CN215578482U - Chip positioning suction head assembly - Google Patents

Abstract

The utility model provides a chip positioning suction head assembly, which comprises a substrate, a mounting seat, a positioning reference block arranged on the substrate, a positioning clamping block arranged on the mounting seat and horizontally opposite to the positioning reference block and used for clamping a chip, a driving assembly used for driving the positioning clamping block to horizontally move and a vacuum suction head driven by the driving assembly to downwards suck the chip, wherein the driving assembly comprises a driving assembly and a clamping head; the driving assembly is provided with a push rod, the positioning clamping block is provided with a driving block, and after the push rod is attached to the driving block, the push rod pushes the positioning clamping block to be away from the positioning reference block in the downward moving process. The chip positioning suction head assembly provided by the utility model has the beneficial effects that: can realize carrying out accurate positioning and pressing from both sides tightly to the chip after absorbing the chip, gesture when correcting the chip material loading, position when guaranteeing the chip material loading is accurate, uses in being applicable to current chip automation test equipment, realizes the automatic accurate feeding of chip with the manipulator cooperation.

Description

Chip positioning suction head assembly

Technical Field

The utility model relates to the technical field of chip processing equipment, in particular to a chip positioning suction head assembly.

Background

In the chip processing process, a feeding mechanism in an automatic processing device needs to transfer the chip from a tray with a larger positioning gap to a test acupuncture point with a smaller designated position gap. The feeding mechanism in the traditional chip automatic testing equipment only realizes the material transfer and the picking and placing of the chip through the vacuum suction head, but cannot control the specific posture and position of the chip during feeding. And along with the continuous development of science and technology, the size of chip is littleer and more, and the positioning accuracy requirement when placing to the chip on the test acupuncture point is higher and higher, and traditional chip material loading subassembly can't satisfy the accurate material loading demand of chip.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defect that the positioning precision of the conventional chip automatic test equipment cannot be realized during loading of early chips, and provides a chip positioning suction head assembly.

The technical scheme adopted by the utility model for solving the technical problems is as follows: a chip positioning suction head assembly comprises a substrate, a mounting seat fixed on the substrate, a positioning reference block arranged on the substrate, a positioning clamping block arranged on the mounting seat and horizontally opposite to the positioning reference block for clamping a chip, a driving assembly arranged on the mounting seat and used for driving the positioning clamping block to horizontally move, and a vacuum suction head driven by the driving assembly to downwards suck the chip; the driving assembly is provided with a push rod, the positioning clamping block is provided with a driving block which can be abutted against the push rod, and when the push rod is attached to the driving block, the push rod pushes the positioning clamping block to be far away from the positioning reference block in the downward moving process.

Further, the mount pad is including being the first mounting panel of vertical setting, second mounting panel and being the third mounting panel of level setting, have on the third mounting panel and supply the mounting hole that the tight piece of location clamp set up, and in be provided with in the mounting hole one pair will the tight piece butt of location clamp in the first spring of location benchmark piece.

Specifically, the positioning reference block is provided with a positioning through hole for placing the chip, the vacuum suction head and the positioning clamping block, and a first positioning edge and a second positioning edge which are perpendicular to each other are formed at the positioning through hole.

Specifically, the location presss from both sides tight piece including set up in basic piece in the mounting hole and by basic piece downwardly extending to first reference column and second reference column in the location through-hole, the drive block set up in on the basic piece of location clamp tight piece.

Specifically, the first positioning column of the positioning and clamping block is arranged in the positioning through hole opposite to the first positioning edge, and the second positioning column is arranged in the positioning through hole opposite to the second positioning edge.

Furthermore, the driving assembly comprises a driving piece fixed on the first mounting plate of the mounting seat, a second moving assembly driven by the driving piece to vertically move on the mounting seat, and a first moving assembly driven by the second moving assembly to vertically move on the mounting seat, the vacuum suction head is fixed on the first moving assembly, and the push rod is fixed on the second moving assembly.

