CN215538373U - Game handle - Google Patents
Game handle Download PDFInfo
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- CN215538373U CN215538373U CN202121157202.9U CN202121157202U CN215538373U CN 215538373 U CN215538373 U CN 215538373U CN 202121157202 U CN202121157202 U CN 202121157202U CN 215538373 U CN215538373 U CN 215538373U
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- gamepad
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Abstract
The utility model discloses a gamepad, which comprises: a handle case in which an assembly chamber is formed; the handle shell comprises a main body part; and grip portions provided on both sides of the main body portion; the semiconductor component is arranged at an assembly cavity at the connecting position of the main body part and the holding part and divides the assembly cavity into a first cavity corresponding to the holding part, the semiconductor component comprises a first semiconductor piece and a second semiconductor piece, and the cold end of the first semiconductor piece and the hot end of the second semiconductor piece face the first cavity; a first temperature detection element disposed outside the handle case; the main control board is in communication connection with the first temperature detection element, the first semiconductor piece and the second semiconductor piece, and can control the on-off of the first semiconductor piece and the second semiconductor piece according to the temperature value detected by the first temperature detection element. The utility model solves the problems that the gamepad in the prior art is greatly influenced by the external environment temperature in winter and summer and the use experience of a user is poor.
Description
Technical Field
The utility model belongs to the field of intelligent game equipment, and particularly relates to an improved structure of a game handle.
Background
Present game paddle structure, the structure is usually including the main part and the portion of gripping that is located the main part both sides, the user is when playing, both hands are held and are operated on the portion of gripping, but in chillier winter, because outside ambient temperature is lower, at this moment, can make the temperature of handle also relatively lower, when the user uses and holds the handle, can be because too cold, the temperature is too low, produce uncomfortable sense, it is same, in hot summer, when the user holds game paddle and plays, because weather is hot, the temperature of handle itself is by environmental impact uprise, then can the palm of the hand sweat when the user grips for a long time, user experience feels poor.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems that the gamepad in the prior art is greatly influenced by the external environment temperature in winter and summer and the user experience is poor, the utility model provides the novel gamepad, the semiconductor refrigerating part is arranged in the gamepad, so that the gamepad can be refrigerated or heated, the user can keep a constant temperature range in winter and summer, and the user experience is improved.
In order to realize the purpose of the utility model, the utility model adopts the following technical scheme to realize:
a gamepad comprising:
a handle case in which an assembly chamber is formed;
the handle shell comprises a main body part;
and grip portions provided on both sides of the main body portion;
the semiconductor component is arranged at an assembly cavity at the connecting position of the main body part and the holding part, the assembly cavity is divided into a first cavity corresponding to the holding part, the semiconductor component comprises a first semiconductor piece and a second semiconductor piece, and the cold end of the first semiconductor piece and the hot end of the second semiconductor piece face the first cavity;
a first temperature detection element disposed at an outer side of the handle case for detecting an external ambient temperature;
the main control board is in communication connection with the first temperature detection element, the first semiconductor piece and the second semiconductor piece, and can control the on-off of the first semiconductor piece and the second semiconductor piece according to the temperature value detected by the first temperature detection element.
In some embodiments of the present application, the game pad further comprises a partition plate disposed in the assembly cavity, and the first semiconductor member and the second semiconductor member are respectively disposed on two sides of the partition plate and connected to the partition plate.
In some embodiments of the present application, insertion slots are provided on two sides of the partition plate, and the first semiconductor refrigeration piece and the second semiconductor refrigeration piece are respectively inserted into the insertion slots on two sides of the partition plate.
In some embodiments of the present application, the first semiconductor piece and the second semiconductor piece are vertically arranged within the handle housing with their outer sides fitting the inner side wall profile of the handle housing.
In some embodiments of the present application, the semiconductor component further divides the assembly cavity into a second cavity, the second cavity corresponds to the main body portion, and the main control board is disposed in the second cavity.
In some embodiments of the present application, the heat dissipation hole is disposed on a wall of the second cavity, and the heat dissipation device for guiding out heat or cold in the second cavity to the side of the heat dissipation hole is disposed in the second cavity.
In some embodiments of the present application, the first cavity is formed with 2 cavities, respectively disposed at both sides of the second cavity.
In some embodiments of the present application, the method further comprises: and the second temperature sensor is arranged in the first cavity and is in communication connection with the main control board.
In some embodiments of the present application, a plurality of vent holes arranged along the length direction of the holding portion are provided on the first cavity wall.
