to the carrying surface 31, and specifically, the glue line 90 is erected above the carrying surface 31 through the winding wheel 11 and the winding wheel 12. Each grinding mechanism 20 further comprises a support plate 22, the support plate 22 is provided with a support surface 221 for connecting the two grinding wheels 21, and the axial directions of the two grinding wheels 21 are perpendicular to the support surface 221. The supporting surface 221 and the carrying surface 31 corresponding to the plurality of grinding mechanisms 20 form a plurality of included angles, so that the grinding wheel 21 connected to the supporting surface 221 clamps and grinds the glue line 90 at a plurality of angles.

In some embodiments, grinding apparatus 100 includes four grinding mechanisms 20, respectively grinding mechanism 20a, grinding mechanism 20b, grinding mechanism 20c, and grinding mechanism 20d, as defined above. The included angle between the supporting surface 221 corresponding to the grinding mechanism 20a and the bearing surface 31 is 90 degrees; the included angle between the supporting surface 221 corresponding to the grinding mechanism 20b and the bearing surface 31 is 0 degree; the included angle between the supporting surface 221 corresponding to the grinding mechanism 20c and the bearing surface 31 is 135 degrees; the supporting surface 221 corresponding to the grinding mechanism 20d forms an angle of 45 ° with the bearing surface 31. The included angles between the supporting surface 221 and the bearing surface 31 of the four grinding mechanisms 20 form a plurality of angles, so that the grinding wheel 21 connected to the supporting surface 221 clamps and grinds the glue line 90 from a plurality of angles, and further the grinding effect of the grinding device 100 is improved.

Referring to fig. 1, the carrying surface 31 has a hollow portion 32. The polishing device 100 is further provided with an accommodating groove 35, the accommodating groove 35 is disposed on one side of the carrying surface 31 departing from the polishing mechanism 20, and the accommodating groove 35 is communicated with the hollow portion 32 and is used for accommodating waste materials falling off from the polishing mechanism 20, so that the waste materials are prevented from being scattered to hurt a human body.

In some embodiments, the polishing device 100 further has a protective cover (not shown) covering the carrying surface 31, and the polishing mechanisms 20 are all located in the protective cover, so as to further prevent the waste generated by polishing by the polishing mechanisms 20 from being dissipated to cause damage to human body.

Referring to fig. 1, the polishing apparatus 100 further includes a wire feeding mechanism 40, and the wire feeding mechanism 40 is disposed between the upper reel 11 and the polishing mechanism 20 (see the polishing mechanism 20d in fig. 1) close to the upper reel 11. The wire feeding mechanism 40 includes a supporting plate 41 and a first roller 42, and the supporting plate 41 and the first roller 42 are used for supporting the rubber wire 90 pulled from the wire feeding wheel 11, so as to control the pulling direction of the rubber wire 90.

In some embodiments, the wire feeding mechanism 40 further includes a first fixing plate 43, the first fixing plate 43 is fixed on the carrying surface 31 and located between the wire feeding wheel 11 and the polishing mechanism 20d, and the supporting plate 41 and the first roller 42 are respectively connected to the first fixing plate 43.

The polishing apparatus further includes a take-up mechanism 50, and the take-up mechanism 50 is disposed between the take-up reel 12 and the polishing mechanism 20 (refer to the polishing mechanism 20c in fig. 1) close to the take-up reel 12. The take-up mechanism 50 includes a second roller 51 and a take-up lever 52 reciprocally movable in a direction parallel to the axis of the take-up pulley 12. The second roller 51 is used for supporting the glue line 90 drawn out from the polishing mechanism 20. The end 521 of the wire take-up rod 52 extends in the direction of the wire take-up wheel 12, and the end 521 is provided with a through hole for the glue wire 90 to pass through and the glue wire 90 to be sequentially arranged and wound on the wire take-up wheel 12.

In some embodiments, the take-up mechanism 50 further comprises a power member 53, wherein the power member 53 is drivingly connected to the take-up pulley 12 and rotates the take-up pulley 12 for drawing and winding the glue string 90. In some embodiments, the power member 53 is coupled to the take-up pulley 12 via a synchronous belt drive.

In some embodiments, the wire rewinding mechanism 50 further includes a second fixing plate 54, the second fixing plate 54 is fixed on the carrying surface 31 and located between the wire rewinding wheel 12 and the polishing mechanism 20c, and the second roller 51, the wire rewinding rod 52 and the power member 53 are respectively connected to the second fixing plate 54. Specifically, the second fixing plate 54 is provided with a sliding rod 541 parallel to the axial direction of the take-up pulley 12, and the take-up rod 52 is slidably connected to the sliding rod 541, so that the take-up rod 52 can reciprocate along the axial direction parallel to the take-up pulley 12.

