CN215543149U

CN215543149U - Wafer cleaning equipment

Info

Publication number: CN215543149U
Application number: CN202121747796.9U
Authority: CN
Inventors: 时岱; 吴楠; 杨军; 包斌
Original assignee: Shenzhen Lixiang Technology Co ltd
Current assignee: Shenzhen Lixiang Technology Co ltd
Priority date: 2021-07-29
Filing date: 2021-07-29
Publication date: 2022-01-18
Anticipated expiration: 2031-07-29

Abstract

The utility model relates to the technical field of wafer cleaning, and discloses wafer cleaning equipment which comprises a supporting block, wherein a cleaning device is arranged at the top of the supporting block, a workbench is fixedly connected to the top of the supporting block, an annular sliding plate is fixedly connected to the top of the supporting block, an annular slide way is arranged on the inner surface of the annular sliding plate, an annular pipe is connected to the inner surface of the annular slide way in a sliding mode, a short pipe is fixedly communicated with the outer surface of the annular pipe, and an air cushion is fixedly communicated with the bottom of the short pipe. This wafer cleaning equipment moves the movable rod through controlling for the inside atmospheric pressure of passageway of taking a breath constantly changes, and the air between air cushion and the wafer passes through the nozzle stub and enters into the ring pipe, and the rethread ring pipe enters into the hose, and inside the passageway of taking a breath again, finally discharges through the outlet duct, along with the continuous removal of movable rod, the air between air cushion and the wafer constantly reduces, makes firmly fixed between air cushion and the wafer.

Description

Wafer cleaning equipment

Technical Field

The utility model relates to the technical field of wafer cleaning, in particular to wafer cleaning equipment.

Background

At present, when a wafer is cleaned, a wafer cleaning device is generally used, and the existing wafer cleaning device has a good wafer cleaning function, but in the process of cleaning the wafer, the wafer may be scratched and damaged due to offset generated by washing, so that the wafer is damaged.

Current patent number is CN201621063171.X wafer cleaning machine, the device is when using, combine washing liquid and ultrasonic wave to wash the dirt on wafer surface, the dirt on cleaning wafer surface that can be clean fast, the rethread hot air is with wafer drying process, the cleaning efficiency and the speed of wafer have been improved, but the device can't accomplish under the condition that does not damage the wafer, effectual fixed to the wafer, thereby lead to probably taking place the skew and the scratch damage when the wafer is washed, current wafer cleaning equipment, through the effective fixed to the wafer, thereby reach the effect that prevents the wafer damage.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

In view of the defects of the prior art, the present invention provides a wafer cleaning apparatus to solve the problem mentioned in the background art that the wafer may be scratched and damaged due to offset generated by rinsing during the wafer cleaning process, thereby causing wafer damage.

(II) technical scheme

In order to achieve the purpose, the utility model provides the following technical scheme: wafer cleaning equipment, including the supporting shoe, the top of supporting shoe is provided with cleaning device, the top fixedly connected with workstation of supporting shoe, the top fixedly connected with annular slide of supporting shoe, annular slide has been seted up to the internal surface of annular slide, and the internal surface sliding connection of annular slide has the ring pipe, the external surface fixed intercommunication of ring pipe has the nozzle stub, the fixed intercommunication in bottom of nozzle stub has the air cushion, the external surface fixed connection of nozzle stub has the head rod, and the one end fixedly connected with flexible glue piece of nozzle stub is kept away from to the head rod, and the device is whole to be effectively fixed through the wafer that needs the washing to reach the effect that prevents the wafer damage.

