CN215576310U - Temperature closed-loop control system - Google Patents
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- CN215576310U CN215576310U CN202122274768.6U CN202122274768U CN215576310U CN 215576310 U CN215576310 U CN 215576310U CN 202122274768 U CN202122274768 U CN 202122274768U CN 215576310 U CN215576310 U CN 215576310U
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Abstract
The utility model provides a temperature closed-loop control system, which comprises: the infrared acquisition unit is used for acquiring the temperature information of the die in a non-contact manner; the information processing unit is in communication connection with the infrared acquisition unit and is used for receiving and processing the temperature information to output a temperature control signal; and the temperature control unit is in communication connection with the information processing unit and is used for receiving the temperature control signal to control the flow and/or the temperature of the hot medium so as to adjust the temperature of the die. The system realizes real-time acquisition, real-time transmission and real-time control of the temperature of the die, reduces the defective rate caused by unstable temperature environment, improves the product quality, and saves resources and cost; and the non-contact temperature measurement mode can effectively avoid causing damage to the surfaces of the die and the formed product, avoid manual operation in a high-temperature environment, eliminate potential safety hazards and improve enterprise competitiveness.
Description
Technical Field
The utility model relates to the field of temperature control, in particular to a temperature closed-loop control system.
Background
With the rapid development of high-end manufacturing industry in China, the manufacturing industry in the future presents informatization and intelligentized closed-loop control. However, the plastic and metal die casting industry based on die forming is open production at present, all devices are almost single work output, and linear control, free communication and system integrated control cannot be achieved.
The mold forming needs a stable temperature environment, and the temperature of the mold cannot be monitored in real time and controlled linearly in real time due to the aging of the mold and the open temperature output of a mold temperature controller in an actual field.
In the traditional technical means, the temperature of the die is mainly controlled by an external heat medium and an electric heater, a temperature output unit is fixed and single, and the monitoring of the temperature inside the die and the surface temperature of a formed product has certain time delay and even needs manual inspection or intervention. Therefore, the conventional technical means easily produces defective products, and the mold is also easily damaged, causing unnecessary resource waste and economic loss. In addition, the working environment of the mold forming is generally a high-temperature dangerous environment, certain potential safety hazards can be caused by manual on-site inspection or intervention, and subjective factors such as working experience and working state of workers can greatly affect the quality of products.
SUMMERY OF THE UTILITY MODEL
In view of the above disadvantages of the prior art, the present invention provides a temperature closed-loop control system to solve the technical problems of poor real-time performance of mold temperature control, high product reject ratio, and insufficient safety of manual intervention in the prior art.
To achieve the above and other related objects, the present invention provides a temperature closed-loop control system, comprising: the infrared acquisition unit is used for acquiring the temperature information of the die in a non-contact manner; the information processing unit is in communication connection with the infrared acquisition unit and is used for receiving and processing the temperature information to output a temperature control signal; and the temperature control unit is in communication connection with the information processing unit and is used for receiving the temperature control signal to control the flow and/or the temperature of the hot medium so as to adjust the temperature of the die.
In a preferred embodiment of the present invention, the temperature closed-loop control system comprises: the gray value acquisition unit is in communication connection with the information processing unit and is used for acquiring gray value information of the mold and transmitting the gray value information to the information processing unit; the information processing unit receives and processes the gray value information and outputs an alarm signal under the condition that the gray value information is abnormal.
In a preferred embodiment of the present invention, the infrared acquisition unit comprises a thermal infrared imager; the gray value acquisition unit comprises a visible light camera.
In a preferred embodiment of the present invention, the temperature closed-loop control system comprises: and the holder is used for arranging the thermal infrared imager and the visible light camera on the holder and adjusting the shooting visual field and the focal length of the thermal infrared imager and the visible light camera.
In a preferred embodiment of the present invention, the temperature information includes: temperature information of a mold cavity and temperature information of the surface of a molded product; and the infrared acquisition unit acquires the temperature information of the mold cavity and the surface of the molded product in real time after receiving the mold opening signal.
