CN215559123U - Distilled water extraction device - Google Patents
Distilled water extraction device Download PDFInfo
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- CN215559123U CN215559123U CN202120803024.6U CN202120803024U CN215559123U CN 215559123 U CN215559123 U CN 215559123U CN 202120803024 U CN202120803024 U CN 202120803024U CN 215559123 U CN215559123 U CN 215559123U
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Abstract
The utility model relates to a distilled water extracting device, which comprises: the heating chamber is provided with a first cavity and a first opening, and the first opening is communicated with the first cavity; the heating element is used for heating the first cavity of the heating chamber; the refrigerating chamber is provided with a second cavity and a second opening, and the second opening is communicated with the second cavity; the refrigerating element is used for refrigerating a second cavity of the refrigerating chamber; and one end of the negative pressure generating device is communicated with the first opening, the other end of the negative pressure generating device is communicated with the second opening, and the negative pressure generating device is used for transferring the substances in the first cavity into the second cavity. The liquid is heated in the heating chamber through the heating element, the heated liquid is changed into hot steam and then enters the refrigerating chamber through the work of the negative pressure generating device, the preparation process of the distilled water is more controllable, and the distilled water is condensed into the liquid by utilizing the temperature difference.
Description
Technical Field
The utility model relates to the technical field of household appliances, in particular to a distilled water extracting device.
Background
At present, most of the distilled water preparation methods in the market adopt a method of boiling water by electric heating and then condensing water vapor to obtain water. This method is simple, but the main disadvantages of this conventional method are high energy consumption, very large specific heat capacity of water, very large consumption of electric energy required to heat water to boiling, and low production because this heat is eventually carried away by the condensed water to cool the water vapor.
SUMMERY OF THE UTILITY MODEL
Based on this, in order to overcome the defect that prior art multiple use such as high energy consumption, low output, provide a distilled water extraction device.
The present invention provides a distilled water extracting apparatus comprising: the heating chamber is provided with a first cavity and a first opening, and the first opening is communicated with the first cavity; a heating element for heating the first cavity of the heating chamber; the refrigeration chamber is provided with a second cavity and a second opening, and the second opening is communicated with the second cavity; a refrigeration element for refrigerating the second cavity of the refrigeration compartment; one end of the negative pressure generating device is communicated with the first opening, the other end of the negative pressure generating device is communicated with the second opening, and the negative pressure generating device is used for transferring the substances in the first cavity into the second cavity.
The utility model discloses a distilled water extraction device heats indoor liquid heating through heating element, and the work that will pass through negative pressure generating device behind the liquid of heating becomes hot steam enters into the refrigeration indoor, and negative pressure generating device's setting can initiatively move the refrigeration indoor with the heat steam transfer that heats indoor in, and the preparation process of distilled water is more controllable, heats indoor hot steam because the difference in temperature will condense for liquid after getting into the refrigeration room.
In one embodiment, the heating element and the cooling element are combined to form a semiconductor module, the heating element forms a heating surface of the semiconductor module, and the cooling element forms a cooling surface of the semiconductor module. The semiconductor module can realize simultaneous cooling and heating in the working process, so that the whole structure is simpler and more reliable. When the semiconductor module works, the heating surface generates heat, the generated heat acts on the heating chamber, the low temperature generated by the refrigerating surface acts on the refrigerating chamber, and the structure is effectively simplified, so that the whole structure is simpler.
In one embodiment, the heating surface is further provided with a heat dissipation structure, and the heat dissipation structure is at least partially arranged in the heating chamber. The heat dissipation structure can lead heat on the heating element out of a heating room in time, and heating efficiency is effectively improved.
In one embodiment, the heat dissipation structure comprises a plurality of fins, and the plurality of fins are arranged at intervals. The arrangement of the fins can increase the heat dissipation area and improve the heat dissipation effect.
In one embodiment, the refrigeration surface is further provided with a cold guide structure, and the cold guide structure is at least partially arranged in the refrigeration chamber. The setting of leading cold structure can be at the effect of semiconductor module cooling down, and microthermal leading cold structure can be when contact hot steam great area of contact occasionally, and the effect of condensation is more obvious.
