CN215528187U - Micro-channel heat sink assembly and chip packaging structure - Google Patents
Micro-channel heat sink assembly and chip packaging structure Download PDFInfo
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- CN215528187U CN215528187U CN202121446932.0U CN202121446932U CN215528187U CN 215528187 U CN215528187 U CN 215528187U CN 202121446932 U CN202121446932 U CN 202121446932U CN 215528187 U CN215528187 U CN 215528187U
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Abstract
The utility model relates to a micro-channel heat sink assembly and a chip packaging structure, comprising: one of the two cover plates is provided with a liquid inlet flow passage, and the other cover plate is provided with a liquid outlet flow passage, or one of the two cover plates is provided with the liquid inlet flow passage and the liquid outlet flow passage simultaneously; both the two cover plates are provided with fixing holes; in the same cover plate, a fixing hole of the cover plate is communicated with the liquid inlet flow channel or the liquid outlet flow channel, and the aperture of the fixing hole is smaller than that of the liquid inlet flow channel or the liquid outlet flow channel; the micro-channel heat sink is provided with a through hole, the aperture of the through hole is larger than that of the fixing hole, and the micro-channel heat sink is arranged between the two cover plates and enables the through hole to correspond to the fixing holes on the two cover plates; the cover plate and the micro-channel heat sink are used for mounting a chip; and the connecting piece is used for penetrating through the fixing holes of the two cover plates and the through hole of the micro-channel heat sink and is assembled and fixed with the fixing holes. The connecting piece and the micro-channel heat sink share the cooling liquid flow path, so that the use requirement is met by the minimum volume, and the miniaturization of equipment is facilitated.
Description
Technical Field
The utility model relates to the technical field of heat exchange, in particular to a micro-channel heat sink assembly and a chip packaging structure.
Background
The laser emitter chip is a core component of laser equipment, the working energy conversion efficiency of the laser emitter chip is only 50% approximately, and the rest energy is emitted in a heat mode, so that the chip can gather high heat in a short time, the temperature of the chip is rapidly increased, the performance of the chip is seriously reduced, and the chip is even damaged. The method widely adopted at present is to mount a chip on a micro-channel heat sink with extremely high heat dissipation efficiency, and take away heat through the flow of cooling water in the micro-channel heat sink, so as to ensure that the temperature of the emitter chip is not too high, and the emitter chip can normally work.
Although the micro-channel heat sink has high heat exchange efficiency, the heat is taken away through external circulating water, and the design problem of a water inlet and outlet structure needs to be considered during packaging. In the conventional method, an outer frame is mounted on the microchannel heat sink and stacked between the cover plate and the bottom plate, and the outer frame is fixed to the cover plate and the bottom plate.
However, the micro-channel heat sink mounting frame can increase the volume of the micro-channel heat exchanger, and the bottom plate and the cover plate also need to be lengthened to meet the requirement of the opening, so that the bottom plate and the cover plate can occupy the space of the equipment, and the miniaturization of the equipment is not facilitated.
Disclosure of Invention
In view of the above, there is a need for a microchannel heat sink assembly that is effectively reduced in size.
The utility model provides a micro-channel heat sink assembly, comprising:
one of the two cover plates is provided with a liquid inlet flow passage, and the other cover plate is provided with a liquid outlet flow passage, or one of the two cover plates is provided with the liquid inlet flow passage and the liquid outlet flow passage simultaneously; the two cover plates are provided with fixing holes; in the same cover plate, the fixing hole of the cover plate is communicated with the liquid inlet flow channel or the liquid outlet flow channel, and the aperture of the fixing hole is smaller than that of the liquid inlet flow channel or the liquid outlet flow channel;
the micro-channel heat sink is provided with a through hole, the aperture of the through hole is larger than that of the fixing hole, and the micro-channel heat sink is arranged between the two cover plates and enables the through hole to correspond to the fixing holes in the two cover plates; a chip is arranged between the cover plate and the micro-channel heat sink; and
and the connecting piece is used for penetrating through the fixing holes of the two cover plates and the through hole of the micro-channel heat sink and is assembled and fixed with the fixing holes.
