CN215549946U - Diamond wire slicer main shaft dismouting structure for silicon chip production - Google Patents
Diamond wire slicer main shaft dismouting structure for silicon chip production Download PDFInfo
- Publication number
- CN215549946U CN215549946U CN202121415732.9U CN202121415732U CN215549946U CN 215549946 U CN215549946 U CN 215549946U CN 202121415732 U CN202121415732 U CN 202121415732U CN 215549946 U CN215549946 U CN 215549946U
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- CN
- China
- Prior art keywords
- diamond wire
- main shaft
- baffle
- outer side
- support frame
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 63
- 239000010432 diamond Substances 0.000 title claims abstract description 63
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 17
- 239000010703 silicon Substances 0.000 title claims abstract description 17
- 238000003466 welding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 5
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
The utility model discloses a main shaft dismounting structure of a diamond wire slicing machine for silicon wafer production, which belongs to the field of silicon wafer production equipment and comprises a support frame, wherein a motor base is fixedly welded on one side of the support frame, a driving motor is fixedly installed at the upper end of the motor base, a main shaft is fixedly connected with a rotating shaft of the driving motor, a fixing ring is fixedly welded on the outer side of the main shaft, and a spring is sleeved on the outer side of the main shaft in a sliding manner; through passing the diamond wire through the through hole and using the magnetic block to compress tightly the side face of the baffle, the diamond wire is convenient to rapidly disassemble and assemble, the magnetic block can be guided to move by the design of the positioning pin, and the magnetic block is prevented from being thrown away under the influence of centrifugal force when the baffle rotates.
Description
Technical Field
The utility model relates to the field of silicon wafer production equipment, in particular to a spindle dismounting structure of a diamond wire slicer for silicon wafer production.
Background
The cutting principle of the diamond wire cutting machine is similar to that of a bow saw. The wire winding cylinder rotating at high speed and rotating in a reciprocating way drives the diamond wire to do reciprocating motion, the diamond wire is tensioned by two tensioning wire wheels (springs or pneumatic), and two guide wheels are additionally arranged to ensure the cutting precision and the surface shape. The diamond wire control platform is controlled to continuously feed towards the direction of the diamond wire control platform through an automatic control working platform, or the diamond wire control platform is controlled to continuously feed towards the direction of the working platform, so that grinding is generated between the diamond wire and an object to be cut, and cutting is formed. In the cutting process, because the diameter of the diamond wire is small and the diamond wire has elasticity, an opening angle is formed between the cut object and the two guide wheels positioned on the left and the right of the cut object by the diamond wire, and the diamond wire is in a micro-arc shape. The force applied to the article being cut is thus combined with the relative motion between the diamond wire and the article being cut, so that the cut is continuously performed.
The current diamond wire slicer main shaft dismouting structure is used in silicon chip production, the gyro wheel need use the mounting means of screw wrench tightening main shaft, and inconvenient quick assembly disassembly gyro wheel is changed, and maintenance efficiency is lower and hinders work efficiency, and simultaneously, the fixed knot who tightens the gyro wheel is adopted to the tip of diamond wire to the fixed knot who adopts the screw, and is longer because of screw pitch, and rotates the screw and can drive the diamond wire and rotate, and the installation is fixed diamond wire consuming time longer. Accordingly, there is a need for improvements in the art.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems in the prior art, the utility model aims to provide a main shaft dismounting structure of a diamond wire slicing machine for silicon wafer production, which drives a spring to compress by pushing a sleeve to one side, conveniently and quickly moves a baffle upwards to dismount a clamping block, quickly replaces a roller, can limit and fix the clamping block by the matching design of the sleeve and the spring, and prevents the clamping block from being separated from a clamping groove in the rotation process of a main shaft to cause mechanical accidents; through passing the diamond wire through the through hole and using the magnetic block to compress tightly the side face of the baffle, the diamond wire is convenient to rapidly disassemble and assemble, the magnetic block can be guided to move by the design of the positioning pin, and the magnetic block is prevented from being thrown away under the influence of centrifugal force when the baffle rotates.
