CN215500314U - Semiconductor wafer temperature control assembly with adjustable temperature control area - Google Patents

Abstract

The utility model relates to the technical field of solid transportation, and discloses a semiconductor wafer temperature control assembly with an adjustable temperature control area.

Description

Semiconductor wafer temperature control assembly with adjustable temperature control area

Technical Field

The utility model relates to the technical field of solid transportation, in particular to a semiconductor wafer temperature control assembly with an adjustable temperature control area.

Background

Electronic products such as mobile phones and the like are used as necessities of people at present, and the functions and the performances of the electronic products are rapidly developed and improved. Many people like to use mobile phones, tablets and other devices to play games, and the temperature of the electronic products is inevitably increased greatly when the games are played. After long-term use, the battery is easily worn out too fast, and even parts in electronic products are damaged. To the problem, some external radiators capable of quickly cooling the mobile phone appear in the market, and although the radiators can achieve the advantage of quickly cooling the mobile phone, the application scenarios of the radiators are limited, and especially the radiators cannot be well adapted to some tablet computers with large volumes.

SUMMERY OF THE UTILITY MODEL

In view of the defects in the prior art, an object of the present invention is to provide a semiconductor wafer temperature control assembly with an adjustable temperature control area, which is used to overcome the above-mentioned defects in the prior art.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a control by temperature change area adjustable semiconductor piece temperature control assembly, includes the organism, the equal slidable mounting in organism both sides has the fixed block, the fixed block with be connected with the extension spring between the organism, the extension spring provides and acts on the fixed block orientation elasticity that removes in the organism, organism one side is provided with the first semiconductor piece that is used for the cell-phone cooling, the opposite side of organism is provided with and is used for giving the radiating radiator unit of first semiconductor piece still includes:

a power module to provide power to operate a heat sink assembly and the first semiconductor;

the support assembly comprises a support body, a second semiconductor wafer for cooling is arranged on the support body, and a fixing groove for mounting the machine body is formed in the support body;

the fixed block is kept away from one side of organism all is provided with the adjustment tank, swing joint has the fixed plate in the adjustment tank, the one end of fixed plate is stretched out the adjustment tank, the fixed plate has horizontality and vertical state, works as when the fixed plate is in the vertical state, two can provide the clamping-force between the fixed plate so that will the organism is fixed in on the cell-phone, works as when the fixed plate is in the horizontality, the fixed plate can provide the joint force that acts on the fixed slot, so that the organism is fixed in the fixed slot, just power module provides the operation carry second semiconductor piece electric power.

As a further improvement of the utility model, a first insertion block is arranged at the bottom of the adjusting groove, a second insertion block is arranged at one side of the adjusting groove, when the fixing plate is in a vertical state, the fixing plate is clamped with the first insertion block, and when the fixing plate is in a horizontal state, the fixing plate is clamped with the second insertion block.

As a further improvement of the present invention, a first power distribution block and a second power distribution block are respectively disposed at both ends of the fixing plate, the first power distribution block is electrically connected to the second power distribution block, the second power distribution block is used for transmitting power for operating the second semiconductor wafer, the second insertion block is provided with a third power distribution block electrically connected to the power module, the third power distribution block is electrically connected to the first power distribution block, and the second power distribution block is electrically connected to the second semiconductor wafer when the fixing plate is in a horizontal state.

As a further improvement of the utility model, slide rails with opposite positions are arranged on two sides of the adjusting groove, and a rotating shaft with two ends connected with the slide rails in a sliding manner is arranged in the fixing plate.

As a further improvement of the utility model, the slide rail is in an inverted L shape.

As a further improvement of the present invention, the heat dissipation assembly includes a cooling cavity disposed in the housing, the cooling cavity includes an air outlet end and an air inlet end, a fan and a heat dissipation plate are disposed in the cooling cavity, the heat dissipation plate abuts against the first semiconductor chip, and the fan is mounted on a side of the heat dissipation plate away from the first semiconductor chip.

As a further improvement of the utility model, a plurality of fins for heat dissipation are arranged on the heat dissipation plate.

As a further improvement of the utility model, the air inlet end and the air outlet end are both provided with a stop lever.

As a further development of the utility model, the power module comprises a battery for providing electrical energy.