In one embodiment, at least two fixing holes on the two cover plates are respectively communicated with the liquid inlet flow channel and the liquid outlet flow channel;
the liquid inlet flow channel and the liquid outlet flow channel are respectively arranged on the two cover plates, the fixing hole of one cover plate is communicated with the liquid inlet flow channel, and the fixing hole of the other cover plate is communicated with the liquid outlet flow channel; or
The liquid inlet flow channel and the liquid outlet flow channel are arranged on the same cover plate, the cover plate is provided with two fixing holes, and the two fixing holes of the cover plate are respectively communicated with the liquid inlet flow channel and the liquid outlet flow channel; the micro-channel heat sink is correspondingly provided with two through holes, the connecting pieces are two, and the connecting pieces are respectively used for penetrating through the corresponding fixing holes of the two cover plates and the corresponding through holes of the micro-channel heat sink and are fixedly assembled with the fixing holes.
In one embodiment, in the microchannel heat sink assembly, the liquid inlet channel and the liquid outlet channel are arranged on the same cover plate, one fixing hole of the cover plate is communicated with the liquid inlet channel, and the other fixing hole is communicated with the liquid outlet channel;
and the two fixing holes on the other cover plate are blind holes.
In one embodiment, in the micro-channel heat sink assembly, the micro-channel heat sink is a plurality of layers, and the plurality of layers of micro-channel heat sinks are stacked.
In one embodiment, in the micro-channel heat sink assembly,
the micro-channel heat sink assembly also comprises a sealing gasket;
each micro-channel heat sink is provided with a groove in the area surrounding the via hole, the sealing gasket is arranged in the groove, and the sealing gasket is arranged between two adjacent layers of the micro-channel heat sinks.
In one embodiment, in the micro flow channel heat sink assembly, the cross-sectional area of the fixing hole is not more than 30% of the cross-sectional area of the via hole.
In one embodiment, in the microchannel heat sink assembly, the connector is a screw, and the fixing hole is a threaded hole.
In one embodiment, in the micro flow channel heat sink assembly, the thickness of the cover plate is 6mm to 15 mm.
The utility model also provides a chip packaging structure which comprises a chip and the micro-channel heat sink assembly, wherein the chip is arranged between the cover plate and the micro-channel heat sink.
In one embodiment, in the chip packaging structure, the micro-channel heat sink is multiple layers, and the multiple layers of micro-channel heat sinks are stacked; the chip is arranged between the cover plate and the micro-channel heat sink and between two adjacent micro-channel heat sinks.
When the micro-channel heat sink assembly works, cooling liquid is introduced from the liquid inlet channel and then enters the through hole of the micro-channel heat sink, and then enters the liquid outlet channel through the micro-channel of the micro-channel heat sink, so that the heat dissipation and cooling of a chip are realized. The micro-channel heat sink assembly is characterized in that fixing holes communicated with the liquid inlet channel or the liquid outlet channel are formed in the cover plates, and then the connecting pieces penetrate through the fixing holes of the two cover plates and the through holes of the micro-channel heat sink and are assembled and fixed with the fixing holes; and the aperture of this via hole is greater than the aperture of fixed orifices, so the connecting piece can not influence the coolant liquid and pass through the via hole, realized so that the connecting piece shares the coolant liquid flow path with the microchannel heat sink, need not to install at the microchannel heat sink be used for with apron and bottom plate between fixed frame, also need not to establish separately on the microchannel heat sink separately and be used for the fixed orifices of connecting piece. The connecting piece and the micro-channel heat sink share a cooling liquid flow path, so that the use requirement is met by the minimum volume, and the miniaturization of equipment is facilitated; the aperture of the fixed hole is limited to be smaller than that of the liquid inlet flow channel or the liquid outlet flow channel, and the aperture of the through hole is larger than that of the fixed hole, so that cooling liquid can smoothly circulate, and the requirements of a micro-channel heat sink water inlet and outlet are met.
Drawings
FIG. 1 is a schematic view of a micro channel heat sink assembly according to an embodiment of the utility model;
fig. 2 is an assembly diagram of the micro flow channel heat sink assembly shown in fig. 1.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Referring to fig. 1, an embodiment of the utility model provides a micro-channel heat sink assembly 10, which includes a cover plate 100, a micro-channel heat sink 200, and a connector 300.
In some of these examples, both cover plates 100, the micro-channel heat sink 200, and the connector 300 are provided with an anti-corrosion layer.
In some examples, the microchannel heat sink assembly 10 includes a passivation and plating process to form an anti-corrosion layer.
The two cover plates 100 are provided with a liquid inlet channel 111 and a liquid outlet channel 112. Further, the liquid inlet channel 111 and the liquid outlet channel 112 may be disposed on the same cover plate at the same time, or the liquid inlet channel may be disposed on one cover plate and the liquid outlet channel may be disposed on the other cover plate.
Both cover plates are provided with fixing holes 120; in the same cover plate, the fixing hole 120 of the cover plate is communicated with the liquid inlet flow passage 111 or the liquid outlet flow passage 112.
The micro-channel heat sink 200 is provided with a via hole 210, and is used for enabling cooling liquid to flow into the micro-channel heat sink 200 through the liquid inlet channel 111 on the cover plate 100 via the via hole 210, and taking away heat of the chip 20 arranged between the cover plate 100 and the micro-channel heat sink 200, so that the temperature of the chip 20 is not too high, and the micro-channel heat sink can work normally; and the aperture of the via hole 210 is larger than that of the fixing hole, so that the cooling liquid can normally flow into the micro channel heat sink 200. Meanwhile, the micro channel heat sink 200 is disposed between the two cover plates 100 and the via holes 210 are corresponding to the fixing holes on the two cover plates 100; thus, the connecting member 300 can be inserted into the fixing holes 120 of the two cover plates 100 and the through holes 210 of the micro channel heat sink 200, and assembled and fixed with the fixing holes 120;
the aperture of the fixing hole 120 is smaller than that of the liquid inlet flow passage 111 or the liquid outlet flow passage 112; thus, the problem that the cooling liquid is blocked by the connector 300 installed in the fixing hole 120 is avoided, so that the cooling liquid smoothly enters the micro flow channel heat sink 200.
It is understood that in one example, only one fixing hole 120 is formed in each of the two cover plates 100 to communicate with the inlet flow path 111 or the outlet flow path 112.
In another example, at least two fixing holes 120 on the two cover plates 100 are respectively communicated with the liquid inlet flow passage 111 and the liquid outlet flow passage 112. Namely, the following two cases are included:
in the first case: the liquid inlet flow passage 111 and the liquid outlet flow passage 112 are respectively arranged on the two cover plates 100, wherein the fixing hole 120 of one cover plate 100 is communicated with the liquid inlet flow passage 111, and the fixing hole 120 of the other cover plate 100 is communicated with the liquid outlet flow passage 112. Further, in one specific example, each cover plate 100 is provided with only one fixing hole 120, wherein the fixing hole 120 of one cover plate 100 is communicated with the liquid inlet flow passage 111, and the fixing hole 120 of the other cover plate 100 is communicated with the liquid outlet flow passage 112. Further, in another specific example, two fixing holes 120 are provided on each cover plate 100, one fixing hole 120 on each cover plate 100 is communicated with the liquid inlet flow channel 111 or the liquid outlet flow channel 112, and the other fixing hole 120 is a blind hole.
In the second case: the liquid inlet flow channel 111 and the liquid outlet flow channel 112 are arranged on the same cover plate 100, the cover plate is provided with two fixing holes 120, and the two fixing holes 120 of the cover plate 100 are respectively communicated with the liquid inlet flow channel 111 and the liquid outlet flow channel 112; the micro-channel heat sink 200 is correspondingly provided with two through holes 210, the number of the connectors 300 is two, and the two connectors 300 are respectively used for penetrating through the corresponding fixing holes 120 of the two cover plates 100 and the corresponding through holes 210 of the micro-channel heat sink 200 and are assembled and fixed with the fixing holes 120.
It is understood that the cooling fluid flow path may be disposed around the inside of the microchannel heat exchanger, and the connector 300 may be disposed in the cooling fluid flow path, that is, the fixing holes of the two cover plates 100 may be disposed in plural numbers as required. In order to ensure the heat dissipation efficiency of the microchannel heat sink and to miniaturize the device, it is preferable that the two cover plates 100 have two fixing holes each.
Optionally, the liquid inlet channel 111 and the liquid outlet channel 112 are disposed on the same cover plate 100, one fixing hole 120 of the cover plate is communicated with the liquid inlet channel 111, and the other fixing hole is communicated with the liquid outlet channel 112; the two fixing holes 120 on the other cover plate are blind holes.
In some examples, the micro-channel heat sink assembly 10 has multiple layers of micro-channel heat sinks 200, and the multiple layers of micro-channel heat sinks 200 are stacked.
In some examples, the micro-fluidic channel heat sink assembly 10 further includes a sealing gasket 400; the micro-channel heat sink 200 is provided with a groove 220 in the area surrounding the via hole 210, the sealing gasket 400 is installed in the groove 220, and the sealing gasket 400 is arranged between two adjacent layers of the micro-channel heat sinks 200.
It can be understood that the inner diameter of the sealing gasket 400 is larger than the diameter of the cross section of the connector 300, and the inner diameter of the groove 220 is the same as the outer diameter of the sealing gasket 400, so that the sealing problem between two adjacent layers of micro-channel heat sinks 200 is solved, and the cooling liquid can smoothly pass through the through hole of the micro-channel heat sink 200 on which the sealing gasket 400 is mounted.
Similarly, in some of the examples, the micro-fluidic channel heat sink assembly 10 is provided with a groove 220 in the area surrounding the fixing hole 120 for mounting the sealing gasket 400.
In some examples, the micro flow channel heat sink assembly 10 has the connector 300 as a threaded rod and the fastening holes 120 as threaded holes. Further, a fastening washer 500 is provided between the cap plate 100 and the nut.
In some examples, in the microchannel heat sink assembly 10, the cover plate 100 having the liquid inlet channel 111 and the liquid outlet channel 112 is provided with a liquid inlet 113 and a liquid outlet 114, respectively, the liquid inlet 113 is communicated with the liquid inlet channel 111, and the liquid outlet 114 is communicated with the liquid outlet channel 112. It is understood that the liquid inlet 113 and the liquid outlet 114 can be disposed on any surface of the cover plate 100, as long as the liquid inlet 113 is communicated with the liquid inlet flow channel 111 and the liquid outlet 114 is communicated with the liquid outlet flow channel 112, so as to ensure smooth circulation of the cooling liquid.
The working principle of the utility model is as follows: the cooling liquid flows into the liquid inlet channel 111 from the liquid inlet 113, passes through the through hole 210 of the micro-channel heat sink 200, further flows into the micro-channel of the micro-channel heat sink 200, and flows out from the liquid outlet 114 through the liquid outlet channel 112, thereby realizing the heat dissipation and cooling of the chip 20.
In some specific examples, the micro fluidic channel heat sink assembly 10 has a cross-sectional area of the securing hole 120 that is no more than 30% of the cross-sectional area of the via hole 210. Therefore, the cooling liquid can better circulate in the cooling liquid flow path, and the heat dissipation effect of the chip is effectively improved.
In some examples, the thickness of the cover plate is 6mm to 15mm in the micro flow channel heat sink assembly 10.
Referring to fig. 2, an assembly diagram of the micro flow channel heat sink assembly 10 is provided according to an embodiment of the present invention.
An embodiment of the present invention further provides a chip package structure, which includes a chip 20 and the micro channel heat sink assembly 10, wherein the chip 20 is disposed between the cover plate 100 and the micro channel heat sink 200.