In a preferred embodiment of the present invention, the temperature closed-loop control system comprises: the reflectivity detection device is in communication connection with the information processing unit and is used for detecting the reflectivity information of the die and transmitting the reflectivity information to the information processing unit; the information processing unit receives and processes the reflectivity information to output the temperature control signal.
In a preferred embodiment of the present invention, the temperature control unit includes: and the flowmeter is used for acquiring the flow information of the heat medium.
In a preferred embodiment of the present invention, the temperature control unit includes: and the flow valve is used for adjusting the flow of the hot medium.
In a preferred embodiment of the present invention, the temperature closed-loop control system comprises: and the display is used for displaying temperature information, flow information and/or alarm information.
In a preferred embodiment of the present invention, the temperature closed-loop control system comprises: and the alarm device is in communication connection with the information processing unit and is used for receiving the alarm signal sent by the information processing unit and executing corresponding alarm action.
As described above, the temperature closed-loop control system according to the present invention has the following advantages: the temperature information of the die, particularly the temperature of a die cavity and the surface temperature of a formed product, is obtained in real time through the non-contact temperature measurement of the infrared acquisition unit, the acquired temperature information is received and processed through the information acquisition unit, and the temperature and/or the flow of the heat medium is controlled through the temperature control unit to adjust the temperature of the die, so that the real-time closed-loop control of the temperature in the die forming process is realized, the defective rate caused by the instability of the temperature environment is reduced, the product quality is improved, and the resources and the cost are saved; the non-contact temperature measurement mode can effectively avoid damage to the surfaces of the die and the molded product, avoid manual operation in a high-temperature environment and eliminate potential safety hazards.
Drawings
Fig. 1 is a schematic structural diagram of a temperature closed-loop control system according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of another temperature closed-loop control system according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the purpose of the present invention. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present invention is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," "retained," and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," and/or "comprising," when used in this specification, specify the presence of stated features, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, operations, elements, components, items, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions or operations are inherently mutually exclusive in some way.
The utility model provides a temperature closed-loop control system applied to the injection molding field and the metal die-casting molding field, which realizes real-time control of the mold temperature by acquiring information such as mold temperature values, gray values and the like and processing based on the prior software technology, reduces the time delay of the temperature control of the prior mold, improves the yield of products and avoids potential safety hazards existing in the field operation of workers. The stability of the cavity temperature of the mold determines the quality of the molded article. Whether it is a thermoplastic, thermosetting or metal die-casting mold, the instability or abnormality of the mold cavity temperature will produce such defective products as deformation, air bubbles, shrinkage, flash, sand holes, cracks, etc. Therefore, the temperature closed-loop control system provided by the utility model has great significance to the injection molding industry and the metal die-casting molding industry.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention are further described in detail by the following embodiments in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
As shown in fig. 1, an embodiment of the present invention provides a schematic structural diagram of a temperature closed-loop control system, which includes: the infrared acquisition unit 11 is used for acquiring the temperature information of the mold in a non-contact manner; the information processing unit 12 is in communication connection with the infrared acquisition unit 11 and is used for receiving and processing the temperature information to output a temperature control signal; and the temperature control unit 13 is in communication connection with the information processing unit 12 and is used for receiving the temperature control signal to control the flow and/or the temperature of the hot medium so as to adjust the temperature of the die.
Specifically, the infrared collection unit 11 collects temperature information of the mold in a non-contact manner, and the temperature information includes, but is not limited to, temperature information of the mold cavity and temperature information of the surface of the molded product. And the infrared acquisition unit acquires the temperature information of the mold cavity and the surface of the molded product in real time after receiving the mold opening signal. The infrared acquisition unit 11 may be a non-contact infrared thermometer, an infrared thermal imager, or a combination of the two. The infrared thermal imager is preferably selected, invisible infrared energy emitted by the mold can be converted into visible thermal images, the temperature of each part of the mold can be visually displayed, and a user can conveniently and quickly lock an abnormal area under the condition of abnormal temperature (such as sudden temperature change and abnormal temperature range). In addition, the infrared thermal imaging technology has strong detection capability and long acting distance, and compared with the infrared thermometer which can only display the temperature value of a certain small area or a certain point on the surface of an object, the infrared thermal imager can simultaneously measure the temperature of each point on the surface of the object, and is more suitable for the utility model.