Preferably, the outer surface of the supporting block is provided with a ventilation channel, the inner surface of the ventilation channel is movably connected with a movable rod, the outer surface of the annular tube is fixedly communicated with a hose, one end of the hose, far away from the annular tube, is fixedly communicated with the inner surface of the ventilation channel, a first support rod is arranged inside the hose, the bottom of the first support rod is fixedly connected with a first spring, the bottom of the first spring is fixedly connected with a first air blocking block, the inside of the hose is provided with a first annular block, the inner surface of the first annular block is attached to the outer surface of the first air blocking block, the inner wall of the supporting block is fixedly communicated with an air outlet pipe, the inside of the air outlet pipe is provided with a second support rod, the bottom of the second support rod is fixedly connected with a second spring, the bottom of the second spring is fixedly connected with a second air blocking block, and the inside of the air outlet pipe is provided with a second annular block, the inner surface of the second annular block is attached to the outer surface of the second air blocking block, the bottom of the air cushion is attached to the top of the wafer at the moment, and then the movable rod is moved leftwards and rightwards, so that the air pressure inside the air exchange channel is changed constantly, air between the air cushion and the wafer is discharged, and the effect of stabilizing the wafer on the workbench is achieved.

Preferably, an air inlet pipe is fixedly communicated with the outer surface of the hose, a third support rod is arranged inside the air inlet pipe, a third spring is fixedly connected to the left side of the third support rod, a third air blocking block is fixedly connected to the left end of the third spring, a third annular block is arranged inside the air inlet pipe, the inner surface of the third annular block is attached to the outer surface of the third air blocking block, a short rod is fixed to the left side of the third air blocking block, the short rod is pulled leftwards at the moment to drive the third air blocking block to be separated from the third annular block, and at the moment, outside air enters the space between the air cushion and the wafer through the air inlet pipe, so that the effect of separating the air cushion from the wafer is achieved.

Preferably, the right side of the supporting block is fixedly connected with a supporting plate, the top of the supporting plate is provided with a first round hole, the inner surface of the first round hole is fixedly connected with a bearing, and the inner surface of the bearing is fixedly connected with a threaded rod, the outer surface of the threaded rod is fixedly connected with a first bevel gear, the top of the supporting plate is fixedly connected with a square sliding plate, the outer surface of the square sliding plate is provided with a second round hole, the inner surface of the second round hole is movably connected with a rotating rod, the left end of the rotating rod is fixedly connected with a second bevel gear, the outer surface of the second bevel gear is meshed with the outer surface of the first bevel gear, the rotating rod is rotated at the moment to drive the second bevel gear to rotate, the rotation of the second bevel gear drives the rotation of the first bevel gear, and the rotation of the first bevel gear drives the rotation of the threaded rod.

Preferably, the inner surface of the square sliding plate is connected with a long plate in a sliding mode, the top of the long plate is provided with a threaded hole, the inner surface of the threaded hole is in threaded connection with the outer surface of the threaded rod, and when the threaded rod rotates, the rotation of the threaded rod drives the long plate to move downwards along the inner surface of the square sliding plate.

Preferably, one side of the long plate, which is far away from the square sliding plate, is fixedly connected with a second connecting rod, one side of the second connecting rod, which is far away from the long plate, is fixed with an isolation cover, the bottom of the isolation cover is matched with the top of the supporting block, when the long plate moves downwards, the second connecting rod is driven to move downwards, at the moment, the second connecting rod moves downwards to drive the isolation cover to move downwards, and at the moment, the isolation cover is attached to the supporting block, so that the effect of isolating the top of the supporting block is achieved.

(III) advantageous effects

Compared with the prior art, the utility model has the beneficial effects that:

1. this wafer cleaning equipment, through moving the movable rod about removing, make the inside atmospheric pressure of passageway of taking a breath constantly change, air between air cushion and the wafer enters into the ring pipe through the nozzle stub, the rethread ring pipe enters into the hose, inside the passageway of taking a breath again, finally discharge through the outlet duct, along with the continuous removal of movable rod, air between air cushion and the wafer constantly reduces, make firmly fixed between air cushion and the wafer, when cleaning device washes the wafer, the wafer has received decurrent power, thereby the effect that the wafer can't move at the washing in-process has been reached, when needs take off the wafer, pulling the nozzle stub left, make it drive the third and keep off the gas piece and break away from third ring piece, the outside air enters into between air cushion and the wafer through the intake pipe, thereby reached and carried out the effect that breaks away from air cushion and wafer.

