CN215499087U

CN215499087U - Speaker module and electronic equipment

Info

Publication number: CN215499087U
Application number: CN202121129670.5U
Authority: CN
Inventors: 张怀省
Original assignee: Goertek Inc
Current assignee: Goertek Inc
Priority date: 2021-05-25
Filing date: 2021-05-25
Publication date: 2022-01-11
Anticipated expiration: 2031-05-25

Abstract

The utility model relates to the technical field of electroacoustic, and particularly discloses a loudspeaker module and electronic equipment, which comprise a metal shell and a metal shell, wherein the metal shell is provided with an accommodating groove, the shell comprises an upper cover plate provided with an opening and a side plate arranged around the periphery of the upper cover plate, and the periphery of the side plate is bent outwards to form a flanging; the loudspeaker monomer is positioned in the accommodating groove and is arranged at the opening; the flanging is connected with the periphery of the isolation net in a sealing mode, and the isolation net, the shell and the loudspeaker single body jointly define a filling space for filling sound-absorbing particles. This application has realized that the sound granule is inhaled in full filling, has improved the acoustics performance of speaker module greatly.

Description

Speaker module and electronic equipment

Technical Field

The utility model relates to the technical field of electroacoustic, and particularly discloses a loudspeaker module and electronic equipment.

Background

Along with the frivolous design of electronic equipment, the space that speaker module can occupy in electronic equipment also is more and more littleer, and the plastic class is chooseed for use to the casing material of traditional speaker module, and the wall thickness need reach more than 0.35mm, and the wall thickness of casing occupies electronic equipment's space great, if the casing further reduces, the rigidity and the intensity of plastic all can not reach the module requirement, and speaker module can produce the resonance sound on the one hand, and on the other hand can't satisfy the standard that the reliability falls the test.

In addition, the filling space of the speaker module of the related art is very limited, and the acoustic performance of the speaker module cannot be further improved.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a speaker module and an electronic device, which solve at least one of the problems described above.

In order to achieve the above object, the present invention provides a speaker module, including:

the metal shell is provided with an accommodating groove and comprises an upper cover plate with an opening and a side plate arranged around the periphery of the upper cover plate, and the periphery of the side plate is bent outwards to form a flanging;

the loudspeaker monomer is positioned in the accommodating groove and is arranged at the opening;

the flanging is connected with the periphery of the isolation net in a sealing mode, and the isolation net, the shell and the loudspeaker single body jointly define a filling space for filling sound-absorbing particles.

The utility model further provides electronic equipment which comprises a first component, a second component and the loudspeaker module, wherein the first component and the second component are matched with the shell to form a front cavity and a rear cavity of the loudspeaker module.

In addition, the speaker module of the present invention may have the following additional features.

According to one embodiment of the present invention, one side of the upper cover plate is recessed downward to form a sound guide groove, and the opening is communicated with the sound guide groove.

According to one embodiment of the utility model, the separation net is a mesh cloth, first foam is arranged around the periphery of the mesh cloth, and the separation net is bonded with the flanging.

According to one embodiment of the utility model, the speaker unit is bonded to the separation net.

According to one embodiment of the utility model, the separation net is a foam board or a metal board.

According to one embodiment of the utility model, the speaker unit is provided with a leakage hole, and the leakage hole is provided with an air-permeable piece.

According to one embodiment of the utility model, the upper cover plate is provided with a filling hole communicated with the filling space, and the filling hole is covered with a sealing cover plate.

According to one embodiment of the utility model, the first component is a middle frame, the housing is butted with the inner surface of the middle frame, and the first component, the speaker monomer and the inner surface of the middle frame jointly define the front cavity.

According to one embodiment of the utility model, the shell and the inner surface of the middle frame are connected in a sealing mode through second foam.

Compared with the prior art, the utility model has the following beneficial effects:

1. the filling space is defined by the isolation net, the shell and the loudspeaker monomer, so that the full filling design of sound absorption particles is realized, and the low-frequency acoustic performance of the loudspeaker module is effectively improved;

2. the shell is made of metal materials, and compared with a traditional injection molding piece, the wall thickness of the shell is reduced to be below 0.2mm, the volume occupancy rate of materials is reduced by nearly one time, and the strength and the reliability of the loudspeaker module are obviously improved; in addition, the thinner shell can increase the volume of the filling space, thereby enlarging the filling space of the sound-absorbing particles and improving the acoustic performance;

3. this application uses the part among the electronic equipment to inject front chamber and back chamber as speaker module's partly, greatly reduced speaker module's Z to the size, improved speaker module's acoustic performance.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a perspective view of a speaker module according to an embodiment of the present application;

FIG. 2 is a schematic structural view of the speaker module shown in FIG. 1 before being assembled with a first component;

fig. 3 is a perspective view of a speaker module according to an embodiment of the present application;

FIG. 4 is a schematic structural view of the module of FIG. 3 prior to assembly with the first component;

FIG. 5 is an exploded view of FIG. 2;

FIG. 6 is a top view of a speaker module according to an embodiment of the present application;

FIG. 7 is a cross-sectional view of FIG. 6 at A-A;

FIG. 8 is a cross-sectional view of FIG. 6 at B-B;

fig. 9 is a top view of the speaker module of fig. 1 assembled with a first component;

FIG. 10 is a cross-sectional view of FIG. 9 at C-C;

fig. 11 is a cross-sectional view of fig. 9 at D-D.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

A speaker module 100 according to some embodiments of the present invention is described below with reference to fig. 1-11.

