CN215544205U - Microcrystal chip shielding cover closed side forming die - Google Patents

Microcrystal chip shielding cover closed side forming die Download PDF

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Publication number
CN215544205U
CN215544205U CN202121589834.2U CN202121589834U CN215544205U CN 215544205 U CN215544205 U CN 215544205U CN 202121589834 U CN202121589834 U CN 202121589834U CN 215544205 U CN215544205 U CN 215544205U
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China
Prior art keywords
plate
die
punch
drift
bending
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CN202121589834.2U
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Chinese (zh)
Inventor
夏爽
王国胜
裴昌权
张学君
胡诚森
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Kunshan Jiafengsheng Precise Electronics Co ltd
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Kunshan Jiafengsheng Precise Electronics Co ltd
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Abstract

The utility model provides a microcrystal chip shielding cover closed side edge forming die which comprises an upper die and a lower die, wherein the upper die is provided with a punch, the punch comprises a convex hull punch, a convex hull shaping punch, a bending punch and a bending shaping punch, and the microcrystal chip shielding cover closed side edge forming die is characterized in that the single edge of the convex hull punch relative to the side edge of a through hole of the lower die plate is reduced by 0.2mm, the single edge of the convex hull shaping punch relative to the side edge of the through hole of the lower die plate is reduced by 0.18mm, and the single edge of the bending punch relative to the side edge of the through hole of the lower die plate is enlarged by 0.31mm, so that the size of the punch is enlarged and reduced, a better effect can be achieved when corresponding procedures are completed, and production requirements are met. This mould need not to cut the breach at product corner when carrying out the product and bending, and guaranteed that the limit of bending is at same height, and stamping time is short, and is efficient, is applicable to mass production.

Description

Microcrystal chip shielding cover closed side forming die
Technical Field
The utility model belongs to the field of mechanical dies, and particularly relates to a closed side edge forming die for a microcrystalline chip shielding cover.
Background
Microcrystalline chip uses more extensively in present life, mainly include microcrystalline chip body and electromagnetic shield cover two parts, in the production process of battery shield cover, need bend the shaping processing to it, present common mode is adding man-hour, cut the product corner earlier, then the distribution shaping of bending, this kind of processing method can make microcrystalline chip bend the height size and have the error, can't guarantee each limit of bending all at same height, and the department of bending has the breach, its shielding efficiency has weakened to a certain extent. In order to solve the problem, a die is provided firstly for punching, stretching and forming a product, and then cutting off the redundant part along the skirt edge, so that the bending parts of the product are all at the same height.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is to provide a closed side edge forming die of the microcrystalline chip shielding cover based on the current processing mode of the microcrystalline chip shielding cover, wherein the bent edges are not at the same height, and a gap exists to weaken the shielding function.
In order to achieve the purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides a micrite chip shield cover closed side forming die, includes mould and lower mould, it is equipped with the drift to go up the mould, the drift includes convex closure drift, convex closure plastic drift, bends the drift and bends the plastic drift, the convex closure drift is for the unilateral 0.2mm that reduces in lower bolster through-hole side clearance, and the unilateral 0.18mm that reduces in the relative lower bolster through-hole side clearance of convex closure plastic drift, the drift of bending has been for the unilateral 0.31mm that enlarges in lower bolster through-hole side clearance.
Compared with the prior art, the utility model has the beneficial effects that: 1. the product has no gap at the corner, and the shielding effect is better; 2. the bending edges of the product are ensured to be at the same height. 3. The production rhythm is continuous, the time required by stamping and stretching is short, and the method is suitable for mass production.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a schematic structural view of a closed side forming die of a microcrystalline chip shielding case when the die is opened;
FIG. 2 is a schematic structural view of a closed side forming mold of a microcrystalline chip shielding case;
fig. 3 is a schematic perspective view of a microcrystalline chip shield case.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Examples
As shown in fig. 1, the upper die comprises an upper cover plate 1, an upper die base 2, an upper base plate 3, an upper clamping plate 4, a stop plate 5 and a stripper plate 7 which are sequentially arranged from top to bottom, the upper cover plate 1, the upper die base 2, the upper base plate 3 and the upper clamping plate 4 are fixed by screws to form a whole, and the stop plate 5 and the stripper plate 7 are fixed to form a whole; the punch pins with different functions are arranged on the upper clamping plate 4, the lower ends of the punch pins are provided with round corners, the round corners are equal to the inner round corners of the workpiece 13, so that the punch pins can be attached to the workpiece 13, the convex hull punch pins 14, the convex hull shaping punch pins 15, the bending punch pins 16 and the bending shaping punch pins 7 are sequentially arranged from left to right in the direction shown in the drawing, the single side of the gap between the convex hull punch pins 14 and the through hole side of the lower template 8 is reduced by 0.2mm, the single side of the gap between the convex hull shaping punch pins 15 and the through hole side of the lower template 8 is reduced by 0.18mm, and the single side of the bending punch pins 16 and the single side of the through hole side of the lower template 8 are enlarged by 0.31mm, so that when the workpiece 13 is subjected to convex hull, shaping and bending processes, better effects are achieved, and production requirements are met. A workpiece 13 is placed on the floating block 12, and four processes of convex hull shaping, bending and bending shaping are sequentially completed in a die; the stop plate 5 and the stripper plate 7 are respectively provided with a slotted hole, the position of the slotted hole corresponds to the punch and is slightly larger than the punch, so that the punch can be smoothly punched downwards, a discharging spring is arranged between the stop plate 5 and the upper clamp plate 4, when the die is in a die opening state, the discharging spring props the upper clamp plate 4 and the stop plate 5 open, the punch is contracted in the stripper plate 7, when the upper die is pressed downwards, the stripper plate 7 is firstly contacted with a workpiece 13 and is pressed and fixed, then the punch punches the workpiece 13, and the stability and the accuracy of punching are ensured. The lower die comprises a lower die plate 8, a lower backing plate 9 and a lower die base 10 which are arranged from top to bottom in sequence; the lower die plate is internally provided with a floating block 12 corresponding to the punch, the lower die base 10 is provided with a spring ejecting pin 11, the spring ejecting pin 11 penetrates through the lower die plate 9 and is connected with the floating block 12, a through hole is formed in the position, corresponding to each floating block, of the lower die plate 8, when the punch is pressed down, the floating block 12 moves downwards in the lower die plate 8 until the floating block 2 moves to the lower die plate 9, and when the upper die moves upwards, the spring ejecting pin 11 resets the floating block 12.
The working principle of the assembly is as follows: the method comprises the steps of placing a material belt provided with a workpiece 13 into a die, closing the die, when a stripper plate 7 of an upper die is contacted with a lower die plate 8 of a lower die, enabling an upper clamp plate 4 to continue to move downwards to compress a discharging spring until the upper clamp plate 4 is contacted with a stop plate 5, namely, a floating block 12 in the lower die slides downwards in the lower die plate 8 for a certain distance, stopping a punch to move downwards, then enabling the upper die to move upwards, enabling the upper clamp plate 4 to drive the discharging spring to move upwards until the upper clamp plate 4 is separated from the stop plate 5, enabling the stripper plate 7 to leave the lower die plate 8 when the punch contracts in the stripper plate 7, completing convex closure in a first process, enabling the material belt to move rightwards to move the workpiece 13 formed by the convex closure to the lower end of a convex closure shaping punch 15, performing a second process, and completing a complete process by reciprocating for 4 times. By adopting the process, the microcrystalline chip shielding cover with the bent skirt edges and the corners without notches as shown in fig. 3 can be obtained, the bent edges are ensured to be at the same height, and the corners without notches enable the microcrystalline chip shielding cover to have a better shielding effect.
Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (6)