Further, first removal subassembly is including being fixed in be vertical setting's first linear guide on the second mounting panel of mount pad, set up in first sliding block on the first linear guide and set up in the third mounting panel of mount pad with first reset spring between the first sliding block, vacuum suction head is fixed in the bottom of first sliding block.

Specifically, be provided with the restriction on the second mounting panel of mount pad first sliding block moves in vertical direction's spacing groove, be provided with on the first sliding block and extend to spacing boss in the spacing groove.

Further, the second removes the subassembly including being fixed in be vertical setting's second linear guide on the first sliding block, set up in second linear guide is last the second sliding block and set up in the third mounting panel of mount pad with second reset spring between the second sliding block, the catch bar is fixed in the bottom of second sliding block.

Specifically, the top of second sliding block is provided with and extends to the promotion portion of first sliding block department, be provided with on the first sliding block with the spacing recess of promotion portion butt.

The chip positioning suction head assembly provided by the utility model has the beneficial effects that: can realize carrying out accurate positioning and pressing from both sides tightly to the chip after absorbing the chip, gesture when correcting the chip material loading, position when guaranteeing the chip material loading is accurate, uses in being applicable to current chip automation test equipment, realizes the automatic accurate feeding of chip with the manipulator cooperation.

Drawings

FIG. 1 is a schematic perspective view of a chip positioning tip assembly according to the present invention;

FIG. 2 is a cross-sectional view of a chip positioning tip assembly provided by the present invention;

FIG. 3 is a schematic perspective exploded view of a positioning clamping block and a positioning reference block in a chip positioning suction head assembly according to the present invention;

FIG. 4 is a bottom view of a chip positioning tip assembly provided by the present invention;

FIG. 5 is a schematic perspective exploded view of a mounting base and a driving assembly of a chip positioning suction head assembly according to the present invention;

figure 6 is a cross-sectional view of a vacuum chuck in a chip positioning chuck assembly provided in accordance with the present invention.

In the figure: 100-chip positioning suction head component, 10-substrate, 20-mounting seat, 21-first mounting plate, 22-second mounting plate, 221-limiting groove, 23-third mounting plate, 231-mounting hole, 232-first spring, 30-positioning reference block, 31-positioning through hole, 32-first positioning edge, 33-second positioning edge, 40-positioning clamping block, 41-driving block, 42-base block, 43-first positioning column, 44-second positioning column, 50-driving component, 51-pushing rod, 52-driving component, 53-second moving component, 531-second linear guide rail, 532-second sliding block, 5321-pushing part, 533-second resetting spring, 54-first moving component, 541-first linear guide rail, 542-a first sliding block, 5421-a limit boss, 5422-a limit groove, 543-a first return spring, 60-a vacuum suction head, 61-a metal section, 62-a rubber coating section and 90-a chip.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

Referring to fig. 1-6, a chip positioning tip assembly 100 is provided according to the present invention. The chip positioning suction head assembly 100 can be used in various automatic test equipment for chips 90, and is matched with driving components such as a manipulator, a moving platform and the like in the automatic test equipment to realize the operations of moving, loading and unloading the chips 90. The chip positioning suction head assembly 100 can realize the adjustment of the position and the posture of the chip 90 during the feeding process through clamping the chip 90 in the material moving process, and ensure that the chip 90 is fed according to the required position and precision.

