CN215575805U

CN215575805U - Chip array and parallel optical fiber coupling alignment assembly

Info

Publication number: CN215575805U
Application number: CN202121365412.7U
Authority: CN
Inventors: 项刚; 雷双全; 曾洁英; 刁云刚; 赵维
Original assignee: Sichuan Jiuhua Photonic Communication Technology Co Ltd
Current assignee: Sichuan Jiuhua Photonic Communication Technology Co Ltd
Priority date: 2021-06-20
Filing date: 2021-06-20
Publication date: 2022-01-18
Anticipated expiration: 2031-06-20

Abstract

The utility model discloses a chip array and parallel optical fiber coupling alignment assembly, which comprises a mounting seat for mounting a chip to be tested, a base, a first flange, a second flange and a third flange, wherein the first flange, the second flange and the third flange define a clamping gap for clamping the mounting seat, and a driving cylinder for driving the mounting seat to enter and exit the clamping gap; the mounting seat is further provided with a plurality of chip mounting cavities, and the chip mounting cavities are arranged at intervals along the length direction or the width direction of the clamping gap. The structural design of this subassembly conveniently realizes photoelectric chip and detects automation.

Description

Chip array and parallel optical fiber coupling alignment assembly

Technical Field

The utility model relates to the technical field of photoelectric chip coupling bodies, in particular to a component for coupling and aligning a chip array and parallel optical fibers.

Background

An optical fiber coupler (coupling module), also called a splitter, a connector, an adapter, and an optical fiber flange, is commonly used to realize optical signal splitting/combining, is an element for extending an optical fiber link, belongs to the field of optical passive elements, and is applied to telecommunication networks, cable television networks, subscriber loop systems, and local area networks.

In the prior art, the optical transmission technology has the advantages of long distance, high bandwidth, high-quality signal transmission, disturbance resistance and the like, and is widely applied to various industries and people's lives. Due to the small size of the mold spot, the requirement on the alignment degree between the photoelectric device and the optical fiber is high when the photoelectric device is packaged. In the prior art, the alignment degree can be verified by adopting an optical power measurement mode during the packaging and processing of the photoelectric device.

Aiming at the characteristics of photoelectric devices and small light size, a technical scheme capable of completing batch testing of photoelectric chips is provided, and the method has important significance for the development of the industry.

SUMMERY OF THE UTILITY MODEL

Aiming at the problem of completing batch test of photoelectric chips in batch, the utility model provides a component for coupling and aligning a chip array and parallel optical fibers. The structural design of this subassembly conveniently realizes photoelectric chip and detects automation.

Aiming at the problems, the utility model provides an assembly for coupling and aligning a chip array and parallel optical fibers, which solves the problems through the following technical points: a chip array and parallel optical fiber coupling alignment assembly comprises a mounting seat for mounting a chip to be tested, a base, a first flange, a second flange and a third flange, wherein the first flange, the second flange and the third flange enclose a clamping gap for clamping the mounting seat, and the assembly further comprises a driving cylinder for driving the mounting seat to enter and exit the clamping gap; the mounting seat is further provided with a plurality of chip mounting cavities, and the chip mounting cavities are arranged at intervals along the length direction or the width direction of the clamping gap.

When the scheme is used, the mounting seat is used as a test frame, a chip to be tested is mounted in the chip mounting cavity, and corresponding optical fibers are arranged on the corresponding side of the clamping gap according to the position of the chip light receiving end or the chip light emitting end on the mounting seat. Different from the prior art, the chip mounting cavities are arranged at intervals along the length direction or the width direction of the clamping gap, so that the assembly can finish the test of a plurality of chips at a time, the installation of the chips is not influenced, and the optical fibers are arranged on one side of the clamping gap; the clamping gap is arranged to be included, so that the final reliable positioning of the mounting seat is facilitated; the device is characterized in that the device also comprises a driving cylinder, so that the device can finish the filling of the chip to be tested and the testing of the chip to be tested at different positions in space, and the corresponding parts of the chip testing station can not interfere with the movement of the chip transfer part, thereby achieving the purpose of conveniently realizing the automation of photoelectric chip detection.

As one kind can be in left and right direction and preceding, the rear direction homoenergetic for the mount pad provides the clamping force, further improves the technical scheme that the mount pad position stops the precision, adopts: the first retaining edge and the third retaining edge are clamped and arranged on the top of the base in a left-right arrangement mode, the position of the first retaining edge on the base is fixed, and the third retaining edge can slide along the width direction of the clamping gap; the second retaining edge is used for providing an end boundary for the clamping gap, and the position of the second retaining edge on the base is fixed. In this scheme, through driving actuating cylinder cooperation second flange and realizing the centre gripping of mount pad front and back direction, realize the centre gripping of mount pad left and right direction through first flange and third flange.