In one embodiment, the cold guide structure comprises a plurality of fins which are arranged at intervals. The arrangement of the fins can increase the refrigerating area and improve the refrigerating effect.
In one embodiment, the negative pressure generating device comprises a negative pressure generating module and a supporting mechanism, wherein the negative pressure generating module is arranged on the supporting mechanism, and the supporting mechanism is at least partially clamped between the heating chamber and the cooling chamber.
The negative pressure generating module is arranged on the supporting mechanism, and the supporting mechanism is clamped between the heating chamber and the refrigerating chamber, so that the installation process is more convenient.
In one embodiment, the supporting mechanism includes a first supporting plate and a second supporting plate, the first supporting plate is provided with an installation notch, the semiconductor module is disposed at the installation notch, the heating chamber is provided with an installation opening opposite to the installation notch, the second supporting plate is provided with an air inlet, the second supporting plate is covered at the first opening of the heating chamber, the negative pressure generating module is disposed on the second supporting plate, and the negative pressure generating module is covered at the air inlet. The installation of the semiconductor module can be facilitated by arranging the installation notch on the first supporting plate, and the installation port corresponding to the installation notch is arranged on the heating chamber, so that heat of the semiconductor module can be conveniently transferred into the heating chamber or a part can be conveniently installed and conveniently extended to the heating chamber to transfer heat. The air passing opening is formed in the second supporting plate, so that the negative pressure generating module is arranged on the second supporting plate, and the assembling structure is simpler. The heating chamber and the refrigerating chamber can be separated by covering the second supporting plate at the first opening of the heating chamber, and heating and refrigerating effects are guaranteed.
In one embodiment, the heating chamber is disposed in the cooling chamber, the semiconductor module is disposed on a sidewall of the heating chamber, the semiconductor module is located in the cooling chamber, the heating surface of the semiconductor module is attached to the sidewall or extends into the first cavity of the heating chamber, and the cooling surface of the semiconductor module is located in the second cavity of the cooling chamber. The structure is simpler through setting up the heating chamber in the refrigerating chamber, can directly get into the refrigerating chamber after the liquid heating in the heating chamber, and simple setting through heating face and refrigeration face can make semiconductor module simple and reliable more moreover, reaches the purpose of simplifying the result through the rational utilization to heating face and refrigeration face.
In one embodiment, the refrigeration chamber comprises a liquid storage mechanism and a shell assembly, the shell assembly is provided with a connecting channel, the shell assembly is clamped on the liquid storage mechanism, and the liquid storage mechanism is communicated with the heating chamber through the connecting channel. Through setting up housing assembly to through housing assembly with refrigeration room and heating room intercommunication can make the assembly process simpler. Casing subassembly can be removable with stock solution mechanism in the implementation, and is easy to assemble more.
In one embodiment, the housing assembly comprises a first housing and a second housing, the first housing is connected with the second housing, and a connecting channel is formed between the first housing and the second housing.
In one embodiment, the outer wall of the refrigeration chamber is provided with an insulation material or at least part of the outer wall is provided with a vacuum insulation structure.
In one embodiment, the side wall of the refrigeration chamber is provided with an insulation material or at least part of the side wall is provided with a vacuum insulation structure.
In one embodiment, the heating element is one of a heating tube, a heating wire, or a PTC heating sheet.
In one embodiment, the cooling element is a semiconductor cooling plate or a cooling fan.
In one embodiment, the negative pressure generating device may be a fan or an air pump.
Through set up insulation material or possess vacuum insulation structure at least on the outer wall can effectual realization outer wall keep warm, avoid heating room or refrigeration room and external heat exchange guarantee rate heating or refrigerated efficiency.
The heating element adopts one of a heating pipe and a heating wire, and the cost is lower. The refrigerating element adopts a semiconductor refrigerating sheet or a heat radiation fan, and has simple structure and low cost.