The information processing unit 12 receives and processes the temperature information sent by the infrared acquisition unit 11, and obtains the judgment result of the mold temperature, such as the temperature is higher than the standard temperature range, lower than the standard temperature range, or within the standard temperature range, and for example, the temperature abnormal time exceeds the temperature abnormal allowable time, and the like. Further, the information processing unit 12 issues a corresponding temperature control signal to the temperature control unit 13 based on the determination result of the mold temperature.
The temperature control unit 13 receives the temperature control signal sent by the information processing unit 12, and controls the flow and/or temperature of the heat carrier based on the temperature control signal, thereby realizing the closed-loop control of the system on the temperature of the mold. The heat medium is heat conducting liquid, and water, heat conducting oil and the like are selected. For example, in the case that the mold temperature is higher than the standard temperature, the temperature control signal is a temperature reduction signal, and the temperature control unit 13 can adjust the mold temperature by reducing the heat medium flow (e.g., reducing the opening of the flow valve), reducing the heat medium temperature (e.g., reducing the temperature of the heat medium heater), and the like.
It is worth mentioning that the processing of the received temperature information by the information processing unit 12, the obtaining of the determination result of the mold temperature, and the issuing of the temperature control signal based on the determination result of the mold temperature do not involve any updating of software technology. Specifically, the information processing unit 12 may be selected from: a Micro Control Unit (MCU), a general Processor such as a Central Processing Unit (CPU), a Network Processor (NP), a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, a discrete Gate or transistor logic device, a discrete hardware component, etc.
The communication connection mode can be a wired communication unit or a wireless communication unit. The wireless communication unit can be any one or combination of a plurality of 3G/4G/5G communication units, NB-IoT communication units, LoRa communication units, Zigbee communication units, Z-wave communication units, Wifi communication units, Bluetooth communication units and the like.
In a preferred embodiment of the present embodiment, the temperature closed-loop control system further includes a gray value acquisition unit 14. The gray value acquisition unit 14 is in communication connection with the information processing unit 12, and is used for acquiring gray value information of the mold and transmitting the gray value information to the information processing unit 12; the information processing unit 12 receives and processes the gray scale value information, and outputs an alarm signal when the gray scale value information is abnormal. Specifically, the gray value acquisition unit 14 may be a visible light camera. The visible light camera collects a gray value image of the cavity, and the information processing unit 12 compares the collected gray value image with a standard image to obtain abnormal information of the mold, such as poor demolding, abnormal insert position and the like. It should be noted that, the image comparison process and the mold anomaly information acquisition process are based on the existing software technology or program, and the present invention does not relate to any software technology update.
As shown in fig. 2, another embodiment of the present invention provides a structural schematic diagram of a temperature closed-loop control system with a visible light camera, which includes: an infrared acquisition unit 11 (such as a thermal infrared imager), an information processing unit 12 (a computer), a temperature control unit 13 (such as a mold temperature controller), and a gray value acquisition unit 14 (such as a visible light camera). The thermal infrared imager 11 and the visible light camera 14 are respectively configured to capture an infrared thermal image and a gray level image of the mold 21, and send image information (including temperature information and gray level information) to the computer 12, the computer 12 is equipped with software (it should be noted that the software is the prior art) for analyzing and processing the received information, and sends a temperature control signal to the mold temperature controller based on an analysis result to adjust the temperature of the mold.
In some examples, after receiving a mold opening signal of the molding machine, the temperature closed-loop control system controls the thermal infrared imager 11 and the visible light camera 14 to shoot in real time to obtain image information, and may select binocular vision or monocular vision to shoot, where the thermal infrared imager collects the surface of a molded product in a set ROI region and the temperature in a mold cavity, and the visible light camera collects gray value information of the mold cavity to assist.