For the restraint effect that promotes flange in this scheme and stop the precision to the mount pad position, as a concrete scheme, adopt: the clamping gap and the mounting seat are both strip-shaped; the length direction of the clamping gap is parallel to the length direction of the mounting seat; the chip mounting cavities are arranged at intervals along the length direction of the clamping gap.

As described above, one of the setting objectives of the above schemes is to facilitate the realization of chip detection automation, and as an integrated technical scheme that can be matched with the fixation of the corresponding optical fiber end, the following is adopted: the second threading plate is arranged on the first retaining edge and used for fixing the end part of the optical fiber for the chip test; the chip mounting cavity is arranged on one side, close to the first flange, of the mounting seat. When the optical fiber is used specifically, the end part of the optical fiber is fixed to stay towards the mounting seat and then is connected with the light receiving end or the transmitting end of the upper chip.

In the concrete use of this subassembly, considering reasons such as wearing and tearing, fitting surface impurity, the deviation may appear in the direction of above orientation, for realizing rectifying of this deviation, adopt: the second threading board is installed on first flange through supporting the platform that slides on first flange top surface, the platform that slides is used for driving the second threading board along preceding, the back to the translation. As a person skilled in the art, the sliding platform can be a position fine adjustment platform.

In order to further improve the stability of the end position of the optical fiber, the following steps are adopted: the optical fiber testing device is characterized by further comprising a first threading plate fixed on the first flange or the base, and the first threading plate is used for fixing the optical fiber for the chip testing. The second threading board more than this scheme cooperation carries out the multiple spot restraint through many optic fibre, reaches the purpose that further promotes optic fibre tip position stability.

Under simple structure's prerequisite, for further promoting the automation level of this subassembly, adopt: still including being fixed in on the base, being located the backup pad that the third flange kept away from centre gripping clearance one side, the third flange passes through the axis and is on a parallel with centre gripping clearance width direction's guide arm and backup pad link to each other, the guide arm is present to the gliding guide bar of backup pad as the third flange, still the cover is equipped with the compression spring that both ends were used for respectively in third flange, backup pad on the guide arm, the front end of mount pad and the rear end of backup pad all have the spigot surface that is used for guiding the leading-in centre gripping clearance of mount pad, compression spring is used for providing the thrust of extrusion mount pad for the third flange. This scheme provides one kind and not only can realize providing the front and back restraint for the mount pad, can also provide the scheme of controlling the restraint for the mount pad, adopts this scheme simultaneously, and the drive of third flange can be accomplished through driving actuating cylinder.

For chip on the mount pad carries out electrical connection such as electricity, adopt: the mounting base comprises a substrate and a PCB (printed circuit board) supported on the substrate, the chip mounting cavity is arranged on the PCB, and the substrate is further provided with a threading hole which penetrates through the substrate in an up-and-down extending mode. In this scheme, the threading hole is as if the threading passageway of wiring between corresponding circuit and the external equipment on the PCB board, if further set up to set up the bar groove on the base, the holding surface that the base provided for the installation group lies in the both sides in bar groove, the threading passageway that runs through on last bar groove and the threading hole group cost subassembly. The chip mounting cavity is arranged on the PCB, and aims to facilitate the arrangement of a contact matched with a pin on the chip on the PCB, so that necessary electrical connection between the chip and external equipment is realized after the chip is mounted.

The utility model has the following beneficial effects:

Drawings

FIG. 1 is a top view of an embodiment of an assembly for coupling and aligning a chip array and parallel optical fibers according to the present disclosure;

fig. 2 is a side view of a mounting base in an embodiment of the present invention, wherein a chip array and parallel optical fibers are aligned in a coupling manner.

The reference numbers in the drawings are respectively: 1. the base, 2, first threading board, 3, first flange, 4, the platform that slides, 5, second flange, 6, mount pad, 61, PCB board, 62, base plate, 7, backup pad, 8, guide arm, 9, compression spring, 10, third flange, 11, drive actuating cylinder, 12, second threading board.

Detailed Description

The present invention will be described in further detail with reference to the following examples, but the present invention is not limited to the following examples:

example 1:

as shown in fig. 1 and 2, an assembly for coupling and aligning a chip array and parallel optical fibers includes a mounting base 6 for mounting a chip to be tested, a base 1, a first rib 3, a second rib 5, and a third rib 10, wherein the first rib 3, the second rib 5, and the third rib 10 enclose a clamping gap for clamping the mounting base 6, and further includes a driving cylinder 11 for driving the mounting base 6 to enter and exit the clamping gap; the mounting seat 6 is further provided with a plurality of chip mounting cavities, and the chip mounting cavities are arranged at intervals along the length direction or the width direction of the clamping gap.

