CN215509533U - Wafer adsorbs vacuum microscope carrier with backlight - Google Patents
Wafer adsorbs vacuum microscope carrier with backlight Download PDFInfo
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- CN215509533U CN215509533U CN202120433498.6U CN202120433498U CN215509533U CN 215509533 U CN215509533 U CN 215509533U CN 202120433498 U CN202120433498 U CN 202120433498U CN 215509533 U CN215509533 U CN 215509533U
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Abstract
The utility model provides a wafer adsorption vacuum carrier with a backlight source, which comprises a carrier base, wherein a vacuum plate is arranged on the carrier base, the vacuum plate is fixed with the carrier base through a fixing block, and the vacuum plate is used for bearing a wafer; a concave cavity used for containing an illumination light source is formed in the carrier base, the illumination light source is arranged in the concave cavity and is opposite to the vacuum plate, and the illumination light source is used for transmitting light to the wafer through the vacuum plate and providing a backlight source for the wafer; when the wafer adsorption vacuum carrying platform with the backlight source works, the vacuum grooves on the vacuum plate are vacuumized, the wafer to be cut is tightly adsorbed on the vacuum plate due to the air pressure difference, the wafer fixing reliability is guaranteed, meanwhile, the illumination light source can irradiate light rays on the wafer to be cut through the vacuum plate, so that the outline visual imaging effect of the wafer and the visual positioning precision during wafer cutting are improved, and finally the cutting quality of the wafer is improved.
Description
Technical Field
The utility model relates to the technical field of wafer cutting, in particular to a wafer adsorption vacuum carrying platform with a backlight source.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and the manufacturing of the silicon wafer requires highly accurate dicing of the wafer. Wafer dicing, also known as dicing, is the process of cutting each die of a wafer by a high speed rotating diamond blade or a fine laser beam. The wafer is usually cut by a special wafer cutting machine, and the precision requirement on the wafer cutting machine in the production process is very high because the spacing between the crystal grains is very small and the crystal grains are very fragile, and the crystal grains are easily damaged if the precision is not enough in the cutting process.
The wafer cutting carrying platform is an important component of the wafer cutting machine, and directly influences the cutting precision, so that the cutting precision of the wafer is influenced. Most of existing wafer cutting carrying tables adopt vacuum carrying tables, when the wafer cutting carrying tables are used, wafers are placed on the carrying tables to be subjected to vacuum adsorption, then vision positioning is carried out, and cutting is carried out according to the results of the vision positioning, so that the precision of the vision positioning directly influences the precision of wafer cutting, a light source is one of important factors influencing the precision of the vision positioning, and the irradiation effect of the light source on the wafer cutting carrying tables is improved, and the precision of the vision positioning can be improved. The light source of the existing vacuum carrying table for visual positioning only irradiates from the upper part of the carrying table, so that the irradiation effect of the light source is poor, the imaging effect of a wafer is not clear enough, the precision of the visual positioning during wafer cutting is influenced, and the cutting quality is not good enough, so that the existing wafer cutting carrying table needs to be improved in order to improve the cutting precision.
A double-side positioning wafer scribing machine (application number: CN 201822176535.0; publication number: CN209303907) disclosed in Chinese patent library comprises a machine platform carrier base, a hollow X/Y-axis two-dimensional platform, a lower CCD positioning component, a hollow DD rotating motor, a glass platform, a focusing mirror, a reflecting mirror, a laser light path component and an upper CCD positioning component, wherein the base is located at the top of the machine platform carrier base, the hollow X/Y-axis two-dimensional platform is arranged on the base, the lower CCD positioning component is arranged inside the hollow X/Y-axis two-dimensional platform, the hollow DD rotating motor is arranged at the hollow position of the hollow X/Y-axis two-dimensional platform, the glass platform with vacuum adsorption is arranged at the top of the hollow DD rotating motor, the focusing mirror is arranged above the glass platform carrier, the reflecting mirror is arranged above the focusing mirror, the laser light path component is arranged at the position opposite to a main working face of the reflecting mirror, and the upper CCD positioning component is arranged at the position opposite to an auxiliary working face of the reflecting mirror.