The present invention provides a speaker module 100, where the speaker module 100 can be applied to electronic devices such as electronic devices, flat panels, and audio devices, and the present embodiment takes the electronic devices as an example for illustration.

Referring to fig. 1 to 5, the speaker module 100 may include: the loudspeaker comprises a metal shell 10, a loudspeaker single body 11, an isolation net 12 and a flexible printed circuit board 13, wherein the shell 10 is provided with a containing groove, the shell 10 comprises an upper cover plate 102 provided with an opening 101 and a side plate 103 arranged around the periphery of the upper cover plate 102, and the periphery of the side plate 103 is bent outwards to form a flange 104; the speaker unit 11 is positioned in the accommodating groove and is installed at the opening 101; the flange 104 is hermetically connected with the periphery of the isolation net 12, and the isolation net 12, the shell 10 and the speaker unit 11 together define a filling space for filling the sound-absorbing particles.

Specifically, this embodiment defines the filling space through spacer 12, casing 10 and speaker monomer 11 jointly, has realized inhaling the full filling design of sound granule, has effectively improved the low frequency acoustic performance of speaker module 100.

It should be noted that, with continued reference to fig. 5, the separation net 12 may be a mesh cloth, a circle of the first sealing foam 14 is disposed around the separation net 12, and the separation net 12 may be bonded to the flange 104. Specifically, the first sealing foam 14 has a series of characteristics of light weight, ultra-thin volume, reliable performance and the like, and can improve the sealing performance of the speaker module and improve the acoustic performance.

In this embodiment, with continued reference to fig. 5, the upper cover plate 102 defines a filling aperture 105 in communication with the filling space, and the filling aperture 105 is covered by the sealing cover plate 15. In actual assembly process, will inhale the sound granule through filling hole 105 and fill in irritating the powder space, sealed apron 15 can prevent to inhale the sound granule and reveal in irritating the powder space, guarantee the stability and the reliability of speaker module 100 work.

In this embodiment, with continued reference to fig. 5-7, the upper cover plate 102 can interface with the first component 200 of the electronic device and can define a front cavity 106 with the speaker unit 11 and the first component 200, with the opening 101 communicating with the front cavity 106. It should be noted that, an existing speaker module usually has a separate front cavity structure, that is, a closed front cavity is directly formed on the speaker module by installing a housing or integrally forming. However, when the electronic device is integrally assembled, the speaker module is mounted inside the housing of the electronic device and is often in contact with the housing or other structures. The housing forming the front chamber forms two layers of housing walls with other structures, occupying a large amount of space. Compared with the prior art, in the speaker module 100 provided by the present invention, the housing 10 in this embodiment is provided with the opening 101, a part of the cavity wall of the housing 10 for forming the front cavity 106 is omitted, and the part of the housing 10 where the cavity wall is omitted is in fit and butt joint with the first component 200 of the electronic device, and forms the complete front cavity 105 together with the speaker unit 11. Therefore, the speaker module 100 provided by the present invention uses the space occupied by the removed cavity wall as the internal space of the front cavity 106, so that the Z-direction size of the speaker module 100 is greatly reduced, and the overall appearance and volume of the electronic device are not affected while the volume of the front cavity 106 is increased.

Further, in the present embodiment, with continued reference to fig. 5, the electronic device may be an electronic device, the speaker module 100 is installed in the electronic device, and the first component 200 may be a middle frame. The upper cover plate 102 interfaces with the inner surface of the center frame. In this way, the housing 10, the middle frame and the speaker unit 11 together form a complete, closed front cavity 106. In the embodiment, the middle frame is an indispensable component in the electronic device, and the middle frame replaces part of the upper cover plate 102 to form a part of the front cavity 105, so that the space occupied by the front cavity 106 formed by the upper cover plate 102 is saved, and the volume of the front cavity 106 is increased. In other embodiments of the utility model, the component may be a circuit board. The circuit board is a part of the front cavity 106 and is matched and butted with the upper cover plate 102 to form a closed front cavity 106.

It should be noted that, the embodiment is only described by taking the middle frame as an example, but the utility model is not limited thereto, and the first component 200 may also be other components in the electronic device, and those skilled in the art may flexibly select the components according to actual needs.

