CN215527482U

CN215527482U - Series chip capacitor

Info

Publication number: CN215527482U
Application number: CN202122335074.9U
Authority: CN
Inventors: 王永贵
Original assignee: Shenzhen Fengbin Electronic New Material Co ltd
Current assignee: Shenzhen Fengbin Electronic New Material Co ltd
Priority date: 2021-09-26
Filing date: 2021-09-26
Publication date: 2022-01-14
Anticipated expiration: 2031-09-26

Abstract

The utility model relates to the technical field of chip capacitors and discloses a series chip capacitor which comprises a shell, wherein the shell is provided with a cover plate, an installation mechanism is arranged in the cover plate, an auxiliary mechanism is arranged in the shell, and a chip capacitor body is arranged in the shell. This series connection chip capacitor, through setting up installation mechanism, in the use, put into the insulating cover that corresponds in proper order with chip capacitor body earlier, cover the apron, make the positive negative pole lead wire at chip capacitor body top put into the mounting groove that corresponds in, the rethread auxiliary mechanism says that the apron is fixed can, only need can use the device through the positive pole joint and the negative pole joint at connection cover board top when needs use, the device simple structure, simple to operate is swift, work efficiency is promoted, simultaneously because the insulating layer plays insulating and spacing effect to the connecting block, bad contact's phenomenon can not appear when using in the device, the practicality of the device has been increased.

Description

Series chip capacitor

Technical Field

The utility model relates to the technical field of chip capacitors, in particular to a series chip capacitor.

Background

With the continuous development of the society, the whole electronic device develops toward miniaturization, large capacity, high reliability and low cost, and in order to meet the requirements of the society, the chip capacitor itself is also rapidly developing: the variety is increasing, the volume is shrinking, the performance is improving, the technology is advancing, the material is updating, and the series products of light, thin, short and small tend to be standardized and generalized. Its application is gradually penetrating and developing from consumer to investment-type devices. When the chip capacitors are used in combination, the chip capacitors need to be connected in series, and a packaged serial chip capacitor is needed to avoid series dispersion. Most of the existing chip type combined capacitors are complex in structure, inconvenient in installation and capable of connecting the lead wires of the capacitors, unstable in connection and poor in practicability, and the phenomenon of poor contact is easily caused.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a series chip capacitor, which solves the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a series connection chip capacitor, includes the casing, the casing is provided with the apron, the inside installation mechanism that is provided with of apron, the inside complementary unit that is provided with of casing, the inside chip capacitor body that is provided with of casing.

Installation mechanism includes the insulating layer, the insulating layer sets up inside the apron, the mounting groove has been seted up to the apron bottom, top fixedly connected with connecting seat in the mounting groove, the spread groove has been seted up on the connecting seat surface, the connecting block has been cup jointed in the spread groove, the connecting seat bottom is through the recess overlap joint on chip capacitor body lead wire top, the wiring hole has all been seted up to the apron top left and right sides, wiring hole bottom is linked together with the mounting groove top, be provided with positive electrode joint and negative terminal in the wiring hole respectively, positive electrode joint bottom and negative terminal bottom are fixed connection respectively at the connecting seat top that corresponds.

Preferably, both ends cup joint with the connecting seat on positive lead wire top and negative pole lead wire top of chip capacitor body respectively about the connecting block, establish ties two adjacent chip capacitor bodies through the connecting block to make the chip capacitor body in the whole device be in the tandem state.

Preferably, the bottom fixedly connected with insulating cover in the casing, chip capacitor body is located insulating cover, and insulating cover can prevent that chip capacitor body and casing from taking place the contact, the phenomenon of contact failure appears.

Preferably, the connecting block is located inside the insulating layer, and the insulating layer plays insulating and spacing roles to the connecting block.

Preferably, the auxiliary mechanism includes the baffle, baffle fixed connection is bottom in the casing, the ventilation groove has all been seted up to the left and right sides in the casing, the inboard fixedly connected with fan in ventilation groove, the fan air outlet is provided with the dust screen, the draw-in groove has been seted up at the casing top, apron bottom fixedly connected with fixture block, the fixture block is located the draw-in groove, the casing left and right sides all has set screw through screw threaded connection.

Preferably, the same heat dissipation hole is formed in the bottom of the shell and the bottom of the insulating sleeve, six heat dissipation holes are formed in the bottom of the shell and are uniformly distributed in the bottom of the shell, and the heat dissipation holes can dissipate heat of the chip capacitor body.

Preferably, the fixing screw penetrates through the clamping groove and the clamping block and extends into the left side of the shell, and the fixing screw fixes the cover plate and the shell under the action of the clamping block and the clamping groove.