In one embodiment, the negative pressure generating device comprises a negative pressure generating module and an adjusting piece, wherein a first air inlet and a first air outlet are arranged on the negative pressure generating module, the first air inlet is communicated with the first opening, the first air outlet is communicated with the second opening, the first air inlet is communicated with the inside of the first air outlet through a channel, and the adjusting piece can open or close the channel. Through setting up the regulating part, the negative pressure generation module opens the opening at the during operation and can make heating room and refrigeration room separate when out of work, has guaranteed that heating and refrigeration process can not take place to disturb.
In one embodiment, the negative pressure generating module is a fan, and the adjusting member is a hinge disposed on the fan, the hinge being configured to open when the fan is operated and close when the fan is stopped.
In one embodiment, the negative pressure generating module is a fan, and the adjusting member is a valve capable of opening or closing the passage.
In one embodiment, the negative pressure generating module is an air pump, and the adjusting member is a valve capable of opening or closing the passage.
In one embodiment, the heating surface and/or the cooling surface is coated with a heat conducting material. The heat conduction effect is better by paving the heat conduction material on the refrigerating surface and/or the refrigerating surface, and the heat on the heating surface and the low temperature of the refrigerating surface are conducted out in time.
In one embodiment, the thermally conductive material may be a thermally conductive silicone grease. The heat-conducting silicone grease has low cost and good safety.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a sectional view of a distilled water extracting apparatus according to the present invention;
fig. 2 is an exploded view of the distilled water extracting apparatus of the present invention.
Wherein, the corresponding relation between the reference signs and the component names is as follows:
1, a heating chamber;
2, a refrigerating chamber, 21 a liquid storage mechanism, 22 a shell assembly, 221 a first shell and 222 a second shell;
3 negative pressure generating device, 31 negative pressure generating module, 32 supporting mechanism, 321 first supporting plate, 322 second supporting plate, 323 mounting notch and 324 air passing opening;
4 semiconductor module, 41 heating element, 42 cooling element;
5, a heat dissipation structure;
6, a cold conducting structure.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
As shown in fig. 1 and 2, a distilled water extracting apparatus includes: the heating device comprises a heating chamber 1, wherein the heating chamber 1 is provided with a first cavity, the heating chamber 1 is provided with a first opening, and the first opening is communicated with the first cavity; a heating element 41, wherein the heating element 41 is used for heating the first cavity 1 of the heating chamber 1; the refrigerating chamber 2 is provided with a second cavity, the refrigerating chamber 2 is provided with a second opening, and the second opening is communicated with the second cavity; a refrigerating element 42, the refrigerating element 42 being adapted to refrigerate the second cavity of the refrigerating compartment 2; and one end of the negative pressure generating device 3 is communicated with the first opening, the other end of the negative pressure generating device 3 is communicated with the second opening, and the negative pressure generating device 3 is used for transferring the substances in the first cavity into the second cavity.
The utility model discloses a distilled water extraction device, through heating element 41 with liquid heating in heating chamber 1, the work that will pass through negative pressure generating device 3 behind the liquid of heating becomes hot steam enters into in refrigeration chamber 2, negative pressure generating device 3's setting can initiatively move in refrigeration chamber 2 with the hot steam transfer in heating chamber 1, the preparation process of distilled water is more controllable, the hot steam in heating chamber 1 is because the difference in temperature will condense for liquid after getting into refrigeration chamber 2.
As shown in fig. 1 and 2, alternatively, the heating element 41 and the cooling element 42 are combined to form the semiconductor module 4, the heating element 41 forms a heating surface of the semiconductor module 4, and the cooling element 42 forms a cooling surface of the semiconductor module.
The semiconductor module 4 can realize the simultaneous operation of refrigeration and heating in the working process, so that the whole structure is simpler and more reliable. When the semiconductor module 4 works, the heating surface generates heat, the generated heat acts on the heating chamber 1, and the low temperature generated by the refrigerating surface acts on the refrigerating chamber 2, so that the structure is effectively simplified, and the whole structure is simpler.
As shown in fig. 1 and fig. 2, optionally, a heat dissipation structure 5 is further disposed on the heating surface, and the heat dissipation structure 5 is at least partially disposed in the heating chamber 1.