It is worth mentioning that in some embodiments of the present invention, with continued reference to fig. 5, 9-10, the first blister 14 interfaces with the second component 300 of the electronic device to form the closed back volume 107. Specifically, the housing 10, the second member 300 and the speaker unit 11 together define a sealed rear chamber 107 when assembled.

The rear chamber 107 in this embodiment is the same as the open front chamber 106, and the existing speaker module usually has a separate rear chamber structure, i.e. a closed rear chamber is directly formed on the speaker module by installing a lower shell or integrally forming. However, when the electronic device is integrally assembled, the speaker module is mounted inside the housing of the electronic device and is often in contact with the housing or other structures. The lower shell forming the back cavity and other structures form two shell walls, which occupy a large amount of space. Compared with the prior art, the speaker module 100 provided by the utility model has the advantages that the rear cavity 107 is open, a lower shell for forming the rear cavity 107 is omitted, and the flange 104 is in matched butt joint with the second component 300 of the electronic device through the first sealing foam 14 to form the complete sealed rear cavity 107 together with the speaker unit 11. Therefore, the speaker module 100 provided by the utility model uses the space occupied by the removed lower shell as the internal space of the rear cavity 107, thereby greatly reducing the Z-direction size of the speaker module 100, and not influencing the overall appearance and volume of the electronic equipment while increasing the volume of the rear cavity 107.

Further, in this embodiment, with continued reference to fig. 5 and 10, the second component 300 may be a motherboard or a motherboard protection cover. The flange 104 is in abutment with the inner surface of the main plate or main plate boot. In this way, the housing 10, the main board or main board cover and the speaker unit 11 together form a complete, sealed rear chamber 107. In this embodiment, the main board or the main board protection cover is also an indispensable component in the electronic device, and the main board or the main board protection cover replaces the lower case to constitute a part of the rear cavity 107, so that the space occupied by the rear cavity 107 constituted by the lower case is saved, and the volume of the rear cavity 107 is increased.

It should be noted that, in the present embodiment, only the motherboard or the motherboard protection cover is taken as an example for description, but the present invention is not limited thereto, and the second component 300 may also be other components in the electronic device, and those skilled in the art may flexibly select the components according to actual needs.

In other embodiments of the present invention, the separation net 12 may be made of a metal plate, such as steel, iron, copper, etc., that is, the metal plate may be directly used as the lower shell, and compared with the conventional injection molded part, the shell 10 and the lower shell in this embodiment are made of a metal material, the wall thickness of the shell 10 and the wall thickness of the lower shell made of a metal material may be processed to be less than 0.2mm, and the strength of the shell 10 and the wall thickness of the lower shell may also be ensured. Thus, on the one hand, the volume occupancy rate of the speaker module 100 can be reduced by nearly one time, and on the other hand, the strength and reliability of the speaker module 100 can be improved. Furthermore, the thinner and lighter housing 10 and lower housing can increase the volume of the filling space, thereby improving the acoustic performance.

It should be noted that in some other embodiments of the present invention, a sealing foam board may be directly used as the separation net 12, and specifically, the sealing foam has a series of features of light weight, ultra-thin volume, reliable performance, and the like. Therefore, on the one hand, the sealed foam board can play a role in sealing the rear cavity, on the other hand, the sealed foam board can be made to be lighter and thinner, the volume of the rear cavity is greatly increased, the filling space is enlarged, and the acoustic performance is improved.

Further, with continued reference to fig. 5, in order to avoid the impact sound generated between the separation net 12 and the speaker unit 11 from affecting the sound quality, the separation net 12 and the speaker unit 11 may be bonded by using a double-sided tape 16.

It is worth mentioning that, the speaker unit 11 is connected with the upper cover plate 102 in a sealing manner, specifically, the speaker unit 11 is fixed on the inner surface of the upper cover plate 102, the upper surface of the speaker unit 11 can be connected with the edge of the opening 104 in a sticking or welding manner, and the lower surface of the speaker unit 11 is stuck on the separation net 12 through the double faced adhesive tape 15, so that the installation of the speaker unit 11 is more compact, and the occupation of more accommodating grooves is avoided, thereby improving the acoustic performance.

In this embodiment, a leakage hole 110 is formed in the frame of the speaker unit 11, and an air-permeable member (not shown in the figure) is disposed on the leakage hole 110. Wherein, ventilative piece includes but not limited to: screen cloth, metal corrosion-resistant net. The air permeable member covers the single body leakage hole 110, so that sound absorption particles in the rear cavity 107 can be prevented from entering a magnetic circuit system in the speaker single body 11, and due to the air holes on the air permeable member, the air flow between the inside of the speaker single body 11 and the rear cavity 107 is not affected.