In some examples, the temperature closed-loop control system utilizes a thermal imager with the temperature sensing performance of infrared bands of 1um-15um, utilizes a non-contact temperature measurement mode on line in real time, monitors the molding temperature of each mold of the mold in real time, the molding temperature comprises the surface temperature of a molded product and the surface temperature of the mold, transmits the temperature acquired in real time to a computer, utilizes the existing image temperature control software to perform real-time analysis, and controls the temperature of the mold in a linear mode to control the output of a heating medium, so that real-time closed-loop control in the molding process of the mold is realized, and defective products caused by the temperature change of the mold or a product are prevented.
In some examples, the temperature closed-loop control system collects a gray value image of the mold cavity by using a common visible light camera based on a waveband of 400nm to 780nm, and transmits the gray value image to the information processing unit 12, and the information processing unit 12 compares the collected gray value image with a standard image to obtain abnormal information of the mold, such as poor mold release, abnormal insert position and the like.
In some examples, the temperature closed-loop control system outputs the status information of the mold in real time through a General-purpose input/output (GPIO) as indicated by the output signal "OK": normal temperature of the mold cavity, normal temperature of the surface of the molded article, no equipment failure and/or normal system operation, etc., as further indicated by output signal "NG": the mould is abnormal, and further, different information can be output according to the type of the abnormality, for example, NG 1-NG 5 sequentially represent different types of the abnormality: temperature value abnormality, temperature adjustment time abnormality, flow abnormality, mold release failure, and insert position abnormality. It should be noted that the software technologies mentioned herein are all prior art, and the present invention does not relate to any update of the software technologies.
In a preferred embodiment of this embodiment, the thermal infrared imager 11 and the visible light camera 14 are mounted on a cradle head 15, and the cradle head 15 is a supporting device for mounting and fixing the thermal infrared imager 11 and the visible light camera 14, and can be divided into a fixed cradle head and an electric cradle head; and can be divided into a horizontal rotating cradle head rotating left and right and an omnibearing cradle head rotating left and right and up and down. In the embodiment, the omnibearing electric cradle head is preferably selected, can receive the control signal from the signal processing unit 12, accurately run and position, adjust and fix the angle, direction and position of the thermal infrared imager 11 and the visible light camera 14, ensure the monitoring range of the die, overcome the on-site potential safety hazard of contact acquisition and the non-real-time property of non-contact patrol acquisition, and the abnormal change of temperature is the most important reason (the expression form of defective products is deformation, bubbles, shrinkage, flashing, sand holes, cracks and the like) causing the plastic or die-casting metal forming to generate defective products, so that the real-time monitoring is particularly important.
In a preferred embodiment of the present invention, the temperature closed-loop control system includes a reflectivity detection device (not shown) communicatively connected to the information processing unit 12, for detecting reflectivity information of the mold and transmitting the reflectivity information to the information processing unit 12; the information processing unit 12 receives and processes the reflectance information and the temperature information to output the temperature control signal.
It should be noted that the reflectivity of different injection molding materials (such as silica gel, TPU, and PC), different die casting metals (such as zinc, copper, aluminum, magnesium, lead, tin, and their alloys), and products with different surface finishments (such as mirror surfaces and frosts) is different, and the temperature closed-loop control system provided in this embodiment obtains the reflectivity information through the reflectivity detection device (such as a reflectivity measuring instrument, a high-temperature reflectivity measuring device, and the like), so that the information processing unit 12 combines the reflectivity information and the temperature information collected by the infrared collection unit 11 to obtain more accurate temperature information of the mold, and further can more accurately judge and control the temperature of the mold.
The mold temperature controller 13 is provided with a flow meter 131. The mold temperature controller 13 collects the flow rate of the heat medium through a flow meter 131, wherein the flow meter 131 can be a differential pressure type flow meter, a rotor flow meter, a throttling type flow meter, a slit flow meter, a volume flow meter, an electromagnetic flow meter, an ultrasonic flow meter and the like; or a liquid flow meter, a gas flow meter and the like can be selected. The system obtains flow information through the flowmeter 131, in time reports to the police so that the troubleshooting under the unusual condition of flow, effectively monitors whether the water course of mould blocks up to in time the suggestion clearance or the maintenance, reduce the defective products production probability that the mould temperature variation caused, promote yields and enterprise competitiveness.