In some examples, in the chip packaging structure, the micro channel heat sink 200 is multi-layered, and multiple layers of micro channel heat sinks 200 are stacked; the chip 20 is disposed between the cover plate 100 and the micro-channel heat sink 200 and between two adjacent micro-channel heat sinks 200.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A micro fluidic channel heat sink assembly, comprising:
one of the two cover plates is provided with a liquid inlet flow passage, and the other cover plate is provided with a liquid outlet flow passage, or one of the two cover plates is provided with the liquid inlet flow passage and the liquid outlet flow passage simultaneously; the two cover plates are provided with fixing holes; in the same cover plate, the fixing hole of the cover plate is communicated with the liquid inlet flow channel or the liquid outlet flow channel, and the aperture of the fixing hole is smaller than that of the liquid inlet flow channel or the liquid outlet flow channel;
the micro-channel heat sink is provided with a through hole, the aperture of the through hole is larger than that of the fixing hole, and the micro-channel heat sink is arranged between the two cover plates and enables the through hole to correspond to the fixing holes in the two cover plates; a chip is arranged between the cover plate and the micro-channel heat sink; and
and the connecting piece is used for penetrating through the fixing holes of the two cover plates and the through hole of the micro-channel heat sink and is assembled and fixed with the fixing holes.
2. The micro flow channel heat sink assembly of claim 1 wherein at least two mounting holes in said two cover plates are in communication with said inlet flow channel and said outlet flow channel, respectively;
the liquid inlet flow channel and the liquid outlet flow channel are respectively arranged on the two cover plates, the fixing hole of one cover plate is communicated with the liquid inlet flow channel, and the fixing hole of the other cover plate is communicated with the liquid outlet flow channel; or
The liquid inlet flow channel and the liquid outlet flow channel are arranged on the same cover plate, the cover plate is provided with two fixing holes, and the two fixing holes of the cover plate are respectively communicated with the liquid inlet flow channel and the liquid outlet flow channel; the micro-channel heat sink is correspondingly provided with two through holes, the connecting pieces are two, and the connecting pieces are respectively used for penetrating through the corresponding fixing holes of the two cover plates and the corresponding through holes of the micro-channel heat sink and are fixedly assembled with the fixing holes.
3. The micro flow channel heat sink assembly of claim 2 wherein the inlet flow channel and the outlet flow channel are in the same cover plate, one of the cover plate fixing holes being in communication with the inlet flow channel and the other fixing hole being in communication with the outlet flow channel;
and the two fixing holes on the other cover plate are blind holes.
4. The micro-fluidic channel heat sink assembly of claim 1 wherein the micro-fluidic channel heat sink is a plurality of layers, the plurality of layers being stacked.
5. The micro-fluidic channel heat sink assembly of claim 4 wherein the micro-fluidic channel heat sink assembly further comprises a sealing gasket;
each micro-channel heat sink is provided with a groove in the area surrounding the via hole, the sealing gasket is arranged in the groove, and the sealing gasket is arranged between two adjacent layers of the micro-channel heat sinks.
6. The micro fluidic channel heat sink assembly of claim 1 wherein the cross sectional area of the securing hole is no more than 30% of the cross sectional area of the via hole.
7. The micro flow channel heat sink assembly of claim 6 wherein the connector is a threaded rod and the securing holes are threaded holes.
8. The micro flow channel heat sink assembly of any of claims 1-7 wherein the cover plate has a thickness of 6mm to 15 mm.
9. A chip package structure comprising a chip and the microchannel heat sink assembly as claimed in any one of claims 1 to 8, wherein the chip is disposed between the cover plate and the microchannel heat sink.
10. The chip package structure of claim 9, wherein the micro-channel heat sink is a plurality of layers, the plurality of layers of micro-channel heat sinks being stacked; the chip is arranged between the cover plate and the micro-channel heat sink and between two adjacent micro-channel heat sinks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121446932.0U CN215528187U (en) | 2021-06-28 | 2021-06-28 | Micro-channel heat sink assembly and chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121446932.0U CN215528187U (en) | 2021-06-28 | 2021-06-28 | Micro-channel heat sink assembly and chip packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN215528187U true CN215528187U (en) | 2022-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121446932.0U Active CN215528187U (en) | 2021-06-28 | 2021-06-28 | Micro-channel heat sink assembly and chip packaging structure |
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| CN (1) | CN215528187U (en) |
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- 2021-06-28 CN CN202121446932.0U patent/CN215528187U/en active Active
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