1. The utility model provides a micrite chip shield cover closed side forming die, includes mould and lower mould, it is equipped with the drift to go up the mould, the drift includes convex closure drift, convex closure plastic drift, bends the drift and bends the plastic drift, its characterized in that, the convex closure drift is for the unilateral 0.2mm that reduces in lower bolster through-hole side clearance, and the unilateral 0.18mm that reduces in the relative lower bolster through-hole side clearance of convex closure plastic drift, the drift of bending has been for the unilateral 0.31mm that enlarges in lower bolster through-hole side clearance.
2. The die as claimed in claim 1, wherein the punch has rounded corners at its lower end.
3. The die of claim 1, wherein the upper die comprises an upper cover plate, an upper die base, an upper base plate, an upper clamping plate, a stop plate and a stripper plate, which are sequentially arranged from top to bottom, the upper cover plate, the upper die base, the upper base plate and the upper clamping plate are fixed by screws to form a whole, and the stop plate and the stripper plate are fixed to form a whole.
4. The die as claimed in claim 3, wherein the retainer plate and the stripper plate have slots corresponding to the position of the punch.
5. The die of claim 3, wherein a discharge spring is disposed between the stop plate and the upper clamp plate, and when the die is opened, the discharge spring is in an uncompressed state, the upper clamp plate is separated from the stop plate, and the punch is located in the stripper plate.
6. The microcrystalline chip shield closed side edge molding die as claimed in claim 1, wherein the lower die comprises a lower die plate, a lower backing plate and a lower die base which are sequentially arranged from top to bottom; the lower die plate is provided with a through hole, a floating block corresponding to the punch is arranged in the through hole, the lower die base is provided with a spring ejection pin, and the spring ejection pin penetrates through the lower backing plate and is connected with the floating block.
CN202121589834.2U 2021-07-13 2021-07-13 Microcrystal chip shielding cover closed side forming die Active CN215544205U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121589834.2U CN215544205U (en) 2021-07-13 2021-07-13 Microcrystal chip shielding cover closed side forming die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121589834.2U CN215544205U (en) 2021-07-13 2021-07-13 Microcrystal chip shielding cover closed side forming die

Publications (1)

Publication Number Publication Date
CN215544205U true CN215544205U (en) 2022-01-18

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CN202121589834.2U Active CN215544205U (en) 2021-07-13 2021-07-13 Microcrystal chip shielding cover closed side forming die

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114733952A (en) * 2022-03-21 2022-07-12 深圳市长盈精密技术股份有限公司 Molding method of shielding part and progressive die thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114733952A (en) * 2022-03-21 2022-07-12 深圳市长盈精密技术股份有限公司 Molding method of shielding part and progressive die thereof

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