CN215510588U - Silicon wafer cylinder processing equipment for semiconductor production - Google Patents
Silicon wafer cylinder processing equipment for semiconductor production Download PDFInfo
- Publication number
- CN215510588U CN215510588U CN202121921096.7U CN202121921096U CN215510588U CN 215510588 U CN215510588 U CN 215510588U CN 202121921096 U CN202121921096 U CN 202121921096U CN 215510588 U CN215510588 U CN 215510588U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- close
- plate
- base
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model discloses silicon crystal cylinder processing equipment for semiconductor production, which comprises a base, wherein a transparent cover is fixedly connected to the top of the base, when the silicon crystal cylinder processing equipment is used, dust generated in the polishing process can be effectively isolated through the arrangement of a protective cover, the harm of scattered dust to the body of a worker is avoided, the position of a polishing disc can be adjusted on the outer side of the transparent cover through the mutual matching among a servo motor, a second threaded rod, a second threaded sleeve, a fixed rod and a T-shaped rod, the harm caused by the direct manual operation of the worker is also avoided, the silicon crystal cylinder is prevented from shaking in the polishing process through the mutual matching among a clamping plate, a pressing plate, an arc-shaped groove, an anti-slip pad, a first threaded rod and a hand-operated wheel, the polishing efficiency is influenced, and the distance between two side plates is adjusted through the mutual matching between the side plates and a hydraulic cylinder, the silicon crystal cylinders with different lengths can be processed, and the using effect is good.
Description
Technical Field
The utility model relates to the technical field of semiconductor production, in particular to silicon wafer column processing equipment for semiconductor production.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, the semiconductor is mainly applied to the fields of integrated circuits, communication systems, photovoltaic power generation, illumination application, high-power conversion and the like, and the raw material for processing and producing the semiconductor is used for processing silicon crystal cylinders, so that the silicon crystal cylinders need to be polished and formed by using silicon crystal cylinder processing equipment.
Current silicon wafer cylinder processing equipment for semiconductor production can not effectually be isolated the dust that produces when polishing to make the staff can cause the injury to staff's health when processing, and current processing equipment lacks positioning mechanism, and silicon wafer cylinder rocks easily when polishing, influences machining efficiency, and current processing equipment can only process the silicon wafer cylinder of same kind of length, and the result of use is poor.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide silicon crystal cylinder processing equipment for semiconductor production.
One of the purposes of the utility model is realized by adopting the following technical scheme:
a silicon crystal cylinder processing device for semiconductor production comprises a base, wherein a transparent cover is fixedly connected to the top of the base, side plates are arranged at the positions, close to the left side and the right side, of the top of the base, first sliding grooves are formed at the positions, close to the left side and the right side, of the top of the base, two first sliding blocks are movably connected to adjacent first sliding groove inner cavities respectively, a fixed shaft is fixedly connected to one adjacent side of each of the two side plates, a clamping plate is fixedly connected to one adjacent end of each of the two fixed shafts, a clamping mechanism is arranged at one adjacent side of each of the two clamping plates, a movable plate is arranged at the position, close to the middle position of the rear side, of the top of the base, an adjusting mechanism is arranged at the rear side of the movable plate, a vertical plate is arranged at the top of the movable plate, a second sliding block is fixedly connected to the bottom of the vertical plate, and a second sliding groove is formed at the top of the movable plate, and second slider swing joint is in second spout inner chamber, the front side of riser is close to top fixedly connected with flat board, dull and stereotyped right side fixedly connected with protecting crust, just protecting crust inner chamber right side fixedly connected with grinding motor, grinding motor's power take off end fixedly connected with bull stick, fixedly connected with second bearing on the flat board, the left end of bull stick runs through the second bearing inner chamber to fixedly connected with grinds the dish.
Furthermore, hydraulic cylinders are arranged on the sides, far away from the side plates, of the hydraulic cylinders, the bottoms of the hydraulic cylinders are fixedly connected with the top of the base, and power ends of the two hydraulic cylinders are fixedly connected with the adjacent side plates respectively.
Furthermore, the clamping mechanism comprises two pressing plates which are respectively positioned at one side of the clamping plate close to the center of the top of the base, the two pressing plates are arranged up and down, the pressing plate positioned at the bottom is fixedly connected with the clamping plate, one side of the pressing plate positioned at the top close to the clamping plate is fixedly connected with a third sliding block, one side of the clamping plate close to the center of the top of the base is provided with a third sliding groove, the third slide block is movably connected with the inner cavity of the third chute, the top of the pressure plate positioned at the top is fixedly connected with a third bearing, a first threaded rod is inserted into the inner cavity of the third bearing, a fixed plate is fixedly connected at the position, close to the top, of one side of the clamping plate, close to the center of the top of the base, and a first threaded sleeve is fixedly connected to the fixing plate, the top end of the first threaded rod penetrates through the inner cavity of the first threaded sleeve, and a hand wheel is fixedly connected to the top end of the first threaded rod.