In some embodiments of the present application, the handle case includes an upper case and a lower case, the upper case is fastened to the lower case and fixedly connected to the lower case, and the vent holes are formed in the lower case.
Compared with the prior art, the utility model has the advantages and positive effects that:
according to the game handle provided by the utility model, the semiconductor component is arranged in the handle shell, when the semiconductor component is arranged, the cold end of the first semiconductor component of the semiconductor component and the hot end of the second semiconductor component respectively face the first cavity corresponding to the position of the holding part, meanwhile, the first temperature detection element is correspondingly arranged, the external environment temperature is detected through the first temperature detection element, the first semiconductor component or the second semiconductor component is correspondingly controlled to work through the main control board according to the height of the detected external environment temperature, so that cold or heat is released into the first cavity, the corresponding change of the temperature at the position of the holding part is realized, the problem that the temperature is too low or too high when a user holds the game handle is solved, and the experience feeling of the user is improved.
Other features and advantages of the present invention will become more apparent from the following detailed description of the utility model when taken in conjunction with the accompanying drawings.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is an overall configuration diagram of a game pad according to an embodiment of the present invention;
FIG. 2 is a first exploded view of a gamepad according to an embodiment of the present invention;
FIG. 3 is a second exploded view of the game pad according to an embodiment of the present invention;
fig. 4 is a schematic view of the internal structure of the game pad according to the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and examples.
It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The present invention provides an embodiment of a game pad, which is shown in fig. 1 to 4, and comprises:
the handle shell 100 is formed with an assembly cavity 200 inside the handle shell 100, and in some preferred embodiments, the handle shell 100 correspondingly comprises an upper shell 130 and a lower shell 140, and the upper shell 130 is buckled on the lower shell 140 and fixedly connected with the lower shell 140 to form an assembly cavity 200.
The handle case 100 includes a main body 110;
and the holding parts 120 are disposed on both sides of the main body part 110, preferably, the holding parts 120 are obliquely extended outward from both ends of the main body part 110 and symmetrically disposed on both sides of the main body part 110, and the holding parts 120 are mainly convenient for a user to hold by hand.
The semiconductor component 300 is disposed in the assembly cavity 200 at the connecting position of the main body 110 and the holding part 120, and can divide the assembly cavity 200 into a first cavity 210 corresponding to the position of the holding part 120, specifically, the semiconductor component 300 in this embodiment is vertically disposed in the assembly cavity 200 to divide the assembly cavity 200.
The semiconductor component 300 also divides the assembly cavity 200 into a second cavity 220, and the second cavity 220 corresponds to the main body 110.
Specifically, the semiconductor component 300 is provided with 2 groups, each group correspondingly comprises a first semiconductor component 310 and a second semiconductor component 320, the 2 groups of semiconductor components 300 are respectively arranged at the connecting positions of the 2 holding parts 120 and the main body part 110, and the assembly cavity 200 is divided by the 2 groups of semiconductor components 300 to form a second cavity 220 and first cavities 210 located at two sides of the first cavity 210.
The semiconductor component 300 comprises a first semiconductor member 310 and a second semiconductor member 320, wherein the cold end of the first semiconductor member 310 and the hot end of the second semiconductor member 320 face the first cavity 210;
the first semiconductor member 310 and the second semiconductor member 320 are preferably a first semiconductor cooling plate and a second semiconductor cooling plate. The first semiconductor refrigeration piece correspondingly comprises a cold end and a hot end, and when the first semiconductor refrigeration piece is electrified, the cold quantity can be correspondingly generated at the cold end, and the heat quantity is correspondingly generated at the hot end.
The same working principle is adopted by the second semiconductor refrigerating sheet.
Preferably, the first semiconductor member 310 and the second semiconductor member 320 are vertically arranged in the handle case 100, and the outer side surfaces thereof are matched with the inner side wall profile of the handle case 100.
In this embodiment, the cold end of the first semiconductor member 310 faces the first cavity 210, and the hot end of the second semiconductor member 320 faces the first cavity 210, so that the first cavity 210 can be alternately used for cooling or heating, if the external environment temperature is low, the second semiconductor member 320 can be correspondingly started to heat the first cavity 210 corresponding to the position of the grip 120, so that the temperature of the grip 120 is increased, and when the environment temperature is low, the cold end working through the first semiconductor member 310 can correspondingly release the cold energy to cool the temperature at the grip 120.
A first temperature detecting element 500 disposed at an outer side of the handle case 100 for detecting an external ambient temperature;
the first temperature detecting element 500 is preferably a first temperature sensor, which is embedded on the outer sidewall of the handle case 100, and when installed, it can be embedded on the outer side of the main body 110 or the outer side of the grip 120 as required, only to conveniently detect the external environment temperature.