Above-mentioned two-sided location wafer scriber, CCD locating component is integrated in the design of an organic whole about through single unit equipment for the wafer product on the glass microscope carrier can realize two-sided location discernment, and can real-time supervision cutting track and the cutting contact ratio of constant head tank, nevertheless because the backlight is not installed to this glass microscope carrier, when the light source of visual location shines from top single direction, wafer profile visual imaging effect is clear inadequately, has influenced the precision of visual location and the cutting effect of wafer to a certain extent.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that when a light source of the existing wafer cutting carrying platform irradiates from a single direction, the outline visual imaging effect of a wafer on the carrying platform is not clear enough, the utility model provides a wafer adsorption vacuum carrying platform with a backlight source, which comprises a carrying platform base, wherein a vacuum plate is arranged on the carrying platform base, the vacuum plate is fixed with the carrying platform base through a fixing block, and the vacuum plate is used for bearing the wafer;
the wafer vacuum forming device comprises a carrying platform base, wherein a cavity for accommodating an illumination light source is formed in the carrying platform base, the illumination light source is installed in the cavity and back to the vacuum plate, and the illumination light source is used for irradiating light to the wafer through the vacuum plate.
Further, the cavity and the vacuum plate are cylindrical in shape.
Furthermore, the surface of the vacuum plate is provided with a plurality of annular grooves, and the centers of the annular grooves are the same and are positioned on the central axis of the vacuum plate.
Furthermore, a plurality of linear grooves and arc-shaped grooves are arranged between the circle center and the outermost circumference, every two linear grooves are distributed in a cross shape relative to the circle center, and every two arc-shaped grooves are distributed in a cross shape relative to the circle center.
Further, the height of the vacuum plate is matched with that of the fixing block.
Further, the outer diameter of the vacuum plate is equal to the inner diameter of the fixing block.
Further, the fixed block is hollow cylinder.
Further, the outer diameter of the fixed block is equal to the outer diameter of the cylindrical base.
Furthermore, the vacuum plate and the fixing block are both made of light-permeable materials.
Further, the illumination light source is an LED light source.
Compared with the prior art, the wafer adsorption vacuum carrying platform with the backlight source comprises a carrying platform base, wherein the illuminating light source is arranged in the concave cavity of the carrying platform base, and the illuminating light source can irradiate light rays on a wafer to be cut through the vacuum plate, so that the contour visual imaging effect of the wafer and the visual positioning precision during wafer cutting are improved, and the cutting quality of the wafer is finally improved; the vacuum plate is provided with a plurality of vacuum grooves for adsorbing the wafer, so that the adsorption is uniform and the adsorption force is large, no relative displacement between the wafer and the vacuum plate in the machining process is ensured, and the cutting quality is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a schematic perspective view of a wafer suction vacuum stage according to the present invention;
FIG. 2 is a schematic structural diagram of a wafer adsorption vacuum carrier according to the present invention;
reference numerals:
10 platform base 11 vacuum plate 12 fixed block
13 illumination light source 14 circular groove 15 linear groove
16 arc-shaped groove
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Specific examples are given below:
referring to fig. 1, a wafer adsorption vacuum stage with a backlight source includes a stage base 10, a vacuum plate 11 is disposed on the stage base 10, the vacuum plate 11 is fixed to the stage base 10 by a fixing block 12, and the vacuum plate 11 is used for bearing a wafer;
a cavity for accommodating an illumination light source 13 is formed in the stage base 10, the illumination light source 13 is installed in the cavity and faces away from the vacuum plate 11, and the illumination light source 13 is used for irradiating light to the wafer through the vacuum plate 11.
In specific implementation, referring to fig. 1, a vacuum plate 11 is disposed on a stage base 10, the vacuum plate 11 is fixed to the stage base 10 by a fixing block 12, and the vacuum plate 11 is used for bearing a wafer to be cut.