Further, two arc fluting has all been seted up to the adjacent one side of clamp plate, just arc slotted inner chamber fixedly connected with slipmat.
Further, the adjusting mechanism comprises two straight plates which are respectively fixedly connected with the rear side of the base close to the left side and the right side, the two straight plates are both fixedly connected with a first bearing, the rear side of the base close to the right side is fixedly connected with a supporting plate, and the left side of the supporting plate is fixedly connected with a servo motor, the power output end of the servo motor is fixedly connected with a second threaded rod, the left end of the second threaded rod penetrates through the adjacent first bearing, and is inserted into the inner cavity of the first bearing far away from the first bearing, a second thread sleeve is sleeved on the second threaded rod near the middle position, the front side of the second threaded sleeve is fixedly connected with a fixed rod, the rear side of the transparent cover, which is close to the bottom, is provided with a first rectangular open slot, the front end of the fixed rod penetrates through the first rectangular slot and is fixedly connected with the rear side of the movable plate.
Further, the rear side fixedly connected with T shape pole of riser, the rear side of translucent cover is close to intermediate position department and has seted up the second rectangle fluting, the second rectangle fluting is run through to the short one end of T shape pole T shape structure to extend to the outside of translucent cover.
Furthermore, the front side of translucent cover is opened and is equipped with the opening, just the front side of translucent cover is equipped with the door that matches each other with the opening, the left side of door is equipped with two hinges, just the door is through two hinges and translucent cover swing joint, the front side of translucent cover is close to right side department fixedly connected with handle.
Compared with the prior art, the utility model has the beneficial effects that:
1. the dust generated in the polishing process can be effectively isolated through the arrangement of the protective cover, the harm of scattered dust to the body of a worker is avoided, the position of the polishing disc can be adjusted outside the transparent cover through the mutual matching of the servo motor, the second threaded rod, the second threaded sleeve, the fixed rod and the T-shaped rod, and the harm caused by the direct manual operation of the worker is also avoided;
2. through the mutual cooperation between splint, clamp plate, arc fluting, slipmat, first threaded rod and the hand wheel avoid rocking at the in-process silicon wafer post of polishing, influence efficiency of polishing, and through the regulation to the distance between two curb plates of mutually supporting between curb plate and the pneumatic cylinder, can process the silicon wafer cylinder of different length, excellent in use effect.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic structural diagram of the present embodiment;
FIG. 2 is a front view of the present embodiment;
FIG. 3 is a top view of the component base;
FIG. 4 is a right side cross-sectional view of the component transparency
Fig. 5 is a right side view of the component platen.
In the figure: 1. a base; 2. a transparent cover; 3. a side plate; 4. a hydraulic cylinder; 5. a fixed shaft; 6. a splint; 7. pressing a plate; 8. a first threaded rod; 9. a hand-operated wheel; 10. a movable plate; 11. a vertical plate; 12. a flat plate; 13. a protective shell; 14. a rotating rod; 15. grinding disc; 16. fixing the rod; 17. a T-shaped rod; 18. a servo motor; 19. a second threaded rod; 20. polishing the motor; 21. and a door.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 5, a silicon crystal cylinder processing device for semiconductor production comprises a base 1, a transparent cover 2 is fixedly connected to the top of the base 1, an opening is arranged on the front side of the transparent cover 2, a door 21 matched with the opening is arranged on the front side of the transparent cover 2, two hinges are arranged on the left side of the door 21, the door 21 is movably connected with the transparent cover 2 through the two hinges, a handle is fixedly connected to the front side of the transparent cover 2 close to the right side of the transparent cover for convenient opening and closing, side plates 3 are arranged on the top of the base 1 close to the left side and the right side of the base, first sliding grooves are arranged on the top of the base 1 close to the left side and the right side of the base, the two first sliding blocks are respectively movably connected to the inner cavities of the adjacent first sliding grooves, hydraulic cylinders 4 are arranged on the sides of the two side plates 3 far away from each other, and