2. This wafer cleaning equipment, through rotating the bull stick, make it drive the rotation of second conical gear, the rotation of second conical gear has driven first conical gear's rotation, the rotation of first conical gear has driven the rotation of threaded rod, the rotation of threaded rod has driven the internal surface downstream of long slab along square slide, when the long slab moves down, the moving down of second connecting rod has been driven, the moving down of second connecting rod has driven the moving down of cage this moment, cage and supporting shoe laminating, thereby reached and kept apart the supporting shoe top, the effect that liquid splashes when preventing to wash.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a schematic cross-sectional elevation view of the structure of the present invention;

FIG. 3 is an enlarged view of the point A in the structure of FIG. 2.

Wherein: 1. a support block; 2. a cleaning device; 3. a work table; 4. an annular slide plate; 5. an annular tube; 6. a short pipe; 7. an air cushion; 8. a soft rubber block; 9. a ventilation channel; 10. a movable rod; 11. a hose; 12. a first air blocking block; 13. a first ring block; 14. an air outlet pipe; 15. a second gas block; 16. a second ring block; 17. an air inlet pipe; 18. a third air blocking block; 19. a third annular block; 20. a short bar; 21. a support plate; 22. a square slide plate; 23. a long plate; 24. a threaded rod; 25. a first bevel gear; 26. a second bevel gear; 27. a rotating rod; 28. and (4) an isolation cover.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, in the wafer cleaning apparatus, a wafer is first placed on a worktable 3, then an air cushion 7 is moved down to be attached to the wafer, then a movable rod 10 is moved left and right to fix the wafer and the air cushion 7, when the wafer needs to be taken down, a short rod 20 is pulled left, and at the moment, the wafer is separated from the air cushion 7, and the wafer can be taken down;

during cleaning, the rotating rod 27 is rotated, and the isolation cover 28 moves downwards to be attached to the supporting block 1, so that the cleaning liquid of the wafer can be prevented from splashing in the cleaning process.

The working principle is as follows: when the wafer cleaning equipment is used, a wafer is firstly placed on a workbench 3, the short pipe 6 is driven to move downwards through the downward movement of the annular pipe 5, the short pipe 6 drives the air cushion 7 to move downwards at the moment, the bottom of the air cushion 7 is attached to the top of the wafer at the moment, the movable rod 10 is moved leftwards and rightwards at the moment, so that the air pressure in the ventilation channel 9 is continuously changed, when the movable rod 10 moves leftwards, the air pressure in the ventilation channel 9 is reduced, the first air blocking block 12 is separated from the first annular block 13, the air between the air cushion 7 and the wafer enters the annular pipe 5 through the short pipe 6, then enters the hose 11 through the annular pipe 5, and finally enters the ventilation channel 9, when the movable rod 10 moves rightwards, the air pressure in the ventilation channel 9 is increased, the first air blocking block 12 is attached to the first annular block 13 again, and the second air blocking block 15 is separated from the second annular block 16, at the moment, air in the ventilation channel 9 is discharged through the air outlet pipe 14, along with the continuous movement of the movable rod 10, the air between the air cushion 7 and the wafer is continuously reduced, so that the air cushion 7 and the wafer are firmly fixed, when the cleaning device 2 washes the wafer, the wafer is subjected to downward force at the moment, so that the effect that the wafer cannot move in the washing process is achieved, when the wafer needs to be taken down, the short rod 20 is pulled leftwards at the moment, so that the short rod drives the third air blocking block 18 to be separated from the third annular block 19, at the moment, external air enters the space between the air cushion 7 and the wafer through the air inlet pipe 17, and the effect that the air cushion 7 is separated from the wafer is achieved;