Preferably, the vacuum plate 11 is fixed to the fixing block 12 by screws; the fixed block 12 is connected with the stage base 10 through screws, the vacuum plate 11 is fixed above the stage base 10, if the upper surface of the vacuum plate 11 needs to be repaired or the vacuum plate 11 needs to be integrally replaced, the screws are only needed to be detached to replace the vacuum plate 11, and the detachment and the replacement are simple and convenient;
specifically, the vacuum plate 11 is cylindrical, and a plurality of vacuum grooves are uniformly distributed on the surface of the vacuum plate 11; when the wafer is loaded on the vacuum plate 11, the vacuum groove is vacuumized, the wafer can be tightly adsorbed and fixed on the vacuum plate 11 by utilizing the atmospheric pressure difference, the adsorption is uniform, the adsorption force is large, and no relative displacement between the wafer and the vacuum plate 11 is ensured in the processing process.
Preferably, the vacuum grooves include a plurality of circular grooves 14, the centers of the circular grooves 14 are the same and are located on the central axis of the vacuum plate 11, a plurality of linear grooves 15 and arc-shaped grooves 16 are arranged between the center of the circular groove 14 and the outermost circumference, the centers of the two linear grooves 15 are distributed in a cross shape, the centers of the two arc-shaped grooves 16 are distributed in a cross shape, and the linear grooves 15 and the arc-shaped grooves 16 intersect with the circular grooves 14 respectively and are distributed in a radial shape on the vacuum plate 11.
Preferably, the vacuum plate 11 and the fixing block 12 may be made of a transparent material such as glass, resin or PETG, and in order to ensure the strength of the vacuum plate 11 and the fixing block 12 and prevent the vacuum plate 11 from being damaged by the fixing block 12 during the wafer cutting operation, the vacuum plate 11 and the fixing block 12 are made of glass in this embodiment.
Referring to fig. 1, the outer diameter of a vacuum plate 11 is equal to the inner diameter of a fixing block 12; preferably, the height of the vacuum plate 11 is matched with that of the fixed block 12, the top end surface of the vacuum plate 11 and the top end surface of the fixed block 12 are positioned on the same horizontal plane, and the vacuum plate 11 is fixed on the inner side wall of the fixed block 12 through screws;
referring to fig. 2, the upper portion of the stage base 10 is a cylindrical base, and a cylindrical cavity for accommodating the illumination light source 13 is formed in the middle of the cylindrical base; an illumination light source 13 is arranged in the concave cavity, and the illumination light source 13 is opposite to the vacuum plate 11; the illumination light source 13 and the vacuum plate 11 are combined, the vacuum plate 11 is transparent, and the illumination light source 13 shines on the back of the wafer to be cut through the vacuum plate 11, so that the contour visual imaging effect of the wafer and the visual positioning precision during wafer cutting are improved, and the wafer cutting precision is further improved.
Preferably, the illumination light source 13 in this embodiment is an LED light source, which has high light emitting efficiency, short response time, and high safety and reliability.
The working principle is as follows: placing a platform base 10 on the ground or a workbench, installing an illumination light source 13 in a cylindrical concave cavity on the platform base 10, then connecting and fixing a vacuum plate 11 and a fixed block 11 through screws, then connecting the fixed block 12 and the platform base 10 through screws, and fixing the vacuum plate 11 above the platform base 10 to finish installation; when the wafer adsorption vacuum carrying platform provided by the utility model is used, a wafer to be cut is placed on the vacuum plate 11, then the power supply is turned on, the vacuum groove of the vacuum plate 11 is vacuumized, the wafer to be cut is tightly adsorbed on the vacuum plate 11 due to the air pressure difference, the adsorption is uniform and the adsorption force is large, no relative displacement between the wafer and the vacuum plate 11 is ensured in the processing process, and meanwhile, the illumination light source 13 generates light and irradiates the wafer through the vacuum plate 11, so that the outline visual imaging effect of the wafer is improved.