In some examples, the system collects information on the flow rate of the pipe of the mold temperature controller 13 through the flow meter 131 in the case where it is determined that the mold temperature is abnormal (the temperature measurement value is out of the set range), and determines that the pipe of the mold temperature controller 13 is clogged in the case where the temperature measurement value is increased and the flow rate measurement value is decreased. The temperature closed-loop control system in the embodiment can help a user to find the reason of temperature abnormity, so that the user can conveniently and rapidly discharge faults, and the product quality and the production efficiency are improved. In other examples, the system analyzes the variation trend of the mold temperature by taking the acquired temperature information as a transverse time coordinate in hours/days/weeks/months and the temperature measurement value as a longitudinal coordinate, and further judges whether human intervention or closed-loop control is needed. It should be noted that the software technologies and methods applied in the above examples are all prior arts, and are all exemplary illustrations of the present system, and the present invention does not relate to any software technology update per se.
The mold temperature controller 13 is further provided with a flow valve 132. After receiving the temperature control signal sent by the computer 12, the mold temperature controller 13 can adjust the flow rate of the heat carrier through adjusting the opening of the flow valve, and further adjust the temperature of the mold. Among them, a linear control flow valve, that is, an adjusting valve for controlling a flow rate change by adjusting an opening degree change is preferable, and a linear proportional relationship is formed between the opening degree change and the flow rate change, and the flow rate change is increased as the valve opening degree is increased.
Specifically, when the computer 12 determines that the mold temperature is too high, a cooling control signal is sent to the mold temperature controller 13, and the mold temperature controller 13 reduces the opening degree of the flow valve to reduce the flow rate of the heat carrier, thereby realizing closed-loop control for reducing the mold temperature. When the computer 12 determines that the mold temperature is too low, a temperature rise control signal is sent to the mold temperature controller 13, and the mold temperature controller 13 increases the opening degree of the flow valve to increase the flow rate of the heat carrier, thereby realizing closed-loop control for increasing the mold temperature.
In other examples, the mold temperature controller 13 controls the temperature of the heat medium by controlling the heating temperature of the heat medium by the heater, thereby adjusting the temperature of the mold. Specifically, when the computer 12 determines that the mold temperature is too high, a cooling control signal is sent to the mold temperature controller 13, and the mold temperature controller 13 reduces the heating power of the heater, thereby reducing the temperature of the heat medium and realizing closed-loop control for reducing the mold temperature. In other examples, the closed-loop control of the mold temperature may be achieved by dual adjustments of the heat medium flow rate and temperature, similar to the embodiments described above, and will not be described here.
In the preferred embodiment of the present invention, the temperature closed-loop control system includes a display 16, which can be disposed on the mold temperature controller 13, as shown in fig. 2, or can be directly selected from the display of the computer 12. Wherein, the computer 12 can be controlled locally or remotely. In the case that the computer 12 remotely controls the mold temperature controller 13, it is preferable that a display is provided on the mold temperature controller 13 for displaying temperature information (such as thermal images, temperature variation curves, etc.), gray-level value information, flow rate information, alarm information, etc., and the display can be in various forms such as tables, images, etc.
In a preferred embodiment of the present embodiment, the temperature closed-loop control system includes an alarm device (not shown) in communication connection with the information processing unit 12 (computer), and is configured to receive an alarm signal sent by the information processing unit 12 and execute a corresponding alarm action in case of system abnormality. The optional alarm device is any one or combination of a plurality of alarm devices such as a sound alarm device, a light alarm device, an electric alarm device, a voice alarm device, a character alarm device and the like.