Further, the chip positioning suction head assembly 100 provided by the present invention comprises a substrate 10, a mounting base 20 fixed on the substrate 10, a positioning reference block 30 disposed on the substrate 10, a positioning clamping block 40 disposed on the mounting base 20 and horizontally opposite to the positioning reference block 30 for clamping the chip 90, a driving assembly 50 disposed on the mounting base 20 for driving the positioning clamping block 40 to horizontally move, and a vacuum suction head 60 driven by the driving assembly 50 to downwardly suck the chip 90. This chip positioning suction head assembly 100 adsorbs chip 90 through vacuum suction head 60 to after guaranteeing complete absorption, utilize the mutually supporting of positioning clamp piece 40 and location reference block 30, will adsorb the side of chip 90 on vacuum suction head 60 and fix a position, thereby guarantee that this chip 90 can put into next station with required gesture when the material loading, guarantee the position accuracy nature and the uniformity of chip 90 material loading. Meanwhile, the driving assembly 50 on the mounting base 20 drives the vacuum chuck 60 to move the adsorption chip 90 downward after driving the positioning clamping block 40 to be separated from the positioning reference block 30. After it is ensured that the chip 90 is completely adsorbed on the vacuum chuck 60 and the vacuum chuck 60 sucks the chip 90 and resets to the initial position, the chip 90 is clamped by the relative movement of the positioning and clamping block 40 and the positioning reference block 30, and the positioning and the feeding posture of the chip 90 are adjusted.

Specifically, as shown in fig. 5, the driving assembly 50 is provided with a pushing rod 51, as shown in fig. 4, the positioning clamp block 40 is provided with a driving block 41 capable of abutting against the pushing rod 51, and after the pushing rod 51 abuts against the driving block 41, the pushing rod 51 pushes the positioning clamp block 40 away from the positioning reference block 30 in the downward movement process. The bottom of the push rod 51 of the driving assembly 50 is provided with a guide slope, and the guide slope gradually contacts with the driving block 41 on the positioning and clamping block 40 during the downward movement of the push rod 51, and the guide slope is used for diverting the downward movement force of the push rod 51 to the driving block 41 and pushing the driving block 41 to move horizontally. In this embodiment, the driving block 41 is a bearing installed in the positioning and clamping block 40, and when the guide slope of the pushing rod 51 contacts the bearing, the bearing is not only driven to rotate, but also the entire driving block 41 is driven to move horizontally along with the rotating shaft of the bearing.

Further, as shown in fig. 5, the mounting base 20 includes a first mounting plate 21, a second mounting plate 22 and a third mounting plate 23, wherein the first mounting plate 21 and the second mounting plate 22 are vertically disposed, and both are disposed perpendicular to the third mounting plate 23. The substrate 10 is positioned at the bottom of the third mounting plate 23 of the mounting base 20. As shown in fig. 2, the positioning and clamping block 40 is embedded in the third mounting plate 23, and the third mounting plate 23 has a mounting hole 231 for the positioning and clamping block 40 to be disposed therein. As shown in fig. 3, a pair of first springs 232 for abutting the positioning clamp block 40 against the positioning reference block 30 are provided in the mounting hole 231. Since the first spring 232 is provided between the mounting hole 231 of the third mounting plate 23 and the positioning clamp block 40, the positioning clamp block 40 is brought into contact with the positioning reference block 30 in the initial state. When the pushing rod 51 contacts the driving block 41 of the positioning and clamping block 40 during the downward movement, the positioning and clamping block 40 is moved to the side away from the positioning reference block 30, so that a space for the vacuum suction head 60 to pass through is formed between the positioning and clamping block 40 and the positioning reference block 30. On the contrary, when the pushing rod 51 moves upward to separate the driving block 41 and the pushing rod 51, the positioning and clamping block 50 moves toward one side of the positioning reference block 30 with the pushing action of the pair of first springs 232, thereby realizing the clamping and guiding positioning of the chip 90.