Optionally, the refrigerating surface is further provided with a cold guide structure 6, and at least part of the cold guide structure 6 is arranged in the refrigerating chamber 2.
The arrangement of the heat dissipation structure 5 can lead the heat on the heating element 41 out of the heating chamber 1 in time, thereby effectively improving the heating efficiency. The setting of leading cold structure 6 can be at the effect of semiconductor module 4 cooling down, and microthermal leading cold structure 6 can be in contact with hot steam occasionally great area of contact, and the effect of condensation is more obvious.
Optionally, the heat dissipation structure 5 includes a plurality of fins, and the plurality of fins are arranged at intervals. The arrangement of the fins can increase the heat dissipation area and improve the heat dissipation effect.
Optionally, the cold guiding structure 6 comprises a plurality of fins, and the plurality of fins are arranged at intervals. The arrangement of the fins can increase the refrigerating area and improve the refrigerating effect.
As shown in fig. 1 and 2, optionally, the negative pressure generating device 3 includes a negative pressure generating module 31 and a supporting mechanism 32, the negative pressure generating module 31 is disposed on the supporting mechanism 32, and the supporting mechanism 32 is at least partially sandwiched between the heating chamber 1 and the cooling chamber 2.
The negative pressure generating module 31 is arranged on the supporting mechanism 32, and the supporting mechanism 32 is clamped between the heating chamber 1 and the cooling chamber 2, so that the installation process is more convenient.
As shown in fig. 1 and fig. 2, optionally, the supporting mechanism 32 includes a first supporting plate 321 and a second supporting plate 322, the first supporting plate 321 is provided with an installation notch 323, the semiconductor module 4 is disposed at the installation notch 323, the heating chamber 1 is provided with an installation opening opposite to the installation notch 323, the second supporting plate 322 is provided with an air vent 324, the second supporting plate 322 covers the first opening of the heating chamber 1, the negative pressure generating module 31 is disposed on the second supporting plate 322, and the negative pressure generating module 31 covers the air vent 324.
The installation of the semiconductor module 4 can be facilitated by arranging the installation notch 323 on the first support plate 321, and the installation port corresponding to the installation notch 323 arranged on the heating chamber 1 can facilitate the heat transfer of the semiconductor module 4 into the heating chamber 1 or facilitate the installation of parts so as to extend into the heating chamber 1 to transfer heat. The assembly structure in which the ventilation opening 324 is provided on the second support plate 322 and the negative pressure generating module 31 is provided on the second support plate 322 is simpler. The heating chamber 1 can be separated from the cooling chamber 2 by covering the second supporting plate 322 at the first opening of the heating chamber 1, thereby ensuring heating and cooling effects.
As shown in fig. 1 and 2, optionally, the heating chamber 1 is disposed in the cooling chamber 2, the semiconductor module 4 is disposed on a sidewall of the heating chamber 1, the semiconductor module 4 is disposed in the cooling chamber 2, a heating surface of the semiconductor module 4 is attached to the sidewall or extends into a first cavity of the heating chamber 1, and a cooling surface of the semiconductor module 4 is disposed in a second cavity of the cooling chamber 2.
The structure is simpler through setting up heating chamber 1 in refrigerating chamber 2, can directly get into in refrigerating chamber 2 after the liquid heating in heating chamber 1, and it is simple and reliable to make semiconductor module 4 through heating face and the simple setting of refrigeration face moreover, reaches the purpose of simplifying the result through the rational utilization to heating face and refrigeration face.
As shown in fig. 1 and fig. 2, optionally, the cooling chamber 2 includes a liquid storage mechanism 21 and a housing assembly 22, the housing assembly 22 is provided with a connecting channel, the housing assembly 22 is clamped on the liquid storage mechanism 21, and the liquid storage mechanism 21 is communicated with the heating chamber 1 through the connecting channel. The assembly process can be made simpler by providing the housing assembly 22 and communicating the cooling compartment 2 and the heating compartment 1 through the housing assembly 22. In practice, the housing assembly 22 may be detachable from the reservoir 21 for easier installation.