The temperature closed-loop control system provided by the utility model adopts the non-contact temperature measuring device, avoids damaging the surface of the die, does not need manual on-site acquisition, avoids potential safety hazards, improves the competitiveness of enterprises, is particularly suitable for the metal die-casting industry, and has the on-site die temperature as high as 200-500 ℃; the closed-loop control system realizes real-time and rapid adjustment of temperature, effectively solves the problem of generation of defective products under abnormal temperature change and improves the product quality; the gray value image is obtained through the visible light camera, so that the problems of poor mold stripping of the mold or abnormal insert position and the like are conveniently found, and the fault is conveniently eliminated in time;
in summary, according to the temperature closed-loop control system provided by the utility model, the temperature information of the mold, especially the temperature of the mold cavity and the surface temperature of the molded product, is obtained in real time by the non-contact temperature measurement of the infrared acquisition unit, the acquired temperature information is received and processed by the information acquisition unit, and the temperature and/or the flow of the heat medium is controlled by the temperature control unit to adjust the temperature of the mold, so that the real-time closed-loop control of the temperature in the molding process of the mold is realized, the defective product rate caused by the instability of the temperature environment is reduced, the product quality is improved, and the resources and the cost are saved; the non-contact temperature measurement mode can effectively avoid damage to the surfaces of the die and the molded product, avoid manual operation in a high-temperature environment, eliminate potential safety hazards and improve the competitiveness of enterprises. The temperature closed-loop control system collects temperature information in real time, transmits the temperature information in real time, realizes real-time temperature control, and can realize quick and accurate temperature control in a real-time temperature control link in a mode of combining temperature and flow. Therefore, the utility model effectively overcomes various defects of the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A closed loop temperature control system, comprising:
the infrared acquisition unit is used for acquiring the temperature information of the die in a non-contact manner;
the information processing unit is in communication connection with the infrared acquisition unit and is used for receiving and processing the temperature information to output a temperature control signal;
and the temperature control unit is in communication connection with the information processing unit and is used for receiving the temperature control signal to control the flow and/or the temperature of the hot medium so as to adjust the temperature of the die.
2. The closed loop temperature control system as set forth in claim 1, comprising:
the gray value acquisition unit is in communication connection with the information processing unit and is used for acquiring gray value information of the mold and transmitting the gray value information to the information processing unit; the information processing unit receives and processes the gray value information and outputs an alarm signal under the condition that the gray value information is abnormal.
3. The closed-loop temperature control system as claimed in claim 2, wherein the infrared acquisition unit comprises a thermal infrared imager; the gray value acquisition unit comprises a visible light camera.
4. The closed loop temperature control system as set forth in claim 3, comprising:
and the holder is used for arranging the thermal infrared imager and the visible light camera on the holder and adjusting the shooting visual field and the focal length of the thermal infrared imager and the visible light camera.
5. The closed-loop temperature control system as set forth in claim 1, wherein said temperature information comprises: temperature information of a mold cavity and temperature information of the surface of a molded product; and the infrared acquisition unit acquires the temperature information of the mold cavity and the surface of the molded product in real time after receiving the mold opening signal.
6. The closed loop temperature control system as set forth in claim 1, comprising:
the reflectivity detection device is in communication connection with the information processing unit and is used for detecting the reflectivity information of the die and transmitting the reflectivity information to the information processing unit;
the information processing unit receives and processes the reflectivity information to output the temperature control signal.
7. The closed loop temperature control system as set forth in claim 1, wherein the temperature control unit comprises:
and the flowmeter is used for acquiring the flow information of the heat medium.
8. The closed loop temperature control system as set forth in claim 1, wherein the temperature control unit comprises:
and the flow valve is used for adjusting the flow of the hot medium.
9. The closed loop temperature control system as set forth in claim 1, comprising:
and the display is used for displaying temperature information, flow information, gray value information and/or alarm information.
10. The closed loop temperature control system as set forth in claim 1, comprising: and the alarm device is in communication connection with the information processing unit and is used for receiving the alarm signal sent by the information processing unit and executing corresponding alarm action.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220042940A1 (en) * | 2018-12-18 | 2022-02-10 | Marposs Societa' Per Azioni | Checking methods and systems for checking a mechanical piece manufactured by using a mold and a manufacturing process in a foundry |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20220042940A1 (en) * | 2018-12-18 | 2022-02-10 | Marposs Societa' Per Azioni | Checking methods and systems for checking a mechanical piece manufactured by using a mold and a manufacturing process in a foundry |
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