Further, as shown in fig. 3 and 4, in the present embodiment, the positioning reference block 30 is sleeved in the opening formed on the substrate 10 from the upper side of the substrate 10, and the positioning reference block 30 is provided with a positioning through hole 31 into which the chip 90, the vacuum chuck 60 and the positioning clamping block 40 can be inserted, and a first positioning edge 32 and a second positioning edge 33 are formed at the positioning through hole 31 and are perpendicular to each other. In this embodiment, the positioning reference block 30 and the positioning clamping block 40 may be used to clamp and guide the rectangular or square chip 90, and the horizontal position of the chip 90 is gradually adjusted through the moving process of the positioning clamping block 40 towards the positioning reference block 30, so that two adjacent sides of the chip 90 may be respectively attached to the first positioning edge 32 and the second positioning edge 33, thereby achieving accurate positioning of the chip 90. Correspondingly, in the present embodiment, the positioning and clamping block 40 includes a base block 42 disposed in the mounting hole 231, and a first positioning column 43 and a second positioning column 44 extending from the base block 42 to the positioning through hole 31, and the driving block 41 is disposed on the base block 42 of the positioning and clamping block 40. The base block 42 of the positioning and clamping block 40 is located inside the installation hole 231 of the installation base 20 and can horizontally move along the installation direction of the installation hole 231, and in the moving process of the base block 42, the first positioning column 43 and the second positioning column 44 located below the base block 42 are driven to horizontally move. The first positioning column 43 of the positioning and clamping block 40 is disposed opposite to the first positioning edge 32 in the positioning through hole 31, and the second positioning column 44 is disposed opposite to the second positioning edge 33 in the positioning through hole 31. As shown in fig. 4, the first positioning column 43 is provided with a third positioning edge parallel to the first positioning edge 32 of the positioning reference block 30, and the second positioning column 44 is provided with a fourth positioning edge parallel to the second positioning edge 33 of the positioning reference block 30. The horizontal distance between the first positioning edge 32 and the first positioning post 43 increases or decreases with the movement of the positioning and clamping block 40, and similarly, the horizontal distance between the second positioning edge 33 and the second positioning post 44 increases or decreases with the movement of the positioning and clamping block 40. When the distance is increased, an opening is formed for the vacuum suction head 60 to move the suction chip 90 downward, after the vacuum suction head 60 has sucked the chip 90 to the initial position, the distance is reduced, the chip 90 sucked on the vacuum suction head 60 is adjusted in angle along with the reduction of the distance, and finally the side edge is attached to the side edge of the positioning reference block 30 and aligned.

Further, in the chip positioning suction head assembly 100 provided by the present invention, the driving assembly 50 located on the mounting base 30 includes a driving member 52 fixed on the first mounting plate 21 of the mounting base 20, a second moving assembly 53 driven by the driving member 52 to move vertically on the mounting base 20, and a first moving assembly 54 driven by the second moving assembly 53 to move vertically on the mounting base 20, the vacuum suction head 60 is fixed on the first moving assembly 54, and the pushing rod 51 is fixed on the second moving assembly 53. The driving member 52 of the driving assembly 50 is used for driving the second moving assembly 53 to vertically descend, and the first moving assembly 54 is driven to synchronously ascend and descend in the vertical direction by the ascending and descending of the second moving assembly 53. And a vacuum suction head 60 is fixed at the bottom of the first moving assembly 54, and when the first moving assembly 54 is lifted, the vacuum suction head 60 at the bottom is driven to lift. The bottom of the second moving component 53 is fixed with a push rod 51, and when the driving component 52 drives the second moving component 53 to move up and down, the push rod 51 moves up and down along with the second moving component. In this embodiment, the driving member 52 is a driving cylinder, and an expansion rod of the driving cylinder can abut against the second moving assembly 53, so as to drive the second moving assembly 53 to vertically lift.

Further, as shown in fig. 5, the first moving assembly 54 on the mounting base 30 includes a first linear guide 541 fixed to the second mounting plate 22 of the mounting base 20 and vertically disposed thereon, a first sliding block 542 disposed on the first linear guide 541, and a first return spring 543 disposed between the third mounting plate 23 and the first sliding block 542 of the mounting base 20, and the vacuum suction head 60 is fixed to the bottom of the first sliding block 542. The first sliding block 542 of the first moving assembly 54 is driven by the second moving assembly 53 to vertically descend, and during the descending process, the first return spring 543 located at the bottom of the first sliding block 542 is compressed. When the second moving member 53 moves upward, the first sliding block 542 is pushed upward by the first return spring 543, thereby returning to the initial position. The movement of the first sliding block 542 in the vertical direction is controlled by the first linear guide 541, thereby ensuring that the vacuum cleaner 60 located at the bottom of the first sliding block 542 can be kept vertically elevated. The bottom surface of the first sliding block 542 and the top surface of the third mounting plate 23 of the mounting seat 30 are both provided with grooves for mounting the first return spring 543, so that the first return spring 543 can be always located between the first sliding block 542 and the third mounting plate 23.