The main control board 600 is in communication connection with the first temperature detection element 500, the first semiconductor part 310 and the second semiconductor part 320, and can control the on/off of the first semiconductor part 310 and the second semiconductor part 320 according to the temperature value detected by the first temperature detection element 500.
When the game handle in this embodiment is used, the external environment temperature can be detected correspondingly by the first temperature detection element 500, when the external environment temperature is detected to be low, the external environment temperature can transmit a signal to the main control board 600, when the main control board 600 receives a temperature signal value, the second semiconductor 320 is correspondingly controlled to be conducted, the second semiconductor 320 is conducted, because the corresponding hot end of the second semiconductor is toward the first cavity 210, the generated heat can be continuously dissipated into the first cavity 210, because the first cavity 210 is located at the position of the holding part 120, when the temperature in the first cavity 210 is increased, the heat can be correspondingly transmitted to the holding part 120, so that the temperature at the position of the holding part 120 held by a person is increased, and the problem that the game handle is too cold and is inconvenient to grasp is effectively solved;
when the first temperature detecting element 500 detects that the ambient temperature is high, the temperature signal is transmitted to the main control board 600, the main control board 600 receives the signal and then controls the conduction of the first semiconductor member 310, at this time, the cold quantity is emitted into the first chamber due to the fact that the cold end of the first semiconductor member 310 faces the first chamber, the temperature of the first chamber is transmitted to the holding portion 120, so that the temperature of the holding portion 120 is reduced, and when a user uses the game handle in hot summer, the game handle can be cooled by the cold quantity released by the first semiconductor member 310.
When the gamepad is used, the holding part 120 of the gamepad can be automatically cooled or heated according to the change of the temperature of the external environment, so that a user can feel a proper temperature when holding the gamepad, poor user experience caused by too cold or too hot can be avoided, and the user experience is improved.
When the external environment temperature is not cold or hot, the first semiconductor device 310 and the second semiconductor device 320 are not controlled to operate, and cooling and heating are not performed.
In order to assemble the first semiconductor member 310 and the second semiconductor member 320 and isolate the first semiconductor member 310 from the second semiconductor member 320, a partition plate 700 is correspondingly disposed on the game pad in the embodiment, the partition plate 700 is disposed in the assembly cavity 200, and the first semiconductor member 310 and the second semiconductor member 320 are respectively disposed on two sides of the partition plate 700 and fixedly connected to the partition plate 700.
Preferably, insertion grooves are formed in two sides of the partition plate 700, and the first semiconductor refrigeration member and the second semiconductor refrigeration member are respectively inserted into the insertion grooves in two sides of the partition plate 700.
The main control board 600 is disposed in the second cavity 220. An accommodating space is formed between the 2 holding portions 120, the second cavity 220 includes a first sidewall close to the accommodating space and a second sidewall opposite to the first sidewall and far away from the accommodating space, preferably, the heat dissipation holes 221 are disposed on the second sidewall and uniformly distributed on the second sidewall.
The heat dissipation air duct is provided with an air outlet, and the air outlet of the heat dissipation air duct faces towards the second side wall correspondingly.
The cold end of the first semiconductor member 310 faces the first cavity 210 and its corresponding hot end faces the second cavity 220, and likewise, the hot end of the second semiconductor member 320 faces the first cavity 210, the corresponding cold side of the first semiconductor cooling element faces the second cavity 220, and when the first semiconductor cooling element is operated, the heat generated at the hot side of the first semiconductor cooling element is dissipated into the second cavity 220, and when the second semiconductor element 320 is operated, the cold generated at the cold end is also dissipated into the second cavity 220, the main control board 600 is disposed in the second cavity 220, and in order to prevent the heat generated by the first semiconductor device 310 during operation or the cold generated by the second semiconductor device 320 during operation from being dissipated into the second cavity 220, which would cause the temperature in the second cavity 220 to be too high or too low and affect the operation of the main control board 600, the heat dissipation device 800 is correspondingly disposed in this embodiment, the wall of the second cavity 220 is provided with heat dissipation holes 221, and the heat dissipation device 800 is configured to guide the heat or cold in the second cavity 220 outwards through the heat dissipation holes 221.
Through the effect of the heat dissipation device 800, the cold or heat is led out, and the normal work of the main control board 600 is ensured.
The heat dissipation device 800, which is a heat dissipation fan in some embodiments, is provided in 2, each of which is disposed in the second cavity 220 and is adjacent to the semiconductor component 300.