As a further improvement of the present invention, the power module includes a charging port provided at a side of the body, the charging port being electrically connected to the battery.

The utility model has the beneficial effects that: the fixing block is provided with the fixing plate capable of adjusting the position, two states are realized through the arrangement of the fixing plate, in the vertical state, the length direction of the fixing plate is perpendicular to the machine body, and one end of the fixing plate extends out of the adjusting groove, so that a clamping space can be formed to clamp the machine body on the mobile phone, in the horizontal state, the length direction of the fixing plate is horizontal to the machine body, and in order to clamp the machine body into the fixing groove, one end of the fixing plate extending out of the adjusting groove cannot extend out of the notch of the fixing groove, so that the installation of the tablet personal computer on the support body cannot be influenced.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic view of the internal front view of FIG. 1 in accordance with the present invention;

FIG. 3 is a rear view of the present invention as shown in FIG. 1;

FIG. 4 is an enlarged, partial bottom cross-sectional view of the anchor block of FIG. 1 in accordance with the present invention;

FIG. 5 is a schematic structural view of a stent assembly of the present invention;

FIG. 6 is a side view of the utility model of FIG. 5;

fig. 7 is a rear view of the stent body of the present invention.

Reference numerals: 1. a body; 11. a cooling cavity; 2. a pushing assembly; 21. a fixed block; 22. a drive member; 221. a hinged lever; 23. a button; 231. buckling; 24. an extension rod; 241. a connecting spring; 242. a clamping block; 25. a tension spring; 31. a fixing plate; 32. a first power distribution block; 33. a rotating shaft; 34. an open slot; 35. a second power distribution block; 36. a slide rail; 37. an adjustment groove; 38. pushing the plate; 39. a groove; 40. a small spring; 41. a second insert block; 42. a third power distribution block; 44. a first insert block; 5. a heat dissipating component; 51. an air outlet end; 52. a fan; 53. a gear lever; 54. an air inlet end; 55. a fin; 56. a heat dissipation plate; 57. a first semiconductor chip; 58. a second semiconductor wafer; 6. a bracket assembly; 61. a stent body; 62. a support leg; 63. and fixing the grooves.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "bottom" and "top," "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.

The semiconductor wafer temperature control assembly with the adjustable temperature control area comprises a machine body 1, wherein fixed blocks 21 are slidably mounted on two sides of the machine body 1, a tension spring 25 is connected between each fixed block 21 and the machine body 1, the tension spring 25 provides elastic force acting on the fixed blocks 21 to move towards the machine body 1, the distance between the two fixed blocks 21 can be adjusted by the movement of the fixed blocks 21 and the elastic force of the tension spring 25, so that mobile phones with different sizes can be adapted, a first semiconductor wafer 57 used for cooling the mobile phones is arranged on one side of the machine body 1, and a heat dissipation assembly 5 used for dissipating heat of the first semiconductor wafer 57 is arranged on the other side of the machine body 1. according to the semiconductor wafer temperature control assembly, the mobile phones can be effectively cooled by the built-in first semiconductor wafer 57, and the semiconductor wafer temperature control assembly has the advantages of being equivalent to active temperature reduction, cooling is performed on the mobile phones by self-generated cold energy, and is arranged by the heat dissipation assembly 5, the heat end of the semiconductor chip can be effectively radiated, so that the requirement of long-term continuous use is met;

a power module for providing power to operate the heat sink assembly 5 and the first semiconductor;

the bracket assembly 6 comprises a bracket body 61, wherein the bracket body 61 is provided with a second semiconductor wafer 58 for cooling, the bracket body 61 is provided with a fixing groove 63 for installing the machine body 1, the machine body 1 can be well placed in the fixing groove 63 through the arrangement of the fixing groove 63, and meanwhile, the bracket body 61 is provided with the second semiconductor wafer 58 for cooling, so that the heat dissipation area is well changed, and the bracket assembly 6 also has good adaptive capacity for large electronic products such as a tablet computer and the like;