Specifically, in order to limit the vertical ascending and descending distance of the first moving component 54, the second mounting plate 22 of the mounting base 20 is provided with a limiting groove 221 for limiting the movement of the first sliding block 542 in the vertical direction, and the first sliding block 542 is provided with a limiting boss 5421 extending into the limiting groove. The vertical distance of the first slide block 542 is the width of the stopper groove 221 provided in the second mounting plate 22 of the mounting base 20. In the initial position, as shown in fig. 1, the top surfaces of the stopper projections 5421 of the first slide block 542 abut the top surfaces of the stopper grooves 221. When the first sliding block 542 moves downward with the second moving member 53 until the bottom surface of the position-restricting projection 5421 abuts against the floor surface of the position-restricting groove 221, the first sliding block 542 stops moving downward, so that the distance that the vacuum cleaner 60 placed on the first sliding block 542 moves up and down in the vertical direction can be limited.

Further, as shown in fig. 5, the second moving assembly 53 in the driving assembly 50 includes a second linear guide 531 fixed on the first sliding block 542 and vertically disposed, a second sliding block 532 disposed on the second linear guide 531, and a second return spring 533 disposed between the third mounting plate 23 and the second sliding block 532 of the mounting seat 20, and the push rod 51 is fixed at the bottom of the second sliding block 532. The second sliding block 532 of the second moving assembly 53 is vertically lowered by the driving member 52, and when the driving member 52 stops moving downward and returns upward, the second sliding block 532 is subjected to the force of the second return spring 533, so that the second sliding block 532 returns upward to the initial position. The second linear guide 531 of the second moving member 53 is vertically disposed on the first slide block 542, so that the second slide block 532 can be vertically moved along the direction in which the second linear guide 531 is disposed. When the second sliding block 532 moves up and down, the push rod 51 located therebelow moves up and down along with the second sliding block. The bottom surface of the second sliding block 532 and the top surface of the third mounting plate 23 of the mounting seat 30 are both provided with grooves for mounting the second return spring 533, so that the second return spring 533 can be always located between the second sliding block 532 and the third mounting plate 23.

Specifically, as shown in fig. 5, the top of the second sliding block 532 is provided with a pushing portion 5321 extending to the first sliding block 542, and correspondingly, a limiting groove 5422 capable of abutting against the pushing portion 5321 is provided on the first sliding block 542, and the pushing portion 5321 moves downward along the limiting groove 5422 as the second sliding block 532 moves downward. After the pushing portion 5321 abuts against the bottom surface of the limiting recess 5422, the second sliding block 532 drives the first sliding block 542 to move downward. Therefore, when the second sliding block 532 is driven by the driving member 52 to vertically descend, the pushing portion 5321 on the second sliding block 532 moves to the bottom surface of the limiting recess 5422, and the first sliding block 542 is driven to vertically descend, so that the second moving assembly 53 drives the first moving assembly 54 to vertically move.

Specifically, as shown in fig. 6, a cross-sectional view of a vacuum tip 60 of a chip positioning tip assembly 100 is provided. The vacuum suction head 60 comprises a metal section 61 and an encapsulation section 62 which is positioned at the bottom of the metal section 61 and is in contact with the chip 90, and the encapsulation section 62 is formed by processing high-strength rubber, so that the vacuum suction head 60 can better adsorb the chip 90 and prevent the vacuum suction head 60 from damaging the chip 90 in the material moving process. As shown in fig. 2, the top of the vacuum nozzle 60 is fixed below the first sliding block 542, a vacuum port is provided on a side surface of the first sliding block 542, and a vacuum passage is provided inside the first sliding block 542, so that the vacuum nozzle 60 communicates with the vacuum port, and the vacuum nozzle 60 communicates with the vacuum generator.