When the scheme is used, the mounting seat 6 serves as a test frame, a chip to be tested is mounted in the chip mounting cavity, and corresponding optical fibers are arranged on the corresponding side of the clamping gap according to the position of the chip light receiving end or the chip light emitting end on the mounting seat 6. Different from the prior art, the chip mounting cavities are arranged at intervals along the length direction or the width direction of the clamping gap, so that the assembly can finish the test of a plurality of chips at a time, the installation of the chips is not influenced, and the optical fibers are arranged on one side of the clamping gap; the arrangement is such that the clamping gap is included, facilitating final reliable positioning of the mounting seat 6; the device is characterized by further comprising a driving cylinder 11, so that the chip to be tested is filled and tested at different positions in space, the corresponding parts of the chip testing station can not interfere with the movement of the chip transfer part, and the purpose of conveniently realizing the automation of photoelectric chip detection is achieved.

As one kind can be in left and right direction and preceding, the rear direction homoenergetic for mount pad 6 provides the clamping force, further improves the technical scheme that 6 positions of mount pad stop precision, adopts: the first retaining edge 3 and the third retaining edge 10 are clamped and arranged on the top of the base 1 in a left-right arrangement mode, the position of the first retaining edge 3 on the base 1 is fixed, and the third retaining edge 10 can slide along the width direction of the clamping gap; the second rib 5 is used for providing an end boundary for the clamping gap, and the position of the second rib 5 on the base 1 is fixed. In this scheme, through driving 11 cooperation second flanges 5 of actuating cylinder and realizing the centre gripping of mount pad 6 preceding, rear direction, realize the centre gripping of mount pad 6 left and right direction through first flange 3 and third flange 10.

For promoting in this scheme flange to 6 position of mount pad stop the restraint effect of precision, as a concrete scheme, adopt: the clamping gap and the mounting seat 6 are both strip-shaped; the length direction of the clamping gap is parallel to the length direction of the mounting seat 6; the chip mounting cavities are arranged at intervals along the length direction of the clamping gap.

As described above, one of the setting objectives of the above schemes is to facilitate the realization of chip detection automation, and as an integrated technical scheme that can be matched with the fixation of the corresponding optical fiber end, the following is adopted: the optical fiber testing device further comprises a second threading plate 12 arranged on the first retaining edge 3, wherein the second threading plate 12 is used for fixing the end part of the optical fiber for chip testing; the chip mounting cavity is arranged on one side, close to the first flange 3, of the mounting seat 6. When the optical fiber is used specifically, the end part of the optical fiber is fixed to stay towards the mounting seat 6 and then is connected with the light receiving end or the transmitting end of the chip on the optical fiber.

In the concrete use of this subassembly, considering reasons such as wearing and tearing, fitting surface impurity, the deviation may appear in the direction of above orientation, for realizing rectifying of this deviation, adopt: the second threading board 12 is installed on first flange 3 through supporting the platform 4 that slides on 3 top surfaces of first flange, the platform 4 that slides is used for driving second threading board 12 along preceding, the rear translation. As a person skilled in the art, the above sliding platform 4 may be a position fine-tuning platform.

In order to further improve the stability of the end position of the optical fiber, the following steps are adopted: the optical fiber testing device is characterized by further comprising a first threading plate 2 fixed on the first flange 3 or the base 1, wherein the first threading plate 2 is used for fixing the optical fiber for chip testing. The second threading board 12 more than this scheme cooperation carries out the multiple spot restraint through many optic fibre, reaches the purpose that further promotes optic fibre tip position stability.

Under simple structure's prerequisite, for further promoting the automation level of this subassembly, adopt: still including being fixed in on the base 1, being located the backup pad 7 that third flange 10 kept away from centre gripping clearance one side, third flange 10 links to each other with backup pad 7 through axis is on a parallel with centre gripping clearance width direction's guide arm 8, guide arm 8 is the gliding guide bar of backup pad 7 now as third flange 10, it is equipped with the compression spring 9 that both ends are used for respectively on third flange 10, backup pad 7 still to overlap on the guide arm 8, the front end of mount pad 6 and the rear end of backup pad 7 all have the spigot surface that is used for guiding the leading-in centre gripping clearance of mount pad 6, compression spring 9 is used for providing the thrust that extrudes mount pad 6 for third flange 10. This scheme provides one kind and not only can realize for mount pad 6 provides the fore-and-aft restraint, can also be for mount pad 6 provides the scheme of controlling the restraint, adopts this scheme simultaneously, and the drive of third flange 10 can be accomplished through driving actuating cylinder 11.