the bottoms of the hydraulic cylinders 4 are fixedly connected with the top of the base 1, the power ends of the two hydraulic cylinders 4 are respectively fixedly connected with the adjacent side plates 3, silicon cylinder bodies with different lengths can be processed by adjusting the distance between the two side plates 3, the using effect is better, the adjacent sides of the two side plates 3 are fixedly connected with the fixed shafts 5, the adjacent ends of the two fixed shafts 5 are fixedly connected with the clamping plates 6, the adjacent sides of the two clamping plates 6 are respectively provided with a clamping mechanism, the top of the base 1 is provided with a movable plate 10 near the middle position of the rear side, the rear side of the movable plate 10 is provided with an adjusting mechanism, the top of the movable plate 10 is provided with a vertical plate 11, the bottom of the vertical plate 11 is fixedly connected with a second sliding block, the top of the movable plate 10 is provided with a second sliding groove, the second sliding block is movably connected with an inner cavity of the second sliding groove, the front side of the vertical plate 11 is fixedly connected with a flat plate 12 near the top, the right side of the flat plate 12 is fixedly connected with a protective shell 13, and the right side of the inner cavity of the protective shell 13 is fixedly connected with a polishing motor 20, a power output end of the polishing motor 20 is fixedly connected with a rotating rod 14, a flat plate 12 is fixedly connected with a second bearing, and the left end of the rotating rod 14 penetrates through the inner cavity of the second bearing and is fixedly connected with a polishing disc 15;
the clamping mechanism comprises two pressing plates 7, the two pressing plates 7 are respectively positioned on one side of the clamping plate 6 close to the center of the top of the base 1, the two pressing plates 7 are arranged up and down, the adjacent sides of the two pressing plates 7 are respectively provided with an arc-shaped slot, the inner cavity of the arc-shaped slot is fixedly connected with an anti-slip pad and is anti-slip, the pressing plate 7 positioned at the bottom is fixedly connected with the clamping plate 6, one side of the pressing plate 7 positioned at the top close to the clamping plate 6 is fixedly connected with a third sliding block, one side of the clamping plate 6 close to the center of the top of the base 1 is provided with a third sliding groove, the third sliding block is movably connected with the inner cavity of the third sliding groove, the top of the pressing plate 7 positioned at the top is fixedly connected with a third bearing, the inner cavity of the third bearing is inserted with a first threaded rod 8, one side of the clamping plate 6 close to the center of the top of the base 1 is fixedly connected with a fixed plate close to the top, the fixed plate is fixedly connected with a first threaded sleeve, the top end of the first threaded rod 8 penetrates through the inner cavity of the first threaded sleeve, the hand-operated wheel 9 is fixedly connected, so that the silicon wafer column body is prevented from shaking in the processing process to influence the processing efficiency;
the adjusting mechanism comprises two straight plates, the two straight plates are fixedly connected to the rear side of the base 1 close to the left side and the right side respectively, first bearings are fixedly connected to the two straight plates, a supporting plate is fixedly connected to the rear side of the base 1 close to the right side, a servo motor 18 is fixedly connected to the left side of the supporting plate, a second threaded rod 19 is fixedly connected to the power output end of the servo motor 18, the left end of the second threaded rod 19 penetrates through the adjacent first bearings and is connected to the inner cavity of the first bearings away from the adjacent first bearings in an inserting mode, a second threaded sleeve is sleeved on the second threaded rod 19 close to the middle position, a fixed rod 16 is fixedly connected to the front side of the second threaded sleeve, a first rectangular slot is formed in the rear side of the transparent cover 2 close to the bottom, the front end of the fixed rod 16 penetrates through the first rectangular slot and is fixedly connected with the rear side of the movable plate 10, and the horizontal position of the polishing plate 15 can be adjusted conveniently;
the rear side fixedly connected with T shape pole 17 of riser 11, the rear side of translucent cover 2 is close to intermediate position department and has seted up the second rectangle fluting, and the second rectangle fluting is run through to the shorter one end of T shape pole 17T shape structure to extend to the outside of translucent cover 2, conveniently adjust the front and back position of polishing dish 15.