Compared with the prior art, the utility model has the beneficial effects that:

1. this series connection chip capacitor, through setting up installation mechanism, in the use, put into corresponding insulating sleeve in proper order with chip capacitor body earlier, cover the apron, make the positive negative pole lead wire at chip capacitor body top put into corresponding mounting groove in, the rethread auxiliary mechanism says that the apron is fixed can, because establish ties a plurality of chip capacitor bodies through the connecting block, only need can use the device through the positive pole joint and the negative pole joint at connection cover plate top when needs use, the device simple structure, simple to operate is swift, the work efficiency has been promoted, simultaneously because the insulating layer plays insulating and spacing effect to the connecting block, the device can not appear contact failure's phenomenon when using, the practicality of the device has been increased.

2. This series connection chip capacitor, through setting up complementary unit, in the use, can dispel the heat to the device inside through ventilation groove and fan, effectively prevent that the high temperature in the casing from causing the damage of chip capacitor body, the dust screen can prevent that the dust from entering into inside the casing, causes the damage of chip capacitor body, the baffle plays spacing and fixed action to chip capacitor body, set screw can play the fixed action through draw-in groove and fixture block between apron and the casing.

Drawings

FIG. 1 is a schematic view of the front side of the overall structure of the present invention;

FIG. 2 is a schematic sectional view of the front part of the overall structure of the present invention;

FIG. 3 is a schematic top view partially in section of a cover plate according to the present invention;

FIG. 4 is a schematic top view of the housing of the present invention;

FIG. 5 is an enlarged view of the mounting mechanism A of the present invention.

In the figure: 1. a housing; 2. a cover plate; 3. an installation mechanism; 301. an insulating layer; 302. connecting blocks; 303. a connecting seat; 304. a positive electrode tab; 305. mounting grooves; 306. connecting grooves; 307. a negative terminal; 308. a wiring hole; 309. an insulating sleeve; 4. an auxiliary mechanism; 401. a clamping block; 402. a set screw; 403. a partition plate; 404. a ventilation slot; 405. a dust screen; 406. heat dissipation holes; 407. a fan; 408. a card slot; 5. a capacitor body.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a series chip capacitor comprises a shell 1, wherein the shell 1 is provided with a cover plate 2, an installation mechanism 3 is arranged inside the cover plate 2, an auxiliary mechanism 4 is arranged inside the shell 1, and a chip capacitor body 5 is arranged inside the shell 1.

The mounting mechanism 3 comprises an insulating layer 301, the insulating layer 301 is arranged inside the cover plate 2, the bottom of the cover plate 2 is provided with a mounting groove 305, the top inside the mounting groove 305 is fixedly connected with a connecting seat 303, the surface of the connecting seat 303 is provided with a connecting groove 306, a connecting block 302 is sleeved in the connecting groove 306, the connecting block 302 is positioned inside the insulating layer 301, the left and right ends of the connecting block 302 are respectively sleeved with the connecting seat 303 at the top end of a positive lead and the top end of a negative lead of the chip capacitor body 5, the bottom of the connecting seat 303 is lapped on the top end of the lead of the chip capacitor body 5 through a groove, the left and right sides of the top of the cover plate 2 are respectively provided with a wiring hole 308, the bottom of the wiring hole 308 is communicated with the top of the mounting groove 305, a positive connector 304 and a negative connector 307 are respectively arranged in the wiring hole 308, the bottom of the positive connector 304 and the bottom of the negative connector 307 are respectively and fixedly connected with the top of the corresponding connecting seat 303, the insulating sleeve 309 is fixedly connected with the bottom inside the shell 1, chip capacitor body 5 is located insulating cover 309, through setting up installation mechanism 3, in the use, earlier put into corresponding insulating cover 309 with chip capacitor body 5 in proper order, cover apron 2, make the positive negative pole lead wire at chip capacitor body 5 top put into corresponding mounting groove 305, rethread complementary unit 4 say that apron 2 is fixed can, owing to establish ties a plurality of chip capacitor bodies 5 through connecting block 302, only need can use the device through anodal joint 304 and the negative pole joint 307 at 2 tops of connecting apron when needs use, the device simple structure, simple to operate is swift, work efficiency has been promoted, simultaneously because insulating layer 301 plays insulating and spacing effect to connecting block 302, bad contact's phenomenon can not appear when the device uses, the practicality of the device has been increased.