the side of the fixed block 21 far away from the body 1 is provided with an adjusting groove 37, the adjusting groove 37 is movably connected with a fixed plate 31, one end of the fixed plate 31 extends out of the adjusting groove 37, the fixed plate 31 has a horizontal state and a vertical state, when the fixed plate 31 is in the vertical state, a clamping force can be provided between the two fixed plates 31 to fix the body 1 on the mobile phone, when the fixed plate 31 is in the horizontal state, the fixed plate 31 can provide a clamping force acting on the fixed groove 63 to fix the body 1 in the fixed groove 63, and the power module provides power for operating and lifting the second semiconductor wafer 58, the utility model arranges the fixed plate 31 capable of adjusting the position on the fixed block 21, and realizes two states by the arrangement of the fixed plate 31, in the vertical state, the length direction of the fixed plate 31 is vertical to the body 1, and one end of the fixed plate 31 extends out of the adjusting groove 37, therefore, a clamping space can be formed to clamp the body 1 on the mobile phone, when the mobile phone is in a horizontal state, the length direction of the fixing plate 31 is horizontal to the body 1, so that when the body 1 is clamped into the fixing groove 63, one end, extending out of the adjusting groove 37, of the fixing plate 31 cannot extend out of a notch of the fixing groove 63, and the installation of the tablet personal computer on the support body 61 cannot be influenced.

Specifically, when the body 1 is mounted in the fixing groove 63, the first semiconductor wafer 57 is located at the notch of the fixing groove 63 and is in the same plane as the second semiconductor wafer 58.

Specifically, the two fixing plates 31 are covered with anti-slip layers on the opposite surfaces in the vertical state, so that the friction force in the process of clamping the mobile phone is effectively increased.

Specifically, the first semiconductor fin 57 and the second semiconductor fin 58 are both made of an N-type semiconductor material and a P-type semiconductor material, and when a current passes through a thermocouple pair formed by combining the N-type semiconductor material and the P-type semiconductor material, heat transfer occurs between the two ends, and the heat is transferred from one end to the other end, so that a temperature difference is generated to form a cold end and a hot end. The cold ends of the first semiconductor and the second semiconductor are both used for one side face which is tightly attached to the mobile phone or the tablet computer.

In one embodiment, the bottom of the adjusting groove 37 is provided with a first insertion block 44, one side of the adjusting groove 37 is provided with a second insertion block 41, when the fixing plate 31 is in a vertical state, the fixing plate 31 is engaged with the first insertion block 44, and when the fixing plate 31 is in a horizontal state, the fixing plate 31 is engaged with the second insertion block 41, because the fixing plate 31 is movably connected with the adjusting groove 37, and through the arrangement of the first insertion block 44 and the second clamping block 242, the fixing force of the fixing plate 31 in the vertical state and the horizontal state can be effectively increased.

Specifically, an opening groove 34 may be formed at an end of the fixing plate 31 located in the adjusting groove 37, and the fixing plate is clamped with the first insertion block 44 and the second insertion block 41 through the opening groove 34.

Furthermore, one side of the adjusting groove 37 is recessed to form a groove 39, the second insert block 41 is fixed in the groove 39, the size of the groove 39 is consistent with that of the end of the fixing plate 31 provided with the opening groove 34, so that the fixing plate 31 can be inserted into the groove 39, meanwhile, the second insert block 41 can also be inserted into the opening groove 34, and therefore a mutual clamping effect is formed, and the fixing effect of the fixing plate 31 is enhanced.

Furthermore, a push plate 38 is arranged at the opening of the groove 39, a plurality of small springs 40 are connected between the push plate 38 and the bottom of the groove 39, and the small springs 40 provide elastic force for driving the push plate 38 to move to the groove opening of the groove 39, so that the small springs 40 can provide certain elastic force when the machine body 1 is mounted on the support body 61, the pressure of the fixing plate 31 towards the side wall of the fixing groove 63 is increased, and the clamping force between the machine body 1 and the support body 61 is enhanced.

In one embodiment, the fixing plate 31 is provided at both ends thereof with a first power distribution block 32 and a second power distribution block 35, respectively, the first power distribution block 32 is electrically connected to the second power distribution block 35, the second power distribution block 35 is used to transmit power for operating the second semiconductor wafer 58, the second insert block 41 is provided with a third power distribution block 42 electrically connected to the power module, the third power distribution block 42 is electrically connected to the first power distribution block 32, and the second power distribution block 35 is electrically connected to the second semiconductor wafer 58 when the fixing plate 31 is in a horizontal state, and the power of the power source can be efficiently transmitted to the second semiconductor in the rack by the arrangement of the first power distribution block 32, the second power distribution block 35, and the third power distribution block 42.

Specifically, the side of the fixing groove 63 is provided with a contact point for contacting and conducting electricity with the second power distribution block 35, and the contact point is electrically connected with the second semiconductor block.

Specifically, the first power distribution block 32 may be disposed inside the opening groove 34, and the length of the first power distribution block 32 is slightly longer, so that it is ensured that the first power distribution block 32 and the second power distribution block 35 are always in contact with each other to be electrified during the sliding process between the opening groove 34 and the second insertion block 41, thereby ensuring the stability of the electrification.

In one embodiment, the two sides of the adjusting slot 37 are provided with slide rails 36 at opposite positions, and the fixing plate 31 is provided with a rotating shaft 33 with two ends slidably connected with the slide rails 36, so that the fixing plate 31 can slide and can rotate to form a horizontal state and a vertical state.

In one embodiment, the slide rail 36 is in an inverted "L" shape, which has the advantage that two sections of the slide rail 36 perpendicular to each other can be formed, so that the first insertion block 44 and the second insertion block 41 can be inserted into the fixing plate 31 in different states.

In one embodiment, the heat dissipation assembly 5 includes a cooling cavity 11 built in the machine body 1, the cooling cavity 11 includes an air outlet end 51 and an air inlet end 54, a fan 52 and a heat dissipation plate 56 are built in the cooling cavity 11, the heat dissipation plate 56 abuts against the first semiconductor sheet 57, the fan 52 is installed on one side of the heat dissipation plate 56 far away from the first semiconductor sheet 57, and through the arrangement of the heat dissipation assembly 5, the hot end of the first semiconductor sheet 57 can be effectively dissipated, so that the heat dissipation efficiency and the durability of heat dissipation are improved.

Specifically, the air outlet end 51 may be disposed on one side of the body 1 away from the first semiconductor chip 57, and the air inlet end 54 may be disposed on both sides of the body 1, so that the blown hot air is not blown to the mobile phone and the user's hand.

Specifically, a plurality of fins 55 for heat dissipation are mounted on the heat dissipation plate 56, and by the arrangement of the fins 55, when air enters the cooling cavity 11, the area of contact with the air is increased, so that the heat dissipation efficiency is improved.

Referring to fig. 1, a blocking rod 53 is installed at each of the air inlet end 54 and the air outlet end 51, and fingers can be effectively prevented from entering the cooling chamber 11 by the blocking rod 53, so that the fingers can be prevented from being cut by the fan 52.

Specifically, the backside of the rack is also provided with a heat sink assembly 5 for dissipating heat from the second semiconductor wafer 58.

Specifically, the bracket assembly 6 further includes a supporting leg 62, the supporting leg 62 and the bracket body 61 can be connected in an articulated or detachable manner, the supporting leg 62 is used for providing a supporting force for fixing the bracket body 61 at a certain angle, and the supporting leg 62 and the bracket body 61 can be detachably connected, so that the bracket body 61 can be taken down separately for holding.

Specifically, the bottom of the bracket body 61 may be provided with an extension block for placing and fixing the tablet computer.

In one embodiment, the power module comprises a battery for providing electric energy, and a certain duration can be effectively provided by the arrangement of the battery to dissipate heat of the mobile phone.

In one embodiment, the power module includes a charging port disposed at one side of the body 1, the charging port is electrically connected to the battery, after the battery is consumed, further heat dissipation can be achieved through the charging port, meanwhile, when the second semiconductor chip 58 is started, power consumption can be greatly increased, and long-time use can be achieved through charging of the charging port.

Specifically, the fixing groove 63 penetrates the support body 61 from front to back, and the charging port is formed in the side face of the air outlet end 51 of the fan 52 in the machine body 1, so that the charging can be facilitated when the machine body 1 is installed on the support body 61.

Specifically, the charging port may be a universal interface such as USB or USB-C.