In some embodiments of the present application, the heat dissipation device 800 is a heat dissipation fin, and the number of the heat dissipation fins is 2, and the heat dissipation fins are disposed in the second cavity 220 and adjacent to the semiconductor component 300.
In other embodiments of the present application, the heat dissipation device 800 includes a heat dissipation fan and a heat dissipation fin, the heat dissipation fan is disposed in one of the second cavities 220, and the heat dissipation fin is disposed in the other second cavity 220, so that the heat dissipation effect is achieved by the cooperation of the heat dissipation fan and the heat dissipation fin.
In order to enable cold or heat generated by cooling or heating through the first semiconductor member 310 or the second semiconductor member 320 to be rapidly transmitted to the holding portion 120, so as to achieve rapid cooling or heating, a plurality of ventilation holes 211 are further disposed on the wall of the first cavity 210 along the length direction of the holding portion 120, and the plurality of ventilation holes 211 can rapidly transmit heat in the first cavity 210 to the holding portion 120 of the game handle, so as to accelerate the flow of air flow.
The game pad in this embodiment further includes a second temperature sensor 900, which is disposed in the first cavity 210 and is in communication connection with the main control board 600. The temperature of the holding part 120 of the handle can be accurately obtained through the second temperature sensor 900 arranged inside the game handle, if a user sweats when holding the holding part of the handle for a long time, at the moment, the temperature of the holding part 120 is higher, the temperature of the holding part 120 can be accurately detected through the second temperature sensor 900, and then the temperature of the game handle can be more accurately controlled to be cooled and heated, the temperature is kept constant, and the user can feel comfortable no matter what conditions are.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (10)
1. A gamepad, comprising:
a handle case in which an assembly chamber is formed;
the handle shell comprises a main body part;
and grip portions provided on both sides of the main body portion;
the semiconductor component is arranged at an assembly cavity at the connecting position of the main body part and the holding part, the assembly cavity is divided into a first cavity corresponding to the holding part, the semiconductor component comprises a first semiconductor piece and a second semiconductor piece, and the cold end of the first semiconductor piece and the hot end of the second semiconductor piece face the first cavity;
a first temperature detection element disposed at an outer side of the handle case for detecting an external ambient temperature;
the main control board is in communication connection with the first temperature detection element, the first semiconductor piece and the second semiconductor piece, and can control the on-off of the first semiconductor piece and the second semiconductor piece according to the temperature value detected by the first temperature detection element.
2. The gamepad according to claim 1, further comprising a spacer arranged in the assembly chamber, the first semiconductor piece and the second semiconductor piece being arranged on either side of the spacer and connected to the spacer.
3. The gamepad according to claim 2, wherein insertion grooves are provided on both sides of the partition, the first and second semiconductor pieces being inserted into the insertion grooves on both sides of the partition, respectively.
4. The gamepad of claim 1, wherein the first and second semiconductor pieces are arranged vertically inside the handle shell, the outer sides of which are adapted to the contour of the inner side walls of the handle shell.
5. The gamepad according to any one of claims 1 to 4, wherein the semiconductor component further divides the assembly cavity into a second cavity, the second cavity corresponding in position to the body part, the main control board being arranged in the second cavity.
6. The gamepad according to claim 5, wherein the second cavity wall is provided with heat dissipation holes, and the second cavity is internally provided with a heat dissipation device for guiding heat or cold in the second cavity out to the side of the heat dissipation holes.
7. The game pad of claim 5, wherein the first cavity is formed with 2, respectively arranged at both sides of the second cavity.
8. The gamepad according to any of the claims 1 to 4, further comprising: and the second temperature sensor is arranged in the first cavity and is in communication connection with the main control board.
9. Gamepad according to any one of the claims 1 to 4, characterised in that a plurality of ventilation holes arranged in the length direction of the grip are provided in the first cavity wall.
10. The gamepad according to claim 9, wherein the handle shell comprises an upper shell and a lower shell, the upper shell being snapped onto the lower shell and fixedly connected to the lower shell, the lower shell being provided with the ventilation holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121157202.9U CN215538373U (en) | 2021-05-27 | 2021-05-27 | Game handle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121157202.9U CN215538373U (en) | 2021-05-27 | 2021-05-27 | Game handle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215538373U true CN215538373U (en) | 2022-01-18 |
Family
ID=79864244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121157202.9U Active CN215538373U (en) | 2021-05-27 | 2021-05-27 | Game handle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215538373U (en) |
-
2021
- 2021-05-27 CN CN202121157202.9U patent/CN215538373U/en active Active
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