The working process of the chip positioning suction head assembly 100 provided by the utility model comprises the following steps:

firstly, the chip positioning suction head assembly 100 is fixed on a manipulator of the chip automatic test equipment and moves to the position above a material tray with the chip 90 along with the manipulator;

then, the driving member 52 of the driving assembly 50 of the chip positioning tip assembly 100 drives the second sliding block 532 of the second moving assembly 53 to move downward. In the process of downward movement of the second sliding block 532, firstly, the pushing rod 51 at the bottom of the second sliding block 532 is driven to abut against the driving block 41 of the positioning and clamping block 40, secondly, after the positioning and clamping block 40 is separated from the positioning reference block 30 by the pushing rod 51 of the second sliding block 532, the pushing part 5321 on the second sliding block 532 abuts against the bottom surface of the limiting groove 5422 of the first sliding block 542 and drives the first sliding block 542 to move downward, and at this time, the pushing rod 51 continuously moves downward along with the first sliding block 542 until the limiting boss 5421 of the first sliding block 542 abuts against the bottom of the limiting groove 221 of the mounting seat 20, and then stops moving downward. After the pushing rod 51 abuts against the driving block 41, the positioning clamping block 40 is separated from the positioning reference block 30, so that an opening through which the vacuum suction head 60 can pass is formed, then the first sliding block 542 drives the vacuum suction head 60 to move downwards to pass through the opening to reach the upper part of the chip 90 on the tray, and the vacuum suction head 60 starts to adsorb the chip 90 until the chip 90 is adsorbed on the vacuum suction head 60.

Then, the driving member 52 of the driving unit 50 stops driving downward and starts returning upward, and the second slide block 532 of the second moving unit 54 and the first slide block 542 of the first moving unit 53 are returned to move upward by the second return spring 533 and the first return spring 543, respectively. Wherein, during the process of resetting the second sliding block 532 upwards, the push rod 51 at the bottom of the second sliding block 532 resets upwards synchronously with the vacuum suction head 60. When the vacuum suction head 60 drives the chip to return upwards to the initial position, the guide inclined surface on the pushing rod 51 contacts with the driving block 41 of the positioning and clamping block 40 and separates with the continuous rising of the pushing rod 51. That is, after the vacuum chuck 60 lifts up to the initial position (the top surface of the limit boss 5421 of the first slide block 542 abuts against the top of the limit groove 221 of the mounting base 20), the positioning and clamping block 40 starts to move towards the positioning reference block 30, and during the moving process, the first positioning column 43 and the second positioning column 44 of the positioning and clamping block 40 abut against the side edge of the chip 90 sucked by the vacuum chuck 60 respectively, and push the other side edge of the chip 90 to align and abut against the first positioning edge 32 and the second positioning edge 33 of the positioning reference block 30 respectively.

When the limit projection 5421 of the first sliding block 542 on the first moving component 54 moves upward to the top surface of the limit groove 221 of the mounting seat 20, the upward movement is stopped; while the second sliding block 532 on the second moving member 53 continues to move upward until it abuts against the driving rod of the driving member 52 with the continuous action of the second return spring 533. At this time, the upper surface of chip 90 sucked to vacuum chuck 60 is bonded to vacuum chuck 60. Four sides of the chip 90 are respectively abutted to the positioning reference block 30 and the positioning clamping block 40, so that the chip 90 is accurately positioned.

Finally, the chip positioning suction head assembly 100 moves above the station for processing the chip 90 along with the robot, the driving member 52 of the driving assembly 50 drives the second moving assembly 53 to move downward again, so as to separate the positioning clamping block 40 from the positioning reference block 30, and then the vacuum suction head 60 extends out of the opening formed between the positioning clamping block 40 and the positioning reference block 30 and stops sucking, thereby precisely placing the chip 90 in the station for processing.