In one embodiment, still include a plurality of pushing assemblies 2, pushing assemblies 2 include button 23, button 23 movable mounting is on organism 1, button 23 one end stretches out organism 1, the other end gets into in the organism 1, button 23 is located and is installed the driving piece 22 that is used for driving fixed block 21 to stretch out organism 1 in the organism 1, in the in-service use process, generally need two manual pulls out two fixed blocks 21, and in the process of pulling out, be difficult to the organism 1 and load on the cell-phone, and during the pulling, because the operation is improper and the application of power is inaccurate, cause the problem of fixed block 21 damage. The button 23 is arranged, so that the fixed block 21 can conveniently extend out of the machine body 1, and the force exerted on the fixed block 21 is stable, so that the fixed block 21 is not easily damaged;

specifically, the button 23 is slidably connected to the body 1, and pressing the button 23 can move the button 23 toward the inside of the body 1.

In one embodiment, the pushing assembly 2 further includes an extension rod 24, the extension rod 24 is slidably mounted on the body 1, one end of the extension rod 24 can penetrate through the side surface of the body 1 where the first semiconductor chip 57 is mounted, the other end of the extension rod 24 is located in the body 1 and is mounted with a fixture block 242 for being clamped with the button 23, a connection spring 241 is disposed between the extension rod 24 and the body 1, the connection spring 241 provides an elastic force acting on one end of the extension rod 24 to extend out of the body 1, so that the fixture block 242 is separated from the button 23, such that the button 23 can be pressed to the maximum stroke during each use, so that the fixture block 242 is clamped with the button 23, so that the fixing block 21 can be always in a growth state, and then when the body 1 is mounted on a mobile phone, the extension rod 24 can be pressed and driven to move toward the inside of the body 1, so as to separate the fixture block 242 from the button 23, like this fixed block 21 is under the effect of extension spring 25, with the cell-phone centre gripping, the operation will pull open fixed block 21 like this and pull out and separate into two independent stages with organism 1 joint for the in-process of installation is more convenient also simpler.

Specifically, one end of the button 23 located on the machine body 1 is bent to form a buckle 231 engaged with the latch 242.

Specifically, the latch 242 is hooked and can be clamped with the latch 231, and the latch 231 and the latch 242 are clamped together by deformation force of the latch 231 and the latch 231 during clamping.

In one embodiment, the driving member 22 is a hinge rod 221, one end of the hinge rod 221 is hinged to the fixed block 21, and the other end of the hinge rod 221 is hinged to the button 23, so that the pressing force of the button 23 pressing down can be converted into a moving force pushing the fixed block 21 out of the machine body 1 through the hinge rod 221.

In one embodiment, the pushing assemblies 2 are provided in four groups, and two groups of pushing assemblies 2 are mounted on two sides of the two fixing blocks 21, so that the advantage of this arrangement is that when the button 23 is pressed, part of the force of the two buttons 23 acting on the fixing block 21 forms an acting force and a reacting force, so that the fixing block 21 is not easily deviated in the process of extending out of the machine body 1.

The working principle is as follows: when the temperature of the mobile phone needs to be reduced, the button 23 is manually pressed firstly, so that the fixing block 21 is driven to extend out of the mobile phone body 1 through the hinge rod 221, the clamping block 242 is clamped with the clamping buckle 231 in the process, the fixing block 21 is always in an extending state, then one side of the first semiconductor sheet 57 is aligned with the mobile phone, then the mobile phone body 1 is moved to the back side of the mobile phone, in the process, the mobile phone gives pressure to one end, extending out of the mobile phone body 1, of the extension rod 24, so that the extension rod 24 is driven to move towards the inner side of the mobile phone body 1, the connecting spring 241 is compressed, the clamping buckle 231 is separated from the opening block, the tension spring 25 is reset to reset the fixing block 21, the mobile phone is clamped through the fixing plate 31, then the fan 52 and the first semiconductor sheet 57 are opened, and the temperature of the mobile phone is reduced;

when the tablet personal computer needs to be cooled, the fixing plate 31 is manually pulled upwards to separate the first insertion block 44 from the opening groove 34, then the opening groove 34 and the first insertion block 44 are separated, then the fixing plate 31 and the rotating shaft 33 are driven to move along the sliding rail 36, when the rotating shaft 33 moves to the top of the sliding rail 36, the fixing plate 31 is rotated to enable the fixing plate 31 to be flush with the fixing block 21, then the fixing plate 31 is clamped into the second insertion block 41, then the machine body 1 is clamped into the fixing groove 63, the fixing plate 31 moves towards the groove 39 for a certain distance along the second insertion block 41 during the second time, at the moment, the push plate 38 and the small spring 40 are compressed, so that extrusion force towards the side wall of the fixing groove 63 is given to the fixing plate 31, and therefore the fixing effect is improved, at the moment, the third power distribution block 42, the first power distribution block 32, the second power distribution block 35 and the contacts arranged on the side wall of the fixing groove 63 are electrically connected, so that power can be supplied to the second semiconductor wafer 58 to complete the adjustment of the cooling area.