According to the wafer adsorption vacuum carrier with the backlight source, the vacuum plate is arranged on the carrier base, the vacuum plate is fixed with the carrier base through the fixing block, the carrier base is provided with the cavity for accommodating the illuminating light source, the illuminating light source is arranged in the cavity and can be used as the backlight source of the wafer, and light is irradiated on the wafer to be processed through the vacuum plate, so that the contour visual imaging effect of the wafer and the precision of visual positioning during wafer cutting are improved, and finally the cutting quality of the wafer is improved; the vacuum plate is provided with a plurality of vacuum grooves for adsorbing the wafer, so that the adsorption is uniform and the adsorption force is large, no relative displacement between the wafer and the vacuum plate in the machining process is ensured, and the cutting quality is further improved.
Although terms such as wafer, stage base, illumination source, vacuum plate, vacuum loop, fixed block, etc. are used more often herein, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (7)
1. The utility model provides a wafer adsorbs vacuum microscope carrier with backlight which characterized in that: the wafer carrying device comprises a carrying platform base (10), wherein a vacuum plate (11) is arranged on the carrying platform base (10), the vacuum plate (11) is fixed with the carrying platform base (10) through a fixing block (12), and the vacuum plate (11) is used for bearing a wafer;
a concave cavity used for accommodating an illumination light source (13) is formed in the carrier base (10), the illumination light source (13) is installed in the concave cavity and is back to the vacuum plate (11), and the illumination light source (13) is used for irradiating light to the wafer through the vacuum plate (11);
the cavity and the vacuum plate (11) are cylindrical; the surface of the vacuum plate (11) is provided with a plurality of annular grooves (14), the circle centers of the annular grooves (14) are the same and are positioned on the central axis of the vacuum plate (11);
a plurality of linear grooves (15) and arc-shaped grooves (16) are arranged between the circle center and the outermost circumference, every two linear grooves (15) are distributed in a cross shape relative to the circle center, and every two arc-shaped grooves (16) are distributed in a cross shape relative to the circle center.
2. The wafer suction vacuum stage with a backlight source as claimed in claim 1, wherein: the height of the vacuum plate (11) is matched with that of the fixing block (12).
3. The wafer suction vacuum stage with a backlight source as claimed in claim 2, wherein: the outer diameter of the vacuum plate (11) is equal to the inner diameter of the fixing block (12).
4. The wafer suction vacuum stage with a backlight source as claimed in claim 3, wherein: the vacuum plate (11) and the fixing block (12) are made of light-permeable materials.
5. The wafer suction vacuum stage with a backlight source as claimed in claim 4, wherein: the fixing block (12) is in a hollow cylindrical shape.
6. The wafer suction vacuum stage with a backlight source as claimed in claim 1, wherein: the outer diameter of the fixed block (12) is equal to the outer diameter of the carrier base (10).
7. The wafer suction vacuum stage with a backlight source as claimed in claim 1, wherein: the illumination light source (13) is an LED light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120433498.6U CN215509533U (en) | 2021-02-26 | 2021-02-26 | Wafer adsorbs vacuum microscope carrier with backlight |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120433498.6U CN215509533U (en) | 2021-02-26 | 2021-02-26 | Wafer adsorbs vacuum microscope carrier with backlight |
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| Publication Number | Publication Date |
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| CN215509533U true CN215509533U (en) | 2022-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120433498.6U Active CN215509533U (en) | 2021-02-26 | 2021-02-26 | Wafer adsorbs vacuum microscope carrier with backlight |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114750318A (en) * | 2022-05-20 | 2022-07-15 | 河北圣昊光电科技有限公司 | Scribing positioning device, scribing machine and positioning method |
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2021
- 2021-02-26 CN CN202120433498.6U patent/CN215509533U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114750318A (en) * | 2022-05-20 | 2022-07-15 | 河北圣昊光电科技有限公司 | Scribing positioning device, scribing machine and positioning method |
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