Optionally, the housing assembly 22 includes a first housing 221 and a second housing 222, the first housing 221 is connected with the second housing 222, and a connecting channel is formed between the first housing 221 and the second housing 222.
As shown in fig. 1 and 2, optionally, the outer wall of the refrigeration chamber 2 is provided with an insulation material or at least a part of the outer wall has a vacuum insulation structure.
As shown in fig. 1 and 2, optionally, the side wall of the refrigeration chamber 2 is provided with an insulation material or at least a part of the side wall has a vacuum insulation structure.
As shown in fig. 1 and 2, the heating element 41 may be one of a heating pipe, a heating wire, or a PTC heating sheet.
As shown in fig. 1 and 2, the cooling element 42 may be a semiconductor cooling fin or a heat dissipation fan.
As shown in fig. 1 and 2, the negative pressure generating device 3 may be a fan or an air pump.
Through set up insulation material or possess vacuum insulation structure at least on the outer wall and can effectually realize the heat preservation of outer wall, avoid heating room 1 or refrigeration room 2 and the external heat exchange guarantee rate heating or refrigerated efficiency of carrying on.
The heating element 41 is made of one of a heating pipe, a heating wire or a PTC, which is low in cost. The refrigeration element 42 is a semiconductor refrigeration sheet or a heat radiation fan, and has simple structure and low cost.
As shown in fig. 1 and fig. 2, optionally, the negative pressure generating device 3 includes a negative pressure generating module 31 and an adjusting member, the negative pressure generating module 31 is provided with a first air inlet and a first air outlet, the first air inlet is communicated with the first opening, the first air outlet is communicated with the second opening, the first air inlet is communicated with the first air outlet through a channel, and the adjusting member can open or close the channel.
The negative pressure generation module 31 is provided with the regulating piece, so that the opening is opened during working, the heating chamber 1 and the refrigerating chamber 2 can be separated during non-working, and the heating and refrigerating processes are prevented from being interfered.
As shown in fig. 1 and 2, the negative pressure generating module 31 may be a fan, and the adjusting member may be a hinge provided on the fan, the hinge being configured to be opened when the fan is operated and to be closed when the fan is stopped.
As shown in fig. 1 and 2, the negative pressure generating module 31 is a fan, and the adjusting member is a valve which can open or close the passage.
As shown in fig. 1 and 2, the negative pressure generating module 31 is an air pump, and the adjusting member is a valve, which can open or close the passage.
As shown in fig. 1 and 2, optionally, the heating surface and/or the cooling surface are coated with a heat conducting material. The heat conduction effect is better by paving the heat conduction material on the refrigerating surface and/or the refrigerating surface, and the heat on the heating surface and the low temperature of the refrigerating surface are conducted out in time.
As shown in fig. 1 and 2, the thermally conductive material may alternatively be a thermally conductive silicone grease. The heat-conducting silicone grease has low cost and good safety.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A distilled water extracting apparatus, comprising:
the heating device comprises a heating chamber (1), wherein the heating chamber (1) is provided with a first cavity, the heating chamber (1) is provided with a first opening, and the first opening is communicated with the first cavity;
a heating element (41), wherein the heating element (41) is used for heating the first cavity of the heating chamber (1);
the refrigeration chamber (2) is provided with a second cavity, the refrigeration chamber (2) is provided with a second opening, and the second opening is communicated with the second cavity;
a refrigerating element (42), the refrigerating element (42) being intended to refrigerate the second cavity of the refrigeration chamber (2);
one end of the negative pressure generating device (3) is communicated with the first opening, the other end of the negative pressure generating device (3) is communicated with the second opening, and the negative pressure generating device (3) is used for transferring the substances in the first cavity into the second cavity.
2. Distilled water extraction device according to claim 1, characterized in that the heating element (41) and the cooling element (42) are combined to form a semiconductor module (4), the heating element (41) constituting a heating surface of the semiconductor module (4) and the cooling element (42) constituting a cooling surface of the semiconductor module.