In the polishing device 100, the supporting plate 41 and the first roller 42 support the rubber thread 90 pulled out from the thread feeding roller 11, and the second roller 51 supports the rubber thread 90 pulled out from the polishing mechanisms 20, so as to control the pulling direction of the rubber thread 90, so that the rubber thread 90 stably passes through the polishing mechanisms 20, thereby improving the polishing stability. Can follow the reciprocating motion that is on a parallel with take-up pulley 12 axis direction through receiving line pole 52, the tip 521 of receiving line pole 52 extends to the direction of take-up pulley 12 for pass gluey line 90 and make gluey line 90 arrange in proper order and coil in take-up pulley 12, the gluey line 90 after being convenient for arrange in order and polish improves the efficiency of polishing.

Referring to fig. 2 and 3, fig. 2 and 3 are schematic structural views of the polishing mechanism 20c or the polishing mechanism 20d according to the embodiment, and an included angle between the supporting surface 221 corresponding to the polishing mechanism 20c and the carrying surface 31 is 135 °; the supporting surface 221 corresponding to the grinding mechanism 20d forms an angle of 45 ° with the bearing surface 31. Each grinding mechanism 20 of this embodiment further includes a driving member 23, a first pulley 24, a second pulley 25, a transmission wheel 26, a driving gear 27, and a timing belt 28. The driving member 23 is fixed to the supporting plate 22, and the driving member 23 is provided with a rotatable transmission shaft 231. The transmission wheel 26 is provided with a gear portion 261 and a pulley portion 262. The driving member 23 is connected to the first pulley 24, and the second pulley 25 and the driving gear 27 are connected to a grinding wheel 21, respectively. The timing belt 28 is connected and sleeved between the first pulley 24, the second pulley 25 and the pulley portion 262, and the gear portion 261 is engaged with the driving gear 27. The driving member 23 drives the two grinding wheels 21 to synchronously rotate through the synchronous belt 28 and the driving wheel 26, so as to prevent the difference of the grinding effect caused by the different rotating speeds of the two grinding wheels 21, and further improve the grinding effect of the grinding wheels 21. And the rotating speeds of the two grinding wheels 21 are adjusted by adjusting the rotating speed of the driving part 23 so as to adapt to different grinding requirements, and the universality of the grinding device 100 is improved.

In the use process of the polishing device 100, the driving member 23 drives the first belt pulley 24 to rotate through the transmission shaft 231, and the first belt pulley 24 drives the second belt pulley 25 to rotate through the timing belt 28, so as to rotate a polishing wheel 21. At the same time, the first pulley 24 also drives the pulley portion 262 to rotate through the timing belt 28, and the pulley portion 262 and the gear portion 261 rotate synchronously, thereby driving the driving gear 27 to rotate so as to rotate the other grinding wheel 21.

In some embodiments, the first pulley 24, the second pulley 25 and the transmission wheel 26 form a triangular transmission structure to keep the timing belt 28 in a tensioned state, thereby improving the stability of the operation of the timing belt 28.

In some embodiments, each polishing mechanism 20 further includes a tension wheel 29, the tension wheel 29 is movably connected to the supporting plate 22 and abuts against the timing belt 28, and the tension wheel 29 applies a force to the timing belt 28 to tension the timing belt 28, so that the timing belt 28 can be pressed against the first pulley 24, the second pulley 25 and the pulley portion 262 with a suitable pressure, thereby improving the running stability of the timing belt 28 and further improving the stability of the polishing apparatus 100.

In some embodiments, the support plate 22 is provided with a retractable rod 222 telescopically positionable to a predetermined position, and the tension wheel 29 is rotatably connected to one end of the retractable rod 222 to movably connect the support plate 22 and abut the timing belt 28.

In the polishing device 100, the driving element 23 drives the two polishing wheels 21 to synchronously rotate through the synchronous belt 28 and the driving wheel 26, so as to prevent the difference of the polishing effect caused by the different rotating speeds of the two polishing wheels 21, and further improve the polishing effect of the polishing wheels 21. And the rotating speeds of the two grinding wheels 21 are adjusted by adjusting the rotating speed of the driving part 23 so as to adapt to different grinding requirements, and the universality of the grinding device 100 is improved. The tension wheel 29 applies a force to the synchronous belt 28 to tighten the synchronous belt 28, so as to improve the running stability of the synchronous belt 28 and further improve the stability of the polishing device 100.

In some embodiments, each grinding mechanism 20 further comprises a guide plate 60, the guide plate 60 is provided with a guide hole 61, and the guide hole 61 faces the gap between the two grinding wheels 21 for passing through the glue line 90 to improve the stability of traction and further the stability of grinding. In some embodiments, the guide plates 60 of the plurality of grinding mechanisms 20 are flush with the holding plate 41, the first roller 42 and the second roller 51, so that the glue lines 90 are parallel to the carrying surface 31.

Referring to fig. 4 and 5, fig. 4 and 5 are schematic structural views of the polishing mechanism 20a according to the embodiment, and an included angle between the supporting surface 221 corresponding to the polishing mechanism 20a and the carrying surface 31 is 90 °.