In addition, the second component 300 is hermetically connected with the flange 104 of the housing 10, so that the connection between the two components is more firm, and the strength of the whole module is greatly improved.

With reference to fig. 10, the first member 200 is provided with a sound emitting hole 20, one side of the upper cover plate 102 is recessed downward to form a sound guiding groove 108, the opening 101 is communicated with the sound emitting hole 20 through the sound guiding groove 108, wherein the groove wall of the sound guiding groove 108 and the first member 200 jointly define a sound guiding channel 17. Specifically, the front cavity 106 is communicated with the sound emitting hole 20 through the sound guide channel 17, and after the speaker unit 11 emits sound, the sound passes through the front cavity 106 and the sound guide channel 17 and finally exits to the outside of the electronic device through the sound emitting hole 20, or external sound enters the speaker module 100 through the sound emitting hole 20. It should be noted that the sound guide channel 17 is defined by the upper cover plate 102 and the first component 200 together, so that the first component 200 can be used as a part of the sound guide side wall of the sound guide channel 17, and compared with the conventional speaker module in which the sound guide channel 17 is formed, the present embodiment can greatly reduce the occupied space of the sound guide channel 17 in the speaker module, so that the speaker module can be made thinner and lighter, and the acoustic performance of the module is not affected.

Further, with continued reference to fig. 7 and 10, the upper cover plate 102 is connected to the first member 200 in a sealing manner through the second sealing foam 18, and specifically, the second sealing foam 18 is disposed along the periphery of the opening 101 and the sound guide groove 108, so as to avoid the sound quality deterioration caused by the gap between the upper cover plate 102 and the first member 200 at the opening 101 and the sound guide groove 108.

In the present embodiment, with continued reference to fig. 5, one end of the flexible printed circuit board 13 is connected to the speaker unit 11, and the other end is connected to an external electrical signal, specifically, the flexible printed circuit board 13 includes a body 130 located in the accommodating cavity, a connecting arm 131 extending from two ends of the body 130 to the direction of the speaker unit 11 and fixedly electrically connected to the speaker unit 11, and an extending arm 132 extending from the body 130 to a direction away from the speaker unit 11 and penetrating through the housing 10. Specifically, unlike the conventional wire bonding connection, the connecting arm 131 and the extending arm 132 directly extend from the body 130 in the present embodiment, which can reduce the contact failure at the wire connection, and improve the acoustic performance of the speaker module 100.

Another embodiment of the present invention provides an electronic device, which includes a first component, a second component and the speaker module 100 as described in the foregoing embodiment, where the first component and the second component of the electronic device are respectively butted with two opposite sides of the housing 10, and can enclose a front cavity and a rear cavity together with the speaker unit 11 and the housing 10, so as to greatly reduce the Z-direction size of the speaker module 100, increase the volume of the front cavity, and at the same time, not affect the overall shape and volume of the electronic device, and improve the acoustic performance of the speaker module 100.

The electronic device of the present invention includes the speaker module 100 according to the above-mentioned embodiment of the present invention. The electronic equipment in the utility model can be electronic equipment, a tablet personal computer, earphones, intelligent wearable equipment and the like. According to the electronic device of the present invention, by providing the speaker module 100, not only the assembly space of the electronic device can be saved, but also the sound production effect of the electronic device can be improved.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A speaker module, comprising:

2. The speaker module as claimed in claim 1, wherein the periphery of the opening is recessed into the receiving cavity to form a supporting step, and the speaker unit is fixed to the supporting step.

3. The speaker module as claimed in claim 2, wherein a side of said upper cover plate is recessed into said receiving cavity to form a sound guide channel, said sound guide channel extends through said side plate, and said opening is in communication with said sound guide channel.

4. A speaker module as claimed in claim 3, wherein the height of the support step is the same as the height of the sound-guiding groove.

5. The speaker module as claimed in claim 1, wherein the isolation mesh is bonded to the flange, and a first foam is further disposed around the periphery of the isolation mesh, and the first foam is opposite to the flange.

6. The speaker module as claimed in claim 5, wherein the speaker unit is bonded to the separation mesh.

7. The speaker module of claim 4, further comprising a second foam disposed around the opening and the sound guide channel.

8. The speaker module as claimed in any one of claims 1-7, wherein the speaker unit has a leak hole, and the leak hole is provided with an air-permeable member.

9. The speaker module as claimed in claim 8, wherein said upper cover plate defines a filling opening communicating with said filling space, said filling opening being covered with a sealing cover plate.

10. An electronic device comprising a first component, a second component, and the speaker module of any of claims 1-9, the first component, the second component, and the housing cooperating to form a front cavity and a back cavity of the speaker module.

11. The electronic device of claim 10, wherein the housing and the second component are sealed with a first foam to form the back cavity, and the housing and the first component are sealed with a second foam to form the front cavity.