The chip positioning suction head assembly 100 provided by the utility model can realize accurate positioning and clamping of the chip 90 after the chip 90 is sucked, correct the posture of the chip 90 during feeding, ensure the position accuracy of the chip 90 during feeding, is suitable for being used in the existing chip 90 automatic test equipment, and is matched with a manipulator to realize the automatic accurate feeding of the chip 90.

The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A chip positioning suction head assembly comprises a substrate and a mounting seat fixed on the substrate, and is characterized by also comprising a positioning reference block arranged on the substrate, a positioning clamping block arranged on the mounting seat and horizontally opposite to the positioning reference block and used for clamping a chip, a driving assembly arranged on the mounting seat and used for driving the positioning clamping block to horizontally move, and a vacuum suction head driven by the driving assembly to downwards suck the chip; the driving assembly is provided with a push rod, the positioning clamping block is provided with a driving block which can be abutted against the push rod, and when the push rod is attached to the driving block, the push rod pushes the positioning clamping block to be far away from the positioning reference block in the downward moving process.

2. The chip positioning suction head assembly of claim 1, wherein the mounting base comprises a first mounting plate, a second mounting plate and a third mounting plate, the first mounting plate, the second mounting plate and the third mounting plate are vertically arranged, the third mounting plate is provided with a mounting hole for the positioning clamping block to be arranged, and a pair of first springs for abutting the positioning clamping block against the positioning reference block are arranged in the mounting hole.

3. The chip positioning suction head assembly as claimed in claim 2, wherein said positioning reference block is provided with a positioning through hole for said chip, said vacuum suction head and said positioning clamping block to be inserted therein, and a first positioning edge and a second positioning edge are formed at said positioning through hole and are perpendicular to each other.

4. The chip positioning suction head assembly of claim 3, wherein the positioning clamping block comprises a base block disposed in the mounting hole and a first positioning column and a second positioning column extending downward from the base block into the positioning through hole, and the driving block is disposed on the base block of the positioning clamping block.

5. The chip positioning suction head assembly of claim 4, wherein the first positioning column of the positioning clamping block is disposed opposite to the first positioning edge in the positioning through hole, and the second positioning column is disposed opposite to the second positioning edge in the positioning through hole.

6. The chip positioning tip assembly of claim 2, wherein said driving assembly comprises a driving member fixed to a first mounting plate of said mounting base, a second moving assembly driven by said driving member to move vertically on said mounting base, and a first moving assembly driven by said second moving assembly to move vertically on said mounting base, said vacuum tip being fixed to said first moving assembly, and said push rod being fixed to said second moving assembly.

7. The chip positioning suction head assembly of claim 6, wherein the first moving assembly comprises a first linear guide vertically disposed on a second mounting plate fixed on the mounting base, a first sliding block disposed on the first linear guide, and a first return spring disposed between a third mounting plate of the mounting base and the first sliding block, and the vacuum suction head is fixed at the bottom of the first sliding block.

8. The chip positioning suction head assembly of claim 7, wherein the second mounting plate of the mounting base is provided with a limiting groove for limiting the movement of the first sliding block in the vertical direction, and the first sliding block is provided with a limiting boss extending into the limiting groove.

9. The chip positioning suction head assembly of claim 7, wherein the second moving assembly comprises a second linear guide fixed on the first sliding block and arranged vertically, a second sliding block arranged on the second linear guide, and a second return spring arranged between the third mounting plate of the mounting seat and the second sliding block, and the push rod is fixed at the bottom of the second sliding block.

10. The chip positioning suction head assembly as claimed in claim 9, wherein the top of the second sliding block is provided with a pushing portion extending to the first sliding block, and the first sliding block is provided with a limiting groove capable of abutting against the pushing portion.

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