The working principle is as follows: when the silicon wafer polishing machine is used, a door 21 is opened through a handle, a silicon wafer cylinder body to be processed is placed on two pressing plates 7 positioned at the bottom, the silicon wafer cylinder body is placed between two arc-shaped grooves, two hand-operated wheels 9 are rotated to drive adjacent first threaded rods 8 to rotate, the first threaded rods 8 rotate to drive the pressing plates 7 at the tops to move downwards through first threaded sleeves, a third sliding block slides in an inner cavity of a third sliding groove to limit the pressing plates 7, the two pressing plates 7 at the tops move downwards to fixedly clamp the silicon wafer cylinder body, the phenomenon that the silicon wafer cylinder body shakes during polishing to influence polishing efficiency is avoided, when the distance between the two side plates 3 needs to be adjusted so as to process silicon wafer cylinders with different lengths, a hydraulic cylinder 4 is started through an external power supply to drive the side plates 3 to move, the distance between the two side plates 3 can be adjusted, the use effect is good, after silicon wafer cylinder body centre gripping is accomplished, start grinding motor 20 and servo motor 18 through external power supply, grinding motor 20 work drives bull stick 14 rotatory, bull stick 14 is rotatory to drive grinding disc 15 rotatory, thereby polish silicon wafer cylinder body, servo motor 18 work drives second threaded rod 19 rotatory, second threaded rod 19 is rotatory to drive the thread bush and removes, remove about the second thread bush and remove about driving fly leaf 10 through dead lever 16, thereby it removes about driving grinding motor 20 to drive, adjust the position of polishing, and can drive riser 11 and slide around on fly leaf 10 through promoting T shape pole 17, thereby can adjust the distance between grinding disc 15 and the silicon wafer cylinder body, setting through translucent cover 2, the dust of avoiding polishing in-process production drifts and causes the injury to staff's health.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (7)
1. The utility model provides a silicon wafer cylinder processing equipment for semiconductor manufacture, includes base (1), its characterized in that: the top of the base (1) is fixedly connected with a transparent cover (2), the top of the base (1) is provided with side plates (3) close to the left side and the right side, the bottom of each side plate (3) is fixedly connected with a first slider, the top of the base (1) is provided with first chutes close to the left side and the right side, the two first sliders are movably connected with adjacent first chute inner cavities respectively, one adjacent side of each of the two side plates (3) is fixedly connected with a fixed shaft (5), one adjacent end of each of the two fixed shafts (5) is fixedly connected with a clamping plate (6), one adjacent side of each of the two clamping plates (6) is provided with a clamping mechanism, the top of the base (1) is provided with a movable plate (10) close to the middle position of the rear side, the rear side of the movable plate (10) is provided with an adjusting mechanism, and the top of the movable plate (10) is provided with a vertical plate (11), just the bottom fixedly connected with second slider of riser (11), the second spout has been seted up at the top of fly leaf (10), just second slider swing joint is in second spout inner chamber, the front side of riser (11) is close to top fixedly connected with flat board (12), the right side fixedly connected with protecting crust (13) of flat board (12), just protecting crust (13) inner chamber right side fixedly connected with grinding motor (20), the power take off end fixedly connected with bull stick (14) of grinding motor (20), fixedly connected with second bearing is gone up in flat board (12), the left end of bull stick (14) runs through the second bearing inner chamber to fixedly connected with grinding dish (15).
2. The silicon wafer column processing apparatus for semiconductor production as set forth in claim 1, wherein: two one side that curb plate (3) kept away from mutually all is equipped with pneumatic cylinder (4), just the bottom and base (1) top fixed connection of pneumatic cylinder (4), two the power end of pneumatic cylinder (4) respectively with adjacent curb plate (3) fixed connection.
3. The silicon wafer column processing apparatus for semiconductor production as set forth in claim 1, wherein: the clamping mechanism comprises two pressing plates (7), the two pressing plates (7) are respectively positioned on one side, close to the center of the top of the base (1), of the clamping plate (6), the two pressing plates (7) are arranged up and down, the pressing plate (7) positioned at the bottom is fixedly connected with the clamping plate (6), a third sliding block is fixedly connected on one side, close to the clamping plate (6), of the pressing plate (7) positioned at the top, a third sliding groove is formed in one side, close to the center of the top of the base (1), of the clamping plate (6), the third sliding block is movably connected to an inner cavity of the third sliding groove, a third bearing is fixedly connected to the top of the pressing plate (7) positioned at the top, a first threaded rod (8) is inserted into an inner cavity of the third bearing, a fixed plate is fixedly connected to one side, close to the center of the top of the base (1), of the clamping plate (6), and a first threaded sleeve is fixedly connected to the fixed plate, the top of first threaded rod (8) runs through the inner chamber of first thread bush to fixedly connected with hand round (9).
4. The silicon wafer column processing apparatus for semiconductor production as set forth in claim 3, wherein: two arc fluting has all been seted up to the adjacent one side of clamp plate (7), just arc slotted inner chamber fixedly connected with slipmat.