The auxiliary mechanism 4 comprises a partition 403, the partition 403 is fixedly connected to the bottom in the housing 1, ventilation slots 404 are respectively formed in the left side and the right side in the housing 1, fans 407 are fixedly connected to the inner sides of the ventilation slots 404, dust screens 405 are arranged at air outlets of the fans 407, a clamping slot 408 is formed in the top of the housing 1, clamping blocks 401 are fixedly connected to the bottom of the cover plate 2, the clamping blocks 401 are located in the clamping slots 408, fixing screws 402 are respectively connected to the left side and the right side of the housing 1 through screw threads, the fixing screws 402 penetrate through the clamping slots 408 and the clamping blocks 401 and extend into the left inner side of the housing 1, the same heat dissipation holes 406 are formed in the bottom of the housing 1 and the bottom of the insulating sleeve 309, six heat dissipation holes 406 are arranged, the six heat dissipation holes 406 are uniformly distributed in the bottom of the housing 1, through the arrangement of the auxiliary mechanism 4, the inside of the device can be dissipated heat through the ventilation slots 404 and the fans 407 in the use process, the damage to the chip capacitor body 5 caused by overhigh temperature in the housing 1 is effectively prevented, the dust screen 405 can prevent that the dust from entering into inside the casing 1, causes the damage of chip capacitor body 5, and baffle 403 plays spacing and fixed action to chip capacitor body 5, and set screw 402 can play fixed action between apron 2 and casing 1 through draw-in groove 408 and fixture block 401.

In the actual operation process, when the device is used, the chip capacitor body 5 is sequentially placed into the corresponding insulating sleeve 309, the cover plate 2 is covered, the positive and negative leads at the top of the chip capacitor body 5 are placed into the corresponding mounting grooves 305, and then the cover plate 2 is fixed through the auxiliary mechanism 4. because a plurality of chip capacitor bodies 5 are connected in series through the connecting block 302, when the device is used, the device can be used only by connecting the positive electrode connector 304 and the negative electrode connector 307 at the top of the cover plate 2, the inside of the device can be radiated through the ventilation groove 404 and the fan 407, the damage of the chip capacitor body 5 caused by overhigh temperature in the shell 1 is effectively prevented, the dust screen 405 can prevent dust from entering the shell 1 to cause the damage of the chip capacitor body 5, and the partition plate 403 has the limiting and fixing functions on the chip capacitor body 5, the fixing screw 402 can fix the cover plate 2 and the housing 1 through the engaging groove 408 and the engaging block 401.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.

Claims

1. A series chip capacitor comprising a case (1), characterized in that: the capacitor is characterized in that the shell (1) is provided with a cover plate (2), an installation mechanism (3) is arranged in the cover plate (2), an auxiliary mechanism (4) is arranged in the shell (1), and a chip capacitor body (5) is arranged in the shell (1);

the mounting mechanism (3) comprises an insulating layer (301), the insulating layer (301) is arranged inside the cover plate (2), the bottom of the cover plate (2) is provided with an installation groove (305), the top in the installation groove (305) is fixedly connected with a connecting seat (303), the surface of the connecting base (303) is provided with a connecting groove (306), a connecting block (302) is sleeved in the connecting groove (306), the bottom of the connecting seat (303) is lapped on the top end of the lead of the chip capacitor body (5) through a groove, wiring holes (308) are formed in the left side and the right side of the top of the cover plate (2), the bottoms of the wiring holes (308) are communicated with the top of the mounting groove (305), the wiring hole (308) is internally provided with a positive electrode joint (304) and a negative electrode joint (307) respectively, the bottom end of the positive electrode joint (304) and the bottom end of the negative electrode joint (307) are respectively and fixedly connected to the tops of the corresponding connecting seats (303).

2. A series chip capacitor according to claim 1, wherein: the left end and the right end of the connecting block (302) are respectively sleeved with the connecting seats (303) at the top end of the positive lead and the top end of the negative lead of the chip capacitor body (5).

3. A series chip capacitor according to claim 1, wherein: the bottom fixedly connected with insulating cover (309) in casing (1), chip capacitor body (5) are located insulating cover (309).

4. A series chip capacitor according to claim 1, wherein: the connecting block (302) is positioned inside the insulating layer (301).

5. A series chip capacitor according to claim 1, wherein: complementary unit (4) are including baffle (403), bottom in baffle (403) fixed connection in casing (1), ventilation groove (404) have all been seted up to the left and right sides in casing (1), ventilation groove (404) inboard fixedly connected with fan (407), fan (407) air outlet is provided with dust screen (405), draw-in groove (408) have been seted up at casing (1) top, apron (2) bottom fixedly connected with fixture block (401), fixture block (401) are located draw-in groove (408), casing (1) left and right sides all has set screw (402) through screw threaded connection.

6. A series chip capacitor according to claim 5, wherein: the bottom of the shell (1) and the bottom of the insulating sleeve (309) are provided with the same heat dissipation hole (406), six heat dissipation holes (406) are formed, and the six heat dissipation holes (406) are uniformly distributed at the bottom of the shell (1).

7. A series chip capacitor according to claim 5, wherein: the fixing screw (402) penetrates through the clamping groove (408) and the clamping block (401) and extends into the left inner part of the shell (1).