In order to solve the above problems, the present invention adopts the following technical solutions.
A main shaft dismounting structure of a diamond wire slicing machine for silicon wafer production comprises a support frame, wherein a motor base is fixedly welded on one side of the support frame, a driving motor is fixedly installed at the upper end of the motor base, a main shaft is fixedly connected with a rotating shaft of the driving motor, a fixing ring is fixedly welded on the outer side of the main shaft, a spring is slidably sleeved on the outer side of the main shaft, a sleeve is slidably sleeved on the outer side of the main shaft, a clamping groove is formed in the upper end of one side of the main shaft, a clamping block is fixedly clamped inside the clamping groove, a baffle is fixedly welded at one end of the clamping block, a roller is fixedly welded on the inner side of the baffle, a diamond wire is wound on the outer side of the roller, a through hole is drilled in the upper end of one side of the baffle, a positioning pin is fixedly welded on one side of the baffle, a magnetic block is slidably sleeved on the outer side of the positioning pin, a driven wheel is installed on one side of the support frame, according to the main shaft dismounting structure of the diamond wire slicing machine for silicon wafer production, the sleeve is pushed to one side to drive the spring to compress, the baffle is conveniently and quickly moved upwards to dismount the clamping block, the roller is quickly replaced, the clamping block can be limited and fixed through the matching design of the sleeve and the spring, and the clamping block is prevented from being separated from the constraint of the clamping groove in the rotation process of the main shaft, so that mechanical accidents are prevented; through passing the diamond wire through the through hole and using the magnetic block to compress tightly the side face of the baffle, the diamond wire is convenient to rapidly disassemble and assemble, the magnetic block can be guided to move by the design of the positioning pin, and the magnetic block is prevented from being thrown away under the influence of centrifugal force when the baffle rotates.
Further, the baffle is hugged closely to telescopic a side, the solid fixed ring of one end fixed connection of spring, the other end fixed connection sleeve of spring drives the spring compression through promoting the sleeve to one side, and the fixture block is demolishd to convenient quick rebound baffle, carries out quick replacement to the gyro wheel.
Further, the main shaft is sleeved with the upper end of the supporting frame in a sliding mode, a side face of the main shaft is tightly attached to the baffle, the clamping block can be limited and fixed through the matching design of the sleeve and the spring, and the clamping block is prevented from being separated from the constraint of the clamping groove in the rotating process of the main shaft, so that mechanical accidents are avoided.
Further, the diamond wire is passed to the inside of through-hole, from driving wheel outside sliding connection diamond wire, through passing the through-hole with the diamond wire to use the magnetic path to compress tightly the baffle side, make things convenient for quick assembly disassembly diamond wire.
Furthermore, one side face of the magnetic block compresses the diamond wires on one side face of the baffle, the positioning pins can guide the magnetic block to move, and the magnetic block is prevented from being thrown out under the influence of centrifugal force when the baffle rotates.
Compared with the prior art, the utility model has the advantages that:
(1) according to the scheme, the sleeve is pushed to one side to drive the spring to compress, the baffle is conveniently and quickly moved upwards to remove the clamping block, the roller is quickly replaced, the clamping block can be limited and fixed through the matching design of the sleeve and the spring, and the clamping block is prevented from being separated from the constraint of the clamping groove in the rotation process of the main shaft to cause mechanical accidents; through passing the diamond wire through the through hole and using the magnetic block to compress tightly the side face of the baffle, the diamond wire is convenient to rapidly disassemble and assemble, the magnetic block can be guided to move by the design of the positioning pin, and the magnetic block is prevented from being thrown away under the influence of centrifugal force when the baffle rotates.
(2) Baffle is hugged closely to telescopic a side, and the solid fixed ring of one end fixed connection of spring, the other end fixed connection sleeve of spring through promoting the sleeve to one side, drive the spring compression, and the fixture block is demolishd to convenient quick rebound baffle, carries out quick replacement to the gyro wheel.