during cleaning of the wafer, the rotating rod 27 is rotated to drive the second bevel gear 26 to rotate, the rotation of the second bevel gear 26 drives the first bevel gear 25 to rotate, the rotation of the first bevel gear 25 drives the threaded rod 24 to rotate, the rotation of the threaded rod 24 drives the long plate 23 to move downwards along the inner surface of the square sliding plate 22, when the long plate 23 moves downwards, the second connecting rod moves downwards to drive the isolating cover 28 to move downwards, and the isolating cover 28 is attached to the supporting block 1, so that the top of the supporting block 1 is isolated, and liquid splashing during cleaning is prevented.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Wafer cleaning equipment, including supporting shoe (1), its characterized in that: the cleaning device is characterized in that a cleaning device (2) is arranged at the top of the supporting block (1), a workbench (3) is fixedly connected to the top of the supporting block (1), an annular sliding plate (4) is fixedly connected to the top of the supporting block (1), an annular sliding way is formed in the inner surface of the annular sliding plate (4), an annular pipe (5) is slidably connected to the inner surface of the annular sliding way, a short pipe (6) is fixedly communicated with the outer surface of the annular pipe (5), an air cushion (7) is fixedly communicated with the bottom of the short pipe (6), a first connecting rod is fixedly connected to the outer surface of the short pipe (6), and the first connecting rod is far away from one end of the short pipe (6) and is fixedly connected with a soft rubber block (8).

2. The wafer cleaning apparatus according to claim 1, wherein: the outer surface of the supporting block (1) is provided with a ventilation channel (9), the inner surface of the ventilation channel (9) is movably connected with a movable rod (10), the outer surface of the annular tube (5) is fixedly communicated with a hose (11), one end, far away from the annular tube (5), of the hose (11) is fixedly communicated with the inner surface of the ventilation channel (9), a first supporting rod is arranged inside the hose (11), the bottom of the first supporting rod is fixedly connected with a first spring, the bottom end of the first spring is fixedly connected with a first air blocking block (12), a first annular block (13) is arranged inside the hose (11), the inner surface of the first annular block (13) is attached to the outer surface of the first air blocking block (12), the inner wall of the supporting block (1) is fixedly communicated with an air outlet pipe (14), and a second supporting rod is arranged inside the air outlet pipe (14), and the bottom fixedly connected with second spring of second vaulting pole to the bottom fixedly connected with second gas block (15) of second spring, the inside of outlet duct (14) is provided with second annular piece (16), the internal surface of second annular piece (16) laminates with the surface of second gas block (15) mutually.

3. The wafer cleaning apparatus according to claim 2, wherein: the outer fixed surface of hose (11) communicates with intake pipe (17), the inside of intake pipe (17) is provided with the third vaulting pole, and the left side fixedly connected with third spring of third vaulting pole to the left end fixedly connected with third air blocking piece (18) of third spring, the inside of intake pipe (17) is provided with third annular piece (19), the internal surface of third annular piece (19) and the surface of third air blocking piece (18) are laminated mutually, the left side of third air blocking piece (18) is fixed with quarter butt (20).

4. The wafer cleaning apparatus according to claim 1, wherein: the right side fixedly connected with backup pad (21) of supporting shoe (1), first round hole has been seted up at the top of backup pad (21), and the internal surface fixedly connected with bearing of first round hole to the internal surface fixedly connected with threaded rod (24) of bearing, the external surface fixedly connected with first conical gear (25) of threaded rod (24), the square slide (22) of top fixedly connected with of backup pad (21), the second round hole has been seted up to the surface of square slide (22), and the internal surface swing joint of second round hole has bull stick (27), the left end fixedly connected with second conical gear (26) of bull stick (27), the surface of second conical gear (26) is connected with the surface mesh of first conical gear (25).

5. The wafer cleaning apparatus according to claim 4, wherein: the inner surface of the square sliding plate (22) is connected with a long plate (23) in a sliding mode, the top of the long plate (23) is provided with a threaded hole, and the inner surface of the threaded hole is in threaded connection with the outer surface of the threaded rod (24).

6. The wafer cleaning apparatus according to claim 5, wherein: one side of the long plate (23) far away from the square sliding plate (22) is fixedly connected with a second connecting rod, one side of the second connecting rod far away from the long plate (23) is fixedly provided with an isolation cover (28), and the bottom of the isolation cover (28) is matched with the top of the supporting block (1).