For chip on the mount pad 6 carries out electrical connection such as electricity, adopt: the mounting seat 6 comprises a substrate 62 and a PCB 61 supported on the substrate 62, the chip mounting cavity is arranged on the PCB 61, and a threading hole which penetrates through the substrate 62 in an up-and-down extending mode is further arranged on the substrate 62. In this scheme, the threading hole is as if the threading passageway of wiring between corresponding circuit and the external equipment on PCB board 61, if further set up to set up the bar groove on base 1, base 1 is located the both sides in bar groove for the holding surface that the installation group provided, the threading passageway that runs through on the cost subassembly is organized to last bar groove and threading hole. The chip mounting cavity is arranged on the PCB 61, and the purpose is to facilitate the arrangement of a contact matched with a pin on the chip on the PCB 61, so that necessary electrical connection between the chip and external equipment is realized after the chip is mounted.

The foregoing is a more detailed description of the present invention in connection with specific preferred embodiments thereof, and it is not intended that the specific embodiments of the present invention be limited to these descriptions. For those skilled in the art to which the utility model pertains, other embodiments that do not depart from the gist of the utility model are intended to be within the scope of the utility model.

Claims

1. A chip array and parallel optical fiber coupling alignment assembly comprises a mounting seat (6) for mounting a chip to be tested, and is characterized by further comprising a base (1), a first rib (3), a second rib (5) and a third rib (10), wherein a clamping gap for clamping the mounting seat (6) is defined by the first rib (3), the second rib (5) and the third rib (10), and the assembly further comprises a driving cylinder (11) for driving the mounting seat (6) to enter and exit the clamping gap; the mounting seat (6) is further provided with a plurality of chip mounting cavities, and the chip mounting cavities are arranged at intervals along the length direction or the width direction of the clamping gap.

2. The chip array and parallel fiber coupling alignment assembly according to claim 1, wherein the first rib (3) and the third rib (10) are arranged on the top of the base (1) in a left-right arrangement with respect to each other, the position of the first rib (3) on the base (1) is fixed, and the third rib (10) can slide along the width direction of the clamping gap; the second rib (5) is used for providing an end boundary for the clamping gap, and the position of the second rib (5) on the base (1) is fixed.

3. An assembly for coupling and aligning a chip array and parallel optical fibers according to claim 2, wherein the clamping gap and the mounting seat (6) are both strip-shaped; the length direction of the clamping gap is parallel to the length direction of the mounting seat (6); the chip mounting cavities are arranged at intervals along the length direction of the clamping gap.

4. The assembly for coupling and aligning the chip array and the parallel optical fibers according to claim 2, further comprising a second threading plate (12) mounted on the first rib (3), wherein the second threading plate (12) is used for fixing the end of the optical fiber for the chip test; the chip mounting cavity is arranged on one side, close to the first flange (3), of the mounting seat (6).

5. An assembly for chip array and parallel fiber coupling alignment according to claim 4, wherein the second threading plate (12) is mounted on the first rib (3) by a sliding platform (4) supported on the top surface of the first rib (3), the sliding platform (4) is used for driving the second threading plate (12) to translate along the front and rear directions.

6. The chip array and parallel optical fiber coupling alignment assembly according to claim 4, further comprising a first threading plate (2) fixed on the first rib (3) or the base (1), wherein the first threading plate (2) is used for fixing an optical fiber for chip testing.

7. An assembly of a chip array and parallel fiber coupling alignment according to claim 2, it is characterized by also comprising a supporting plate (7) which is fixed on the base (1) and is positioned on one side of the third flange (10) far away from the clamping gap, the third flange (10) is connected with the supporting plate (7) through a guide rod (8) with the axis parallel to the width direction of the clamping gap, the guide rod (8) is used as a guide rod of the third rib (10) sliding relative to the support plate (7), the guide rod (8) is also sleeved with a compression spring (9) with two ends respectively acting on the third flange (10) and the support plate (7), the front end of the mounting seat (6) and the rear end of the supporting plate (7) are respectively provided with a guide surface for guiding the mounting seat (6) into the clamping gap, the compression spring (9) is used for providing pushing force for extruding the mounting seat (6) for the third rib (10).

8. An assembly of a chip array and parallel optical fiber coupling alignment according to any one of claims 1 to 7, wherein the mounting base (6) includes a base plate (62) and a PCB supported on the base plate (62), the chip mounting cavity is disposed on the PCB, and the base plate (62) is further provided with a threading hole extending through the base plate (62) in an up-and-down manner.