Referring to fig. 6 and 7 together, fig. 6 and 7 are schematic structural views of the polishing mechanism 20b in the embodiment, and an included angle between the supporting surface 221 corresponding to the polishing mechanism 20b and the carrying surface 31 is 0 °.

It can be understood that the included angle between the supporting surface 221 and the carrying surface 31 is adjusted according to the angle to be polished, and may also be, for example, 30 °, 60 °, 120 °, 150 °, and the like. And in some embodiments, in order to achieve uniform polishing, the angles between the supporting surface 221 and the carrying surface 31 corresponding to the plurality of polishing mechanisms 20 are in an arithmetic progression. The size of the support surface 221 is set according to the space occupied by the corresponding grinding mechanism 20 on the carrying surface 31.

It should be understood by those skilled in the art that the above embodiments are only for illustrating the present application and are not to be taken as limiting the present application, and that suitable changes and modifications to the above embodiments are within the scope of the present disclosure as long as they are within the spirit and scope of the present application.

Claims (10)

1. The utility model provides a grinding device for polish to gluing line surface, its characterized in that: the method comprises the following steps:

the traction mechanism comprises wire feeding wheels and wire collecting wheels which are arranged at intervals, wherein the wire feeding wheels are used for winding the rubber wire to be polished, and the wire collecting wheels are used for drawing out the rubber wire on the wire feeding wheels and winding the polished rubber wire; and

the grinding mechanisms are arranged between the wire feeding wheel and the wire collecting wheel, each grinding mechanism comprises two grinding wheels arranged at intervals, the two grinding wheels are used for allowing the glue wire to pass through and grinding the surface of the glue wire, and the grinding wheels corresponding to the grinding mechanisms clamp and grind the glue wire from a plurality of angles.

2. An abrading device as defined in claim 1, wherein: the grinding device further comprises a bearing frame, the bearing frame is provided with a bearing surface for connecting the grinding mechanisms, the rubber threads are arranged in parallel with the bearing surface, the grinding mechanisms further comprise a supporting plate, the supporting plate is provided with a supporting surface for connecting the two grinding wheels, and the supporting surfaces corresponding to the grinding mechanisms and included angles between the bearing surfaces are a plurality of angles.

3. An abrading device as defined in claim 2, wherein: the polishing device is characterized in that the bearing surface is provided with a hollow part, the polishing device is further provided with an accommodating groove, the accommodating groove is formed in one side, deviating from the polishing mechanism, of the bearing surface, and the accommodating groove is communicated with the hollow part and used for accommodating waste materials falling off from the polishing mechanism.

4. An abrading device as defined in claim 2, wherein: each grinding machanism still includes driving piece, first band pulley, second band pulley, drive wheel, drive gear and hold-in range, the driving piece is fixed in the backup pad, the driving piece is equipped with rotatable transmission shaft, the drive wheel is equipped with gear portion and band pulley portion, the driving piece is connected first band pulley, the second band pulley reaches drive gear connects a dozen emery wheel respectively, first band pulley the second band pulley reaches connect the cover to establish between the band pulley portion the hold-in range, gear portion with drive gear meshes, the driving piece passes through the hold-in range reaches drive gear drive two grinding wheel synchronous rotations.

5. An abrading device as defined in claim 4, wherein: each grinding mechanism still includes the take-up pulley, the take-up pulley is movably connected the backup pad and the butt hold-in range.

6. An abrading device as defined in claim 4, wherein: the first belt wheel, the second belt wheel and the transmission wheel form a triangular transmission structure.

7. An abrading device as defined in claim 1, wherein: each grinding mechanism still includes the deflector, the deflector is equipped with the guiding hole, the guiding hole orientation two clearance between the wheel of polishing are used for passing the line of glue.

8. An abrading device as defined in claim 1, wherein: the polishing device further comprises a wire inlet mechanism, the wire inlet mechanism is arranged between the wire feeding wheel and the polishing mechanism close to the wire feeding wheel, the wire inlet mechanism comprises a supporting plate and a first roller wheel, and the supporting plate and the first roller wheel are used for supporting a rubber wire pulled out from the wire feeding wheel so as to control the pulling direction of the rubber wire.

9. An abrading device as defined in claim 1, wherein: the grinding device further comprises a take-up mechanism, the take-up mechanism is arranged between the take-up pulley and the grinding mechanism close to the take-up pulley, the take-up mechanism comprises a second roller wheel and a take-up rod capable of moving in a reciprocating mode along the axis direction of the take-up pulley, the second roller wheel is used for abutting against a rubber wire pulled out by the grinding mechanism, the end portion of the take-up rod extends to the take-up pulley, and a through hole is formed in the end portion of the take-up rod and used for allowing the rubber wire to penetrate through and enable the rubber wire to be sequentially arranged and wound on the take-up pulley.

10. An abrading device as defined in claim 9, wherein: the take-up mechanism further comprises a power part, and the power part is connected to the take-up pulley in a transmission manner and drives the take-up pulley to rotate and is used for drawing and winding the rubber wire.

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