The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the utility model may occur to those skilled in the art without departing from the principle of the utility model, and are considered to be within the scope of the utility model.

Claims (10)

1. The utility model provides a control by temperature change area adjustable semiconductor wafer temperature control assembly, includes organism (1), the equal slidable mounting in organism (1) both sides has fixed block (21), fixed block (21) with be connected with extension spring (25) between organism (1), extension spring (25) provide and act on fixed block (21) orientation the elasticity of organism (1) removal, its characterized in that: organism (1) one side is provided with first semiconductor piece (57) that are used for cooling for the cell-phone, the opposite side of organism (1) is provided with and is used for giving radiating radiator unit (5) of first semiconductor piece (57), still includes:

a power module for providing power to operate a heat sink assembly (5) and the first semiconductor;

the support assembly (6), the support assembly (6) comprises a support body (61), a second semiconductor wafer (58) for cooling is arranged on the support body (61), and a fixing groove (63) for installing the machine body (1) is arranged on the support body (61);

keep away from fixed block (21) one side of organism (1) all is provided with adjustment tank (37), swing joint has fixed plate (31) in adjustment tank (37), the one end of fixed plate (31) is stretched out adjustment tank (37), fixed plate (31) have horizontality and vertical state, work as when fixed plate (31) are in vertical state, two can provide the clamping-force between fixed plate (31) so that will organism (1) is fixed in on the cell-phone, works as when fixed plate (31) are in the horizontal state, fixed plate (31) can provide the joint power who acts on fixed slot (63), so that organism (1) is fixed in fixed slot (63), just the electric power module provides the operation second semiconductor wafer (58) electric power.

2. The temperature control assembly of claim 1, wherein: adjusting groove (37) bottom is provided with first inserted block (44), one side of adjusting groove (37) is provided with second inserted block (41), works as when fixed plate (31) is in the vertical state, fixed plate (31) with first inserted block (44) joint, works as when fixed plate (31) is in the horizontality, fixed plate (31) with second inserted block (41) joint.

3. The temperature control assembly of claim 2, wherein: the two ends of the fixing plate (31) are respectively provided with a first power distribution block (32) and a second power distribution block (35), the first power distribution block (32) is electrically connected with the second power distribution block (35), the second power distribution block (35) is used for transmitting the power for operating the second semiconductor wafer (58), the second insertion block (41) is provided with a third power distribution block (42) electrically connected with the power module, when the fixing plate (31) is in a horizontal state, the third power distribution block (42) is electrically connected with the first power distribution block (32), and the second power distribution block (35) is electrically connected with the second semiconductor wafer (58).

4. The temperature control assembly of claim 1, wherein: the two sides of the adjusting groove (37) are provided with slide rails (36) with opposite positions, and a rotating shaft (33) with two ends connected with the slide rails (36) in a sliding manner is arranged in the fixing plate (31).

5. The temperature control assembly of claim 4, wherein: the slide rail (36) is in an inverted L shape.

6. The temperature control assembly of claim 1, wherein: radiating component (5) including place in cooling chamber (11) in organism (1), cooling chamber (11) are including air-out end (51) and air inlet end (54), cooling chamber (11) embeds there are fan (52) and heating panel (56), heating panel (56) with first semiconductor piece (57) butt, fan (52) install in heating panel (56) are kept away from one side of first semiconductor piece (57).

7. The temperature control assembly of claim 6, wherein: the heat dissipation plate (56) is provided with a plurality of fins (55) for heat dissipation.

8. The temperature control assembly of claim 6, wherein: the air inlet end (54) and the air outlet end (51) are both provided with a stop lever (53).

9. The temperature control assembly of claim 1, wherein: the power module includes a battery that provides electrical energy.

10. The temperature control assembly of claim 9, wherein: the power module comprises a charging port arranged on one side of the machine body, and the charging port is electrically connected with the battery.

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