3. The distilled water extracting device according to claim 2, wherein the heating surface is further provided with a heat dissipating structure (5), the heat dissipating structure (5) is at least partially arranged in the heating chamber (1); and/or
Still be provided with on the refrigeration face and lead cold structure (6), lead cold structure (6) at least part and set up in refrigeration room (2).
4. Distilled water extraction device according to claim 2, characterized in that the negative pressure generating device (3) comprises a negative pressure generating module (31) and a support mechanism (32), the negative pressure generating module (31) being arranged on the support mechanism (32), the support mechanism (32) being at least partially sandwiched between the heating chamber (1) and the cooling chamber (2).
5. The distilled water extracting device according to claim 4, wherein the supporting mechanism (32) comprises a first supporting plate (321) and a second supporting plate (322), the first supporting plate (321) is provided with a mounting notch (323), the semiconductor module (4) is disposed at the mounting notch (323), the heating chamber (1) is provided with a mounting opening opposite to the mounting notch (323), the second supporting plate (322) is provided with an air passing opening (324), the second supporting plate (322) is covered at the first opening of the heating chamber (1), the negative pressure generating module (31) is disposed on the second supporting plate (322), and the negative pressure generating module (31) is covered at the air passing opening (324).
6. Distilled water extraction device according to claim 2, characterized in that the heating chamber (1) is arranged in the cooling chamber (2), the semiconductor module (4) is arranged on a side wall of the heating chamber (1), and the semiconductor module (4) is located in the cooling chamber (2), the heating surface of the semiconductor module (4) is attached to the side wall or the heating surface extends into the first cavity of the heating chamber (1), and the cooling surface of the semiconductor module (4) is located in the second cavity of the cooling chamber (2).
7. The distilled water extracting device according to claim 1, wherein the refrigerating chamber (2) comprises a liquid storage mechanism (21) and a shell assembly (22), the shell assembly (22) is provided with a connecting channel, the shell assembly (22) is clamped on the liquid storage mechanism (21), and the liquid storage mechanism (21) is communicated with the heating chamber (1) through the connecting channel.
8. The distilled water extracting device of claim 1, wherein the outer wall of the refrigerating chamber (2) is provided with an insulating material or at least part of the outer wall is provided with a vacuum insulating structure; and/or
The side wall of the refrigeration chamber (2) is provided with a heat insulation material or at least part of the side wall is provided with a vacuum heat insulation structure; and/or
The heating element (41) is one of a heating pipe, a heating wire or a PTC heating sheet; and/or
The refrigerating element (42) is a semiconductor refrigerating sheet or a radiating fan; and/or
The negative pressure generating device (3) can be a fan or an air pump.
9. The distilled water extracting device of claim 1, wherein the negative pressure generating device (3) comprises a negative pressure generating module (31) and a regulating member, the negative pressure generating module (31) is provided with a first air inlet and a first air outlet, the first air inlet is communicated with the first opening, the first air outlet is communicated with the second opening, the first air inlet is communicated with the first air outlet through a channel, and the regulating member can open or close the channel.
10. The distilled water extracting apparatus according to claim 9,
the negative pressure generating module (31) is a fan, the adjusting piece is a hinge, the hinge is arranged on the fan, and the hinge is configured to be opened when the fan works and closed when the fan stops; or
The negative pressure generating module (31) is a fan, the adjusting piece is a valve, and the valve can open or close the channel; or
The negative pressure generating module (31) is an air pump, and the adjusting piece is a valve which can open or close the channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120803024.6U CN215559123U (en) | 2021-04-19 | 2021-04-19 | Distilled water extraction device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120803024.6U CN215559123U (en) | 2021-04-19 | 2021-04-19 | Distilled water extraction device |
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| CN215559123U true CN215559123U (en) | 2022-01-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113562799A (en) * | 2021-04-19 | 2021-10-29 | 广东顺德中午电器制造有限公司 | Distilled water extraction device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113562799A (en) * | 2021-04-19 | 2021-10-29 | 广东顺德中午电器制造有限公司 | Distilled water extraction device |
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