(3) The main shaft is sleeved with the upper end of the supporting frame in a sliding mode, a side face of the main shaft is tightly attached to the baffle, the clamping block can be limited and fixed through the matching design of the sleeve and the spring, and the clamping block is prevented from being separated from the constraint of the clamping groove in the rotating process of the main shaft, so that mechanical accidents are avoided.
(4) The diamond wire is passed to the inside of through-hole, follows driving wheel outside sliding connection diamond wire, through passing the through-hole with the diamond wire to use the magnetic path to compress tightly the baffle side, make things convenient for quick assembly disassembly diamond wire.
(5) One side face of the magnetic block compresses the diamond wires on one side face of the baffle, the positioning pins can guide the magnetic block to move, and the magnetic block is prevented from being thrown out under the influence of centrifugal force when the baffle rotates.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged cross-sectional view taken at A of the present invention;
fig. 3 is an enlarged sectional view at B of the present invention.
The reference numbers in the figures illustrate:
the device comprises a support frame 1, a motor base 11, a driving motor 12, a main shaft 13, a fixing ring 14, a spring 15, a sleeve 16, a clamping groove 17, a clamping block 2, a baffle 21, a roller 22, a diamond wire 23, a through hole 24, a positioning pin 25, a magnetic block 26 and a driven wheel 27.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
Referring to fig. 1-3, a spindle dismounting structure of a diamond wire slicer for silicon wafer production comprises a support frame 1, a motor base 11 is fixedly welded on one side of the support frame 1, a driving motor 12 is fixedly installed on the upper end of the motor base 11, the driving motor 12 is of the type SRM-05, and belongs to the prior art, the driving motor 12 is connected with a control switch, the control switch is connected with a power supply, a spindle 13 is fixedly connected with a rotating shaft of the driving motor 12, a fixing ring 14 is fixedly welded on the outer side of the spindle 13, a spring 15 is slidably sleeved on the outer side of the spindle 13, a sleeve 16 is slidably sleeved on the outer side of the spindle 13, a clamping groove 17 is formed in the upper end of one side of the spindle 13, a clamping block 2 is fixedly clamped inside the clamping groove 17, a baffle 21 is fixedly welded on one end of the clamping block 2, a roller 22 is fixedly welded on the inner side of the baffle 21, a diamond wire 23 is wound on the outer side of the roller 22, a through hole 24 is drilled in the upper end of one side of the baffle 21, one side of baffle 21 is fixed the welding has locating pin 25, and the outside slip of locating pin 25 is cup jointed magnetic path 26, and driven wheel 27 is installed to one side of support frame 1.
Referring to fig. 1, a side surface of a sleeve 16 is tightly attached to a baffle 21, one end of a spring 15 is fixedly connected to a fixing ring 14, the other end of the spring 15 is fixedly connected to the sleeve 16, the sleeve 16 is pushed to one side, the spring 15 is driven to be compressed, the clamping block 2 is conveniently and quickly removed from the baffle 21, the roller 22 is quickly replaced, the main shaft 13 is slidably sleeved in the upper end of the support frame 1, the side surface of the main shaft 13 is tightly attached to the baffle 21, the clamping block 2 can be limited and fixed through the matching design of the sleeve 16 and the spring 15, the clamping block 2 is prevented from being separated from a clamping groove 17 to be bound in the rotating process of the main shaft 13, and mechanical accidents are caused.
Referring to fig. 1-3, the diamond wire 23 penetrates through the inside of the through hole 24, the diamond wire 23 is slidably connected to the outer side of the driven wheel 27, the diamond wire 23 penetrates through the through hole 24, the magnetic block 26 is used for pressing the side surface of the baffle plate 21, the diamond wire 23 is conveniently and quickly disassembled and assembled, the diamond wire 23 is pressed on the side surface of the baffle plate 21 by the side surface of the magnetic block 26, the positioning pin 25 is designed to guide the magnetic block 26 to move, and the magnetic block 26 is prevented from being thrown out under the influence of centrifugal force when the baffle plate 21 rotates.
This diamond wire slicer main shaft dismouting structure is used in silicon chip production, through promoting sleeve 16 to one side, drive the compression of spring 15, convenient quick rebound baffle 21 demolishs fixture block 2, carry out quick replacement to gyro wheel 22, sleeve 16 and spring 15's cooperation design can carry out spacing fixed to fixture block 2, prevent that main shaft 13 from rotating in-process fixture block 2 and breaking away from draw-in groove 17 constraint, cause mechanical accident, through passing diamond wire 23 through-hole 24, and utilize the ability of magnetic path 26 adsorption baffle 21, it compresses tightly in baffle 21 side to drive diamond wire 23, make things convenient for quick assembly disassembly diamond wire 23, the design of locating pin 25 can guide the removal of magnetic path 26, and magnetic path 26 is influenced by centrifugal force and is thrown away when preventing baffle 21 from rotating.
The foregoing is only a preferred embodiment of the present invention; the scope of the utility model is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (5)
1. The utility model provides a silicon chip production is with diamond wire slicer main shaft dismouting structure, includes support frame (1), its characterized in that: the welding tool is characterized in that a motor base (11) is fixedly welded on one side of the support frame (1), a driving motor (12) is fixedly installed at the upper end of the motor base (11), a main shaft (13) is fixedly connected with a rotating shaft of the driving motor (12), a fixing ring (14) is fixedly welded on the outer side of the main shaft (13), a spring (15) is sleeved on the outer side of the main shaft (13) in a sliding mode, a sleeve (16) is sleeved on the outer side of the main shaft (13) in a sliding mode, a clamping groove (17) is formed in the upper end of one side of the main shaft (13), a clamping block (2) is clamped inside the clamping groove (17), a baffle (21) is fixedly welded at one end of the clamping block (2), an idler wheel (22) is fixedly welded on the inner side of the baffle (21), a diamond wire (23) is wound on the outer side of the idler wheel (22), and a through hole (24) is drilled in the upper end of one side of the baffle (21), one side fixed welding of baffle (21) has locating pin (25), magnetic path (26) have been cup jointed in the outside slip of locating pin (25), driven wheel (27) are installed to one side of support frame (1).
2. The spindle dismounting structure of a diamond wire slicer for silicon wafer production according to claim 1, wherein: a side face of the sleeve (16) is tightly attached to the baffle (21), one end of the spring (15) is fixedly connected with the fixing ring (14), and the other end of the spring (15) is fixedly connected with the sleeve (16).
3. The spindle dismounting structure of a diamond wire slicer for silicon wafer production according to claim 1, wherein: the inner part of the upper end of the support frame (1) is sleeved with a main shaft (13) in a sliding mode, and one side face of the main shaft (13) is tightly attached to the baffle (21).
4. The spindle dismounting structure of a diamond wire slicer for silicon wafer production according to claim 1, wherein: the inner part of the through hole (24) penetrates through the diamond wire (23), and the outer side of the driven wheel (27) is connected with the diamond wire (23) in a sliding mode.
5. The spindle dismounting structure of a diamond wire slicer for silicon wafer production according to claim 1, wherein: one side surface of the magnetic block (26) presses the diamond wire (23) on one side surface of the baffle plate (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121415732.9U CN215549946U (en) | 2021-06-24 | 2021-06-24 | Diamond wire slicer main shaft dismouting structure for silicon chip production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121415732.9U CN215549946U (en) | 2021-06-24 | 2021-06-24 | Diamond wire slicer main shaft dismouting structure for silicon chip production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215549946U true CN215549946U (en) | 2022-01-18 |
Family
ID=79820300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121415732.9U Expired - Fee Related CN215549946U (en) | 2021-06-24 | 2021-06-24 | Diamond wire slicer main shaft dismouting structure for silicon chip production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215549946U (en) |
-
2021
- 2021-06-24 CN CN202121415732.9U patent/CN215549946U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220118 |