5. The silicon wafer column processing apparatus for semiconductor production as set forth in claim 1, wherein: the adjusting mechanism comprises two straight plates, the two straight plates are fixedly connected to the rear side of the base (1) close to the left side and the right side respectively, first bearings are fixedly connected to the two straight plates, a supporting plate is fixedly connected to the rear side of the base (1) close to the right side, a servo motor (18) is fixedly connected to the left side of the supporting plate, a second threaded rod (19) is fixedly connected to the power output end of the servo motor (18), the left end of the second threaded rod (19) penetrates through the adjacent first bearings and is inserted into the inner cavities of the first bearings which are far away from each other, a second threaded sleeve is sleeved on the second threaded rod (19) close to the middle position, a fixed rod (16) is fixedly connected to the front side of the second threaded sleeve, a first rectangular slot is formed in the rear side of the transparent cover (2) close to the bottom, and the front end of the fixed rod (16) penetrates through the first rectangular slot, and is fixedly connected with the rear side of the movable plate (10).
6. The silicon wafer column processing apparatus for semiconductor production as set forth in claim 1, wherein: the rear side fixedly connected with T shape pole (17) of riser (11), the rear side of translucent cover (2) is close to intermediate position department and has seted up the second rectangle fluting, the second rectangle fluting is run through to the short one end of T shape pole (17) T shape structure to extend to the outside of translucent cover (2).
7. The silicon wafer column processing apparatus for semiconductor production as set forth in claim 1, wherein: the front side of translucent cover (2) is opened and is equipped with the opening, just the front side of translucent cover (2) is equipped with door (21) that matches each other with the opening, the left side of door (21) is equipped with two hinges, just door (21) are through two hinges and translucent cover (2) swing joint, the front side of translucent cover (2) is close to right side department fixedly connected with handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121921096.7U CN215510588U (en) | 2021-08-17 | 2021-08-17 | Silicon wafer cylinder processing equipment for semiconductor production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121921096.7U CN215510588U (en) | 2021-08-17 | 2021-08-17 | Silicon wafer cylinder processing equipment for semiconductor production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215510588U true CN215510588U (en) | 2022-01-14 |
Family
ID=79791508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121921096.7U Active CN215510588U (en) | 2021-08-17 | 2021-08-17 | Silicon wafer cylinder processing equipment for semiconductor production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215510588U (en) |
-
2021
- 2021-08-17 CN CN202121921096.7U patent/CN215510588U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205021385U (en) | Thyrite arrester list arc armour inner arc grinding burnishing device | |
| CN213166028U (en) | Blank trimming device for ceramic processing | |
| CN215510588U (en) | Silicon wafer cylinder processing equipment for semiconductor production | |
| CN213647048U (en) | Polishing equipment for ceramic processing | |
| CN111906546A (en) | Aluminum alloy cutting equipment with burring function | |
| CN107627216B (en) | A kind of intelligent grinding machine of the high safety performance based on Internet of Things | |
| CN203056781U (en) | Locomotive traction motor slot wedge chamfering device | |
| CN206186064U (en) | Deburring plastic grinding device for ceramic machining | |
| CN215847446U (en) | Surface grinding device is used in mould production | |
| CN211661740U (en) | Rotary grinding machine machining table | |
| CN211760792U (en) | Processing frock in waterproof ventilative power amplifier chamber | |
| CN204893091U (en) | Full -automatic edging machine's of diamond saw blade rotatory and two -sided grinding mechanism of saw bit | |
| CN208801147U (en) | A kind of device for the processing of pliers head front end face surface | |
| CN215547845U (en) | Workpiece positioning mechanism of grinding machine | |
| CN206689887U (en) | A kind of multi-functional drill milling boring grinding machine | |
| CN214265047U (en) | Cam disc grinding device | |
| CN220372890U (en) | Mechanical workpiece for production | |
| CN212145299U (en) | Turning and polishing integrated equipment for machining | |
| CN217372069U (en) | Sintering process jig | |
| CN108237492A (en) | A kind of wedge block drilled hole polishing clamping device | |
| CN216179048U (en) | Grinding device is used in processing of semiconductor spare part | |
| CN214109915U (en) | Polisher is used in die casting production | |
| CN217291822U (en) | Dull polish machine for composite reinforcement plate | |
| CN218592575U (en) | Polishing equipment for machining aluminum alloy box cover of high-voltage vacuum circuit breaker | |
| CN216991276U (en) | A external mold grinding device for hardware processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |